US980843A - Mounting of conductors. - Google Patents
Mounting of conductors. Download PDFInfo
- Publication number
- US980843A US980843A US56237210A US1910562372A US980843A US 980843 A US980843 A US 980843A US 56237210 A US56237210 A US 56237210A US 1910562372 A US1910562372 A US 1910562372A US 980843 A US980843 A US 980843A
- Authority
- US
- United States
- Prior art keywords
- filament
- supporting system
- coating
- protective coating
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 title description 10
- 239000000463 material Substances 0.000 description 30
- 239000011253 protective coating Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- GFVUWETXLKDTIO-UHFFFAOYSA-J [C+4].[SH-].[SH-].[SH-].[SH-] Chemical compound [C+4].[SH-].[SH-].[SH-].[SH-] GFVUWETXLKDTIO-UHFFFAOYSA-J 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 241001527902 Aratus Species 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K3/00—Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof
Definitions
- Ni srnirs r i KARL SCHRi TER 9F BERLIN, GERMANY, ASSIGNOR TO GENERAL ELECTRIC COMQANY, A COBEORATIGN (31 NEW YORK.
- My invention relates to the mounting of conductors, and it comprises a process therefor which is cheap and easy to carry out, and possesses various advantages which will appear from the specification following.
- a conductor is subjected to treatment liable to result in the formation of a deposit on the structure in question.
- a deposit may be formed, for instance, when material passes off from the conductor in'consequence of the passage of current through it. It is sometimes desirable to insure thefinal absence of deposited material, and for this purpose treatment with chemical reagents which act upon this material but do not attack the conductor or the structure associated with it has been resorted to.
- Such treatment has the disadvantage that in consequence of the necessity of avoiding injury from the reagent used the range of materials that may be combined in the apparatus is not wholly unrestricted.
- the use of such reagents is avoided; and the formation of deposits on the structure referred to is prevented by a protective coating thereon which is afterward removed.
- My invention is applicable especially in connection with the manufacture of apparatus with filaments formed by the incorporation of material from which the finished filament is. to be made with auxiliary material or hinder such that the resulting composition can be readily formed into a filamentary bodyand otherwise shaped as desired by various well-known methods, the auxiliary material being eliminated after completion of the shaping.
- the filament Prior to the elimination of the auxiliary material, the filament may be placed on the supporting system intended to ultimately carry 'it. This procedure is, in particular, practiced with metallic auxiliary material in the manufacture of electric lamps.
- Figure 1 IS a perspective view of an ordinary type of lamp mountshown without the giobe in connection with which my invention may be used; and Fig. 2 is a fragmentary diagrammatic section of the same illustrating certain steps in the practice of my invention according to the mode described.
- the filament system or mount shown in Fig. 1 comprises the usual glass stem or carrier a through which the current supply leads Z, Z are introduced into the lamp, :1 standard 7) of glass or other suitable material secured to said stem, and two sets of hooked arms or engaging elements 1: projecting from said standard by which the filament (Z is carried.
- filament materials which are mechanically difiicult to work may, as above intimated, be incorporated with ductile metallic auxiliary material to form ductile compositions which can readily be worked up and shaped. as desired.
- the auxiliary material may be driven out of the wires thus produced by passing an electric current. through them. If this conversion of the crude filament into a finished filament is not elfected till after it has been placed on its final supporting system, the metal expelled from the filament naturally forms deposits. When the filament stem shown in the drawing is used, these eposits are formed especially on the axial standard 6 and the engaging elements 0.
- a protective coating is, in accord ance with my invention, applied to the parts exposed to them before the filament is mounted and removed after the auxiliary material has been expelled.
- the supporting system may be coated with a thin collodion film by dipping it in a solution of collodion in ether and alcohol; or it may be brushed over with a solution of paraffin in benzin, or with one of rubber in any suitable liquid,,such as carbon bisulfid. After the evaporation of the solvent, the supporting system remains covered with a coat ng 6 of collodion or the like (Fig. 2).
- the wire or filament is now placed on the supporting system and the auxiliary material volat-ilized, fine particles of this material are deposited on the protective coating, and in the subsequent removal of this coating by the solution the deposit is also removed.
- a solvent for collodion coatings ether and alcohol is desirable; for paraflin coatings, benzin; for rubber coatings, carbon bisulfid.
- neutral non-corrosive solvents are used instead of the corrosive fluids, such as acids, formerly necessary, and attack of the material of the supporting system or of the filament is in consequence impossible.
- a supporting system for a filament having a protective coating adapted to re ceive deposits of material given oil from the filament during the passage of current therethrough and to be removed by treatment which does not affect any part of the systom.
- a supporting system for a filament having a protective coating adapted to receive material deposited on the supporting system during passage of current through the filament and to be removed with suitable fluid along with such deposited material.
- a filament mount comprising a filament containing material adapted to be eliminated by passage of current through the filament and a glass stem having an organic protective coating adapted to receive 'material deposited from the filament and to be removed with suitable fluid.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
K. SGHR'O'TER.
MOUNTING OF GONDUG'I'ORS.
APPLIOATION FILED MAY 20, 1910.
980,843, Patented Jan. 3, 1911.
Fig. l.
Witnesses: Inventor:
w M Karl Schrb'tr",
His DIttorney.
Ni srnirs r i KARL SCHRi TER, 9F BERLIN, GERMANY, ASSIGNOR TO GENERAL ELECTRIC COMQANY, A COBEORATIGN (31 NEW YORK.
MOUNTING OF CONDUCTORS.
senses.
Specification of Letters Eatent.
Patent-ed Jan. 3, i913 To all whom it may concern:
Be it known that I, KARL SoHRornR, a subject of the Emperor of Germany, residing at Berlin, Germany, have invented certain new and useful Improvements. in Mounting of Conductors, of which the following is a specification.
My invention relates to the mounting of conductors, and it comprises a process therefor which is cheap and easy to carry out, and possesses various advantages which will appear from the specification following.
It frequently happens that after being mounted in proximity to some structure (as, for example, its supporting system or holding devices) intended to be associated with it in an apparatus of which it is designed to form a part, a conductor is subjected to treatment liable to result in the formation of a deposit on the structure in question. Such a deposit may be formed, for instance, when material passes off from the conductor in'consequence of the passage of current through it. It is sometimes desirable to insure thefinal absence of deposited material, and for this purpose treatment with chemical reagents which act upon this material but do not attack the conductor or the structure associated with it has been resorted to. Such treatment has the disadvantage that in consequence of the necessity of avoiding injury from the reagent used the range of materials that may be combined in the apparatus is not wholly unrestricted. In the process of the present invention, the use of such reagents is avoided; and the formation of deposits on the structure referred to is prevented by a protective coating thereon which is afterward removed.
My invention is applicable especially in connection with the manufacture of apparatus with filaments formed by the incorporation of material from which the finished filament is. to be made with auxiliary material or hinder such that the resulting composition can be readily formed into a filamentary bodyand otherwise shaped as desired by various well-known methods, the auxiliary material being eliminated after completion of the shaping. Prior to the elimination of the auxiliary material, the filament may be placed on the supporting system intended to ultimately carry 'it. This procedure is, in particular, practiced with metallic auxiliary material in the manufacture of electric lamps.
I have hereinafter described a mode in which my invention may be carried out and applied in the manufacture of electric lamps; but I desire it to be understood that the mode described is illustrative and that the invention can be carried out and applied in other ways within the scope of the appended claims.
In the drawings accompanying this specification and forming part thereof, Figure 1 IS a perspective view of an ordinary type of lamp mountshown without the giobe in connection with which my invention may be used; and Fig. 2 is a fragmentary diagrammatic section of the same illustrating certain steps in the practice of my invention according to the mode described.
The filament system or mount shown in Fig. 1 comprises the usual glass stem or carrier a through which the current supply leads Z, Z are introduced into the lamp, :1 standard 7) of glass or other suitable material secured to said stem, and two sets of hooked arms or engaging elements 1: projecting from said standard by which the filament (Z is carried.
In order to bring them into the form of wire, filament materialswhich are mechanically difiicult to work may, as above intimated, be incorporated with ductile metallic auxiliary material to form ductile compositions which can readily be worked up and shaped. as desired. The auxiliary material may be driven out of the wires thus produced by passing an electric current. through them. If this conversion of the crude filament into a finished filament is not elfected till after it has been placed on its final supporting system, the metal expelled from the filament naturally forms deposits. When the filament stem shown in the drawing is used, these eposits are formed especially on the axial standard 6 and the engaging elements 0. Instead of treatment with acids being resorted to for the removal of these deposits, a protective coating is, in accord ance with my invention, applied to the parts exposed to them before the filament is mounted and removed after the auxiliary material has been expelled. For example, the supporting system may be coated with a thin collodion film by dipping it in a solution of collodion in ether and alcohol; or it may be brushed over with a solution of paraffin in benzin, or with one of rubber in any suitable liquid,,such as carbon bisulfid. After the evaporation of the solvent, the supporting system remains covered with a coat ng 6 of collodion or the like (Fig. 2). If the wire or filament is now placed on the supporting system and the auxiliary material volat-ilized, fine particles of this material are deposited on the protective coating, and in the subsequent removal of this coating by the solution the deposit is also removed. As a solvent for collodion coatings, ether and alcohol is desirable; for paraflin coatings, benzin; for rubber coatings, carbon bisulfid. Inasmuch as in this process the solvent need be capable only of issolving the protective coating and not the metallic deposit, neutral non-corrosive solvents are used instead of the corrosive fluids, such as acids, formerly necessary, and attack of the material of the supporting system or of the filament is in consequence impossible.
It is desirable either to avoid coatingthese parts of the supporting system which attain a hi h temperature during the heating of the filament to expel the auxiliary material or else to remove the coating from them before the filament is put in place. (In Fig. 2 the protective coating 6 which covers the glass stem 1) is shown as leaving the arms 0 exposed.) Such a course avoids any chemical alteration in the coating which might occur at the more highly heated parts of the supporting system by carbonization of the organic coatingmaterial. It is to be noted that the formation of deposits on the parts thus left uncovered may 1n a measure be prevented by their high temperature during the passage of current through the filament; whereas overheating of the coating material might render it difficult to dissolve, or result in its reacting with the part which it covers.
What I claim as new and desire to secure by Letters Patent of the United States, is,
1. The process which consists in applying a protective coating to structure associated with a filament in the apparatus of which it forms a part, permanently mounting a filament in operative relation to such structure, passing current through said filament to expel material therefrom, and removing the coating.
2. The process which consists in applying a filament containing binder to a supporting system having a suitable protective coating, passing current through the filament to volatilize said binder, and removing said coating from the supporting system.
3. The process which consists in subjecting a conductor permanently mounted in its intended relation to structure associated with it in the apparatus of which it is designed to form a part to treatment liable to result in the formation of a deposit on such structure and then removing a coating from said structure.
4. The process which consists in applying to a filament supporting system a protective coat-ing adapted to receive deposits of materials expelled from the filament during passage of current therethrough and to be removed with them.
5. The process which consists in passing current through a conductor permanently mounted in its intended relation to structure associated with it in the ap aratus of which it forms a part to expe material therefrom While all parts of such structure except those which attain a high temperature during the operation are covered with a protective coating and removing said coating along with deposited material from the conductor.
6. The process which consists in applying a soluble rotective coating to a lamp mount, placing a filamentary body containing ductile metal binder thereon, passing current throu h the filament to expel the binder, and dissolving the protective coating from the mount and thus removing material of the binder deposited thereon.
7. A supporting system for a filament having a protective coating adapted to re ceive deposits of material given oil from the filament during the passage of current therethrough and to be removed by treatment which does not affect any part of the systom.
8. A supporting system for a filament having a protective coating adapted to receive material deposited on the supporting system during passage of current through the filament and to be removed with suitable fluid along with such deposited material.
9. A filament mount comprising a filament containing material adapted to be eliminated by passage of current through the filament and a glass stem having an organic protective coating adapted to receive 'material deposited from the filament and to be removed with suitable fluid.
10. The process which consists in passing current through a filament mounted on a supporting system having a protective coating to expel binding material from the filament and ren'loving the coating With 5 suitable fluid along with any material deposited on the supporting system.
11. The process which consists in passing current through a filament mounted on a supporting system having a soluble organic protective coating and dissolving away the 10 coating to remove any deposit formed on the supporting system.
In Witness whereof, I have hereunto set my hand this fourth day of May, 1910.
KARL SCHROTER. Witnesses:
HENRY HAsPER, WOLDEMAR HAUPT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US56237210A US980843A (en) | 1910-05-20 | 1910-05-20 | Mounting of conductors. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US56237210A US980843A (en) | 1910-05-20 | 1910-05-20 | Mounting of conductors. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US980843A true US980843A (en) | 1911-01-03 |
Family
ID=3049210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US56237210A Expired - Lifetime US980843A (en) | 1910-05-20 | 1910-05-20 | Mounting of conductors. |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US980843A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2987799A (en) * | 1957-07-15 | 1961-06-13 | Pacific Semiconductors Inc | Mobile particle entrapment method |
-
1910
- 1910-05-20 US US56237210A patent/US980843A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2987799A (en) * | 1957-07-15 | 1961-06-13 | Pacific Semiconductors Inc | Mobile particle entrapment method |
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