US9051408B2 - Curable compositions allowing to obtain materials having an optimised performance, and materials obtained from said compositions - Google Patents
Curable compositions allowing to obtain materials having an optimised performance, and materials obtained from said compositions Download PDFInfo
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- US9051408B2 US9051408B2 US14/362,899 US201214362899A US9051408B2 US 9051408 B2 US9051408 B2 US 9051408B2 US 201214362899 A US201214362899 A US 201214362899A US 9051408 B2 US9051408 B2 US 9051408B2
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- monomer
- vinylester
- blend
- polymerisable compound
- polymerisation
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- 239000000203 mixture Substances 0.000 title claims abstract description 81
- 239000000463 material Substances 0.000 title claims abstract description 51
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 41
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 12
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 10
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 9
- 125000004585 polycyclic heterocycle group Chemical group 0.000 claims abstract description 6
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims description 47
- 239000002131 composite material Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 229920006393 polyether sulfone Polymers 0.000 claims description 18
- 239000004695 Polyether sulfone Substances 0.000 claims description 15
- 239000011159 matrix material Substances 0.000 claims description 10
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 9
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 claims description 7
- 230000002787 reinforcement Effects 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- 238000009472 formulation Methods 0.000 claims description 4
- 229920002492 poly(sulfone) Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims description 2
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 claims description 2
- 101000848724 Homo sapiens Rap guanine nucleotide exchange factor 3 Proteins 0.000 description 16
- 102100034584 Rap guanine nucleotide exchange factor 3 Human genes 0.000 description 16
- 230000009477 glass transition Effects 0.000 description 12
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000465 moulding Methods 0.000 description 8
- 238000007654 immersion Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- -1 epoxide compound Chemical class 0.000 description 4
- VZTQQYMRXDUHDO-UHFFFAOYSA-N C=CC(=O)OCC(O)COC1=CC=C(C(C)(C)C2=CC=C(OCC(O)COC(=O)C=C)C=C2)C=C1 Chemical compound C=CC(=O)OCC(O)COC1=CC=C(C(C)(C)C2=CC=C(OCC(O)COC(=O)C=C)C=C2)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229940125904 compound 1 Drugs 0.000 description 3
- 229940125782 compound 2 Drugs 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000013001 point bending Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004412 Bulk moulding compound Substances 0.000 description 2
- MPJBQAVLBYQSOR-UHFFFAOYSA-N C1CC2C3CCC(C3)C2C1.C=CC(=O)OCC.C=CC(=O)OCC Chemical compound C1CC2C3CCC(C3)C2C1.C=CC(=O)OCC.C=CC(=O)OCC MPJBQAVLBYQSOR-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000491 Polyphenylsulfone Polymers 0.000 description 2
- 239000003677 Sheet moulding compound Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- UNOYHCWVEOZVEP-UHFFFAOYSA-N C1CC2C3CCC(C3)C2C1.C=CC(=O)OCCC.C=CC(=O)OCCC Chemical compound C1CC2C3CCC(C3)C2C1.C=CC(=O)OCCC.C=CC(=O)OCCC UNOYHCWVEOZVEP-UHFFFAOYSA-N 0.000 description 1
- FTLNNQZSGWUFDE-UHFFFAOYSA-N C=CC(OCCCC1C2C(C3)C(CCCOC(C=C)=O)CC3C2CC1)=O Chemical compound C=CC(OCCCC1C2C(C3)C(CCCOC(C=C)=O)CC3C2CC1)=O FTLNNQZSGWUFDE-UHFFFAOYSA-N 0.000 description 1
- 241000726425 Circe Species 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920000927 poly(p-phenylene benzobisoxazole) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 238000012345 traction test Methods 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
- C08F226/10—N-Vinyl-pyrrolidone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
- C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
Definitions
- the present invention relates to the field of curable compositions for industrial use.
- curable composition able to produce, after curing, materials which provide an excellent compromise between toughness, performance at high temperatures and moisture resistance.
- This material can in particular be a material forming the matrix of a composite material.
- it can also be an adhesive material enabling parts to be assembled to one another and, in particular, parts made of composite materials.
- the invention can therefore find applications in all sorts of industry and, more specifically, in the aeronautics, space, rail, naval and motor vehicle industries, for example for the manufacture and assembly of structural parts, engine parts, cabin parts, or bodywork parts, in the arms industry, for example for the manufacture and assembly of missiles or of missile launchers, or again in the field of leisure and sport, for example for the manufacture and assembly of items intended for water sports and board sports.
- Composite materials enable the exceptional mechanical properties of certain materials, which it is not known how to manufacture in massive form, but only in the form of filaments, to be exploited. Matrices formed of organic polymers are then used to bind the filaments to one another.
- thermosetting resins typically obtained from compositions which are conventionally called “thermosetting resins” (although some of them can be cured under the effect of treatment other than heat), and which include monomers, oligomers and/or prepolymers capable of causing, by polymerisation/reticulation, the formation of an infusible and insoluble material.
- thermosetting resins and, in particular, from vinylester resins, have a toughness, i.e. an impact resistance, which is mediocre.
- the Inventors therefore set themselves the goal of providing curable compositions made from a vinylester resin which, after curing, allow materials to be obtained providing an excellent compromise between toughness, performance at high temperatures and moisture resistance.
- curable compositions should have a viscosity enabling the composite materials to be used on an industrial scale, including by techniques involving an injection operation such as, for example, moulding by simultaneous injection, or moulding by low-pressure injection of resin.
- curable composition comprising a vinylester polymerisable compound, jointly with a sulphonated polyaromatic thermoplastic polymer, and an N-vinyl lactam, and which is characterised in that it further comprises:
- a “polymerisable compound” is understood to be a compound which is capable of undergoing a polymerisation/reticulation reaction through the presence of at least two reactive sites that it comprises, whether under the effect of heat, of light (visible light, UV or IR), of ionising radiation (electron beam, ⁇ or ⁇ radiation, X rays, etc.), of an oxidation-reduction reaction or of any other means.
- This compound can therefore take the form of a monomer, an oligomer or a prepolymer resulting from polymerisation of this monomer, or again the form of a blend thereof.
- vinylester compound is understood to mean a monomer which has been obtained by reaction between an epoxide compound and an unsaturated carboxylic acid (typically acrylic acid or methacrylic acid), or again an oligomer or a prepolymer resulting from polymerisation of this monomer, or again a blend of these.
- unsaturated carboxylic acid typically acrylic acid or methacrylic acid
- oligomer or a prepolymer resulting from polymerisation of this monomer or again a blend of these.
- epoxyvinylester compounds are described in particular in the monograph entitled “ Vinylester resins ” of Techniques de l'In deepur, Plastics and Composites Treatise, volume AM 3450 (reference [2]).
- carrierycyclic group is understood to mean a group the cyclic part of which is formed by at least two condensed cycles, the cycles of which consist solely of carbon atoms
- heteropolycyclic group is understood to mean a group the cyclic part of which is formed by at least two condensed cycles, at least one of which includes at least one heteroatom, i.e. an atom other than a carbon atom, typically chosen from among nitrogen, oxygen and sulphur.
- (meth)acrylate group designates equally an acrylate group or a methacrylate group, i.e. a group of the following formula: —O—C(O)—C(R) ⁇ CH 2 , in which R can be either a hydrogen atom or a methyl group.
- the vinylester polymerisable compound preferentially comprises at least one bisphenolic unit A and/or one novolac unit and is therefore, preferably, chosen from among:
- the vinylester polymerisable compound is an epoxidised bisphenol A diacrylate monomer of formula (I) below:
- Such a compound is notably available from the company CYTEC with the reference EbecrylTM 600.
- the sulphonated aromatic thermoplastic polymer is, preferably, chosen from among the polysulfones, the polyethersulfones and the polyphenylsulfones such as, for example, those sold by the company SOLVAY Advanced Polymers with the references UdeITM (polysulfones), VeradelTM and VirantageTM (polyethersulfones) and RadelTM (polyphenylsulfones).
- polyethersulfones such as, for example, the one sold by the company SOLVAY Advanced Polymers with the reference VirantageTM VW-10700 RFP, are particularly preferred.
- N-Vinyl lactam is preferably chosen from among N-vinyl-2-pyrrolidone, N-vinyl-2-piperidone and N-vinyl caprolactam, and N-vinyl-2-pyrrolidone is very particularly preferred.
- compound 1 is preferably the monomer of formula (II) below:
- This monomer is known by the name tris-(2-hydroxyethypisocyanurate triacrylate and is available from the company SARTOMER with the reference SR 368.
- This monomer is known by the name tricyclodecane dimethanol-diacrylate and is available from the company SARTOMER with the reference SR 833S.
- the curable composition has the following qualitative and quantitative formulation, expressed by mass percentages:
- the curable composition has the following qualitative and quantitative formulation, expressed as mass percentages:
- Such a curable composition indeed produces, after curing, a material which provides an excellent compromise between roughness, performance at high temperatures and moisture resistance, since it has at once a hardness greater than 1.4 MPa.m 1/2 (as determined by standard ISO 13586:2000), a glass transition temperature of over 180° C. and a moderate sensitivity to moisture.
- Another object of the invention is a material which is characterised in that it is obtained by curing a curable composition as defined above.
- this material is, preferably, either an adhesive assembling parts with one another, and, in particular, parts made of composite material(s), or a material forming the matrix of a composite material of the type which includes a matrix in which there is a reinforcement.
- the reinforcement present in this composite material can be of different types.
- it can be a reinforcement consisting of glass fibres, quartz fibres, carbon fibres; graphite fibres, silica fibres, metal fibres such as steel fibres, aluminium fibres or boron fibres, organic fibres such as aramid fibres, polyethylene fibres, polyester fibres or fibres of poly(p-phenylene benzobisoxazole), more commonly known by the acronym PBO, or again silicon carbide fibres.
- This reinforcement can, depending on the nature of the fibres which constitute it, take the form of cut wires, ground fibres, mats made of continuous filaments, mats with cut filaments, rovings, fabrics, knits, felts, etc., or again the form of complexes produced by associating different types of flat materials.
- the composite material can be manufactured by all techniques known to those skilled in the art of composite materials such as, for example, impregnation, molding by simultaneous injection, molding by autoclave drape forming, vacuum molding, low resin pressure injection molding (or RTM for “Resin Transfer Molding”), low-pressure “wet” cold press molding, compound injection molding (or BMC for “Bulk Molding Compound”), compression molding of prepreg mats (or SMC for “Sheet Molding Compound”), filament winding, centrifugation, or again by pultrusion.
- RTM resin pressure injection molding
- BMC low-pressure “wet” cold press molding
- compound injection molding or BMC for “Bulk Molding Compound”
- compression molding of prepreg mats or SMC for “Sheet Molding Compound”
- filament winding or again by pultrusion.
- Another object of the invention is a composite material which includes a matrix containing a reinforcement, which is characterised in that the matrix is obtained by curing a curable composition as defined above.
- FIGS. 1A , 1 B and 1 C show the projections, with a fixed DTCD mass fraction, on ternary PES-NVP/EPAC/TTHEC diagrams, of the response surface of the roughness of materials obtained from curable compositions consisting of a PES/NVP/EPAC/TTHEC/DTCD blend;
- FIG. 1A is for a DTCD mass fraction of 0.10;
- FIG. 1B is for a DTCD mass fraction of 0.05, while FIG. 1C is for a DTCD mass fraction of 0.00.
- FIGS. 2A , 2 B and 2 C show the projections, with a fixed DTCD mass fraction, on ternary PES-NVP/EPAC/TTHEC diagrams, of the response surface of the glass transition temperature of materials obtained from curable compositions consisting of a PES/NVP/EPAC/TTHEC/DTCD blend;
- FIG. 2A is for a DTCD mass fraction of 0.10;
- FIG. 2B is for a DTCD mass fraction of 0.050, while FIG. 2C is for a DTCD mass fraction of 0.00.
- FIGS. 3A , 3 B and 3 C show the projections, with a fixed DTCD mass fraction, on ternary PES-NVP/EPAC/TTHEC diagrams, of the response surface of the relative mass increase exhibited by materials obtained from curable compositions consisting of a PES/NVP/EPAC/TTHEC/DTCD blend, after immersion for 48 hours in hot water;
- FIG. 3A is for a DTCD mass fraction of 0.10;
- FIG. 3B is for a DTCD mass fraction of 0.05, while FIG. 3C is for a DTCD mass fraction of 0.00.
- FIGS. 4A , 4 B and 4 C show the projections, with a fixed DTCD mass fraction, on ternary PES-NVP/EPAC/TTHEC diagrams, of the response surface of the glass transition temperature exhibited by materials obtained from curable compositions consisting of a PES/NVP/EPAC/TTHEC/DTCD blend, after immersion for 48 hours in hot water;
- FIG. 4A is for a DTCD mass fraction of 0.10;
- FIG. 4B is for a DTCD mass fraction of 0.05, while FIG. 4C is for a DTCD mass fraction of 0.00.
- compositions 1 to 20 were firstly prepared by using:
- compositions were prepared by firstly dissolving the PES in the NVP, with a NVP/PES mass ratio of 1.575, at a temperature of approximately 70° C., with constant mechanical stirring.
- Table I below shows the mass EPAC fractions, as a PES-NVP blend, as TTHEC and as DTCD, used for each of compositions 1 to 20.
- Compositions 1 to 20 were then poured into steel molds measuring 200 mm in width and length, and 5 mm in height, degassed in a vacuum to eliminate the air trapped during pouring, and then polymerised/reticulated by ionisation in an electron beam (CIRCE II Accelerator—10 MeV—of the company LINAC Technologies) with doses of 230 kGy (1 ⁇ 10 kGy pass, followed by one 20 kGy pass, followed by 4 ⁇ 50 kGy passes).
- CIRCE II Accelerator 10 MeV—of the company LINAC Technologies
- the materials obtained in this manner were subjected to tests to determine their toughness, their glass transition temperature and their hygroscopicity, and to assess their ageing resistance in a moist environment.
- the toughness quantified by determining the critical stress intensity factor, noted K Ic , of the materials was determined by tests which were undertaken in accordance with standard ISO 13586:2000 which determines the methods for testing toughness of plastic materials according to the crack opening mode (mode I).
- T g The glass transition temperature, noted T g , was determined by dynamic thermo-mechanical analyses (DMA), since this technique has, indeed, the advantage that it subjects the analysed materials only to very small deformations and, hence, that it does not modify their structure.
- DMA dynamic thermo-mechanical analyses
- the DMA analyses were undertaken by means of a Q800 of the company TA Instruments, in doubly-recessed bending mode, using the following operating conditions: stress frequency: 1 Hz; stress amplitude: 30 ⁇ m; temperature range: 25 to 300° C. with a gradient of 3° C./min.
- the hygroscopicity of the materials was determined by immersing these materials for 48 hours in water kept at 80° C., and by calculating the relative mass increase of the materials following this immersion.
- RMI relative mass increase
- Ageing resistance in a moist environment of the materials was assessed by determining the glass transition temperature of the materials after they had been immersed for 48 hours in water. This glass transition temperature is noted moist Tg.
- FIGS. 1A to 4C By fixing the DTCD mass fraction (since this mass fraction varies only between 0.00 and 0.10), these experimental results enabled the projections shown FIGS. 1A to 4C to be established, in which:
- EPAC contributes moderately to the toughness of the materials, has an unfavourable influence on their glass transition temperature, but has, conversely, a favourable influence on their properties under moist conditions
- the PES-NVP blend has a favourable influence on the toughness and the glass transition temperature of the materials (before immersion in hot water), but is responsible for a degradation of their properties in moist conditions PMR and moist Tg), which is not truly surprising, bearing in mind the hydrophilicity of NVP
- TTHEC improves the glass transition temperature appreciably, but contributes to the take-up of water
- DTCD has an unfavourable influence on the toughness, but improves the glass transition temperature and, above all, greatly limits the take-up of water.
- This curable composition has the following qualitative and quantitative composition, expressed as mass fractions:
- this curable composition has a viscosity which is slightly less than 100 Pa.s at 25° C., making it suitable for use in many techniques for implementing composite materials, including techniques involving an injection operation such as molding by simultaneous injection, or molding by low-pressure injection.
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
Description
-
- a first non-vinylester polymerisable compound, or
compound 1, which comprises at least one isocyanurate group bearing at least two (meth)acrylate groups; and - a second non-vinylester polymerisable compound, or compound 2, which comprises at least one carbopolycyclic or heteropolycyclic group bearing at least two (meth)acrylate groups.
- a first non-vinylester polymerisable compound, or
-
- the bisphenol A vinylester resins such as, for example, those sold by the company SARTOMER with the reference SR 601E, by the company CYTEC with the reference Ebecryl™ 600;
- the halogenated bisphenol A vinylester resins such as, for example, those sold by the company DOW Chemicals with the references Derakane™ DER 510A-40 and 510C-350;
- the novolac vinylester resins such as, for example, those sold by the company CYTEC with the reference Ebecryl™ 609; and
- the mixed vinylester resins, comprising at once bisphenolic A units and novolac units such as, for example, those sold by the company DSM Composite Resins with the reference Atlac™ 430.
or an oligomer or a prepolymer resulting from a polymerisation of this monomer, or again a blend thereof. Such a compound is notably available from the company CYTEC with the reference Ebecryl™ 600.
or an oligomer or a prepolymer resulting from a polymerisation of this monomer, or again a blend thereof. This monomer is known by the name tris-(2-hydroxyethypisocyanurate triacrylate and is available from the company SARTOMER with the reference SR 368.
or an oligomer or a prepolymer resulting from a polymerisation of this monomer, or again a blend thereof. This monomer is known by the name tricyclodecane dimethanol-diacrylate and is available from the company SARTOMER with the reference SR 833S.
-
- 33±5% of the epoxidised bisphenol A diacrylate monomer of formula (I) above, or of an oligomer or of a prepolymer resulting from a polymerisation of this monomer, or again of a blend thereof;
- 10±3% of a polyethersulfone;
- 15±3% of N-vinyl-2-pyrrolidone;
- 40±5% of the monomer of formula (II) above, or of an oligomer or of a prepolymer resulting from a polymerisation of this monomer, or again of a blend thereof; and
- 2±1.5% of the monomer of formula (III) above, or of an oligomer or of a prepolymer resulting from a polymerisation of this monomer, or again of a blend thereof.
-
- 33±1% of the epoxidised bisphenol A diacrylate monomer of formula (I) above, or of an oligomer or of a prepolymer resulting from a polymerisation of this monomer, or again of a blend thereof;
- 10±1% of a polyethersulfone;
- 15±1% of N-vinyl-2-pyrrolidone;
- 40±1% of the monomer of formula (II) above, or of an oligomer or of a prepolymer resulting from a polymerisation of this monomer, or again of a blend thereof; and
- 2±1% of the monomer of formula (III) above, or of an oligomer or of a prepolymer resulting from a polymerisation of this monomer, or again of a blend thereof.
-
- the acronym PES designates the polyethersulfone which is sold by the company SOLVAY Advanced Polymers with the reference Virantage™ VW-10700 RFP;
- the acronym NVP designates N-vinyl-2-pyrrolidone;
- the acronym EPAC designates the oligomer epoxidised bisphenol A diacrylate which is sold by the company CYTEC with the reference Ebecryl™ 600;
- the acronym TTHEC designates the monomer tris-(2-hydroxyethyl) isocyanurate triacrylate which is sold by the company SARTOMER with the reference SR 368; while
- the acronym DTCD designates the monomer tricyclodecane dimethanol-diacrylate which is sold by the company SARTOMER with the reference SR 833S.
-
- EPAC as the vinylester compound;
- PES as the sulphonated polyaromatic thermoplastic polymer;
- NVP as the N-vinyl lactam;
- TTHEC as
compound 1; and - DTCD as compound 2.
TABLE I | |||
Constituents |
Compositions | EPAC | PES- | TTHEC | DTCD | |
1 | 0.273 | 0.245 | 0.383 | 0.100 |
2 | 0.155 | 0.245 | 0.500 | 0.100 |
3 | 0.287 | 0.262 | 0.426 | 0.025 |
4 | 0.423 | 0.327 | 0.250 | — |
5 | 0.248 | 0.327 | 0.375 | 0.050 |
6 | 0.440 | 0.245 | 0.265 | 0.050 |
7 | 0.173 | 0.327 | 0.500 | — |
8 | 0.073 | 0.327 | 0.500 | 0.100 |
9 | 0.255 | 0.245 | 0.500 | — |
10 | 0.368 | 0.279 | 0.353 | — |
11 | 0.346 | 0.303 | 0.301 | 0.050 |
12 | 0.164 | 0.286 | 0.500 | 0.050 |
13 | 0.500 | 0.250 | 0.250 | — |
14 | 0.073 | 0.327 | 0.500 | 0.100 |
15 | 0.362 | 0.289 | 0.250 | 0.100 |
16 | 0.362 | 0.289 | 0.250 | 0.100 |
17 | 0.255 | 0.245 | 0.500 | — |
18 | 0.173 | 0.327 | 0.500 | — |
19 | 0.196 | 0.303 | 0.426 | 0.075 |
20 | 0.423 | 0.327 | 0.250 | — |
TABLE II | ||
Properties of the materials obtained |
Klc | Tg | RMI | Moist Tg | |
Compositions | (MPa · m1/2) | (° C.) | (% by mass) | (° C.) |
1 | 0.92 | 193.80 | 4.23 | 138.31 |
2 | 1.16 | 201.92 | 4.35 | 154.71 |
3 | — | 189.36 | 4.38 | 139.47 |
4 | 1.52 | 177.57 | 4.01 | 118.88 |
5 | 1.30 | 195.44 | 4.65 | 137.69 |
6 | — | 175.67 | 3.39 | — |
7 | 1.31 | 202.40 | 5.26 | 139.44 |
8 | — | 214.69 | 4.46 | — |
9 | — | 191.17 | 4.52 | — |
10 | 1.58 | 185.89 | 3.32 | 133.81 |
11 | 1.21 | 186.12 | — | — |
12 | — | 197.92 | — | — |
13 | — | 167.88 | — | — |
14 | — | 208.18 | — | — |
15 | — | 180.59 | — | — |
16 | — | 181.56 | — | — |
17 | — | 187.64 | — | — |
18 | — | 199.97 | — | — |
19 | — | 198.79 | — | — |
20 | — | 177.93 | — | — |
-
-
FIGS. 1A to 1C are the projections of the response surface of KIc; -
FIGS. 2A to 2C are the projections of the response surface of Tg; -
FIGS. 3A to 3C are the projections of the response surface of RMI; while -
FIGS. 4A to 4C are the projections of the response surface of moist Tg;
-
TABLE III | |||
Constituents |
Properties | EPAC | PES-NVP | TTHEC | DTCD | ||
Klc | + | ++ | − | −− | ||
Tg | −− | + | ++ | + | ||
RMI | + | −− | − | ++ | ||
Moist Tg | + | −− | + | − | ||
It can be seen from this table that: | ||||||
EPAC contributes moderately to the toughness of the materials, has an unfavourable influence on their glass transition temperature, but has, conversely, a favourable influence on their properties under moist conditions; | ||||||
the PES-NVP blend has a favourable influence on the toughness and the glass transition temperature of the materials (before immersion in hot water), but is responsible for a degradation of their properties in moist conditions PMR and moist Tg), which is not truly surprising, bearing in mind the hydrophilicity of NVP; | ||||||
TTHEC improves the glass transition temperature appreciably, but contributes to the take-up of water, while | ||||||
DTCD has an unfavourable influence on the toughness, but improves the glass transition temperature and, above all, greatly limits the take-up of water. |
-
- a KIc ranging from 1.2 to 1.6 MPa.m1/2;
- a Tg ranging from 170 to 215° C.;
- a RMI ranging from 3.4 to 4.5% by mass; and
- a moist Tg ranging from 130 to 155° C.
-
- EPAC: 0.330 (i.e. 33.0% by mass);
- PES: 0.097 (i.e. 9.70% by mass);
- NVP: 0.153 (i.e. 15.3% by mass);
- TTHEC: 0.400 (i.e. 40.0% by mass); and
- DTCD: 0.023 (i.e. 23.0% by mass);
and, after curing, produces a material which has a KIc of 1.44±0.21 MPa.m1/2, a Tg of 184±3° C., a RMI of 4.2±0.3 by mass and a moist Tg of 138±5° C.
- [1] WO-A-2011/042554
- “Résines vinylesters [Vinylester resins]”, Techniques de I'Ingénieur, Plastics and Composites Treatise, volume AM 3450
- EP-A-1 473 325
Claims (15)
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FR1161154A FR2983485B1 (en) | 2011-12-05 | 2011-12-05 | CURABLE COMPOSITIONS FOR OBTAINING OPTIMIZED BEHAVIOR MATERIALS AND MATERIALS OBTAINED THEREFROM |
FR1161154 | 2011-12-05 | ||
PCT/EP2012/074367 WO2013083567A1 (en) | 2011-12-05 | 2012-12-04 | Curable compositions that can be used to obtain materials having an optimised performance, and materials obtained from said compositions |
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US10745530B2 (en) | 2014-02-12 | 2020-08-18 | Airbus Safran Launchers Sas | Sizing composition for reinforcing fibres and applications thereof |
US10975265B2 (en) * | 2016-07-04 | 2021-04-13 | Showa Denko K.K. | Radical-curable adhesive composition and adhesive |
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WO2013083567A1 (en) | 2013-06-13 |
ES2558606T3 (en) | 2016-02-05 |
FR2983485A1 (en) | 2013-06-07 |
US20140336341A1 (en) | 2014-11-13 |
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