SG11201501690SA - Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment - Google Patents

Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment

Info

Publication number
SG11201501690SA
SG11201501690SA SG11201501690SA SG11201501690SA SG11201501690SA SG 11201501690S A SG11201501690S A SG 11201501690SA SG 11201501690S A SG11201501690S A SG 11201501690SA SG 11201501690S A SG11201501690S A SG 11201501690SA SG 11201501690S A SG11201501690S A SG 11201501690SA
Authority
SG
Singapore
Prior art keywords
geothermally
electronic devices
devices installed
cooling electronic
subsurface environment
Prior art date
Application number
SG11201501690SA
Inventor
David Smith
Original Assignee
David Smith
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by David Smith filed Critical David Smith
Publication of SG11201501690SA publication Critical patent/SG11201501690SA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/06—Heat pumps characterised by the source of low potential heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D1/00—Devices using naturally cold air or cold water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/0052—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using the ground body or aquifers as heat storage medium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2331/00—Details or arrangements of other cooling or freezing apparatus not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E70/00—Other energy conversion or management systems reducing GHG emissions
    • Y02E70/30—Systems combining energy storage with energy generation of non-fossil origin
SG11201501690SA 2012-09-07 2013-08-09 Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment SG11201501690SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261698365P 2012-09-07 2012-09-07
PCT/US2013/054414 WO2014039212A1 (en) 2012-09-07 2013-08-09 Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment

Publications (1)

Publication Number Publication Date
SG11201501690SA true SG11201501690SA (en) 2015-04-29

Family

ID=50237530

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201501690SA SG11201501690SA (en) 2012-09-07 2013-08-09 Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment

Country Status (9)

Country Link
US (2) US9593876B2 (en)
EP (1) EP2893270A4 (en)
JP (1) JP2015534164A (en)
KR (1) KR20150053265A (en)
CN (1) CN104823005A (en)
AU (1) AU2013313223A1 (en)
IN (1) IN2015DN01748A (en)
SG (1) SG11201501690SA (en)
WO (1) WO2014039212A1 (en)

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US11421921B2 (en) * 2012-09-07 2022-08-23 David Lane Smith Cooling electronic devices installed in a subsurface environment
US9258926B2 (en) 2014-06-24 2016-02-09 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US11744041B2 (en) 2014-06-24 2023-08-29 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US9699939B2 (en) 2014-06-24 2017-07-04 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US11191186B2 (en) 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US9408332B2 (en) 2014-06-24 2016-08-02 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9560789B2 (en) 2014-06-24 2017-01-31 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9655283B2 (en) * 2014-06-30 2017-05-16 Microsoft Technology Licensing, Llc Submerged datacenter
WO2016088280A1 (en) * 2014-12-05 2016-06-09 株式会社ＥｘａＳｃａｌｅｒ Electronic apparatus cooling device
US10583940B2 (en) * 2015-03-03 2020-03-10 York Space Systems LLC Pressurized payload compartment and mission agnostic space vehicle including the same
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JP6278053B2 (en) * 2016-03-28 2018-02-14 富士通株式会社 Immersion cooling device
JP6658312B2 (en) * 2016-06-01 2020-03-04 富士通株式会社 Immersion cooling device, immersion cooling system, and control method of immersion cooling device
US10264711B2 (en) * 2016-11-30 2019-04-16 Data Marine, LLC Data vessel integrated with cooling and docking station with ancillary service
JP6939034B2 (en) * 2017-04-05 2021-09-22 富士通株式会社 Cooling systems, cooling devices, and electronic systems
US10314199B2 (en) * 2017-08-14 2019-06-04 F Clay Smith, III Conduitless, liquid phase, internal circulation, immersion cooling system
CN107979955B (en) * 2017-11-24 2020-06-30 北京百度网讯科技有限公司 Modularized liquid cooling server case
CN108124409B (en) * 2017-12-19 2021-03-23 漳州科华技术有限责任公司 Server liquid cooling system
JP2020017570A (en) * 2018-07-23 2020-01-30 富士通株式会社 Optical module and immersion system
JP7295381B2 (en) * 2019-02-14 2023-06-21 富士通株式会社 Cooling device, cooling system and cooling method
CN111831084B (en) * 2019-04-23 2022-07-01 富联精密电子(天津)有限公司 Cooling system
US11060312B1 (en) * 2019-05-06 2021-07-13 Amazon Technologies, Inc. Data center network tunnel
US10881030B1 (en) 2019-07-31 2020-12-29 Hewlett Packard Enterprise Development Lp Electrical and liquid cooling midplane
US10750637B1 (en) * 2019-10-24 2020-08-18 Microsoft Technology Licensing, Llc Immersion cooling infrastructure module having compute device form factor
GB202001872D0 (en) 2020-02-11 2020-03-25 Iceotope Group Ltd Housing for immersive liquid cooling of multiple electronic devices
NL2027361B9 (en) * 2021-01-21 2022-09-12 Stem Tech | Ixora Holding B V Immersive cooling unit for cooling electronic components and method of using the same
EP4282235A1 (en) * 2021-01-21 2023-11-29 Stem Technologies/Ixora Holding B.V. Immersive cooling unit for cooling electronic components and method of using the same
US11606878B2 (en) 2021-04-09 2023-03-14 Microsoft Technology Licensing, Llc Systems and methods for immersion-cooled datacenters
US11533829B2 (en) 2021-04-09 2022-12-20 Microsoft Technology Licensing, Llc Systems and methods for immersion-cooled datacenters
CN114625226B (en) * 2022-03-11 2023-06-23 北部湾大学 Temperature anomaly controller for computer group

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Also Published As

Publication number Publication date
EP2893270A4 (en) 2016-10-05
US20150000319A1 (en) 2015-01-01
US20170223870A1 (en) 2017-08-03
JP2015534164A (en) 2015-11-26
WO2014039212A1 (en) 2014-03-13
CN104823005A (en) 2015-08-05
US10240845B2 (en) 2019-03-26
EP2893270A1 (en) 2015-07-15
KR20150053265A (en) 2015-05-15
IN2015DN01748A (en) 2015-05-29
US9593876B2 (en) 2017-03-14
AU2013313223A1 (en) 2015-03-19

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