US1037887A - Process of plating metals. - Google Patents

Process of plating metals. Download PDF

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Publication number
US1037887A
US1037887A US64226711A US1911642267A US1037887A US 1037887 A US1037887 A US 1037887A US 64226711 A US64226711 A US 64226711A US 1911642267 A US1911642267 A US 1911642267A US 1037887 A US1037887 A US 1037887A
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United States
Prior art keywords
metal
coating
plating
adhesive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US64226711A
Inventor
Milton W Franklin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to US64226711A priority Critical patent/US1037887A/en
Application granted granted Critical
Publication of US1037887A publication Critical patent/US1037887A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching

Definitions

  • the metal .to be plated or a metal with which it will readily unite and incorporate the same, as by rubbing, into. the adhesive film.
  • metal is deposited on all sides of' each particle.
  • aqueous, or other suitable solution of the gum is applied in a very thin layer upon the non-conducting surface to be coated.
  • the surface is sprinkled with a very 'fine powder of metal, preferably of the metal to be plated,'for example, copper. is then'rubbed into the film of adhesiye.
  • the metal coating applied in this manner is very strong and can be removed from a smooth glass or other vitreous surface only with the greatest difiiculty. Its appearance, when viewed through the glass is similar to that of a mirror of the metal.
  • This process is particularly useful for coating vitreous or other non-conducting surfaces of condensers, ozone tubes and other electrical apparatus which are frequently operated at an elevated temperature.

Description

coating, I may mention glue, water shellac, gum
UNITED STATES PATENT OFFICE.
MILTON W. FRANKLIN, OF SCHENECTADY, NEW YORK, ASSIGNOR TO GENERAL ELECTRIC COMPANY, A CORPORATION OF NEW YORK.
PROCESS OF PLATING METALS.
No Drawing.
10 trolytica'lly coating non-conducting surfaces with metal The method formerly in use for coating non-conducting material, such as glass, with metal consists in first covering-the material to be coated with a varnish, such as copal or shellac. The varnish furnished a sticky surface which-was coatedwith graphite, and was then made the cathode in a plating bath. In the finished product the metal film is at tached to the glass, or other vitreous surface only by means of the varnish, which renders the articles thus plated unfit for use at high temperatures. Even at ordifia'ry room temperature the metal coating can be easily peeled ofi. i I
I have discovered that when the non-con ducting surface is coated with an adhesive which is permeable, and preferably also soluble, in the plating electrolyte, 'and a conducting layer is applied as usual, the plated film adheres very' firmly tothe surface upon which it is applied. To render the film of adhesive conducting, I prefer to use, in a.
finely divided state, the metal .to be plated, or a metal with which it will readily unite and incorporate the same, as by rubbing, into. the adhesive film. During'the plating process, metal is deposited on all sides of' each particle.
As a suitable material for the adhesive in arabic, annnar, or gum tragacanth- An aqueous, or other suitable solution of the gum is applied in a very thin layer upon the non-conducting surface to be coated. The surface is sprinkled with a very 'fine powder of metal, preferably of the metal to be plated,'for example, copper. is then'rubbed into the film of adhesiye. When the surface thus prepared is plated in the ordinary way, each grain of the original metal powder is coated with metal and the minute quantity of ad- Speciflcation of Letters Patent.-
Application filed August 4, 1911. Serial No. 642,267.
Patented Sept. 10, 1912.
hesive is practically dissolved out leaving a coating of pure metal. If any portion of the adhesive remains, it is probably incorporated with the metal.
The metal coating applied in this manner is very strong and can be removed from a smooth glass or other vitreous surface only with the greatest difiiculty. Its appearance, when viewed through the glass is similar to that of a mirror of the metal.
This process is particularly useful for coating vitreous or other non-conducting surfaces of condensers, ozone tubes and other electrical apparatus which are frequently operated at an elevated temperature.
WVhat I claim as new and desire to secure by Letters Patent of the United States, is,
l. The process of preparing non-conducting surfaces to receive an electrolytic deposit which consists in covering said surface with a film of adhesive material permeable with respect to the electrolyte in which the object is to be plated, incorporating conductive material into the adhesive film and electro-plating a metallic coating thereon.
2. The process of preparing a non-conductive surface to receive an electrolytic deposit which consists in covering said surface with a thin layer of adhesive material permeable and soluble in the solution which will subsequently form the plating .bath, working a conductive powder into said adhesive and electro-plating a metallic'coating thereon.
3. The process of preparing vitreous surfaces to receive an adherent electrolytic deposit of metal-which consists in applying a thin coating of water solublegum upon said surface, and incorporating into said coating MILTON W. FRANKLIN.
Witnesses:
BENJAMIN B. HULL, HELEN Onronn.
US64226711A 1911-08-04 1911-08-04 Process of plating metals. Expired - Lifetime US1037887A (en)

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US64226711A US1037887A (en) 1911-08-04 1911-08-04 Process of plating metals.

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US1037887A true US1037887A (en) 1912-09-10

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2880147A (en) * 1956-02-13 1959-03-31 Horizons Inc Electrolytic process
US5328588A (en) * 1993-03-19 1994-07-12 Samuel Hopkins Method of inlaying metals in non-conductive materials
US10493343B2 (en) 2017-10-04 2019-12-03 Russell James Horner Apparatus for playing a game and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2880147A (en) * 1956-02-13 1959-03-31 Horizons Inc Electrolytic process
US5328588A (en) * 1993-03-19 1994-07-12 Samuel Hopkins Method of inlaying metals in non-conductive materials
US10493343B2 (en) 2017-10-04 2019-12-03 Russell James Horner Apparatus for playing a game and method

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