US9593876B2 - Cooling electronic devices installed in a subsurface environment - Google Patents

Cooling electronic devices installed in a subsurface environment Download PDF

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US9593876B2
US9593876B2 US14/378,261 US201314378261A US9593876B2 US 9593876 B2 US9593876 B2 US 9593876B2 US 201314378261 A US201314378261 A US 201314378261A US 9593876 B2 US9593876 B2 US 9593876B2
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containment vessel
thermally conductive
conductive fluid
electronic devices
interior space
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US20150000319A1 (en
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David Smith
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/06—Heat pumps characterised by the source of low potential heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D1/00—Devices using naturally cold air or cold water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/0052—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using the ground body or aquifers as heat storage medium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2331/00—Details or arrangements of other cooling or freezing apparatus not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage
    • Y02E60/142—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E70/00—Other energy conversion or management systems reducing GHG emissions
    • Y02E70/30—Systems combining energy storage with energy generation of non-fossil origin

Definitions

  • This disclosure relates to a system and method for geothermally cooling electronic devices, including but not limited to computer systems, by installing the electronic devices in subsurface environments such as boreholes, excavations, or bodies of water.
  • heat generated by the internal electronic components of computing devices has long been a significant factor determining the overall system design of computer systems.
  • the most common forms of heat dissipation in early personal computer designs were direct physical contact between the heat-generating integrated circuit chip and a heat-conducting mass such as aluminum, and non-turbulent airflow, typically generated by electrical fans, to circulate cool air through a space interior to the computer system housing.
  • heat dissipation consisted primarily of ventilation apertures in housings, followed by ambient-air fans and blowers which cooled by forced air convection.
  • the cooling capacity of the earth's subsurface has long been recognized as a potential energy-saving feature of systems that cool inhabited environments. Because the subsurface maintains essentially a constant temperature at a given depth and the rock and/or artesian mass and volume of the subsurface are vast, heat can be exchanged with either warmer surface fluid, thereby providing cooling, or cooler surface fluid, thereby providing warming. Vignal and Chapuis, in U.S. Pat. No. 3,965,694 (1976) describe a means of exchanging heat with the earth's subsurface via a U-shaped line or pipe buried in a deep hole bored in the earth; their design is directed at systems for warming or cooling above-ground air. Many devices since then have been disclosed that improve on various aspects of air-conditioning designs and provide for more efficient heat transfer between above-ground fluids and subsurface rock or liquid.
  • Kidwell and Fraim describes a method and apparatus for using coaxial flow heat exchanging structures for regulating the temperature of heat-generating electronics installed in the base housing of an electromagnetic signal transmission/reception tower. The heat transfer is effected using a fluid flow loop from the surface to the underground environment and back to the surface.
  • Chainer in U.S. Pat. Application No. 2013/0081781 describes a system for data center cooling wherein heat transfer fluid is removed from the indoor volume of the data center and cooled via ambient air and geothermal heat exchange processes.
  • Attlesey, et al. in U.S. Pat. No. 7,724,517 (2010) disclose a design of a case for a liquid submersion cooled electronic device; the embodiments described therein include a liquid-tight case for enclosing electronic equipment, with at least a portion of one of the walls composed of translucent or transparent material for visibility into the interior of the case.
  • Attlesey describes cooling of electronic equipment by means of a dielectric liquid circulating in and through a fluid-tight container.
  • Tufty et al. disclose a similar approach in U.S. Pat. Application No. 2013/0081790 (April 2013).
  • Campbell, et al. in U.S. Pat. No. 7,961,475 describe an apparatus and method for immersion cooling of one or more electronic subsystems in which cooling fluid passes in and out of one or more containers docked within an electronics rack.
  • At least one embodiment described herein provides a geothermal cooling mechanism for electronic devices and systems of devices, including but not limited to computer hardware systems, installed in a subsurface environment.
  • the design provides a significant improvement in long-term electronic equipment operating costs by eliminating the need to remove heat from the human-inhabited environment of the facility in which the hardware is installed.
  • the increased cooling capability of the subsurface environment is likely to lead to a lower average operating temperature of the hardware, which will translate into a longer average operational lifetime of the hardware.
  • the design also results in a very high security physical installation for electronic equipment systems.
  • the computer hardware or other electronic equipment can be installed as individual units or in a high-density configuration. Designs are optimized for effective and efficient direct transfer of thermal energy away from heat-generating electronics into the surrounding environment.
  • the computer systems dissipates internally generated heat from the surface of an enclosure to the near-infinite cooling mass of the earth's underground or a large body of water, either through direct contact, or using a heat-transporting fluid in contact with at least some portion of the outer surfaces of the individual components or subsystems within the installation.
  • fluid is intended to include gases (e.g. atmospheric air, helium, nitrogen, etc), liquids (e.g. mineral oil, silicone oil, water), etc. or a combination of gases and liquids.
  • the exterior surface of the enclosure is preferably composed of materials conducive to heat transfer.
  • the enclosure has entrances, optionally liquid-tight, for power, networking, and other control and monitoring signals and functions. Heat may be transferred from the fluid directly into the subsurface environment via passive or forced circulation, or the fluid may be circulated away from the computer hardware enclosure or containment vessel, cooled in a remote location, then re-circulated back to the computer hardware enclosure or containment vessel at a lower temperature.
  • the installation can be in any orientation and can be positioned at the surface or any distance below the surface, with or without direct contact to the above-surface environment.
  • the computer system casing may be of solid construction, or it may be of a hollow construction that provides an increased surface area and a channel through which may flow fluid for heat transfer.
  • Computer system casing units may be stacked or grouped together to form a single structural unit, or they may be in close proximity as single units not in direct contact with other units.
  • FIG. 1 shows a conceptual cross-section of a convection type geothermal cooled computer hardware system designed for subsurface installation according to an embodiment of the disclosed subject matter.
  • FIG. 2 shows a conceptual cross-section of a heat exchanger type geothermal cooled computer hardware system designed for subsurface installation according to an embodiment of the disclosed subject matter.
  • FIG. 3 shows a conceptual cross-section of a heat exchanger type geothermal cooled computer hardware system designed for a human-accessible subsurface installation according to an embodiment of the disclosed subject matter.
  • FIG. 4 shows a conceptual cross-section of a computer cluster designed for subsurface installation that contains computer component assemblies that are cooled by external cooling fluid circulation according to an embodiment of the disclosed subject matter.
  • FIG. 5 shows a conceptual cross-section of a computer cluster designed for subsurface installation that contains computer component assemblies that are cooled by interior channel and external cooling fluid circulation according to an embodiment of the disclosed subject matter.
  • FIG. 6 shows a conceptual cross-section of a computer cluster designed for subsurface installation that contains computer component assemblies that are cooled by internal cooling fluid circulation according to an embodiment of the disclosed subject matter.
  • FIG. 7 shows a conceptual cross-section of a computer cluster designed for subsurface installation that contains computer component assemblies that are cooled by interior channel and internal cooling fluid circulation according to an embodiment of the disclosed subject matter.
  • the design consists of a computer hardware system, either as an individual unit or as a cluster of units, installed in a case designed to conduct heat from the computer hardware system to a fluid within a containment vessel in a subsurface environment; cooling of the computer hardware system is accomplished by geothermal heat transfer from the containment vessel fluid to the external subsurface environment.
  • the containment vessel exists primarily or entirely below ground level, and can have any size, shape, or orientation as dictated by the constraints of the particular installation requirements.
  • FIG. 1 depicts a basic embodiment of the design.
  • the containment vessel 100 is a sealed or unsealed structure which is near or any distance below surface level 108 .
  • the containment vessel 100 is installed in either a removable or non-removable fashion in surrounding physical materials 112 such as earth, water, or concrete.
  • the sealed embodiment will have a sealing cap 104 which may be covered by surrounding physical materials 112 .
  • the unsealed embodiment will have containment vessel walls 110 that extend to the surface of the surrounding physical materials 112 .
  • a liquid-tight connector assembly 114 extends through any sealing cap 104 to provide an entry port for power, control and electrical signal cabling 126 to and from one or more computer hardware systems 116 , each of which consists of one or more individual electronic device subsystems.
  • the cooling fluid 120 with surface level 122 fills some or all of the containment vessel 100 volume and surrounds the computer hardware systems 116 .
  • the cooling fluid 120 is cooled by geothermal heat conduction into the surrounding subsurface mass; the cooled fluid moves downward convectively 124 near the containment vessel 100 wall, and the warmer fluid moves convectively upward 128 as it gains heat from the computer hardware systems 116 .
  • Fluid flow may be augmented by an optional fluid circulator 132 which forces fluid upward from the lower region of the containment vessel 100 . Fluid flow in and around the computer hardware system 116 may be accomplished by embodiments such as those described in FIGS. 4, 5, 6 , and/or 7 .
  • FIG. 2 shows a configuration similar to that of FIG. 1 , the primary difference being that warmer fluid 172 is removed from the containment vessel 150 at higher temperature and transferred to a remote location for geothermal heat exchange 156 or other method of heat exchange; after the fluid is cooled remotely by geothermal heat exchange 156 or other method, it is transferred 176 back into the containment vessel 150 .
  • the containment vessel 150 is a sealed or unsealed structure which is near or any distance below surface level 158 .
  • the containment vessel 150 is installed in either a removable or non-removable fashion in surrounding physical materials 152 such as earth, water, or concrete.
  • the sealed embodiment will have a sealing cap 154 which may be covered by surrounding physical materials 152 .
  • the unsealed embodiment will have containment vessel walls 160 that extend to the surface of the surrounding physical materials 152 .
  • a liquid-tight connector assembly 164 extends through any sealing cap 154 to provide an entry port for cooling fluid, power, control and electrical signal cabling 162 to and from one or more computer hardware systems 166 , each of which consists of one or more individual electronic device subsystems.
  • the cooling fluid 168 with surface level 170 which fills some or all of the containment vessel 150 volume, surrounds the electronic devices or systems 166 , each of which consists of one or more electronic devices.
  • the cooling fluid 168 is pumped to a geothermal heat exchange system 156 or other heat exchanger installed external to, and either adjacent to or remote from, the containment vessel 150 .
  • the geothermal heat exchange unit 156 uses primary or secondary geothermal heat exchange such as open or closed loop earth or water geothermal heat sinks, and cools the fluid for reinsertion 176 into the interior of the containment vessel 150 .
  • Fluid flow in and around the computer hardware systems 166 may be accomplished by embodiments such as those described in FIGS. 4, 5, 6 , and/or 7 .
  • FIG. 3 shows a configuration similar to that of FIG. 2 , the primary difference being the presence of a secondary containment vessel 210 that is sufficiently large and of the correct environment and structure to facilitate human access, inspection, and maintenance of at least a portion of the entire assembly.
  • the containment vessel 200 is installed in either a removable or non-removable fashion inside the secondary containment vessel 210 .
  • the secondary containment vessel 210 is installed in surrounding physical materials 202 such as earth, water, or concrete and contains a human accessible extension to the surface.
  • the containment vessel 200 is a sealed or unsealed structure which is near or any distance below surface level 208 .
  • the sealed embodiment will have a sealing cap 204 ; the sealed and unsealed embodiments will allow human access inside the containment vessel 200 , optionally through an access panel or port 206 .
  • a liquid-tight connector assembly 214 extends through any sealing cap 204 to provide an entry port for cooling fluid, power, control and electrical signal cabling 212 to and from one or more computer hardware system 216 , each of which consists of one or more individual electronic devices.
  • the cooling fluid 218 with surface level 220 which fills some or all of the containment vessel 200 volume, surrounds the computer hardware systems 216 , each of which consists of one or more individual electronic device subsystems.
  • the warmer fluid 222 is removed from the containment vessel 200 at higher temperature and transferred to a remote location for geothermal heat exchange 224 ; after the fluid is cooled remotely by a geothermal heat exchange system 224 or other heat exchanger, it is transferred 226 back into the containment vessel 200 .
  • the cooling fluid 222 is pumped to a geothermal heat exchange 224 installed external to, and either adjacent to or remote from, the containment vessel 200 .
  • the geothermal heat exchange unit 224 uses primary or secondary geothermal heat exchange such as open or closed loop earth or water geothermal heat sinks, or other heat exchange system, and cools the fluid 226 for reinsertion into the interior of the containment vessel 200 .
  • Fluid flow in and around the computer hardware systems 216 may be accomplished by embodiments such as those described in FIGS. 4, 5, 6 , and/or 7 .
  • FIG. 4 shows a conceptual cross-section of an embodiment of a grouping of electronic devices or systems; for the purpose of the embodiments depicted in FIGS. 4, 5, 6 and/or 7 such grouping will be called a computer cluster.
  • This embodiment provides an enclosure 300 for the computer cluster, with a fluid filled interior space 304 , and an entry port for power, control and electrical signal cabling 308 .
  • the exterior surface of the enclosure 300 is in contact with a surrounding cooling fluid 312 which circulates and is cooled in any of the manners described for FIGS. 1, 2 , and/or 3 above.
  • the components which are interior to the enclosure 300 include one or more power supplies 316 , one or more data storage assemblies 320 consisting of disk drives or other type of storage units, one or more motherboard assemblies 324 , and other computer hardware 328 that may be required by a particular application.
  • the motherboard assembly 324 , power supply assembly 316 , data storage assembly 320 , and customized computer assembly 328 are assemblies that contain standard computer components that have been arranged in a manner to facilitate proper computer operation and optimal heat transfer; they may be bracket mounted and open to the interior of the computer cluster enclosure 300 or each assembly may be fully enclosed as a unit in order to either contain a secondary cooling fluid such as a dielectric or to isolate the assembly from direct contract with either the primary or another secondary cooling liquid.
  • Each assembly 324 , 316 , 320 , 328 will have cable entrances for power and electrical signaling that serve to interconnect the assemblies as required for computer operation.
  • Each assembly 324 , 316 , 320 , 328 may be mounted in such a fashion as to transfer heat directly from the assembly to the wall of the computer cluster enclosure.
  • the interior of the computer cluster enclosure 304 may contain fluids separated by interior partitions and control structures that serve to transfer heat from the inward facing surfaces of assemblies 324 , 316 , 320 , 328 to the outer wall of the computer cluster enclosure 300 .
  • the electronic devices or systems interior to the enclosure 300 do not need to be arranged exactly as shown and may have various arrangements to facilitate heat transfer and operation.
  • Multiple computer cluster enclosures 300 may be connected in a single logical and/or physical structure as to form a single operating and/or installed unit.
  • FIG. 5 shows a conceptual cross-section of an embodiment of a computer cluster.
  • This embodiment has a pipe-like cylindrical or tubular enclosure of various cross-sectional geometries and lengths that allow the flow of cooling fluid 360 through one or more channels in its central space.
  • the computer cluster has a computer cluster enclosure 350 with a gas or liquid filled interior space 354 , and an entry port for power, control and electrical signal cabling 358 .
  • the exterior surface of the computer cluster enclosure 350 is in contact with a surrounding cooling fluid 360 .
  • the interior space of the computer cluster enclosure 350 has a sealing cap 366 with an entry port through which the cooling fluid is forced 362 .
  • the cooling fluid 360 is warmed by contact with the surfaces of the computer cluster enclosure 350 as it flows downward 362 ; the cooling fluid 360 exits at the bottom of the computer cluster enclosure, then flows across the computer cluster enclosure 350 surfaces as it rises 364 ; the cooling fluid 360 is circulated and cooled in any of the manners described for FIGS. 1, 2 , and/or 3 above.
  • the computer components interior to the computer cluster enclosure 350 include one or more power supplies 370 , one or more data storage assemblies 374 consisting of disk drives or other type of storage units, one or more motherboard assemblies 378 , and other computer hardware 382 that may be required by a particular application.
  • the motherboard assembly 378 , power supply assembly 370 , data storage assembly 374 , and customized computer assembly 382 are assemblies that contain standard computer components that have been arranged in a manner to facilitate proper computer operation and optimal heat transfer; they may be bracket mounted and open to the interior of the computer cluster enclosure 350 or each assembly may be fully enclosed as a unit in order to either contain a secondary cooling fluid such as a dielectric or to isolate the assembly from direct contract with either the primary or another secondary cooling fluid.
  • Each assembly 378 , 370 , 374 , 382 will have cable entrances for power and electrical signaling that serve to interconnect the assemblies as required for computer operation.
  • Each assembly 378 , 370 , 374 , 382 may be mounted in such a fashion as to transfer heat directly from the assembly to the wall of the computer cluster enclosure.
  • the interior of the computer cluster enclosure 354 may contain gases and/or liquids separated by interior partitions and control structures that serve to transfer heat from the inward facing surfaces of assemblies 378 , 370 , 374 , 382 to the outer wall of the computer cluster enclosure 350 .
  • the computer components interior to the enclosure 350 do not need to be arranged exactly as shown and may have various arrangements to facilitate heat transfer and operation.
  • the circulation of the cooling fluid 360 may be reversed by moving the sealing cap 366 , through which the cooling fluid is forced 362 , to the bottom of the computer cluster enclosure 350 .
  • Multiple computer cluster enclosures 350 may be connected in a single logical and/or physical structure as to form a single operating and/or installed unit.
  • FIG. 6 shows a conceptual cross-section of an embodiment of a computer cluster.
  • This embodiment has a pipe-like cylindrical or tubular enclosure of various cross-sectional geometries and lengths that allow the flow of cooling fluid 410 through the interior of the computer cluster enclosure 400 and around the interior assemblies 418 .
  • the computer cluster enclosure 400 has a fluid filled interior space 404 and an entry port for power, control, and electrical signal cabling 408 .
  • the exterior surface of the computer cluster enclosure 400 is in contact with a surrounding cooling fluid 410 .
  • the computer cluster enclosure 400 has a sealing cap 416 with an entry port through which the cooling fluid is forced 412 .
  • the cooling fluid 410 is warmed by contact with the interior assemblies 418 and exits the enclosure 414 through the exit ports 440 into the containment vessel.
  • the cooling fluid 410 is circulated and cooled in any of the manners described for FIGS. 1, 2 , and/or 3 above.
  • the computer components interior to the computer cluster enclosure 400 include one or more power supplies 420 , one or more data storage assemblies 424 consisting of disk drives or other type of storage units, one or more motherboard assemblies 428 , and other computer hardware 432 that may be required by a particular application.
  • the motherboard assembly 428 , power supply assembly 420 , data storage assembly 424 , and customized computer assembly 432 are assemblies that contain standard computer components that have been arranged in a manner to facilitate proper computer operation and optimal heat transfer; each assembly is fully enclosed as a unit in order to either contain a secondary cooling fluid such as a dielectric or to isolate the assembly from direct contract with either the primary or another secondary cooling fluid.
  • Each assembly 428 , 420 , 424 , 432 will have cable entrances for power and electrical signaling that serve to interconnect the assemblies as required for computer operation.
  • Each assembly 428 , 420 , 424 , 432 may be mounted in such a fashion as to transfer heat directly from the assembly to the wall of the computer cluster enclosure.
  • each assembly 428 , 420 , 424 , 432 could be mounted in a fashion to maximize the assembly's 428 , 420 , 424 , 432 contact with cooling fluid 410 within computer cluster enclosure 400 .
  • the computer components interior to the enclosure 400 do not need to be arranged exactly as shown and may have various arrangements to facilitate heat transfer and operation.
  • the circulation of the cooling fluid 410 may be reversed by moving the sealing cap 416 through which the cooling fluid 412 is forced to the bottom of the computer cluster enclosure 400 .
  • Multiple computer cluster enclosures 400 may be connected in a single logical and/or physical structure as to form a single operating and/or installed unit.
  • FIG. 7 shows a conceptual cross-section of an embodiment of a computer cluster.
  • This embodiment has a pipe-like cylindrical or tubular enclosure of various cross-sectional geometries and lengths that allow the flow of cooling fluid 460 through one or more channels in its central space, into the interior of the computer cluster enclosure 450 , and around the interior assemblies 468 .
  • the computer cluster enclosure 450 has a fluid filled interior space 454 and an entry port for power, control and electrical signal cabling 458 .
  • the exterior surface of the computer cluster enclosure 450 is in contact with a surrounding cooling fluid 460 .
  • the computer cluster enclosure 450 has one or more upper and lower sealing caps 466 through which the cooling fluid is forced 462 .
  • the cooling fluid 460 enters the interior space 454 through one or more entry ports 470 ; once inside the interior space 454 , the cooling fluid 460 is warmed by contact with the interior assemblies 468 , and the cooling fluid 460 exits the enclosure 464 through the exit ports 490 into the containment vessel.
  • the cooling fluid 460 is circulated and cooled any of the manners described for FIGS. 1, 2 , and/or 3 above.
  • the computer components interior to the computer cluster enclosure 450 include one or more power supplies 474 , one or more data storage assemblies 478 consisting of disk drives or other type of storage units, one or more motherboard assemblies 482 , and other computer hardware 486 that may be required by a particular application.
  • the motherboard assembly 482 , power supply assembly 474 , data storage assembly 478 , and customized computer assembly 486 are assemblies that contain standard computer components that have been arranged in a manner to facilitate proper computer operation and optimal heat transfer; each assembly is fully enclosed as a unit in order to either contain a secondary cooling fluid such as a dielectric or to isolate the assembly from direct contract with either the primary or another secondary cooling fluid.
  • Each assembly 482 , 474 , 478 , 486 will have cable entrances for power and electrical signaling that serve to interconnect the assemblies as required for computer operation.
  • each assembly 482 , 474 , 478 , 486 could be mounted in a fashion to maximize the assembly's 482 , 474 , 478 , 486 contact with cooling fluid 460 within computer cluster enclosure 450 .
  • Each assembly 482 , 474 , 478 , 486 may be mounted in such a fashion as to transfer heat directly from the assembly to the wall of the computer cluster enclosure.
  • the computer components interior to the enclosure 450 do not need to be arranged exactly as shown and may have various arrangements to facilitate heat transfer and operation.
  • the circulation of the cooling fluid 460 may be reversed by removing the warmed fluid from one or more channels in central space of the computer cluster enclosure 450 and introducing the cooled fluid into the computer cluster enclosure 450 via the exit ports 490 .
  • Multiple computer cluster enclosures 450 may be connected in a single logical and/or physical structure as to form a single operating and/or installed unit.
  • FIG. 1 100 Containment vessel 104 Sealing cap 108 Surface level 110 Containment vessel walls extending to surface (optional) 112 Surrounding physical material 114 Liquid-tight connector assembly 116 Computer hardware system 120 Cooling fluid 122 Cooling fluid surface level 124 Fluid cooled by geothermal heat transfer 126 Power and signal cabling 128 Fluid warmed by computer hardware systems 132 Fluid circulator (optional) FIG. 2.
  • Containment vessel 202 Surrounding physical materials 204 Sealing cap 206 Optional panel or port for human access to containment vessel interior 208 Surface level 210 Secondary containment vessel 212 Power and signal cabling 214 Liquid-tight connector assembly 216 Computer hardware system 218 Cooling fluid 220 Cooling fluid surface level 222 Fluid warmed by computer hardware systems 224 Geothermal heat exchange system (or other heat exchanger) 226 Re-entering fluid cooled by geothermal (or other) heat exchange method FIG. 4. 300 Computer cluster enclosure 304 Fluid-filled interior space 308 Power and signal cabling 312 Surrounding cooling fluid 316 Power supply assembly or subsystem 320 Data storage assembly or subsystem 324 Motherboard assembly or subsystem 328 Customized computer assembly or subsystem FIG. 5.
  • Cooling fluid Forced flow of cooling fluid into enclosure 464 Forced flow of cooling fluid out of enclosure 466
  • Sealing cap 468 Cooling fluid warmed by contact with electronic devices or assemblies 474 Power supply assembly or subsystem 478 Data storage assembly or subsystem 482 Motherboard assembly or subsystem 486 Customized computer or other electronics assembly 490 Exit port

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US14/378,261 2012-09-07 2013-08-09 Cooling electronic devices installed in a subsurface environment Active 2033-08-30 US9593876B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/378,261 US9593876B2 (en) 2012-09-07 2013-08-09 Cooling electronic devices installed in a subsurface environment
US15/457,025 US10240845B2 (en) 2012-09-07 2017-03-13 Cooling electronic devices installed in a subsurface environment

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US11421921B2 (en) * 2012-09-07 2022-08-23 David Lane Smith Cooling electronic devices installed in a subsurface environment
US11191186B2 (en) 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US11744041B2 (en) 2014-06-24 2023-08-29 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US10264711B2 (en) * 2016-11-30 2019-04-16 Data Marine, LLC Data vessel integrated with cooling and docking station with ancillary service
US20200026010A1 (en) * 2018-07-23 2020-01-23 Fujitsu Limited Optical module and liquid immersion system
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US20150000319A1 (en) 2015-01-01
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