US925365A - Metallization of vitreous ceramic surfaces. - Google Patents

Metallization of vitreous ceramic surfaces. Download PDF

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Publication number
US925365A
US925365A US44633708A US1908446337A US925365A US 925365 A US925365 A US 925365A US 44633708 A US44633708 A US 44633708A US 1908446337 A US1908446337 A US 1908446337A US 925365 A US925365 A US 925365A
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Prior art keywords
silver
metallization
copper
solution
roughened
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US44633708A
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Quentin Marino
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching

Definitions

  • This invention relates to the metallization of vitreous, porcelain, earthenware and the like surfaces, so that metal or metallic alloy may be electrolytically deposited upon such surfaces, and it has for its object to enable such met-allization to be effected in a simple manner.
  • the metallization of the surface according to this invention is intended to be effected after said surface has been roughened or rendered matte, which operation may be accomplished in any well known manner, for instance, by the use of hydrofluoric acid, or by means of an emery wheel or sand blast.
  • My invention is carried out as follows.
  • a cold solution is made by putting cuprous oxid into a solution of nitrate of silver whereby is guickly formed a gray substance consisting o filiform silver and basic nitrate ofcopper the use of this substance enables the electrolytic metallization of the surface to be effected.
  • This gray substance is then dissolved in hydrofluoric acid, and the solution so formed is applied, say, by means of a brush, to the roughened surface.
  • I dust the surface, while it is wet with the lastmentioned solution, with a mixture of metals, or with one metal only, in a finely-divided state and such as will reduce the silver on the one hand and the copper on the other, both of which latter are combined with the fluoric acid.
  • I may use a mixture of powdered copper and zinc, or a powder of cop er with either iron, nickel, cobalt, cadmiumflead or bismuth, the copper and zinc reducing the silver, while the zinc, iron, nickel, cobalt, cadmium, lead or bismuth reduces the copper.
  • I may, however, use powdered zinc only, which reduces Specification of Letters Patent.
  • any solution which lies on the unroughened port-ions may be easily removed therefrom, by, say, wiping it off with a cloth or the like.
  • the article with its surface treated as above described may now be placed as a cathode in a suitable electrolyte of gold, silver, nickel, copper, or other metal or metallic alloy of which a deposit is required, and electrical connection be made so as to cause the metal or alloy to be-deposlted thereon by electrolysis as usual.
  • cupric hydrate instead of cuprous acid.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

UNITED srratms ggmvr OFFICE.
QUENTIN MARIN 0, OF LONDON, ENGLAND, ASSIGNOR OF THREE-FOURTHS TO EDWIN JOSEPH RICHARDSON, OF LONDON, ENGLAND.
METALLIZATION OF VITREOUS CERAMIC SURFACES.
To all whom it may concern:
3e it known that I, QUENTIN MARINO, a citizen of Italy, and residing at Wymermg Mansions, l/Vymering Road, Elgin avenue, London, VV., England, have invented certain new and useful Improvements in or Relating to the Metallization of Vitreous Ceramic Surfaces, of which the following is a specification.
This invention relates to the metallization of vitreous, porcelain, earthenware and the like surfaces, so that metal or metallic alloy may be electrolytically deposited upon such surfaces, and it has for its object to enable such met-allization to be effected in a simple manner.
The metallization of the surface according to this invention is intended to be effected after said surface has been roughened or rendered matte, which operation may be accomplished in any well known manner, for instance, by the use of hydrofluoric acid, or by means of an emery wheel or sand blast.
My invention is carried out as follows. A cold solution is made by putting cuprous oxid into a solution of nitrate of silver whereby is guickly formed a gray substance consisting o filiform silver and basic nitrate ofcopper the use of this substance enables the electrolytic metallization of the surface to be effected. This gray substance is then dissolved in hydrofluoric acid, and the solution so formed is applied, say, by means of a brush, to the roughened surface. In order to insure its adherence to such surface, I reduce the copper and the silver in the fluorid to a metallic state by eliminating the hydrofluoric acid. To effect this reduction, I dust the surface, while it is wet with the lastmentioned solution, with a mixture of metals, or with one metal only, in a finely-divided state and such as will reduce the silver on the one hand and the copper on the other, both of which latter are combined with the fluoric acid. For this purpose, I may use a mixture of powdered copper and zinc, or a powder of cop er with either iron, nickel, cobalt, cadmiumflead or bismuth, the copper and zinc reducing the silver, while the zinc, iron, nickel, cobalt, cadmium, lead or bismuth reduces the copper. I may, however, use powdered zinc only, which reduces Specification of Letters Patent.
Application filed July 31, 1908.
Patented June 15, 1909.
Serial No. 446,337.
both the silver and the copper. Or I may use powdered zinc mixed with either iron, nickel, cobalt,-cadmium, lead or bismuth to effect the reduction. In any case, when a mixture of metals is employed, the particles thereof must be intimately mixed together. The surface thus becomes coated with a mixture of silver and copper in the form of a very thin film sufficiently continuous for it to be electrically conducting for the purpose of having deposited thereon electrolytically the metal or metallic alloy desired. Instead of leaving the surface in this condition, I render it more conductive by rubbing it briskly, when dry, with a brush or the like, until it presents a polished and uniform ap pearance, thereby facilitating the passage ofthe electric current throughout the film. In some cases it may be desired to electrolytically deposit the metal or metallic alloy on portions only of the surface, for instance, when ornamenting a surface; in such cases, only those portions of the surface which are to be ornamented require to be roughened, and, as my solution, applied as above described, adheres only to the roughened portions, any solution which lies on the unroughened port-ions may be easily removed therefrom, by, say, wiping it off with a cloth or the like. The article with its surface treated as above described may now be placed as a cathode in a suitable electrolyte of gold, silver, nickel, copper, or other metal or metallic alloy of which a deposit is required, and electrical connection be made so as to cause the metal or alloy to be-deposlted thereon by electrolysis as usual.
I may use cupric hydrate instead of cuprous acid.
I claim, v y
1. Metallizing a roughened, vitreous, ceramic surface by applying thereto a solution resulting from dissolving in hydrofluoric acid a gray substance consisting of filiform silver and basic nitrate of copper, and then, while the surface is wet with the solution, dusting said surface with a metal in a finely divided state and such as will reduce the silver and copper in the fluorid to a metallic state, substantially as described.
2. The process of metallization of a roughened vitreous, ceramic surface, the step of preparing a gray substance consisting of .filiform silver and basic nitrate of copper anddissolving the gray substance so formed iii in hydrofluoric acid, substantially as described. I
3. In the metallization of a roughened, vitreous, ceramic surface. preparing a gray substance consisting of filiform silver and nitrodissolving this substance in hydrofluoric acid, applying the resulting solution to said roughened surface, then while the surface is wet with the solution, dusting thereon a suitable powdered metal which will reduce the silver and the copper in the fluorid to a metallic state and when the surface is dry, rubbing said surface briskly until it presents a polished and uniform appearance, substantially as hcreinbefore described.
4. The process ofmetallization of a roughened vitreous ceramic surface, the step of preparing a cold solution made by putting cuprous oxid into a solution of nitrate of silver.
5. Metallizing a roughened vitreous, ce-
' ramic surface by applying thereto a solution resulting from dissolving in hydrofluoric acid filiform silver and basic nitrate of copper and then while the surface is wet with the first mentioned solution, dusting said surface with a metal in a finely divided state such as will reduce the silver andthe copper in fluorid to a metallic state and then electrically depositing upon said surface a metal or a metallic alloy of which a deposit is required.
6. In the metallization of a roughened vitreous, porcelain, earthenware surface, preparing a gray substance consisting of filiform' silver and basic nitrate of copperdissolving this substance in hydrofluoric acid, applying the resulting solution to said roughened surface, then while the surface is wet with the last mentioned solution dusting thereon a suitable powdered metal which will reduce the silver and the copper in the fluorid to a metallic state and when the surface is dry, rubbing said surface briskly until itpresents a polished and uniform appearance, and then electrically depositing upon said surface a metal or metallic alloy of which a deposit is required.
In witness whereof I have hereunto set my hand in presence of two witnesses.
QUENTIN 'MARrNo.
Witnesses:
HARRY T. l GEY, JOHN NALLE SMITH.
US44633708A 1908-07-31 1908-07-31 Metallization of vitreous ceramic surfaces. Expired - Lifetime US925365A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3367792A (en) * 1963-09-16 1968-02-06 Dow Chemical Co Electroless plating on nonconducting surfaces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3367792A (en) * 1963-09-16 1968-02-06 Dow Chemical Co Electroless plating on nonconducting surfaces

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