US9704649B2 - Method for producing ceramic electronic component - Google Patents
Method for producing ceramic electronic component Download PDFInfo
- Publication number
- US9704649B2 US9704649B2 US13/105,926 US201113105926A US9704649B2 US 9704649 B2 US9704649 B2 US 9704649B2 US 201113105926 A US201113105926 A US 201113105926A US 9704649 B2 US9704649 B2 US 9704649B2
- Authority
- US
- United States
- Prior art keywords
- water repellent
- main body
- samples
- external terminal
- component main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 249
- 230000002940 repellent Effects 0.000 claims abstract description 208
- 239000005871 repellent Substances 0.000 claims abstract description 208
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 126
- 238000007747 plating Methods 0.000 claims description 56
- 238000010304 firing Methods 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 84
- 239000012530 fluid Substances 0.000 abstract description 25
- 239000002904 solvent Substances 0.000 abstract description 4
- 239000011800 void material Substances 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 description 74
- 238000012360 testing method Methods 0.000 description 49
- 239000010408 film Substances 0.000 description 47
- 230000015572 biosynthetic process Effects 0.000 description 44
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 36
- 238000007654 immersion Methods 0.000 description 36
- 238000000034 method Methods 0.000 description 31
- 239000003985 ceramic capacitor Substances 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 16
- 238000005476 soldering Methods 0.000 description 13
- 239000010949 copper Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 238000010292 electrical insulation Methods 0.000 description 7
- 238000005470 impregnation Methods 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
- B05D1/38—Successively applying liquids or other fluent materials, e.g. without intermediate treatment with intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
Definitions
- the present invention relates to a method for producing a ceramic electronic component, and more particularly, to a method for producing a ceramic electronic component, which includes a step of providing a component main body with water repellency in order to prevent the ingress of moisture into the ceramic electronic component.
- the ingress of moisture into a void section of a ceramic electronic component causes degradation of reliability, such as electrical insulation and lifetime characteristics.
- the ingress of moisture is likely to occur, for example, during a plating process which is performed to form external terminal electrodes and during use in a high-humidity environment.
- the ingress of moisture is likely to occur through gaps at the interfaces between internal electrodes and ceramic layers.
- the techniques described in Japanese Patent No. 3304798 and Japanese Patent No. 3444291 are intended to prevent the ingress of moisture by forming a water repellent film on the surface of a ceramic body or on the surfaces of external electrodes before performing a plating process on the external electrodes.
- the water repellent film is formed by immersing the ceramic body with the external electrodes formed thereon in a water repellent agent under atmospheric pressure or under reduced pressure in a vacuum.
- a technique described in Japanese Patent No. 4167360 is intended to prevent the ingress of moisture by performing a plating process onto external electrodes and then impregnating a porous section of the surface and inside of the external terminal electrodes with a water repellent member.
- a chip subjected to a plating process is immersed in the water repellent member under reduced pressure in a vacuum in the step of impregnating the porous section with the water repellent member.
- the water repellent member is removed from the surface of the external terminal electrodes in order not to damage the appearance or the wettability.
- the impregnation with the water repellent agent is performed under atmospheric pressure or under reduced pressure in a vacuum in the techniques described in Japanese Patent No. 3304798, Japanese Patent No. 3444291, and Japanese Patent No. 4167360.
- the simple impregnation under atmospheric pressure or under reduced pressure in a vacuum may fail to cause the water repellent agent to sufficiently penetrate deeply into minute voids, thereby resulting in an insufficient water repellent effect and, thus, degrade reliability.
- Preferred embodiments of the present invention provide a method for producing a ceramic electronic component, which overcomes the problems described above.
- a method for producing a ceramic electronic component preferably includes the steps of preparing a component main body made of a ceramic, forming an external terminal electrode on an outer surface of the component main body, and providing at least the component main body with water repellency using of a water repellent agent.
- a step is preferably performed in which at least the component main body is provided with water repellency using a water repellent agent that is dissolved in a supercritical fluid as a solvent.
- the time to perform the step of providing water repellency is not particularly limited. More specifically, the step of providing water repellency may be performed at any time before and after the step of forming an external terminal electrode, or even in the process of the step of forming an external terminal electrode when the step of forming an external terminal electrode includes multiple steps such as, for example, a firing (or curing) step and a plating step. Furthermore, the step of providing water repellency may preferably be performed more than once.
- a known CO 2 supercritical fluid for example, is preferably used as the supercritical fluid.
- the production method according to a preferred embodiment of the present invention is advantageously applied to a ceramic electronic component which includes a component main body including a laminated structure including a plurality of stacked ceramic layers and a plurality of internal electrodes provided along specific interfaces between the ceramic layers and being partially exposed.
- the step of forming an external terminal electrode preferably includes a step of forming the external terminal electrode on the outer surface of the component main body so as to be electrically connected to the internal electrodes.
- the supercritical fluid is highly diffusive, superior in penetration, and highly soluble. Therefore, the water repellent agent dissolved in the supercritical fluid can easily penetrate deeply into minute nano-level voids.
- this step enables the water repellent agent to sufficiently penetrate deeply into minute nano-level voids in the ceramic electronic component.
- the ceramic electronic component produces a sufficient water repellent (waterproof) effect, thereby significantly improving the reliability of the ceramic electronic component, such as electrical insulation or lifetime characteristics.
- the method according to another preferred embodiment of the present invention preferably further includes a step of removing the water repellent agent on at least the outer surface of the component main body after the step of providing water repellency, such that the water repellent agent is prevented from interfering with platability or solderability.
- the component main body is impregnated with the water repellent agent not only at the surface but also deeply therein, and thus, maintains a sufficient water repellent effect. Therefore, a water repellent agent which has a stronger water repellent ability is effectively provided.
- the water repellent agent effectively prevents the ingress of a plating solution into the component main body as long as the step of forming a plating film is performed after the step of providing water repellency.
- the step of removing the water repellent agent on at least the surface on which a plating film is to be formed is preferably performed before the step of forming a plating film and after the step of providing water repellency, so as to prevent defective adhesion of a plating film, even when a water repellent agent having a stronger water repellent ability is used.
- the water repellent agent When the step of providing water repellency is performed before the step of forming an external terminal electrode, that is, with no electrode formed on the component main body, the water repellent agent easily penetrates more deeply into the component main body.
- the penetration of the water repellent agent into the interfaces between the ceramic layers and the internal electrodes effectively prevents the ingress of moisture into the component main body, and thus, improve the reliability, such as electrical insulation and lifetime characteristics, thereof.
- the water repellent agent is more likely to penetrate into the interfaces between the ceramic layers and the internal electrodes, and high reliability, such as sufficient electrical insulation and lifetime characteristics, is achieved even when a laminated ceramic electronic component includes ceramic layers having an extremely reduced thickness.
- the water repellent agent includes a silane coupling agent
- water repellency is produced by dehydration and condensation at both the ceramic surface and the surface of an oxide film of the metal section, because the silane coupling agent has both an organic functional group and a hydrolyzable group.
- the FIGURE is a cross-sectional view illustrating a laminated ceramic electronic component 1 produced by a method according to a preferred embodiment of the present invention.
- a ceramic electronic component 1 preferably includes a component main body 2 having a laminated structure.
- the component main body 2 preferably includes a plurality of internal electrodes 3 and 4 provided therein. More specifically, the component main body 2 preferably includes a plurality of stacked ceramic layers 5 , and a plurality of layered internal electrodes 3 and 4 disposed along the interfaces between the ceramic layers 5 .
- the ceramic layers 5 are preferably made of a dielectric ceramic, for example. It is to be noted that the ceramic electronic component 1 may define other components, such as inductors, thermistors, and piezoelectric components. Therefore, depending on the function of the ceramic electronic component 1 , the ceramic layers 5 may preferably be composed of a magnetic ceramic, a semiconductor ceramic, and a piezoelectric ceramic, for example, in addition to a dielectric ceramic.
- the ends of the plurality of internal electrodes 3 and the ends of the plurality of internal electrodes 4 are respectively exposed at end surfaces 6 and 7 of the component main body 2 , and external terminal electrodes 8 and 9 are respectively provided so that the ends of the internal electrodes and the ends of the internal electrodes 4 are electrically connected to each other.
- the ceramic electronic component 1 is a two-terminal component including the two external terminal electrodes 8 and 9 , preferred embodiments of the present invention can be also applied to multi-terminal ceramic electronic components.
- Each of the external terminal electrodes 8 and 9 preferably includes, for example, a first electrode layer 10 formed on the exposed surfaces of the internal electrodes 3 and 4 in the component main body 2 , that is, on the end surfaces 6 and 7 , a second electrode layer 11 formed thereon, and a third electrode layer 12 formed thereon.
- the first to third electrode layers 10 to 12 provide the following functions.
- the first electrode layer 10 electrically connects the plurality of internal electrodes 3 or the plurality of internal electrodes 4 to each other, and preferably includes a highly conductive metal, such as copper, for example, as its main component.
- the second and third electrode layers 11 and 12 provide and/or improve the mountability of the ceramic electronic component 1 . More specifically, the second electrode layer 11 provides the external terminal electrodes 8 and 9 with a solder barrier property, and preferably includes, for example, nickel as its main component.
- the third electrode layer 12 provides the external terminal electrodes 8 and 9 with solderability, and preferably includes, for example, tin or gold as its main component.
- each of the external terminal electrodes 8 and 9 may include four or more layers, or may include one or two layers, as opposed to the first to third electrode layers 10 to 12 as described above.
- the component main body 2 is produced in accordance with a well-known method.
- the external terminal electrodes 8 and 9 are formed on the end surfaces 6 and 7 of the component main body 2 so as to be electrically connected to the internal electrodes 3 and 4 , respectively.
- the step of forming the first electrode layer 10 , the step of forming the second electrode layer 11 , and the step of forming the third electrode layer 12 are preferably sequentially performed in the step of forming the external terminal electrodes 8 and 9 .
- the second and third electrode layers 11 and 12 are preferably formed by an electroless plating method of depositing metal ions with the use of a reducing agent, or an electrolytic plating method through a process of applying an electric current, for example.
- the first electrode layer 10 may preferably be formed by the electroless plating method or electrolytic plating method described above, by applying and firing a conductive paste, by applying and curing a conductive resin, or by a thin film formation method such as sputtering, for example.
- the plurality of internal electrodes 3 exposed at the one end surface 6 are electrically insulated from each other, and the plurality of internal electrodes 4 exposed at the other end surface 7 are electrically insulated from each other.
- metal ions in a plating solution are first deposited on the exposed sections of the respective internal electrodes 3 and 4 .
- the plated depositions are further grown to physically connect the plated depositions on the respective exposed sections of the adjacent internal electrodes 3 and the plated depositions on the respective exposed sections of the adjacent internal electrodes 4 . In this manner, the first electrode layer 10 is formed so as to be homogeneous and dense.
- the first electrode layer 10 described above is made of a plating film including, as its main component, copper, for example, which provides favorable throwing power, the efficiency of the plating process is increased, and the fixing strength of the external terminal electrodes 8 and 9 us also increased.
- the first electrode layer 10 is preferably formed on the pair of end surfaces 6 and 7 of the component main body 2 so that the end edges of the first electrode layers 10 are located on a pair of principal surfaces 13 and 14 and a pair of side surfaces, which are adjacent to the end surfaces 6 and 7 of the component main body 2 .
- dummy conductors which provide no substantial contribution to the development of electrical properties may preferably be formed so as to be exposed near both ends of the component main body 2 in the stacking direction to promote the plating growth such that metal ions for the formation of the first electrode layers 10 are deposited on the dummy conductors.
- the end surfaces 6 and 7 of the component main body 2 are preferably subjected to a polishing treatment in order to sufficiently expose the internal electrodes 3 and 4 as well as the dummy conductors at the end surfaces 6 and 7 .
- a heat treatment is preferably performed after the plate processing. This heat treatment forms an interdiffusion layer between each of the internal electrodes 3 and 4 and the first electrode layer 10 . This formation of the interdiffusion layer also prevents ingress of moisture into the component main body 2 .
- a step is preferably performed in which a water repellent agent is used to provide at least the component main body 2 with water repellency.
- the water repellent agent is preferably dissolved in a supercritical fluid such as, for example, a supercritical CO 2 fluid as a solvent.
- the water repellent agent is dissolved in a supercritical fluid by encapsulating the water repellent agent and one of the component main body 2 and the ceramic electronic component 1 in a pressure vessel, and introducing a liquid to function as a supercritical fluid into the pressure vessel while adding additional pressure to the liquid with a pump, thereby increasing the temperature and the pressure.
- the water repellent agent dissolved in the supercritical fluid is maintained for a predetermined period of time to cause the water repellent agent to penetrate into minute voids of the component main body 2 or the ceramic electronic component 1 .
- the component main body 2 or the ceramic electronic component 1 is removed from the pressure vessel, dried, and then subjected to a heat treatment. In this manner, the step of providing water repellency is completed.
- the supercritical fluid used in the step of providing water repellency is preferably highly diffusive, superior in penetration, and highly soluble, for example. Therefore, the water repellent agent dissolved in the supercritical fluid can easily penetrate deeply into minute nano-level voids. Accordingly, this step enables the water repellent agent to sufficiently penetrate deeply into minute nano-level voids present in the component main body 2 or the ceramic electronic component 1 . As a result, the component main body 2 or the ceramic electronic component 1 has a sufficient water repellent effect, thereby enabling the reliability of the ceramic electronic component 1 , such as electrical insulation or lifetime characteristics, to be significantly improved.
- the time at which the step of providing water repellency is performed is not particularly limited. More specifically, the step of providing water repellency may preferable be performed before or after the step of forming an external terminal electrode, or during the step of forming an external terminal electrode, for example, between the step of forming the first electrode layer 10 and the step of forming the second electrode layer 11 . Therefore, as described above, the component main body 2 encapsulated in the pressure vessel may include at least a portion of the external terminal electrodes 8 and 9 already formed thereon. In addition, the step of providing water repellency may preferably be performed more than once.
- the water repellent agent effectively prevents the ingress of a plating solution into the component main body 2 as long as the step of forming a plating film is performed after the step of providing water repellency.
- the water repellent agent can easily penetrate more deeply into the component main body 2 .
- the penetration of the water repellent agent into the interfaces between the ceramic layers 5 and the internal electrodes 3 and 4 prevents the ingress of moisture into the component main body 2 , and thus, improves the reliability, such as electrical insulation and lifetime characteristics.
- the water repellent agent is more likely to penetrate into the interfaces between the ceramic layers 5 and the internal electrodes 3 and 4 , and high reliability, such as sufficient electrical insulation and lifetime characteristics, is effectively achieved, even if the ceramic layers 5 between the internal electrodes 3 and 4 have a reduced thickness.
- an organosilicon compound which has both an organic functional group and a hydrolyzable group is preferable.
- the silane coupling agent provides water repellency by dehydration and condensation at the ceramic surface and the surface of an oxide film of the metal section.
- the hydrolysis reaction of the silane coupling agent is developed by the addition of moisture to the silane coupling agent or by moisture adsorbed on the surface to be treated.
- alcohol or other suitable agent in which water is likely to be dissolved may preferably be used along with the silane coupling agent.
- a step of removing the water repellent agent on at least the outer surface of the component main body 2 is performed, if necessary.
- This removal step preferably utilizes, for example, a wet removal step (chemical removal step) involving a dissolution treatment, or a dry removal step (mechanical removal step) involving a barrel treatment or a blast treatment.
- the removal step prevents the water repellent agent from interfering with platability and solderability.
- the component main body 2 is impregnated with the water repellent agent not only at the surface but also deeply therein, and thus, maintains a sufficient water repellent effect. Therefore, a water repellent agent which has a stronger water repellent ability can be used without problems.
- a step of removing the water repellent agent on at least the surface on which a plating film is to be formed before the plating step after the step of providing water repellency reduces the likelihood of defective adhesion of a plating film, even when using a water repellent agent having a stronger water repellent ability.
- the water repellent agent may be further provided by normal immersion or vacuum impregnation. This is because the method using a supercritical fluid is useful for penetration into minute pores in a ceramic body, whereas the latter conventional immersion or vacuum impregnation may be preferable for pores with relatively large diameters on the outermost surface.
- a component main body of laminated structure for a laminated ceramic capacitor was prepared, which included ceramic layers made of a barium titanate based dielectric material and Ni internal electrodes, with a Cu thick film formed by firing a conductive paste as a first electrode layer for the external terminal electrode.
- the component main body had external dimensions of about 2.0 mm ⁇ about 1.25 mm ⁇ about 1.25 mm.
- the thickness of the ceramic layer was about 1 ⁇ m between adjacent internal electrodes.
- silane coupling agents H, M, and L shown in Table 1 below were prepared as water repellent agents.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 2 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the component main body were encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO 2 was introduced into the pressure vessel while adding additional pressure to the liquid CO 2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO 2 .
- the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the component main body. Then, the component main body was removed from the pressure vessel.
- the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the component main body removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 2 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the component main body immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the component main body. Then, the component main body was removed from the solution of the silane coupling agent.
- the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the component main body removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were formed sequentially by electrolytic plating on the first electrode layer made of a Cu thick film to obtain laminated ceramic capacitors as samples.
- the laminated ceramic capacitors according to each sample were evaluated for the formation of plating film, and subjected to a moisture resistance loading test, as shown in Table 2.
- the number of samples was 100 for each sample number. More specifically, regarding the formation of the plating film, a sample having defective adhesion was determined as being defective by microscopic observation, and the number of defective samples was counted.
- a direct-current voltage of about 10V was applied for about 144 hours in an environment with a temperature of about 125° C. and a relative humidity of about 95%, a sample having insulation resistance value after the test less than about 1 M ⁇ was determined to be defective, and the number of defective samples was counted.
- the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
- the treatment for removing the water repellent treatment caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the plating film, thus effectively providing a balance between the formation of the plating film and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
- a component main body of laminated structure for a laminated ceramic capacitor was prepared, which included ceramic layers made of a barium titanate based dielectric material Ni internal electrodes, with a Cu thick film formed by firing a conductive paste as a first electrode layer for the external terminal electrode.
- a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were formed sequentially by electrolytic plating on the first electrode layer made of a Cu thick film to obtain laminated ceramic capacitors.
- silane coupling agents H, M, and L shown in Table 1 above were also prepared as water repellent agents in Experiment Example 2.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 3 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the laminated ceramic capacitor was encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO 2 was introduced into the pressure vessel while adding additional pressure to the liquid CO 2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO 2 .
- the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the laminated ceramic capacitor. Then, the laminated ceramic capacitor was removed from the pressure vessel.
- the laminated ceramic capacitor removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the laminated ceramic capacitor removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 3 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the laminated ceramic capacitor immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the laminated ceramic capacitor. Then, the laminated ceramic capacitor was removed from the solution of the silane coupling agent.
- the laminated ceramic capacitor removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the laminated ceramic capacitor removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- sample 33 was produced under the same conditions as for sample 13 in Experimental Example 1.
- the laminated ceramic capacitors according to each sample were evaluated for the soldering property, and subjected to a moisture resistance loading test, as shown in Table 3.
- the number of samples was 100 for each sample number.
- the laminated ceramic capacitor was immersed in molten solder in accordance with the test condition specified in JIS C 60068-2-58 (2006), and then evaluated by microscopic observation for an external terminal electrode covered with solder, the sample with its solder coverage less than about 90% at the surface of the external terminal electrode was determined to be a defective sample, and the number of defective samples was calculated.
- the evaluations in the moisture resistance loading test were made in the same manner as in Experimental Example 1.
- the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
- the treatment for removing the water repellent treatment caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in soldering property, thus providing a balance between the soldering property and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
- a component main body having laminated structure for a laminated ceramic capacitor was prepared, which included ceramic layers made of a barium titanate based dielectric material and Ni internal electrodes.
- the component main body had external dimensions of about 1.9 mm ⁇ about 1.05 mm ⁇ about 1.05 mm.
- the thickness of the ceramic layer was about 1 ⁇ m between adjacent internal electrodes.
- silane coupling agents H, M, and L shown in Table 1 above were also prepared as water repellent agents in Experiment Example 3.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 4 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the component main body was encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO 2 was introduced into the pressure vessel while adding additional pressure to the liquid CO 2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO 2 .
- the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the component main body. Then, the component main body was removed from the pressure vessel.
- the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the component main body removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 4 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the component main body immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the component main body. Then, the component main body was removed from the solution of the silane coupling agent.
- the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the component main body removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- a conductive resin electrode layer as a first electrode layer of the external terminal electrode was formed on the component main body, and a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were then formed sequentially by electrolytic plating on the conductive resin electrode layer, thereby completing a laminated ceramic capacitor.
- the laminated ceramic capacitors according to each sample were evaluated for the formation of the external terminal electrodes, and subjected to a moisture resistance loading test, as shown in Table 4.
- the number of samples was 100 for each sample number. More specifically, for evaluating the formation of the external terminal electrodes, the samples were evaluated by stereoscopic microscope under sufficient illumination, a sample with the external terminal electrodes found to have any defects, such as a pinhole, was determined as a defective sample, and the number of defective samples was counted.
- the evaluations in the moisture resistance loading test were made in the same manner as in Experimental Example 1.
- the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
- the treatment for removing the water repellent agent caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the external terminal electrodes, thus providing a balance between the formation of the external terminal electrodes and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
- silane coupling agents H, M, and L shown in Table 1 above were also prepared as water repellent agents in Experiment Example 4.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 5 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the component main body was encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO 2 was introduced into the pressure vessel while adding additional pressure to the liquid CO 2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO 2 .
- the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the component main body. Then, the component main body was taken out of the pressure vessel.
- the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the component main body removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the silane coupling agent shown in the column “Silane Coupling Agent” in Table 5 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the component main body immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the component main body. Then, the component main body was removed from the solution of the silane coupling agent.
- the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the component main body removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
- the treatment for providing water repellency was not performed for sample 73 as a comparative example, shown in Table 5.
- a Cu electrolytic plating film was formed as a first electrode layer of the external terminal electrode. More specifically, Cu ions in a plating solution were deposited on the exposed ends of the plurality of internal electrodes exposed at the end surfaces of the component main body, and the Cu plated depositions were further grown to form Cu electrolytic plating films by physical connections between the respective mutually cross-linked exposed ends of adjacent internal electrodes.
- a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were formed sequentially by electrolytic plating on the Cu electrolytic plating film as a first electrode layer of the external terminal electrode, thereby completing a laminated ceramic capacitor.
- the laminated ceramic capacitors according to each sample were evaluated for the formation of external terminal electrodes, and subjected to a moisture resistance loading test, as shown in Table 5, in the same manner as in Experimental Example 3.
- the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
- the treatment for removing the water repellent agent caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the external terminal electrodes, thus providing a balance between the formation of the external terminal electrodes and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.
Description
1. Field of the Invention
The present invention relates to a method for producing a ceramic electronic component, and more particularly, to a method for producing a ceramic electronic component, which includes a step of providing a component main body with water repellency in order to prevent the ingress of moisture into the ceramic electronic component.
2. Description of the Related Art
The ingress of moisture into a void section of a ceramic electronic component causes degradation of reliability, such as electrical insulation and lifetime characteristics. The ingress of moisture is likely to occur, for example, during a plating process which is performed to form external terminal electrodes and during use in a high-humidity environment. In particular, in a laminated ceramic electronic component including a component main body which has a laminated structure, the ingress of moisture is likely to occur through gaps at the interfaces between internal electrodes and ceramic layers. In this case, even when external terminal electrodes are formed on the outer surface of the component main body so as to be electrically connected to the internal electrodes, with the result that the interfaces between the internal electrodes and the ceramic layers are covered with the external electrodes, the ingress of moisture may be caused due to various voids and gaps. In particular, when the external terminal electrodes are formed only by plating, the ingress of moisture is more likely to occur.
As methods for preventing the ingress of moisture as described above, methods for providing a water repellent agent (which may be referred to as a “waterproof agent” in some cases) have been proposed.
For example, the techniques described in Japanese Patent No. 3304798 and Japanese Patent No. 3444291 are intended to prevent the ingress of moisture by forming a water repellent film on the surface of a ceramic body or on the surfaces of external electrodes before performing a plating process on the external electrodes. It is to be noted that, in Japanese Patent No. 3304798 and Japanese Patent No. 3444291, the water repellent film is formed by immersing the ceramic body with the external electrodes formed thereon in a water repellent agent under atmospheric pressure or under reduced pressure in a vacuum.
On the other hand, a technique described in Japanese Patent No. 4167360 is intended to prevent the ingress of moisture by performing a plating process onto external electrodes and then impregnating a porous section of the surface and inside of the external terminal electrodes with a water repellent member. In this case, a chip subjected to a plating process is immersed in the water repellent member under reduced pressure in a vacuum in the step of impregnating the porous section with the water repellent member. In addition, as described in Japanese Patent No. 4167360, the water repellent member is removed from the surface of the external terminal electrodes in order not to damage the appearance or the wettability.
As described above, the impregnation with the water repellent agent is performed under atmospheric pressure or under reduced pressure in a vacuum in the techniques described in Japanese Patent No. 3304798, Japanese Patent No. 3444291, and Japanese Patent No. 4167360. However, the simple impregnation under atmospheric pressure or under reduced pressure in a vacuum may fail to cause the water repellent agent to sufficiently penetrate deeply into minute voids, thereby resulting in an insufficient water repellent effect and, thus, degrade reliability.
In addition, as in the case of the techniques described in Japanese Patent No. 3304798 and Japanese Patent No. 3444291, when a step of removing the water repellent film is not performed after the formation of the water repellent film on the surface of the ceramic body and the surface of the external electrodes, the excessively high water repellent ability of the water repellent agent may cause problems such as defective film deposition or defective film adhesion in a subsequent plating process. However, conversely, when emphasis is placed on the prevention of the problem in the plating process and the water repellent agent used has a reduced water repellent ability reduced, the essential effect of preventing ingress of moisture will not be sufficiently produced. For these reasons, the techniques described in Japanese Patent No. 3304798 and Japanese Patent No. 3444291 are significantly limited in terms of the selection of the water repellent agent and the conditions for the impregnation.
On the other hand, when a step of removing the water repellent member is performed after the impregnation with the water repellent member as in the technique described in Japanese Patent No. 4167360, the insufficient removal may cause problems in terms of appearance and soldering properties, whereas the excessive removal will fail to provide the essential effect of preventing ingress of moisture sufficiently. For these reasons, the technique described in Japanese Patent No. 4167360 is also significantly limited in terms of the selection of the water repellent member and the conditions for the impregnation, and further significantly limited in terms of the conditions for the removal.
Preferred embodiments of the present invention provide a method for producing a ceramic electronic component, which overcomes the problems described above.
A method for producing a ceramic electronic component according to a preferred embodiment of the present invention preferably includes the steps of preparing a component main body made of a ceramic, forming an external terminal electrode on an outer surface of the component main body, and providing at least the component main body with water repellency using of a water repellent agent. In order to solve the problems described above, in the step of providing water repellency, a step is preferably performed in which at least the component main body is provided with water repellency using a water repellent agent that is dissolved in a supercritical fluid as a solvent.
It is to be noted that in preferred embodiments of the present invention, the time to perform the step of providing water repellency is not particularly limited. More specifically, the step of providing water repellency may be performed at any time before and after the step of forming an external terminal electrode, or even in the process of the step of forming an external terminal electrode when the step of forming an external terminal electrode includes multiple steps such as, for example, a firing (or curing) step and a plating step. Furthermore, the step of providing water repellency may preferably be performed more than once.
In addition, a known CO2 supercritical fluid, for example, is preferably used as the supercritical fluid.
Preferably, the production method according to a preferred embodiment of the present invention is advantageously applied to a ceramic electronic component which includes a component main body including a laminated structure including a plurality of stacked ceramic layers and a plurality of internal electrodes provided along specific interfaces between the ceramic layers and being partially exposed. In this case, the step of forming an external terminal electrode preferably includes a step of forming the external terminal electrode on the outer surface of the component main body so as to be electrically connected to the internal electrodes.
Preferably, the supercritical fluid is highly diffusive, superior in penetration, and highly soluble. Therefore, the water repellent agent dissolved in the supercritical fluid can easily penetrate deeply into minute nano-level voids.
Therefore, according to various preferred embodiments of the present invention, this step enables the water repellent agent to sufficiently penetrate deeply into minute nano-level voids in the ceramic electronic component. As a result, the ceramic electronic component produces a sufficient water repellent (waterproof) effect, thereby significantly improving the reliability of the ceramic electronic component, such as electrical insulation or lifetime characteristics.
The method according to another preferred embodiment of the present invention, preferably further includes a step of removing the water repellent agent on at least the outer surface of the component main body after the step of providing water repellency, such that the water repellent agent is prevented from interfering with platability or solderability. In addition, regardless of the removal, the component main body is impregnated with the water repellent agent not only at the surface but also deeply therein, and thus, maintains a sufficient water repellent effect. Therefore, a water repellent agent which has a stronger water repellent ability is effectively provided.
When the step of forming an external terminal electrode includes a step of forming a plating film, the water repellent agent effectively prevents the ingress of a plating solution into the component main body as long as the step of forming a plating film is performed after the step of providing water repellency.
In a preferred embodiment of the present invention, the step of removing the water repellent agent on at least the surface on which a plating film is to be formed is preferably performed before the step of forming a plating film and after the step of providing water repellency, so as to prevent defective adhesion of a plating film, even when a water repellent agent having a stronger water repellent ability is used.
When the step of providing water repellency is performed before the step of forming an external terminal electrode, that is, with no electrode formed on the component main body, the water repellent agent easily penetrates more deeply into the component main body.
When the ceramic electronic component includes a component main body which has the laminated structure as described above, the penetration of the water repellent agent into the interfaces between the ceramic layers and the internal electrodes effectively prevents the ingress of moisture into the component main body, and thus, improve the reliability, such as electrical insulation and lifetime characteristics, thereof.
When the step of providing water repellency is performed before the step of forming an external terminal electrode as described above, the water repellent agent is more likely to penetrate into the interfaces between the ceramic layers and the internal electrodes, and high reliability, such as sufficient electrical insulation and lifetime characteristics, is achieved even when a laminated ceramic electronic component includes ceramic layers having an extremely reduced thickness.
When the water repellent agent includes a silane coupling agent, water repellency is produced by dehydration and condensation at both the ceramic surface and the surface of an oxide film of the metal section, because the silane coupling agent has both an organic functional group and a hydrolyzable group.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.
The FIGURE is a cross-sectional view illustrating a laminated ceramic electronic component 1 produced by a method according to a preferred embodiment of the present invention.
Referring to the FIGURE, a ceramic electronic component 1 preferably includes a component main body 2 having a laminated structure. The component main body 2 preferably includes a plurality of internal electrodes 3 and 4 provided therein. More specifically, the component main body 2 preferably includes a plurality of stacked ceramic layers 5, and a plurality of layered internal electrodes 3 and 4 disposed along the interfaces between the ceramic layers 5.
When the ceramic electronic component 1 defines a laminated ceramic capacitor, the ceramic layers 5 are preferably made of a dielectric ceramic, for example. It is to be noted that the ceramic electronic component 1 may define other components, such as inductors, thermistors, and piezoelectric components. Therefore, depending on the function of the ceramic electronic component 1, the ceramic layers 5 may preferably be composed of a magnetic ceramic, a semiconductor ceramic, and a piezoelectric ceramic, for example, in addition to a dielectric ceramic.
The ends of the plurality of internal electrodes 3 and the ends of the plurality of internal electrodes 4 are respectively exposed at end surfaces 6 and 7 of the component main body 2, and external terminal electrodes 8 and 9 are respectively provided so that the ends of the internal electrodes and the ends of the internal electrodes 4 are electrically connected to each other.
It is to be noted that while the ceramic electronic component 1 is a two-terminal component including the two external terminal electrodes 8 and 9, preferred embodiments of the present invention can be also applied to multi-terminal ceramic electronic components.
Each of the external terminal electrodes 8 and 9 preferably includes, for example, a first electrode layer 10 formed on the exposed surfaces of the internal electrodes 3 and 4 in the component main body 2, that is, on the end surfaces 6 and 7, a second electrode layer 11 formed thereon, and a third electrode layer 12 formed thereon. The first to third electrode layers 10 to 12 provide the following functions.
The first electrode layer 10 electrically connects the plurality of internal electrodes 3 or the plurality of internal electrodes 4 to each other, and preferably includes a highly conductive metal, such as copper, for example, as its main component. On the other hand, the second and third electrode layers 11 and 12 provide and/or improve the mountability of the ceramic electronic component 1. More specifically, the second electrode layer 11 provides the external terminal electrodes 8 and 9 with a solder barrier property, and preferably includes, for example, nickel as its main component. The third electrode layer 12 provides the external terminal electrodes 8 and 9 with solderability, and preferably includes, for example, tin or gold as its main component.
It is to be noted that each of the external terminal electrodes 8 and 9 may include four or more layers, or may include one or two layers, as opposed to the first to third electrode layers 10 to 12 as described above.
Next, a method for producing the ceramic electronic component 1, and in particular, a method for forming the external terminal electrodes 8 and 9 will be described.
First, the component main body 2 is produced in accordance with a well-known method. Next, the external terminal electrodes 8 and 9 are formed on the end surfaces 6 and 7 of the component main body 2 so as to be electrically connected to the internal electrodes 3 and 4, respectively. In this case, the step of forming the first electrode layer 10, the step of forming the second electrode layer 11, and the step of forming the third electrode layer 12 are preferably sequentially performed in the step of forming the external terminal electrodes 8 and 9.
Among the first to third electrode layers 10 to 12, the second and third electrode layers 11 and 12 are preferably formed by an electroless plating method of depositing metal ions with the use of a reducing agent, or an electrolytic plating method through a process of applying an electric current, for example.
On the other hand, the first electrode layer 10 may preferably be formed by the electroless plating method or electrolytic plating method described above, by applying and firing a conductive paste, by applying and curing a conductive resin, or by a thin film formation method such as sputtering, for example.
A case of forming the first electrode layer 10 by plating will be described in more detail. First, in the component main body 2 before performing plating, the plurality of internal electrodes 3 exposed at the one end surface 6 are electrically insulated from each other, and the plurality of internal electrodes 4 exposed at the other end surface 7 are electrically insulated from each other. For the formation of the first electrode layer 10, preferably, metal ions in a plating solution are first deposited on the exposed sections of the respective internal electrodes 3 and 4. Then, the plated depositions are further grown to physically connect the plated depositions on the respective exposed sections of the adjacent internal electrodes 3 and the plated depositions on the respective exposed sections of the adjacent internal electrodes 4. In this manner, the first electrode layer 10 is formed so as to be homogeneous and dense.
When the first electrode layer 10 described above is made of a plating film including, as its main component, copper, for example, which provides favorable throwing power, the efficiency of the plating process is increased, and the fixing strength of the external terminal electrodes 8 and 9 us also increased.
It is to be noted that as shown in the FIGURE, the first electrode layer 10 is preferably formed on the pair of end surfaces 6 and 7 of the component main body 2 so that the end edges of the first electrode layers 10 are located on a pair of principal surfaces 13 and 14 and a pair of side surfaces, which are adjacent to the end surfaces 6 and 7 of the component main body 2. In order to enable the first electrode layers 10 to be efficiently formed, dummy conductors which provide no substantial contribution to the development of electrical properties may preferably be formed so as to be exposed near both ends of the component main body 2 in the stacking direction to promote the plating growth such that metal ions for the formation of the first electrode layers 10 are deposited on the dummy conductors.
In addition, before the plating step described above, the end surfaces 6 and 7 of the component main body 2 are preferably subjected to a polishing treatment in order to sufficiently expose the internal electrodes 3 and 4 as well as the dummy conductors at the end surfaces 6 and 7.
As described above, when the first electrode layer 10 is formed by plating, a heat treatment is preferably performed after the plate processing. This heat treatment forms an interdiffusion layer between each of the internal electrodes 3 and 4 and the first electrode layer 10. This formation of the interdiffusion layer also prevents ingress of moisture into the component main body 2.
In addition, in the present preferred embodiment, a step is preferably performed in which a water repellent agent is used to provide at least the component main body 2 with water repellency. In this case, the water repellent agent is preferably dissolved in a supercritical fluid such as, for example, a supercritical CO2 fluid as a solvent. More specifically, in order to provide the water repellent agent, the water repellent agent is dissolved in a supercritical fluid by encapsulating the water repellent agent and one of the component main body 2 and the ceramic electronic component 1 in a pressure vessel, and introducing a liquid to function as a supercritical fluid into the pressure vessel while adding additional pressure to the liquid with a pump, thereby increasing the temperature and the pressure. Then, the water repellent agent dissolved in the supercritical fluid is maintained for a predetermined period of time to cause the water repellent agent to penetrate into minute voids of the component main body 2 or the ceramic electronic component 1. Then, preferably, the component main body 2 or the ceramic electronic component 1 is removed from the pressure vessel, dried, and then subjected to a heat treatment. In this manner, the step of providing water repellency is completed.
The supercritical fluid used in the step of providing water repellency is preferably highly diffusive, superior in penetration, and highly soluble, for example. Therefore, the water repellent agent dissolved in the supercritical fluid can easily penetrate deeply into minute nano-level voids. Accordingly, this step enables the water repellent agent to sufficiently penetrate deeply into minute nano-level voids present in the component main body 2 or the ceramic electronic component 1. As a result, the component main body 2 or the ceramic electronic component 1 has a sufficient water repellent effect, thereby enabling the reliability of the ceramic electronic component 1, such as electrical insulation or lifetime characteristics, to be significantly improved.
The time at which the step of providing water repellency is performed is not particularly limited. More specifically, the step of providing water repellency may preferable be performed before or after the step of forming an external terminal electrode, or during the step of forming an external terminal electrode, for example, between the step of forming the first electrode layer 10 and the step of forming the second electrode layer 11. Therefore, as described above, the component main body 2 encapsulated in the pressure vessel may include at least a portion of the external terminal electrodes 8 and 9 already formed thereon. In addition, the step of providing water repellency may preferably be performed more than once.
When the step of forming the external terminal electrodes 8 and 9 includes a step of forming a plating film, the water repellent agent effectively prevents the ingress of a plating solution into the component main body 2 as long as the step of forming a plating film is performed after the step of providing water repellency.
In addition, when the step of providing water repellency is performed before the step of forming an external terminal electrode, that is, with no electrode formed on the component main body 2, the water repellent agent can easily penetrate more deeply into the component main body 2. Here, when the component main body 2 has a laminated structure as in the present preferred embodiment, the penetration of the water repellent agent into the interfaces between the ceramic layers 5 and the internal electrodes 3 and 4 prevents the ingress of moisture into the component main body 2, and thus, improves the reliability, such as electrical insulation and lifetime characteristics. In particular, when the step of providing water repellency is performed before the step of forming an external terminal electrode as described above, the water repellent agent is more likely to penetrate into the interfaces between the ceramic layers 5 and the internal electrodes 3 and 4, and high reliability, such as sufficient electrical insulation and lifetime characteristics, is effectively achieved, even if the ceramic layers 5 between the internal electrodes 3 and 4 have a reduced thickness.
As the water repellent agent used in the step of providing water repellency, an organosilicon compound (silane coupling agent) which has both an organic functional group and a hydrolyzable group is preferable. The silane coupling agent provides water repellency by dehydration and condensation at the ceramic surface and the surface of an oxide film of the metal section.
The hydrolysis reaction of the silane coupling agent is developed by the addition of moisture to the silane coupling agent or by moisture adsorbed on the surface to be treated. In order to accelerate the hydrolysis reaction of the silane coupling agent, alcohol or other suitable agent in which water is likely to be dissolved may preferably be used along with the silane coupling agent.
To improve the solubility of the water repellent agent in a supercritical fluid, and to accelerate the hydrolysis reaction of, in particular, a silane coupling agent as the water repellent agent, it is also preferable to use co-solvents, i.e., alcohols.
In addition, after the step of providing water repellency, a step of removing the water repellent agent on at least the outer surface of the component main body 2 is performed, if necessary. This removal step preferably utilizes, for example, a wet removal step (chemical removal step) involving a dissolution treatment, or a dry removal step (mechanical removal step) involving a barrel treatment or a blast treatment.
As described above, the removal step prevents the water repellent agent from interfering with platability and solderability. In addition, regardless of the removal, the component main body 2 is impregnated with the water repellent agent not only at the surface but also deeply therein, and thus, maintains a sufficient water repellent effect. Therefore, a water repellent agent which has a stronger water repellent ability can be used without problems.
In particular, a step of removing the water repellent agent on at least the surface on which a plating film is to be formed before the plating step after the step of providing water repellency reduces the likelihood of defective adhesion of a plating film, even when using a water repellent agent having a stronger water repellent ability.
In addition, after a supercritical fluid is applied to provide a water repellent agent, the water repellent agent may be further provided by normal immersion or vacuum impregnation. This is because the method using a supercritical fluid is useful for penetration into minute pores in a ceramic body, whereas the latter conventional immersion or vacuum impregnation may be preferable for pores with relatively large diameters on the outermost surface.
Next, experimental examples will be described which were performed to confirm the advantageous effects of the present invention.
In Experimental Example 1, the step of providing water repellency was performed, during the process of forming the external terminal electrodes, that is, before a plating process and after a thick film was formed by firing a conductive paste.
A component main body of laminated structure for a laminated ceramic capacitor was prepared, which included ceramic layers made of a barium titanate based dielectric material and Ni internal electrodes, with a Cu thick film formed by firing a conductive paste as a first electrode layer for the external terminal electrode. The component main body had external dimensions of about 2.0 mm×about 1.25 mm×about 1.25 mm. In addition, the thickness of the ceramic layer was about 1 μm between adjacent internal electrodes.
On the other hand, three types of silane coupling agents H, M, and L shown in Table 1 below were prepared as water repellent agents.
TABLE 1 | ||
Silane Coupling | Water | |
Agent | Repellent | |
Symbol | Ability | Composition and Name |
H | High | CF3—CH2—CH2—Si(OCH3)3 |
Trifluoropropyl | ||
trimethoxysilane | ||
M | Middle | CH3—(CH2)9—Si(OCH3)3 |
Decyl trimethoxysilane | ||
L | Low | (CICH2—CH2—CH2—Si(OCH3)3 |
3-Chloropropyl | ||
trimethoxysilane | ||
Next, for samples 1 to 6 as examples of preferred embodiments of the present invention, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 2 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the component main body were encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO2 was introduced into the pressure vessel while adding additional pressure to the liquid CO2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO2.
Then, the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the component main body. Then, the component main body was removed from the pressure vessel.
Next, for samples 1 to 3, the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 4 to 6, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the component main body removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
On the other hand, for samples 7 to 12 as comparative examples as shown in Table 2, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 2 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the component main body immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the component main body. Then, the component main body was removed from the solution of the silane coupling agent.
Next, for samples 7 to 9, the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 10 to 12, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the component main body removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
In addition, the treatment for providing water repellency was not performed for sample 13 as a comparative example, shown in Table 2.
Next, for all of samples 1 to 13, a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were formed sequentially by electrolytic plating on the first electrode layer made of a Cu thick film to obtain laminated ceramic capacitors as samples.
The laminated ceramic capacitors according to each sample were evaluated for the formation of plating film, and subjected to a moisture resistance loading test, as shown in Table 2. For each evaluation item, the number of samples was 100 for each sample number. More specifically, regarding the formation of the plating film, a sample having defective adhesion was determined as being defective by microscopic observation, and the number of defective samples was counted. In addition, in the moisture resistance loading test, a direct-current voltage of about 10V was applied for about 144 hours in an environment with a temperature of about 125° C. and a relative humidity of about 95%, a sample having insulation resistance value after the test less than about 1 MΩ was determined to be defective, and the number of defective samples was counted.
TABLE 2 | ||||||
Number of | ||||||
Silane | Number of | Defectives in | ||||
Water | Cou- | Defectives in | Moisture | |||
Sample | Repellent | Removal | pling | Formation of | Resistance | |
Number | Treatment | Step | Agent | Plating | Loading Test | |
1 | Supercritical | Absence | H | 24/100 | 0/100 | |
|
||||||
2 | Supercritical | Absence | M | 0/100 | 0/100 | |
|
||||||
3 | Supercritical | Absence | L | 0/100 | 0/100 | |
|
||||||
4 | Supercritical | Presence | H | 0/100 | 0/100 | |
|
||||||
5 | Supercritical | Presence | M | 0/100 | 0/100 | |
|
||||||
6 | Supercritical | Presence | L | 0/100 | 0/100 | |
|
||||||
7 | Normal | Absence | H | 25/100 | 0/100 | |
|
||||||
8 | | Absence | M | 12/100 | 2/100 | |
|
||||||
9 | Normal | Absence | L | 0/100 | 4/100 | |
|
||||||
10 | Normal | Presence | H | 0/100 | 4/100 | |
|
||||||
11 | Normal | Presence | M | 0/100 | 3/100 | |
|
||||||
12 | Normal | Presence | L | 0/100 | 4/100 | |
|
||||||
13 | No treatment | — | — | 0/100 | 12/100 | |
A discussion is provided below based on the absence or presence of the step of removing the water repellent agent.
When a comparison is made among samples 7 to 9 which employed normal immersion in the water repellent treatment, the use of the silane coupling agent with a higher water repellent ability caused defective samples in the formation of the plating film, whereas the use of the silane coupling agent with a lower water repellent ability caused defective samples in the moisture resistance loading test. From this result, it was determined that it is difficult to achieve a balance between the formation of a plating film and the moisture resistance loading test in the case of samples 7 to 9 employing normal immersion in the water repellent treatment.
In contrast to samples 7 to 9, when a comparison is made among samples 1 to 3 which employed a supercritical state in the water repellent treatment, as in the case of samples 2 and 3, the use of the silane coupling agent with a relatively low water repellent ability caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the plating film, thus effectively providing a balance between the formation of the plating film and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply.
It is to be noted that the use of the silane coupling agent with a higher water repellent ability as in the case of sample 1 caused defective samples in the formation of the plating film. This problem is overcome by performing the step of removing the water repellent agent as described below.
For samples 10 to 12 which employed normal immersion in the water repellent treatment, the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
In contrast to samples 10 to 12, for samples 4 to 6 which employed a supercritical state in the water repellent treatment, the treatment for removing the water repellent treatment caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the plating film, thus effectively providing a balance between the formation of the plating film and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
It is to be noted that while the use of the silane coupling agent with a higher water repellent ability without the removal step caused defective samples in the formation of the plating film as in the case of sample 1 described above, the use of the silane coupling agent with a higher water repellent ability caused no defective samples in the formation of the plating film for sample 4 because the removal step was performed. From this result, it was determined that it is effective to perform the step of removing the water repellent agent when using the silane coupling agent with a higher water repellent ability.
For sample 13 without the water repellent treatment, no defective samples were produced in the formation of the plating film, whereas many samples were defective in the moisture resistance loading test.
In Experimental Example 2, the step of providing water repellency was performed after the formation of the external terminal electrodes, that is, after a plating process.
As in the component main body prepared in Experimental Example 1 for a laminated ceramic capacitor, more specifically, a component main body of laminated structure for a laminated ceramic capacitor was prepared, which included ceramic layers made of a barium titanate based dielectric material Ni internal electrodes, with a Cu thick film formed by firing a conductive paste as a first electrode layer for the external terminal electrode.
Next, a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were formed sequentially by electrolytic plating on the first electrode layer made of a Cu thick film to obtain laminated ceramic capacitors.
On the other hand, the three types of silane coupling agents H, M, and L shown in Table 1 above were also prepared as water repellent agents in Experiment Example 2.
Next, for samples 21 to 26 as examples of preferred embodiments of the present invention, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 3 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the laminated ceramic capacitor was encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO2 was introduced into the pressure vessel while adding additional pressure to the liquid CO2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO2.
Then, the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the laminated ceramic capacitor. Then, the laminated ceramic capacitor was removed from the pressure vessel.
Next, for samples 21 to 23, the laminated ceramic capacitor removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 24 to 26, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the laminated ceramic capacitor removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
On the other hand, for samples 27 to 32 as comparative examples as shown in Table 3, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 3 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the laminated ceramic capacitor immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the laminated ceramic capacitor. Then, the laminated ceramic capacitor was removed from the solution of the silane coupling agent.
Next, for samples 27 to 29, the laminated ceramic capacitor removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 30 to 32, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the laminated ceramic capacitor removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
In addition, the treatment for providing water repellency was not performed for sample 33 as a comparative example, shown in Table 3. It is to be noted that sample 33 was produced under the same conditions as for sample 13 in Experimental Example 1.
The laminated ceramic capacitors according to each sample were evaluated for the soldering property, and subjected to a moisture resistance loading test, as shown in Table 3. For each evaluation item, the number of samples was 100 for each sample number. More specifically, for the qualitative evaluation of the solderability, the laminated ceramic capacitor was immersed in molten solder in accordance with the test condition specified in JIS C 60068-2-58 (2006), and then evaluated by microscopic observation for an external terminal electrode covered with solder, the sample with its solder coverage less than about 90% at the surface of the external terminal electrode was determined to be a defective sample, and the number of defective samples was calculated. In addition, the evaluations in the moisture resistance loading test were made in the same manner as in Experimental Example 1.
TABLE 3 | |||||
Number of | |||||
Silane | Number of | Defectives in | |||
Water | Cou- | Defectives in | Moisture | ||
Sample | Repellent | Removal | pling | Soldering | Resistance |
Number | Treatment | Step | Agent | Property | Loading Test |
21 | Supercritical | Absence | H | 30/100 | 0/100 |
state | |||||
22 | Supercritical | Absence | M | 0/100 | 0/100 |
state | |||||
23 | Supercritical | Absence | L | 0/100 | 0/100 |
state | |||||
24 | Supercritical | Presence | H | 0/100 | 0/100 |
state | |||||
25 | Supercritical | Presence | M | 0/100 | 0/100 |
state | |||||
26 | Supercritical | Presence | L | 0/100 | 0/100 |
state | |||||
27 | Normal | Absence | H | 33/100 | 0/100 |
immersion | |||||
28 | Normal | Absence | M | 21/100 | 4/100 |
immersion | |||||
29 | Normal | Absence | L | 0/100 | 7/100 |
immersion | |||||
30 | Normal | Presence | H | 0/100 | 7/100 |
immersion | |||||
31 | Normal | Presence | M | 0/100 | 7/100 |
immersion | |||||
32 | Normal | Presence | L | 0/100 | 6/100 |
immersion | |||||
33 | No treatment | — | — | 0/100 | 12/100 |
A discussion is provided below regarding the absence or presence of the step of removing the water repellent agent.
When a comparison is made among samples 27 to 29 which employed normal immersion in the water repellent treatment, the use of the silane coupling agent with a higher water repellent ability caused defective sample in soldering property, whereas the use of the silane coupling agent with a lower water repellent ability caused defective samples in the moisture resistance loading test. From this result, it was determined that it is difficult to achieve a balance between the soldering property and the moisture resistance loading test in the samples 27 to 29 which employed normal immersion in the water repellent treatment.
In contrast to samples 27 to 29, when a comparison is made among samples 21 to 23 which employed a supercritical state in the water repellent treatment, as in the case of samples 22 and 23, the use of the silane coupling agent with a relatively low water repellent ability caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in soldering property, thus providing a balance between the soldering property and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply.
It is to be noted that the use of the silane coupling agent with a higher water repellent ability as in the case of sample 21 caused defective samples in soldering property. This problem is overcome by performing the step of removing the water repellent agent as described below.
For samples 30 to 32 which employed normal immersion in the water repellent treatment, the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
In contrast to these samples, for samples 24 to 26 which employed a supercritical state in the water repellent treatment, the treatment for removing the water repellent treatment caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in soldering property, thus providing a balance between the soldering property and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
It is to be noted that while the use of the silane coupling agent with a higher water repellent ability without the removal step caused defective samples in soldering property as in the case of sample 21 described above, the use of the silane coupling agent with a higher water repellent ability caused no defective samples in soldering property for sample 24 because the removal step was performed. From this result, it was determined that it is effective to perform the step of removing the water repellent agent when the silane coupling agent with a higher water repellent ability is used.
Since sample 33 without the water repellent treatment was produced under the same condition as for sample 13 in Experimental Example 1 as described previously, the same numerical values as shown in Table 2 are indicated for the number of defective samples in soldering property and the number of defect samples in the moisture resistance loading test.
In Experimental Example 3, the step of providing water repellency was performed before the formation of the external terminal electrodes.
A component main body having laminated structure for a laminated ceramic capacitor was prepared, which included ceramic layers made of a barium titanate based dielectric material and Ni internal electrodes. The component main body had external dimensions of about 1.9 mm×about 1.05 mm×about 1.05 mm. In addition, the thickness of the ceramic layer was about 1 μm between adjacent internal electrodes.
In addition, the three types of silane coupling agents H, M, and L shown in Table 1 above were also prepared as water repellent agents in Experiment Example 3.
Next, for samples 41 to 46 as examples of preferred embodiments of the present invention, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 4 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the component main body was encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO2 was introduced into the pressure vessel while adding additional pressure to the liquid CO2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO2.
Then, the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the component main body. Then, the component main body was removed from the pressure vessel.
Next, for samples 41 to 43, the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 44 to 46, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the component main body removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
On the other hand, for samples 47 to 52 as comparative examples as shown in Table 4, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 4 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the component main body immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the component main body. Then, the component main body was removed from the solution of the silane coupling agent.
Next, for samples 47 to 49, the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 50 to 52, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the component main body removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
In addition, the treatment for providing water repellency was not performed for sample 53 as a comparative example, shown in Table 4.
Next, for all of samples 41 to 53, a conductive resin electrode layer as a first electrode layer of the external terminal electrode was formed on the component main body, and a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were then formed sequentially by electrolytic plating on the conductive resin electrode layer, thereby completing a laminated ceramic capacitor.
The laminated ceramic capacitors according to each sample were evaluated for the formation of the external terminal electrodes, and subjected to a moisture resistance loading test, as shown in Table 4. For each evaluation item, the number of samples was 100 for each sample number. More specifically, for evaluating the formation of the external terminal electrodes, the samples were evaluated by stereoscopic microscope under sufficient illumination, a sample with the external terminal electrodes found to have any defects, such as a pinhole, was determined as a defective sample, and the number of defective samples was counted. In addition, the evaluations in the moisture resistance loading test were made in the same manner as in Experimental Example 1.
TABLE 4 | ||||||
Number of | ||||||
Defectives in | Number of | |||||
Silane | Formation of | Defectives in | ||||
Water | Cou- | External | Moisture | |||
Sample | Repellent | Removal | pling | Terminal | Resistance | |
Number | Treatment | Step | Agent | Electrodes | Loading Test | |
41 | | Absence | H | 2/100 | 3/100 | |
state | ||||||
42 | Supercritical | Absence | M | 0/100 | 0/100 | |
state | ||||||
43 | Supercritical | Absence | L | 0/100 | 0/100 | |
state | ||||||
44 | Supercritical | Presence | H | 0/100 | 0/100 | |
state | ||||||
45 | Supercritical | Presence | M | 0/100 | 0/100 | |
state | ||||||
46 | Supercritical | Presence | L | 0/100 | 0/100 | |
state | ||||||
47 | | Absence | H | 3/100 | 4/100 | |
immersion | ||||||
48 | Normal | Absence | M | 0/100 | 4/100 | |
immersion | ||||||
49 | Normal | Absence | L | 0/100 | 5/100 | |
immersion | ||||||
50 | Normal | Presence | H | 0/100 | 18/100 | |
immersion | ||||||
51 | Normal | Presence | M | 0/100 | 20/100 | |
immersion | ||||||
52 | Normal | Presence | L | 0/100 | 21/100 | |
immersion | ||||||
53 | No treatment | — | — | 0/100 | 21/100 | |
A discussion is provided below regarding the absence or presence of the step of removing the water repellent agent.
When a comparison is made among samples 47 to 49 which employed normal immersion in the water repellent treatment, the use of the silane coupling agent with a higher water repellent ability caused defective samples in the formation of the external terminal electrodes. In addition, for all of samples 47 to 49, defective samples were caused in the moisture resistance loading test.
In contrast to these samples, when a comparison is made among samples 41 to 43 which employed a supercritical state in the water repellent treatment, as in samples 42 and 43, the use of the silane coupling agent with a relatively low water repellent ability caused no defectives samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the external terminal electrodes, thus providing a balance between the formation of the external terminal electrodes and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply.
It is to be noted that the use of the silane coupling agent with a higher water repellent ability as in the case of sample 41 caused defective samples in the formation of the external terminal electrodes and defective samples in the moisture resistance loading test. This problem is overcome performing the step of removing the water repellent agent as described below.
For samples 50 to 52 which employed normal immersion in the water repellent treatment, the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
In contrast to samples 50 to 52, for samples 44 to 46 which employed a supercritical state in the water repellent treatment, the treatment for removing the water repellent agent caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the external terminal electrodes, thus providing a balance between the formation of the external terminal electrodes and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
It is to be noted that while the use of the silane coupling agent with a higher water repellent ability without the removal step caused defective samples in the formation of the external terminal electrodes and defective samples in the moisture resistance loading test as in sample 41 described above, the use of the silane coupling agent with a higher water repellent ability caused no defective samples in the formation of the external terminal electrodes and caused no defective samples in the moisture resistance loading test for sample 44 because the removal step was performed. From this result, it was determined that it is effective to perform the step of removing the water repellent agent when using the silane coupling agent with a higher water repellent ability.
For sample 53 without the water repellent treatment, no defective samples were caused in the formation of the external terminal electrodes, whereas many defective samples were caused in the moisture resistance loading test.
In Experimental Example 4, the step of providing water repellency was performed before the formation of the external terminal electrodes as in the case of Experimental Example 3, and a step of Cu electrolytic plating was performed instead of the step of forming a conductive resin electrode layer as a first electrode layer of the external terminal electrode in Experimental Example 3.
As in the case of the component main body prepared in Experimental Example 3, a component main body for a laminated ceramic capacitor was prepared.
In addition, the three types of silane coupling agents H, M, and L shown in Table 1 above were also prepared as water repellent agents in Experiment Example 4.
Next, for samples 61 to 66 as examples of preferred embodiments of the present invention, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 5 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, about 1.5 ml of the selected silane coupling agent and the component main body was encapsulated in a pressure vessel having an inner volume of about 50 ml for supercritical treatment, liquid CO2 was introduced into the pressure vessel while adding additional pressure to the liquid CO2 with a pump, so that the water repellent agent in the supercritical fluid had a concentration of about 3 volume %, and the temperature and the pressure were increased until reaching a temperature of about 40° C. and a pressure of about 25 MPa, thereby dissolving the water repellent agent in the supercritical CO2.
Then, the water repellent agent dissolved in the supercritical fluid was maintained for about 3 hours to cause the water repellent agent to penetrate into minute voids of the component main body. Then, the component main body was taken out of the pressure vessel.
Next, for samples 61 to 63, the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 64 to 66, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the component main body removed from the pressure vessel was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes.
On the other hand, for samples 67 to 72 as comparative examples as shown in Table 5, the silane coupling agent shown in the column “Silane Coupling Agent” in Table 5 was selected from among the three types of silane coupling agents H, M, and L shown in Table 1, the selected silane coupling agent was dissolved in isopropyl alcohol so as to be about 3 volume %, the component main body immersed in the solution of the silane coupling agent was maintained at a temperature of about 40° C. for about 3 hours, thereby causing the water repellent agent to penetrate into the component main body. Then, the component main body was removed from the solution of the silane coupling agent.
Next, for samples 67 to 69, the component main body removed from the pressure vessel was dried, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, for samples 70 to 72, in order to confirm the effect of the step of removing the water repellent agent after the water repellent treatment, the component main body removed from the solution of the silane coupling agent was immersed in isopropyl alcohol for about 30 seconds before drying to remove the water repellent agent on the surface, and then subjected to a heat treatment at a temperature of about 150° C. for about 30 minutes. In addition, the treatment for providing water repellency was not performed for sample 73 as a comparative example, shown in Table 5.
Next, for all of samples 61 to 73, a Cu electrolytic plating film was formed as a first electrode layer of the external terminal electrode. More specifically, Cu ions in a plating solution were deposited on the exposed ends of the plurality of internal electrodes exposed at the end surfaces of the component main body, and the Cu plated depositions were further grown to form Cu electrolytic plating films by physical connections between the respective mutually cross-linked exposed ends of adjacent internal electrodes.
Next, a Ni plating film as a second electrode layer and a Sn plating film as a third electrode layer were formed sequentially by electrolytic plating on the Cu electrolytic plating film as a first electrode layer of the external terminal electrode, thereby completing a laminated ceramic capacitor.
The laminated ceramic capacitors according to each sample were evaluated for the formation of external terminal electrodes, and subjected to a moisture resistance loading test, as shown in Table 5, in the same manner as in Experimental Example 3.
TABLE 5 | ||||||
Number of | ||||||
Defectives in | Number of | |||||
Silane | Formation of | Defectives in | ||||
Water | Cou- | External | Moisture | |||
Sample | Repellent | Removal | pling | Terminal | Resistance | |
Number | Treatment | Step | Agent | Electrodes | Loading Test | |
61 | | Absence | H | 10/100 | 13/100 | |
state | ||||||
62 | Supercritical | Absence | M | 0/100 | 0/100 | |
state | ||||||
63 | Supercritical | Absence | L | 0/100 | 0/100 | |
state | ||||||
64 | Supercritical | Presence | H | 0/100 | 0/100 | |
state | ||||||
65 | Supercritical | Presence | M | 0/100 | 0/100 | |
state | ||||||
66 | Supercritical | Presence | L | 0/100 | 0/100 | |
state | ||||||
67 | | Absence | H | 12/100 | 15/100 | |
immersion | ||||||
68 | Normal | Absence | M | 0/100 | 16/100 | |
immersion | ||||||
69 | Normal | Absence | L | 0/100 | 25/100 | |
immersion | ||||||
70 | Normal | Presence | H | 0/100 | 89/100 | |
immersion | ||||||
71 | Normal | Presence | M | 0/100 | 89/100 | |
immersion | ||||||
72 | Normal | Presence | L | 0/100 | 90/100 | |
immersion | ||||||
73 | No treatment | — | — | 0/100 | 90/100 | |
A discussion is provided below regarding the absence or presence of the step of removing the water repellent agent.
When a comparison is made among samples 67 to 69 which employed normal immersion in the water repellent treatment, the use of the silane coupling agent with a higher water repellent ability caused defective samples in the formation of the external terminal electrodes. In addition, for all of samples 67 to 69, defective samples were caused in the moisture resistance loading test.
In contrast to these samples, when a comparison is made among samples 61 to 63 which employed a supercritical state in the water repellent treatment, as in the case of samples 62 and 63, the use of the silane coupling agent with a relatively low water repellent ability caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the external terminal electrodes, thus providing a balance between the formation of the external terminal electrodes and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply.
It is to be noted that the use of the silane coupling agent with a higher water repellent ability as in the case of sample 61 caused defective samples in the formation of the external terminal electrodes and defective samples in the moisture resistance loading test. This problem is overcome by performing the step of removing the water repellent agent as described below.
For samples 70 to 72 which employed normal immersion in the water repellent treatment, the treatment for removing the water repellent agent decreased the water repellent ability at the surface, thereby causing defective samples in the moisture resistance loading test.
In contrast to these samples, for samples 64 to 66 which employed a supercritical state in the water repellent treatment, the treatment for removing the water repellent agent caused no defective samples in the moisture resistance loading test, and furthermore, caused no defective samples in the formation of the external terminal electrodes, thus providing a balance between the formation of the external terminal electrodes and the moisture resistance loading test. This is assumed to be because the water repellent agent penetrates more deeply, thereby preventing the internal ingress of moisture even after the removal step.
It is to be noted that while the use of the silane coupling agent with a higher water repellent ability without the removal step caused defective samples in the formation of the external terminal electrodes and defective samples in the moisture resistance loading test as in the case of sample 61 described above, the use of the silane coupling agent with a higher water repellent ability caused no defective samples in the formation of the external terminal electrodes and caused no defective samples in the moisture resistance loading test for sample 64 because the removal step was performed. From this result, it was determined that it is effective to perform the step of removing the water repellent agent when using the silane coupling agent with a higher water repellent ability.
For sample 73 without the water repellent treatment, no defective samples were caused in the formation of the external terminal electrodes, whereas many defective samples were caused in the moisture resistance loading test.
While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
Claims (4)
1. A method for producing a ceramic electronic component, comprising:
a step of preparing a component main body including a pair of end surfaces, a pair of principal surfaces, a pair of side surfaces, a ceramic layer, and an internal electrode;
a step of forming an external terminal electrode on a portion of the pair of principal surfaces, a portion of the pair of side surfaces, and an entirety of the pair of end surfaces, the step of forming the external terminal electrode including at least a step of forming a first electrode layer by applying and firing a conductive paste; and
before the step of forming the first electrode layer, a step of providing water repellency including a step of providing a water repellent agent by dehydration and condensation on at least the portion of the pair of principal surfaces, at least the portion of the pair of side surfaces, the entirety of the pair of end surfaces, and a surface of an oxide film of the internal electrode; wherein
the water repellent agent comprises a CF3group.
2. The method for producing a ceramic electronic component according to claim 1 , wherein the step of forming the external terminal electrode further includes a step of forming a second electrode layer;
the step of forming the second electrode layer comprises a step of forming a plating film; and
the step of forming the plating film is performed after the step of providing water repellency.
3. The method for producing a ceramic electronic component according to claim 2 , further comprising a step of removing the water repellent agent from at least one of the surfaces of the component main body on which the plating film is to be formed, after the step of providing water repellency and before the step of forming a plating film.
4. The method for producing a ceramic electronic component according to claim 1 , wherein the component main body has a laminated structure including a plurality of stacked ceramic layers and a plurality of internal electrodes formed along specific interfaces between the ceramic layers and being partially exposed, the plurality of stacked ceramic layers including the ceramic layer and the plurality of internal electrodes including the internal electrode; and
the step of forming the external terminal electrode comprises a step of forming the external terminal electrode on the pair of end surfaces of the component main body to electrically connect the external terminal electrode to the plurality of internal electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/749,741 US9490066B2 (en) | 2010-05-19 | 2013-01-25 | Method for producing ceramic electronic component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010114923 | 2010-05-19 | ||
JP2010-114923 | 2010-05-19 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/749,741 Continuation US9490066B2 (en) | 2010-05-19 | 2013-01-25 | Method for producing ceramic electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
US20110287176A1 US20110287176A1 (en) | 2011-11-24 |
US9704649B2 true US9704649B2 (en) | 2017-07-11 |
Family
ID=44972696
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/105,926 Active US9704649B2 (en) | 2010-05-19 | 2011-05-12 | Method for producing ceramic electronic component |
US13/749,741 Active US9490066B2 (en) | 2010-05-19 | 2013-01-25 | Method for producing ceramic electronic component |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/749,741 Active US9490066B2 (en) | 2010-05-19 | 2013-01-25 | Method for producing ceramic electronic component |
Country Status (4)
Country | Link |
---|---|
US (2) | US9704649B2 (en) |
JP (2) | JP5768471B2 (en) |
KR (1) | KR101200686B1 (en) |
CN (2) | CN102290239B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190304684A1 (en) * | 2016-12-27 | 2019-10-03 | Murata Manufacturing Co., Ltd. | Method for selectively coating electronic component with coating material, and method for manufacturing electronic component |
US11227724B2 (en) * | 2018-10-29 | 2022-01-18 | Samsung Electro-Mechanics Co., Ltd. | Method of manfacturing multilayer ceramic capacitor and multilayer ceramic capacitor |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102097329B1 (en) * | 2013-09-12 | 2020-04-06 | 삼성전기주식회사 | Multi-layered ceramic capacitor, manufacturing method thereof and board for mounting the same |
CN103773226B (en) * | 2013-12-20 | 2015-12-02 | 深圳顺络电子股份有限公司 | A kind of method of hydrophobic sol and solution slice component outer electrode slurry sagging |
US9390858B2 (en) * | 2014-04-03 | 2016-07-12 | Murata Manufacturing Co., Ltd. | Electronic component, method of manufacturing the same, and mount structure of electronic component |
JP2015053528A (en) * | 2014-12-11 | 2015-03-19 | 株式会社村田製作所 | Multilayer ceramic electronic component |
KR102037264B1 (en) * | 2014-12-15 | 2019-10-29 | 삼성전기주식회사 | Device for embedded substrate, method of manufacturing the same and printed circuit board with embedded device |
WO2016153028A1 (en) * | 2015-03-26 | 2016-09-29 | 京セラ株式会社 | Substrate with built-in capacitor, interposer and mounted substrate |
JP2017059604A (en) * | 2015-09-15 | 2017-03-23 | 株式会社村田製作所 | Method of manufacturing electronic component |
CN105575831B (en) * | 2015-12-21 | 2018-01-12 | 深圳顺络电子股份有限公司 | A kind of method for the external electrode for making electronic component |
CN105469954A (en) * | 2015-12-31 | 2016-04-06 | 中山因塞施特电子科技有限公司 | Electrode of metal powder matrix inductor and preparation method thereof |
CN105622166B (en) * | 2016-01-12 | 2018-09-11 | 武汉理工大学 | A kind of processing method on silane coupler modified titanium boride ceramics surface |
JP6852327B2 (en) * | 2016-09-20 | 2021-03-31 | 株式会社村田製作所 | Multilayer ceramic electronic components |
JP6852326B2 (en) * | 2016-09-20 | 2021-03-31 | 株式会社村田製作所 | Multilayer ceramic electronic components |
DE112018001802T5 (en) | 2017-03-28 | 2019-12-12 | Tdk Corporation | RECHARGEABLE SOLIDS LITHIUMION BATTERY AND COMPOSITE BODY |
DE102020100154A1 (en) | 2019-01-21 | 2020-07-23 | Taiyo Yuden Co., Ltd. | CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR THE SAME |
US10937596B2 (en) * | 2019-02-06 | 2021-03-02 | Tdk Corporation | Electronic component |
DE102020107286A1 (en) | 2019-03-28 | 2020-10-01 | Taiyo Yuden Co., Ltd. | Multi-layer ceramic capacitor and method for its manufacture |
JP7243487B2 (en) * | 2019-06-27 | 2023-03-22 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic capacitor |
JP7481064B2 (en) | 2019-11-19 | 2024-05-10 | 太陽誘電株式会社 | Ceramic electronic components and their manufacturing method |
JP7115461B2 (en) * | 2019-12-12 | 2022-08-09 | 株式会社村田製作所 | Multilayer ceramic capacitor |
JP2021097078A (en) | 2019-12-13 | 2021-06-24 | 太陽誘電株式会社 | Ceramic electronic component and manufacturing method thereof |
CN114249897A (en) * | 2020-09-24 | 2022-03-29 | 深圳市鸿信顺电子材料有限公司 | Impregnation liquid and application thereof in surface treatment process of sheet type element |
KR20220087860A (en) | 2020-12-18 | 2022-06-27 | 삼성전기주식회사 | Mutilayer electronic component and method for manufacturing the same |
KR20220087974A (en) | 2020-12-18 | 2022-06-27 | 삼성전기주식회사 | Electronic component and fabricating method thereof |
CN113834315A (en) * | 2021-11-26 | 2021-12-24 | 江苏鑫华半导体材料科技有限公司 | Method and system for drying polycrystalline silicon |
CN115635385B (en) * | 2022-09-30 | 2023-06-20 | 广东微容电子科技有限公司 | Chamfering method of MLCC |
Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04151814A (en) | 1990-10-16 | 1992-05-25 | Taiyo Yuden Co Ltd | Chip type electronic part and terminal electrode formation method |
JP2000220074A (en) | 1998-11-26 | 2000-08-08 | Toray Ind Inc | Production of fiber-treating agent and fibrous structural material |
US6171644B1 (en) * | 1996-01-24 | 2001-01-09 | Matsushita Electric Industrial Co., Ltd. | Electronic component and method of manufacture therefor |
JP2001102247A (en) | 1999-09-30 | 2001-04-13 | Kyocera Corp | Chip electronic component |
JP2001110670A (en) | 1999-10-07 | 2001-04-20 | Matsushita Electric Ind Co Ltd | Ceramic electronic component and its manufacturing method |
US6287640B1 (en) * | 1997-05-30 | 2001-09-11 | Micell Technologies, Inc. | Surface treatment of substrates with compounds that bind thereto |
WO2001078171A1 (en) | 2000-04-07 | 2001-10-18 | Daikin Industries, Ltd. | Additive for electrode |
JP3304798B2 (en) | 1997-01-28 | 2002-07-22 | 松下電器産業株式会社 | Electronic component and method of manufacturing the same |
US20030007314A1 (en) * | 2001-03-26 | 2003-01-09 | Yukio Sanada | Ceramic electronic component and method of producing the same |
JP3444291B2 (en) | 2001-03-26 | 2003-09-08 | 株式会社村田製作所 | Ceramic electronic component and method of manufacturing the same |
US20050046536A1 (en) | 2002-04-15 | 2005-03-03 | Ritter Andrew P. | Plated terminations |
US6960366B2 (en) | 2002-04-15 | 2005-11-01 | Avx Corporation | Plated terminations |
US6972942B2 (en) | 2002-04-15 | 2005-12-06 | Avx Corporation | Plated terminations |
US6982863B2 (en) | 2002-04-15 | 2006-01-03 | Avx Corporation | Component formation via plating technology |
JP2006057042A (en) | 2004-08-23 | 2006-03-02 | Howa Kk | Method for impregnation treatment |
US20060234022A1 (en) * | 2005-04-15 | 2006-10-19 | Inpaq Technology Co., Ltd. | Ceramic glaze coating structure of a chip element and method of forming the same |
US20070014075A1 (en) | 2002-04-15 | 2007-01-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
US7177137B2 (en) | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
WO2007119281A1 (en) | 2006-03-15 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing same |
JP2007281125A (en) | 2006-04-05 | 2007-10-25 | Murata Mfg Co Ltd | Electronic component |
US7345868B2 (en) | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
US20080123249A1 (en) | 2006-02-27 | 2008-05-29 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
US20080123248A1 (en) | 2005-10-28 | 2008-05-29 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
US20080199977A1 (en) * | 2007-02-15 | 2008-08-21 | Air Products And Chemicals, Inc. | Activated Chemical Process for Enhancing Material Properties of Dielectric Films |
JP2008235698A (en) | 2007-03-22 | 2008-10-02 | Murata Mfg Co Ltd | Laminated ceramic electronic component and manufacturing method therefor |
US7463474B2 (en) | 2002-04-15 | 2008-12-09 | Avx Corporation | System and method of plating ball grid array and isolation features for electronic components |
US20110252629A1 (en) | 2008-12-25 | 2011-10-20 | Murata Manufacturing Co., Ltd. | Method for producing ceramic body |
US20110273056A1 (en) * | 2008-12-26 | 2011-11-10 | Murata Manufacturing Co., Ltd. | Method for manufacturing ceramic electronic component and ceramic electronic component |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4552786A (en) * | 1984-10-09 | 1985-11-12 | The Babcock & Wilcox Company | Method for densification of ceramic materials |
US6303523B2 (en) * | 1998-02-11 | 2001-10-16 | Applied Materials, Inc. | Plasma processes for depositing low dielectric constant films |
WO2005104148A1 (en) * | 2004-04-23 | 2005-11-03 | Murata Manufacturing Co., Ltd. | Electronic component and manufacturing method thereof |
JP2007234828A (en) * | 2006-02-28 | 2007-09-13 | Tdk Corp | Electronic component and manufacturing method thereof |
JP2009295602A (en) * | 2006-08-22 | 2009-12-17 | Murata Mfg Co Ltd | Laminated electronic component, and method for manufacturing laminated electronic component |
JP4767197B2 (en) | 2007-02-27 | 2011-09-07 | 三洋電機株式会社 | Manufacturing method of solid electrolytic capacitor |
-
2011
- 2011-04-27 JP JP2011099123A patent/JP5768471B2/en active Active
- 2011-04-28 KR KR1020110040048A patent/KR101200686B1/en active IP Right Grant
- 2011-04-29 CN CN201110114209.7A patent/CN102290239B/en active Active
- 2011-04-29 CN CN2013100058826A patent/CN103077825A/en active Pending
- 2011-05-12 US US13/105,926 patent/US9704649B2/en active Active
-
2013
- 2013-01-08 JP JP2013000955A patent/JP2013062550A/en active Pending
- 2013-01-25 US US13/749,741 patent/US9490066B2/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04151814A (en) | 1990-10-16 | 1992-05-25 | Taiyo Yuden Co Ltd | Chip type electronic part and terminal electrode formation method |
US6171644B1 (en) * | 1996-01-24 | 2001-01-09 | Matsushita Electric Industrial Co., Ltd. | Electronic component and method of manufacture therefor |
JP3304798B2 (en) | 1997-01-28 | 2002-07-22 | 松下電器産業株式会社 | Electronic component and method of manufacturing the same |
US6287640B1 (en) * | 1997-05-30 | 2001-09-11 | Micell Technologies, Inc. | Surface treatment of substrates with compounds that bind thereto |
JP2000220074A (en) | 1998-11-26 | 2000-08-08 | Toray Ind Inc | Production of fiber-treating agent and fibrous structural material |
JP2001102247A (en) | 1999-09-30 | 2001-04-13 | Kyocera Corp | Chip electronic component |
JP4167360B2 (en) | 1999-09-30 | 2008-10-15 | 京セラ株式会社 | Chip-type electronic components |
JP2001110670A (en) | 1999-10-07 | 2001-04-20 | Matsushita Electric Ind Co Ltd | Ceramic electronic component and its manufacturing method |
WO2001078171A1 (en) | 2000-04-07 | 2001-10-18 | Daikin Industries, Ltd. | Additive for electrode |
US20030158310A1 (en) | 2000-04-07 | 2003-08-21 | Michio Asano | Additive for electrode |
US20030007314A1 (en) * | 2001-03-26 | 2003-01-09 | Yukio Sanada | Ceramic electronic component and method of producing the same |
JP3444291B2 (en) | 2001-03-26 | 2003-09-08 | 株式会社村田製作所 | Ceramic electronic component and method of manufacturing the same |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7344981B2 (en) | 2002-04-15 | 2008-03-18 | Avx Corporation | Plated terminations |
US6982863B2 (en) | 2002-04-15 | 2006-01-03 | Avx Corporation | Component formation via plating technology |
US7463474B2 (en) | 2002-04-15 | 2008-12-09 | Avx Corporation | System and method of plating ball grid array and isolation features for electronic components |
US7067172B2 (en) | 2002-04-15 | 2006-06-27 | Avx Corporation | Component formation via plating technology |
US20050046536A1 (en) | 2002-04-15 | 2005-03-03 | Ritter Andrew P. | Plated terminations |
US6960366B2 (en) | 2002-04-15 | 2005-11-01 | Avx Corporation | Plated terminations |
US7154374B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Plated terminations |
US7161794B2 (en) | 2002-04-15 | 2007-01-09 | Avx Corporation | Component formation via plating technology |
US20070014075A1 (en) | 2002-04-15 | 2007-01-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
US7177137B2 (en) | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
US6972942B2 (en) | 2002-04-15 | 2005-12-06 | Avx Corporation | Plated terminations |
US20080158774A1 (en) | 2002-10-07 | 2008-07-03 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
US7345868B2 (en) | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
JP2006057042A (en) | 2004-08-23 | 2006-03-02 | Howa Kk | Method for impregnation treatment |
US20060234022A1 (en) * | 2005-04-15 | 2006-10-19 | Inpaq Technology Co., Ltd. | Ceramic glaze coating structure of a chip element and method of forming the same |
US20080123248A1 (en) | 2005-10-28 | 2008-05-29 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
US20080123249A1 (en) | 2006-02-27 | 2008-05-29 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
US20080151470A1 (en) * | 2006-03-15 | 2008-06-26 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing the same |
WO2007119281A1 (en) | 2006-03-15 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Laminated electronic component and method for manufacturing same |
JP2007281125A (en) | 2006-04-05 | 2007-10-25 | Murata Mfg Co Ltd | Electronic component |
US20080199977A1 (en) * | 2007-02-15 | 2008-08-21 | Air Products And Chemicals, Inc. | Activated Chemical Process for Enhancing Material Properties of Dielectric Films |
JP2008235698A (en) | 2007-03-22 | 2008-10-02 | Murata Mfg Co Ltd | Laminated ceramic electronic component and manufacturing method therefor |
US20110252629A1 (en) | 2008-12-25 | 2011-10-20 | Murata Manufacturing Co., Ltd. | Method for producing ceramic body |
CN102265359A (en) | 2008-12-25 | 2011-11-30 | 株式会社村田制作所 | Process for producing ceramic body |
US20110273056A1 (en) * | 2008-12-26 | 2011-11-10 | Murata Manufacturing Co., Ltd. | Method for manufacturing ceramic electronic component and ceramic electronic component |
Non-Patent Citations (8)
Title |
---|
Motoki et al., "Laminated Electronic Component and Manufacturing Method Therefor", U.S. Appl. No. 12/781,058, filed May 17, 2010. |
Motoki et al., "Laminated Electronic Component and Method for Manufacturing the Same", U.S. Appl. No. 12/043,225, filed Mar. 6, 2008. |
Official Communication issued in corresponding Japanese Patent Application No. 2011-099123, mailed on Oct. 7, 2014. |
Official Communication issued in corresponding Japanese Patent Application No. 2013-000955, mailed on Apr. 22, 2014. |
Official Communication issued in corresponding Japanese Patent Application No. 2013-000955, mailed on Jan. 14, 2014. |
Ogawa et al., "Laminated Electronic Component and Manufacturing Method Therefor", U.S. Appl. No. 12/788,340, filed May 27, 2010. |
Saito, et al.; "Method for Producing Ceramic Electronic Component"; U.S. Appl. No. 13/749,741, filed Jan. 25, 2013. |
Saruban et al., "Laminated Electronic Component and Manufacturing Method Therefor", U.S. Appl. No. 13/020,886, filed Feb. 4, 2011. |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190304684A1 (en) * | 2016-12-27 | 2019-10-03 | Murata Manufacturing Co., Ltd. | Method for selectively coating electronic component with coating material, and method for manufacturing electronic component |
US11802348B2 (en) * | 2016-12-27 | 2023-10-31 | Murata Manufacturing Co., Ltd. | Method for selectively coating electronic component with coating material, and method for manufacturing electronic component |
US11227724B2 (en) * | 2018-10-29 | 2022-01-18 | Samsung Electro-Mechanics Co., Ltd. | Method of manfacturing multilayer ceramic capacitor and multilayer ceramic capacitor |
Also Published As
Publication number | Publication date |
---|---|
KR101200686B1 (en) | 2012-11-12 |
CN102290239B (en) | 2014-04-23 |
CN102290239A (en) | 2011-12-21 |
JP2012004544A (en) | 2012-01-05 |
JP5768471B2 (en) | 2015-08-26 |
US20110287176A1 (en) | 2011-11-24 |
US20130141836A1 (en) | 2013-06-06 |
KR20110127594A (en) | 2011-11-25 |
US9490066B2 (en) | 2016-11-08 |
JP2013062550A (en) | 2013-04-04 |
CN103077825A (en) | 2013-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9490066B2 (en) | Method for producing ceramic electronic component | |
JP5459487B2 (en) | Multilayer electronic component and manufacturing method thereof | |
JP5439954B2 (en) | Multilayer electronic component and manufacturing method thereof | |
KR101136173B1 (en) | Laminated electronic component and manufacturing method therefor | |
KR100975757B1 (en) | Laminated electronic component and method for manufacturing same | |
US8520362B2 (en) | Laminated ceramic electronic component and manufacturing method therefor | |
US20090052114A1 (en) | Multilayer electronic component and method for manufacturing the same | |
US20180240584A1 (en) | Ceramic electronic component and manufacturing method therefor | |
JP2008251751A (en) | Electronic component, and manufacturing method thereof | |
JP3304798B2 (en) | Electronic component and method of manufacturing the same | |
KR100432182B1 (en) | Ceramic electronic part and method of producing the same | |
JPWO2002082480A1 (en) | Ceramic electronic component and its manufacturing method | |
JP2001110670A (en) | Ceramic electronic component and its manufacturing method | |
CN113363029A (en) | Electronic component packaging structure and manufacturing method thereof | |
JP2012243786A (en) | Ceramic electronic component manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MURATA MANUFACTURING CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SAITO, JUNICHI;KOBAYASHI, TOSHIHIKO;OGAWA, MAKOTO;AND OTHERS;SIGNING DATES FROM 20110428 TO 20110506;REEL/FRAME:026266/0201 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |