US1037887A - Process of plating metals. - Google Patents
Process of plating metals. Download PDFInfo
- Publication number
- US1037887A US1037887A US64226711A US1911642267A US1037887A US 1037887 A US1037887 A US 1037887A US 64226711 A US64226711 A US 64226711A US 1911642267 A US1911642267 A US 1911642267A US 1037887 A US1037887 A US 1037887A
- Authority
- US
- United States
- Prior art keywords
- metal
- coating
- plating
- adhesive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
Definitions
- the metal .to be plated or a metal with which it will readily unite and incorporate the same, as by rubbing, into. the adhesive film.
- metal is deposited on all sides of' each particle.
- aqueous, or other suitable solution of the gum is applied in a very thin layer upon the non-conducting surface to be coated.
- the surface is sprinkled with a very 'fine powder of metal, preferably of the metal to be plated,'for example, copper. is then'rubbed into the film of adhesiye.
- the metal coating applied in this manner is very strong and can be removed from a smooth glass or other vitreous surface only with the greatest difiiculty. Its appearance, when viewed through the glass is similar to that of a mirror of the metal.
- This process is particularly useful for coating vitreous or other non-conducting surfaces of condensers, ozone tubes and other electrical apparatus which are frequently operated at an elevated temperature.
Description
coating, I may mention glue, water shellac, gum
UNITED STATES PATENT OFFICE.
MILTON W. FRANKLIN, OF SCHENECTADY, NEW YORK, ASSIGNOR TO GENERAL ELECTRIC COMPANY, A CORPORATION OF NEW YORK.
PROCESS OF PLATING METALS.
No Drawing.
10 trolytica'lly coating non-conducting surfaces with metal The method formerly in use for coating non-conducting material, such as glass, with metal consists in first covering-the material to be coated with a varnish, such as copal or shellac. The varnish furnished a sticky surface which-was coatedwith graphite, and was then made the cathode in a plating bath. In the finished product the metal film is at tached to the glass, or other vitreous surface only by means of the varnish, which renders the articles thus plated unfit for use at high temperatures. Even at ordifia'ry room temperature the metal coating can be easily peeled ofi. i I
I have discovered that when the non-con ducting surface is coated with an adhesive which is permeable, and preferably also soluble, in the plating electrolyte, 'and a conducting layer is applied as usual, the plated film adheres very' firmly tothe surface upon which it is applied. To render the film of adhesive conducting, I prefer to use, in a.
finely divided state, the metal .to be plated, or a metal with which it will readily unite and incorporate the same, as by rubbing, into. the adhesive film. During'the plating process, metal is deposited on all sides of' each particle.
As a suitable material for the adhesive in arabic, annnar, or gum tragacanth- An aqueous, or other suitable solution of the gum is applied in a very thin layer upon the non-conducting surface to be coated. The surface is sprinkled with a very 'fine powder of metal, preferably of the metal to be plated,'for example, copper. is then'rubbed into the film of adhesiye. When the surface thus prepared is plated in the ordinary way, each grain of the original metal powder is coated with metal and the minute quantity of ad- Speciflcation of Letters Patent.-
Application filed August 4, 1911. Serial No. 642,267.
Patented Sept. 10, 1912.
hesive is practically dissolved out leaving a coating of pure metal. If any portion of the adhesive remains, it is probably incorporated with the metal.
The metal coating applied in this manner is very strong and can be removed from a smooth glass or other vitreous surface only with the greatest difiiculty. Its appearance, when viewed through the glass is similar to that of a mirror of the metal.
This process is particularly useful for coating vitreous or other non-conducting surfaces of condensers, ozone tubes and other electrical apparatus which are frequently operated at an elevated temperature.
WVhat I claim as new and desire to secure by Letters Patent of the United States, is,
l. The process of preparing non-conducting surfaces to receive an electrolytic deposit which consists in covering said surface with a film of adhesive material permeable with respect to the electrolyte in which the object is to be plated, incorporating conductive material into the adhesive film and electro-plating a metallic coating thereon.
2. The process of preparing a non-conductive surface to receive an electrolytic deposit which consists in covering said surface with a thin layer of adhesive material permeable and soluble in the solution which will subsequently form the plating .bath, working a conductive powder into said adhesive and electro-plating a metallic'coating thereon.
3. The process of preparing vitreous surfaces to receive an adherent electrolytic deposit of metal-which consists in applying a thin coating of water solublegum upon said surface, and incorporating into said coating MILTON W. FRANKLIN.
Witnesses:
BENJAMIN B. HULL, HELEN Onronn.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64226711A US1037887A (en) | 1911-08-04 | 1911-08-04 | Process of plating metals. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64226711A US1037887A (en) | 1911-08-04 | 1911-08-04 | Process of plating metals. |
Publications (1)
Publication Number | Publication Date |
---|---|
US1037887A true US1037887A (en) | 1912-09-10 |
Family
ID=3106164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US64226711A Expired - Lifetime US1037887A (en) | 1911-08-04 | 1911-08-04 | Process of plating metals. |
Country Status (1)
Country | Link |
---|---|
US (1) | US1037887A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2880147A (en) * | 1956-02-13 | 1959-03-31 | Horizons Inc | Electrolytic process |
US5328588A (en) * | 1993-03-19 | 1994-07-12 | Samuel Hopkins | Method of inlaying metals in non-conductive materials |
US10493343B2 (en) | 2017-10-04 | 2019-12-03 | Russell James Horner | Apparatus for playing a game and method |
-
1911
- 1911-08-04 US US64226711A patent/US1037887A/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2880147A (en) * | 1956-02-13 | 1959-03-31 | Horizons Inc | Electrolytic process |
US5328588A (en) * | 1993-03-19 | 1994-07-12 | Samuel Hopkins | Method of inlaying metals in non-conductive materials |
US10493343B2 (en) | 2017-10-04 | 2019-12-03 | Russell James Horner | Apparatus for playing a game and method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5281326A (en) | Method for coating a dielectric ceramic piece | |
US1947981A (en) | Plating aluminum | |
US2211584A (en) | Coaxial electrical conductor | |
US2070679A (en) | Process for preparing nonmetallic articles for electro-plating | |
JPS59123789A (en) | Treatment for plating aluminum body to be treated having anodic oxidized film | |
TWI794440B (en) | Electrolytic rhodium plating solution | |
US1037887A (en) | Process of plating metals. | |
CN105873352B (en) | High-frequency communication substrate and its manufacturing method | |
US2247755A (en) | Electric contact | |
US1773135A (en) | Method of spot electroplating | |
US4817277A (en) | Method of manufacturing an electrically conductive adhesive bond | |
US5158657A (en) | Circuit substrate and process for its production | |
GB2186597A (en) | Electrical contact surface coating | |
US2834724A (en) | Method of electroplating plastic articles | |
US2195231A (en) | Art of coating metals | |
US1574055A (en) | Fabrication of metal sheets by electrodeposition | |
US2966448A (en) | Methods of electroplating aluminum and alloys thereof | |
US1827142A (en) | Process for the treatment of aluminum | |
US3676314A (en) | Method of electrodepositing vitreous coatings atop a multiapertured substrate | |
US2211582A (en) | Process of electrolytically coating nonconductive materials | |
US1282265A (en) | Electrolytic process and product. | |
US1282270A (en) | Electrolytic process and product. | |
US1720216A (en) | Tarnish-resisting silver plate and process for producing same | |
JPS632158B2 (en) | ||
US1533656A (en) | Art of making electrotypes |