US8192074B2 - Method and apparatus for correcting the output signal of a radiation sensor and for measuring radiation - Google Patents
Method and apparatus for correcting the output signal of a radiation sensor and for measuring radiation Download PDFInfo
- Publication number
- US8192074B2 US8192074B2 US12/065,240 US6524006A US8192074B2 US 8192074 B2 US8192074 B2 US 8192074B2 US 6524006 A US6524006 A US 6524006A US 8192074 B2 US8192074 B2 US 8192074B2
- Authority
- US
- United States
- Prior art keywords
- temperature
- sensor
- value
- output signal
- temperature signals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005259 measurement Methods 0.000 claims abstract description 25
- 238000012937 correction Methods 0.000 claims description 25
- 238000012935 Averaging Methods 0.000 claims description 18
- 239000012528 membrane Substances 0.000 claims description 10
- 230000009466 transformation Effects 0.000 claims description 5
- 238000009877 rendering Methods 0.000 claims description 4
- 230000001131 transforming effect Effects 0.000 claims description 2
- 230000008859 change Effects 0.000 description 15
- 238000009529 body temperature measurement Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 9
- 230000035939 shock Effects 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J5/14—Electrical features thereof
- G01J5/16—Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables
Definitions
- the disclosed embodiments relate to a method and an apparatus for correcting the output signal of a radiation sensor and for measuring radiation.
- Related disclosures can be found in DE 102 004 028 032.0 and DE 102 004 028 022.3.
- Radiation sensors transform electromagnetic radiation into an electrical signal. This may be accomplished, for example, by thermopiles, bolometers or the like.
- the radiation sensed by them is often infrared radiation (wavelength larger than 800 nm).
- Radiation sensors of this type are often used for contactless temperature measurement.
- the body of which the temperature is to be measured emits radiation in dependence of its temperature. The radiation is the more intense the higher the temperature of said body is. Accordingly, the emitted infrared radiation of a body may be used for contactless measuring its temperature. The details thereof will be explained with reference to FIG. 1 .
- FIG. 1 shows a sensor element 10 . It comprises a frame 2 which is a support for a membrane 3 .
- the frame 2 surrounds an opening 4 which may have rectangular or round cross-section depending on particular necessities.
- the membrane 3 serves to thermally insulate the actual sensing portion 1 formed on the top surface of the membrane 3 from the surrounding as far as possible.
- the sensing portion 1 of the sensor element 10 receives radiation, preferably infrared radiation, as indicated by two arrows IRn and IRs. IRs indicates the desired signal radiation from the body to be measured. However, the sensing portion receives also noise radiation, as indicated by arrow IRn. This may come from components in the immediate vicinity of the sensing portion, for example the housing of the sensor, shielding members, or the like.
- the sensing portion 1 itself cannot distinguish which kind of radiation impinges on its surface. It will transform both of them into an electrical signal.
- the sensing portion 1 comprises a thermopile consisting of a sequence of hot and cold contacts
- the measurement principle is that the incident radiation will transform into a temperature change (usually rise of temperature) at the hot ends/contacts 1 a .
- the ends above the opening 4 are the hot ends 1 a of the thermopile
- the ends above the frame 2 are the cold ends lb.
- the hot and cold ends may be covered with auxiliary layers, particularly an absorbing layer 5 above the hot ends 1 a and a reflecting layer 6 above the cold ends lb.
- the incident radiation causes a difference in temperature between the hot and the cold ends, and in dependence of this temperature difference, the thermopile will generate an electrical signal.
- Another noise source is indicated by the thick arrow Ta. It is heat conduction through the various physical bodies. 7 is a substrate such as a silicon wafer, a ceramics baseboard or a printed circuit board on which the sensor element 10 of FIG. 1 is mounted. Changes in the ambient temperature will communicate through heat conduction through the support 7 , frame 2 , and membrane 3 to the sensing portion 1 . Heat conduction also takes place between the surrounding atmosphere and the sensor element 10 and the sensing portion 1 thereof, but heat conduction through the substrate 7 is usually much stronger in effect. Since the cold ends are usually differently located with respect to the frame 2 as the warm ends, the former will experience a change in ambient temperature earlier than the warm ends. The hot contact on the membrane of the sensor element is usually the last relevant component that experiences a temperature change because it is usually the thermally best isolated part of the relevant measurement system.
- a change in ambient temperature will first be experienced by the cold ends and only later by the warm ends of the sensing portion 1 . Accordingly, through heat conduction a temperature difference builds up between the hot and the cold ends which has nothing to do with the temperature difference caused by the signal infrared radiation.
- the temperature difference caused by heat conduction will be the larger the faster the temperature change is, because in a fast transition through a temperature range the sensor element will not go through the temperature range in a state close to thermal equilibrium. It will not have almost the same temperature everywhere on the sensor. Rather, there will be temperature differences between the hot and the cold ends which serve to cause errors in the output signal and accordingly in the measured temperature.
- Another proposal is to design the housing of the sensor element 10 such that noise radiation as symbolized by arrow IRn is blocked from the sensing portion as far as possible.
- thermo shock an even more sophisticated compensation of error sources particularly at changing ambient temperature
- a method of correcting the output signal of a radiation sensor comprises the steps of obtaining two or more temperature signals from a corresponding number of measurements of quantities relating to the temperature of the radiation sensor, and correcting the output signal with reference to said temperature signals.
- a method for measuring the temperature of an object comprises the steps of obtaining an output signal from a radiation sensor receiving radiation from said object in accordance with said radiation impinging on said sensor, and correcting the output signal with a method as mentioned above.
- An apparatus for measuring radiation comprises a sensor element for receiving radiation and transforming it into an electrical output signal, and means for obtaining two or more temperature signals from a corresponding number of measurements of quantities relating to the temperature of the apparatus. Said two or more temperature signals are used for correcting the output signal. The temperature can be determined from said corrected output signal.
- two or more temperature measurements of the temperature of the sensor or the sensor element or the sensing portion are obtained for obtaining a measure for the thermal imbalance.
- the two or more temperature measurements may be spaced in locus and/or spaced in time. In any case, they will reflect thermal dynamics relating to the sensor temperature and allow conclusions relating to the thermal imbalance caused to the hot contacts 1 a and the cold contacts 1 b of the sensing portion 1 .
- these temperature measurements can be evaluated by providing correction values for the output signal from said temperature measurements, and/or by immediately correcting the output signal of the sensor element with reference to said temperature measurements.
- FIG. 1 is a schematic sectional view of an embodiment of the sensor element incorporating features of the disclosed embodiments
- FIG. 2 is a schematic plain view of a sensor formed in accordance with an embodiment of the disclosed embodiments
- FIG. 3 is a schematic sectional view of an apparatus for measuring the temperature
- FIG. 4 is a schematic structure of the signal processing
- FIG. 5 is a block diagram of a way of processing a temperature signal in a correcting means
- FIG. 6 is a block diagram of how to obtain a particular average value
- FIG. 7 is a diagram showing typical signal curves
- FIG. 8 is a schematic representation of another correcting means
- FIG. 9 is a schematic representation of yet another correcting means.
- FIG. 1 shows a sectional view of a sensor element 10 formed in accordance with an embodiment of the disclosed embodiments.
- 2 is a frame formed by micromachining, for example from a silicon wafer. It may have a rectangular outer cross section. An opening 4 with rectangular or partially or fully rounded cross section is surrounded by the frame 2 . A membrane 3 spans across the opening 4 . On the membrane 3 , the sensing portion 1 is formed. It may be a thermopile with a couple of warm contacts 1 a and cold contacts 1 b . The warm contacts 1 a are usually located above the opening 4 . The cold contacts may be located above the frame 2 or also above the opening 4 , depending on particular necessities.
- the warm contacts 1 a have a temperature T 2
- the cold contacts 1 b have a temperature T 1 . From said temperature difference, the actual electrical signal will be determined.
- An absorbing layer 5 for enhancing absorption may be provided above the warm contacts 1 a
- a reflecting layer 6 for preventing absorption may be provided above the cold contacts 1 b.
- one or more temperature sensors 11 may be provided on the sensor element 10 . They may be provided on an arbitrary position of the sensor element 10 , but preferably distant from the hot contacts 1 a , e.g. close to the cold contact 1 b and/or inbetween cold contact 1 b and warm contact 1 a.
- one temperature sensor 11 is provided close to the cold contacts 1 b and another one is provided in between cold and warm contacts, as shown in FIG. 1 . If, caused by a thermal shock, a temperature change sweeps through the sensor element 10 as indicated by thick arrow Tn, this will first by experienced by the cold contact 1 b and by the accordingly allocated temperature sensor 11 a , and thereafter it will be experienced by the temperature sensor 11 b located between warm and cold contacts. Accordingly, the two temperature sensors will show different temperatures, they show a gradient over locus. This gradient is not caused by the radiation to be measured. Rather, it reflects the thermal shock experienced by the sensor element 10 and particularly, the thermal imbalance (noise imbalance) caused by the change of ambient temperature in addition to the thermal imbalance (signal imbalance) caused by the infrared radiation from the objects to be measured.
- a temperature sensor 11 may have own electrical terminals through which its signal can be interrogated. It can be, for example, a temperature resistant resistor or similar devices.
- the above embodiment measures the temperature at two locations on the sensor element 10 , itself. However, it is not necessary to measure the thermal imbalance immediately at the sensor element itself. Rather, it may also be measured between the sensor element 10 and another component, for example the substrate 7 because also such an imbalance is a measure for the thermal inequilibrium caused by change in ambient temperature (thermal shock). Accordingly, there need not be two sensor elements provided on the sensor element 10 itself. Rather, one may be provided somewhere on the sensor element 10 , and another in another component of the sensor.
- FIG. 2 shows an embodiment of a sensor 20 in a schematically way. It is a plain view on a base plate of a possibly housed sensor 20 with the housing, for example a cap member, being removed.
- 10 symbolizes the sensor element of FIG. 1 with a temperature sensor 11 thereon.
- 21 symbolizes an evaluation electronics which may be an ASIC (application specific integrated circuit).
- 29 a to e symbolize contact points for sensor terminals. Not shown is a wiring between sensor element 10 , evaluation electronics 21 and contacts 29 a to e . 22 symbolizes a temperature sensor on the base plate of the sensor 20 , said base plate having reference numeral 25 in FIG. 2 . It may be component 7 in FIG. 1 .
- the evaluation electronics 21 may itself have a temperature sensor 24 formed thereon.
- At least two of the temperature sensors 11 , 22 and 24 may be used. They are provided on suitable differing locations on the sensor 20 , and they will show a temperature gradient over locus not being caused by the signal infrared radiation to be measured, but by a change of ambient temperature. Again, such a gradient can be used for correcting the output signal of the sensor element 10 .
- a temperature gradient can be used for correcting the output signal of the sensor element 10 .
- one may for example consider the temperature difference between sensor elements 24 and 11 , or between 22 and 11 , or between 24 and 22 . In the later option, it is not at all necessary to provide a temperature sensor on the sensor element 10 itself.
- the apparatus for measuring radiation may comprise only a sensor as schematically shown in FIG. 2 , said sensor having the sensor element 10 and means 21 for correcting the output signal.
- Said means 21 for correcting the output signal may be an ASIC formed within sensor 20 .
- ASIC 21 receives the raw output signal of sensor element 10 , obtains the temperature measurements, and corrects the raw output signal of sensor element 10 and outputs the correct signal to the terminals 29 a to e.
- At least one temperature signal relating to the temperature of the sensor or to one or more components of the sensor and used for correction may be obtained from a measurement outside the sensor, for example a measurement on the circuit board where the sensor is mounted. The signal may then be inputted to the sensor in an appropriate manner or it may be used outside the sensor on or with quantities output from the sensor.
- the apparatus for measuring radiation may be a larger system in which the raw signal from the sensor element 10 (perhaps amplified and calibrated in sensor 20 ) is transmitted away from the sensor 20 towards an external circuit for further processing there.
- the sensor element 10 may have a size of less than 3 mm*3 mm, preferably less than 2 mm*2 mm.
- the sensor 20 may have a regular or standardized housing such as a TO5-housing. Multiple sensor elements 10 may be provided in one sensor. Each output signal thereof may be corrected as described. Signal multiplexing may be used for this as well as for signal output.
- FIG. 3 shows an embodiment of an electronic component which schematically shows in cross section a housed circuit.
- 31 is a baseboard, for example a printed circuit board.
- 32 may be a socket for a radiation sensor. 20 symbolizes the radiation sensor itself in the side view, it shows the sensor base plate 25 , a cap 36 housing and closing the sensor, a radiation entrance window 37 which may comprise a focusing element such as a lens or a mirror, and terminals 38 received by the socket 32 or immediately soldered to the circuit board 31 .
- 39 a to c symbolize other circuit elements such as resistors, capacitors, and the like.
- 33 may be again an ASIC or a digital component such as a microprocessor.
- 35 symbolizes a connector for transmitting away signals and receiving signals and for power supply.
- the temperature signals obtained from the at least two measurements within sensor 20 may be transmitted away from sensor 20 together with the raw (and possibly amplified and calibrated) output signal of the sensor element 10 . These signals may be processed for example in ASIC or microprocessor 33 , and corrected values are further used or outputted via connector 35 .
- circuit 30 as shown in FIG. 3 may also be some kind of preprocessing, signal formatting and process control, and signals corresponding to the temperature measurements and the raw output signal (perhaps calibrated and amplified) of the sensor element 10 are transmitted away from circuit 30 towards a regular computer for further processing there.
- FIG. 4 shows a general signal flow.
- 10 indicates the sensor element, which outputs a raw signal (voltage) Vr.
- This signal Vr may be amplified in an amplifier 42 giving an amplified voltage Va, which may further linearly be calibrated for offset and sensitivity in a calibration 43 , this giving a calibrating voltage Vc.
- a transformation means 44 transforms the calibrating voltage Vc into a voltage reflecting the temperature Vt of the object to be measured.
- the correaction of the obtained signals as described above is made prior to transformation means 44 .
- box 21 representing the correcting means 21 as shown in FIG. 2 , which may be the ASIC within sensor 20 or an external component as shown with reference numeral 33 in FIG. 3 or a (not shown) usual computer.
- the correction means 21 may be preferably inserted between sensor element 10 and amplifier 42 or between amplifier 42 and calibration 43 or between calibration 43 and transformation means 44 .
- the transformation means may involve Botzmanns T ⁇ 4 dependency.
- Correcting means 21 receives the uncorrected (but perhaps already amplified and/or calibrated) signal, corrects it as mentioned above in accordance with the at least two measurements of temperature of the sensor or a particular component thereof, and outputs it for further processing.
- Correction means 21 receives the at least two temperature measurements Tn and Tm as indicated with boxes 45 and 46 and may further receive calibration values 47 .
- the correction may be performed on the analog or on the digital side.
- calibration 43 may be analog or digital.
- Amplification 42 and calibration 43 may be performed in a unified component or may be reversed in order as compared to what is shown in FIG. 4 .
- one or more of the boxes 42 , 43 and 44 may be incorporated in the correcting means 21 to form a unified piece of hardware such as the mentioned ASIC.
- a temperature gradient over time is obtained. It may then not be necessary to obtain temperature measurements at two or more locations.
- This embodiment reflects the fact that a temperature gradient in time correlates strongly with a temperature gradient over locus. Looking at the entire measuring apparatus when it experiences a temperature shock, this shock will cause a temperature gradient over locus with the peripheral components experiencing the temperature change first, and more central components experiencing the temperature change later, thus rendering a gradient over locus, as explained above.
- the innermost component in this respect will usually be the hot contact on the membrane of the sensor element, because usually this is the thermally best isolated part of the relevant measurement system.
- this locus will almost always also experience a temperature gradient over time when a temperature shock through change of ambient temperature is experienced. As long as the entire measurement system is in thermal equilibrium, its components have the same temperature and won't show a gradient over locus, and their temperature is stable and won't show a gradient over time, either.
- one way of providing correction to the uncorrected signal is to form a difference between at least two of the obtained temperature values and to apply a correction proportional to the difference additively or multiplicatively to the uncorrected signal.
- values derived from said temperature values may be used, particularly average values.
- Averaging has the advantage that the useful signal will sum up, whereas noise tends to neutralize itself.
- Averaging may be particularly used if the gradient over time of the temperature signal is evaluated.
- va is the average value to be determined, vae is an earlier corresponding average value, Ta is the actually measured temperature value, and k is an averaging coefficient between 0 and 1.
- the value k is a weighting coefficient that weights the present temperature value Ta in relation to the value vae incorporating the earlier values of Ta. Together, the entire weight is 1. If k is large, then the actual temperature strongly influences the new average value va and the earlier composite value vae has weaker influence thereon, whereas when k is small, the actual temperature Ta only weakly influences va whereas the earlier values incorporated in vae have stronger effect thereon. Therefore, by setting k, one can determine whether the effective time of the average value va is closer to the present or closer to the past. In the extreme, if k is 1, then the history incorporated in the earlier value has no influence at all, because it is multiplied with zero.
- the value k can be selected in view of the time constant of the sensor element 10 (more in detail: the time constant for the hot contacts to react on the temperature change applied through heat conduction from the bottom of the frame). Further, the averaging parameter k can be selected in accordance with the sampling rate of the device 21 performing the correction. And further, the sampling rate can be determined in accordance with said time constant.
- FIG. 5 shows a block diagram of a correcting means 50 for performing the immediate correction.
- the correcting means may be part of correcting means 21 . Its input signals Ta, Ts and output signal Tk may be one or more of the values Tn, Tm, Vr, Va, Vc or Vt in FIG. 4 . It receives the signal from the sensor element 10 , symbolized as signal Ts in FIG. 5 , which may have undergone already some preferably linear processing such as amplification and/or calibration as shown in FIG. 4 . Further, correcting means 50 receives signal Ta representing the measured temperature measured by one temperature sensor such as one of reference numerals 11 , 22 and 24 in FIG. 2 . Register 51 keeps an actual value, and register 52 keeps a past value.
- a subtractor 53 is a subtractor in which the earlier value from 52 is subtracted from the later value at 51 .
- the difference goes to a calibration 54 which may perform a preferably linear correction.
- a calibration 54 which may perform a preferably linear correction.
- it is applied to the uncorrected temperature signal Ts in box 55 .
- It may be an addition or a multiplication or some kind of nonlinear correction in accordance with the calibrated value leaving box 54 .
- a table may be addressed, the table outputting correction values for correcting Ts.
- the thus corrected signal Ts leaves box 55 and the correcting means 50 as a signal Tk for further processing, particularly for sooner or later entering box 44 in FIG. 4 .
- the value from register 51 is transferred to register 52 after the difference of the registered values was formed, register 51 receives a new value of Ta, and the procedure starts again.
- FIG. 6 shows a block diagram of an averaging means 60 that may be used for example as block 51 in FIG. 5 and/or as block 52 in FIG. 5 . It forms an autoregressive average as mentioned above.
- 62 is a register holding a value.
- Ta is the input of the measured temperature.
- 61 symbolizes a multiplier to multiply the input value with the averaging coefficient k (0 ⁇ k ⁇ 1), and the result goes to an adder 64 which also receives the content of register 62 multiplied by 1 ⁇ k in multiplier 63 . The sum of both is again written to register 62 and output as an average value va.
- autoregressive average has the advantage that not a plurality of registers is necessary for holding past values. Rather, said past values are all contained in the already held average value which is added to the appropriately weighted new temperature value for registering in the same register as the earlier value by overwriting it.
- both registers 51 and 52 may be replaced by respectively one averager 60 as shown in FIG. 6 , but these averagers working with differing averaging coefficients.
- the one in the top of FIG. 5 has a higher coefficient (closer to 1) and is thus closer to the actual value of Ta, whereas the lower thereof has a smaller value of k (closer to 0) so that its output is closer to the past.
- such averagers 60 may receive differing inputs from differing temperature sensors as shown in FIG. 2 . If they receive different temperature inputs, they may have the same averaging coefficient k.
- FIG. 7 The result of the FIG. 5 correcting means 50 using two averagers 60 as shown in FIG. 6 with differing averaging coefficients k on the same input Ta is shown in FIG. 7 .
- the curve T(t) symbolizes a temperature change in the temperature as experienced by a temperature sensor 1 , 22 , 24 as shown in FIG. 2 .
- Curve va 1 ( t ) symbolizes the autoregressive average with a higher k (i.e. quicker following T(t)), whereas va 2 ( t ) represents the curve of the autoregressive average having a smaller k (thus following curve T(t) slower).
- the temperature of the sensor 20 or sensor element 10 may be measured at two or more different locations and with two or more different time references, such as different points of time of different measurements or different effective times of different autoregressive averages as mentioned above. One obtains then at least four values which allow formation of at least six differences amongst them.
- FIG. 8 shows a corresponding embodiment.
- a correcting means functionally corresponding to correcting means 50 in FIG. 5 . It receives a signal Ta 1 representing the temperature at a first location, and a signal Ta 2 representing the temperature at a second location. Both signals respectively may go through a fast and a slow autoregressive averaging process as described with reference to FIG. 6 , thus rendering four values relating to different locations at different times.
- storage registers may be used with an appropriate renewal structure behind them.
- each of said differences may be determined for properly taking into account said difference for correcting the temperature signal to be corrected Ts from the sensor in order to produce the corrected temperature signal Tk. This may be accomplished in a calibration process in which a sensor in its built-in state is exposed to a defined change of ambient temperature so that the respective sensor signals are obtained (Ts from the radiation sensor on the one hand side and Ta 1 , Ta 2 at least on the other hand side).
- coefficients 82 for the respective differences can be obtained and permanently stored in the correcting means 80 as shown in FIG. 8 , preferably by writing them into PROM-like registers.
- the weighted differences may be added in an adder 83 and used for correction of Ts in box 84 to obtain Tk.
- coefficients used in the above described techniques may be obtained by calibrating an individual sensor, possibly in its built-in state, in a defined environment in which the respective outputs are monitored and the coefficients are set such that deviation between actual and target values become minimum. Coefficients may be permanently written into the sensor, e.g. into the correcting means 21 .
- FIG. 8 instead of the structure of FIG. 8 also the one in FIG. 9 can be used. Behind this is the idea that the differences formed in FIG. 8 are, and go through, linear operations so that instead of separately forming and weighting the differences and adding them, also their input values can be weighted and added.
- This weight can be applied to the output of averagers 60 or to corresponding values, as shown in FIG. 9 , and the weighted results are summed up. From a computational point of view, this is less complex than the embodiment in FIG. 8 and renders the same result.
- the correcting means 21 in FIG. 2 may have one or more clocked tasks which are repeatedly executed. All required processings may be compiled to one big task executed with a suitable repetition rate.
- Such a task may comprise data acquisition (from at least of sensor element 10 , and from one or more temperature sensors 11 , 22 , 24 ), calibration, subtraction, and the like, as described above.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
- Indication And Recording Devices For Special Purposes And Tariff Metering Devices (AREA)
Abstract
Description
va=k*Ta+(1−k)*vae,
Claims (25)
va=k*Ta+(1−k)*vae,
va=k*Ta+(1−k)*vae,
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005041050A DE102005041050B4 (en) | 2005-08-30 | 2005-08-30 | Method and device for correcting the output signal of a radiation sensor and for measuring radiation |
DE102005041050.2 | 2005-08-30 | ||
DE102005041050 | 2005-08-30 | ||
PCT/EP2006/008402 WO2007025697A1 (en) | 2005-08-30 | 2006-08-28 | Method and apparatus for correcting the output signal of a radiation sensor and for measuring radiation |
Publications (2)
Publication Number | Publication Date |
---|---|
US20090219971A1 US20090219971A1 (en) | 2009-09-03 |
US8192074B2 true US8192074B2 (en) | 2012-06-05 |
Family
ID=37247528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/065,240 Active 2028-11-16 US8192074B2 (en) | 2005-08-30 | 2006-08-28 | Method and apparatus for correcting the output signal of a radiation sensor and for measuring radiation |
Country Status (6)
Country | Link |
---|---|
US (1) | US8192074B2 (en) |
EP (1) | EP1924830A1 (en) |
JP (1) | JP2009506333A (en) |
CN (1) | CN101253397A (en) |
DE (1) | DE102005041050B4 (en) |
WO (1) | WO2007025697A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150010038A1 (en) * | 2013-07-02 | 2015-01-08 | Exergen Corporation | Infrared Contrasting Color Temperature Measurement System |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011076680A1 (en) * | 2011-05-30 | 2012-12-06 | Hilti Aktiengesellschaft | Imaging measuring system and measuring method for measuring a heat emission at a target object |
US9976908B2 (en) | 2013-07-02 | 2018-05-22 | Exergen Corporation | Device for temperature measurements of surfaces with a low unknown and/or variable emissivity |
JP6194799B2 (en) * | 2014-01-15 | 2017-09-13 | オムロン株式会社 | Infrared sensor |
CN106706135B (en) * | 2015-11-16 | 2019-04-16 | 上海新微技术研发中心有限公司 | Packaging structure of infrared temperature sensor integrated with ASIC (application specific integrated circuit) and manufacturing method thereof |
DE102015122452A1 (en) * | 2015-12-21 | 2017-06-22 | Heimann Sensor Gmbh | Method and system for non-contact temperature measurement |
CN107796091A (en) * | 2017-10-18 | 2018-03-13 | 珠海格力电器股份有限公司 | A kind of sensor calibration method, apparatus in air-conditioner set and the air-conditioning using described device |
EP3486623B1 (en) * | 2017-11-17 | 2019-10-30 | Melexis Technologies NV | Low-drift infrared detector |
CN111721425B (en) * | 2020-06-29 | 2022-08-05 | 烟台艾睿光电科技有限公司 | Infrared temperature measurement method, device, equipment and computer readable storage medium |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4900162A (en) * | 1989-03-20 | 1990-02-13 | Ivac Corporation | Infrared thermometry system and method |
US5378873A (en) * | 1992-06-05 | 1995-01-03 | Katzmann; Fred L. | Electrothermal conversion elements, apparatus and methods for use in comparing, calibrating and measuring electrical signals |
US6414310B1 (en) * | 1999-10-29 | 2002-07-02 | Sensor Electronics Corporation | Automatic control circuit for infrared detectors |
US6565254B2 (en) | 2000-06-06 | 2003-05-20 | Seiko Epson Corporation | Infrared sensing element and temperature measuring device |
DE68929426T2 (en) | 1988-04-12 | 2003-07-31 | Citizen Watch Co Ltd | Clinical radiation thermometer |
US6821016B2 (en) | 2001-06-04 | 2004-11-23 | Omron Corporation | Infrared clinical thermometer and temperature state estimation method, information notification method, and measurement operation method thereof |
DE10341142A1 (en) | 2003-09-06 | 2005-03-31 | Braun Gmbh | Radiation thermometer housing temperature gradient compensation procedure uses time averages of measured internal temperature differences |
US6908224B2 (en) * | 2002-05-21 | 2005-06-21 | Kendro Laboratory Products, Lp | Temperature sensor pre-calibration method and apparatus |
DE102004028022A1 (en) | 2004-06-09 | 2005-12-29 | Perkinelmer Optoelectronics Gmbh & Co.Kg | sensor |
DE102004028032A1 (en) | 2004-06-09 | 2005-12-29 | Perkinelmer Optoelectronics Gmbh & Co.Kg | sensor element |
US20090086788A1 (en) * | 2007-09-27 | 2009-04-02 | Nail Khaliullin | Temperature sensor, device and system including same, and method of operation |
US20110019713A1 (en) * | 2005-07-18 | 2011-01-27 | Micron Technology, Inc. | System and method for automatically calibrating a temperature sensor |
US20110125444A1 (en) * | 2008-06-11 | 2011-05-26 | Utah State University Research Foundation | Mini-Cell, On-Orbit, Temperature Re-Calibration Apparatus and Method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6455696A (en) * | 1987-08-26 | 1989-03-02 | Hochiki Co | Fire judging device |
EP1302761B1 (en) * | 2000-06-13 | 2014-08-06 | Omron Healthcare Co., Ltd. | Pyrometer |
JP2003033012A (en) * | 2001-07-09 | 2003-01-31 | Denso Corp | Current controller for inductive load |
-
2005
- 2005-08-30 DE DE102005041050A patent/DE102005041050B4/en not_active Expired - Fee Related
-
2006
- 2006-08-28 CN CNA200680031452XA patent/CN101253397A/en active Pending
- 2006-08-28 WO PCT/EP2006/008402 patent/WO2007025697A1/en active Application Filing
- 2006-08-28 JP JP2008528399A patent/JP2009506333A/en active Pending
- 2006-08-28 US US12/065,240 patent/US8192074B2/en active Active
- 2006-08-28 EP EP06777088A patent/EP1924830A1/en not_active Ceased
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68929426T2 (en) | 1988-04-12 | 2003-07-31 | Citizen Watch Co Ltd | Clinical radiation thermometer |
US4900162A (en) * | 1989-03-20 | 1990-02-13 | Ivac Corporation | Infrared thermometry system and method |
US5378873A (en) * | 1992-06-05 | 1995-01-03 | Katzmann; Fred L. | Electrothermal conversion elements, apparatus and methods for use in comparing, calibrating and measuring electrical signals |
US6414310B1 (en) * | 1999-10-29 | 2002-07-02 | Sensor Electronics Corporation | Automatic control circuit for infrared detectors |
US6565254B2 (en) | 2000-06-06 | 2003-05-20 | Seiko Epson Corporation | Infrared sensing element and temperature measuring device |
US6821016B2 (en) | 2001-06-04 | 2004-11-23 | Omron Corporation | Infrared clinical thermometer and temperature state estimation method, information notification method, and measurement operation method thereof |
US6908224B2 (en) * | 2002-05-21 | 2005-06-21 | Kendro Laboratory Products, Lp | Temperature sensor pre-calibration method and apparatus |
DE10341142A1 (en) | 2003-09-06 | 2005-03-31 | Braun Gmbh | Radiation thermometer housing temperature gradient compensation procedure uses time averages of measured internal temperature differences |
DE102004028022A1 (en) | 2004-06-09 | 2005-12-29 | Perkinelmer Optoelectronics Gmbh & Co.Kg | sensor |
DE102004028032A1 (en) | 2004-06-09 | 2005-12-29 | Perkinelmer Optoelectronics Gmbh & Co.Kg | sensor element |
DE102004028022B4 (en) | 2004-06-09 | 2006-11-16 | Perkinelmer Optoelectronics Gmbh & Co.Kg | sensor |
US20110019713A1 (en) * | 2005-07-18 | 2011-01-27 | Micron Technology, Inc. | System and method for automatically calibrating a temperature sensor |
US20090086788A1 (en) * | 2007-09-27 | 2009-04-02 | Nail Khaliullin | Temperature sensor, device and system including same, and method of operation |
US20110125444A1 (en) * | 2008-06-11 | 2011-05-26 | Utah State University Research Foundation | Mini-Cell, On-Orbit, Temperature Re-Calibration Apparatus and Method |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150010038A1 (en) * | 2013-07-02 | 2015-01-08 | Exergen Corporation | Infrared Contrasting Color Temperature Measurement System |
US10054495B2 (en) * | 2013-07-02 | 2018-08-21 | Exergen Corporation | Infrared contrasting color temperature measurement system |
US10704963B2 (en) | 2013-07-02 | 2020-07-07 | Exergen Corporation | Infrared contrasting color emissivity measurement system |
Also Published As
Publication number | Publication date |
---|---|
WO2007025697A1 (en) | 2007-03-08 |
JP2009506333A (en) | 2009-02-12 |
EP1924830A1 (en) | 2008-05-28 |
US20090219971A1 (en) | 2009-09-03 |
DE102005041050B4 (en) | 2007-09-06 |
CN101253397A (en) | 2008-08-27 |
DE102005041050A1 (en) | 2007-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8192074B2 (en) | Method and apparatus for correcting the output signal of a radiation sensor and for measuring radiation | |
CA2589377C (en) | Thermometer calibration | |
KR101236551B1 (en) | Radiometry using an uncooled microbolometer detector and infra-red camera using thereof | |
KR100668025B1 (en) | Temperature correction processing apparatus | |
US7991571B2 (en) | Providing nonlinear temperature compensation for sensing means by use of padé approximant function emulators | |
US4527896A (en) | Infrared transducer-transmitter for non-contact temperature measurement | |
US8158942B2 (en) | Device and method for detecting infrared radiation through a resistive bolometer matrix | |
US8872110B2 (en) | Thermographic camera | |
US6065866A (en) | Method of calibrating a radiation thermometer | |
WO1999015866A1 (en) | Radiation thermometer and method for adjusting the same | |
CN107966211B (en) | Infrared sensor for measuring ambient air temperature | |
KR20070114225A (en) | Method and system for measuring and compensating for the case temperature variations in a bolometer based system | |
WO2018037721A1 (en) | Thermal humidity measuring device | |
CN111579081A (en) | Infrared temperature measurement method, device and equipment | |
Tank et al. | Multispectral infrared pyrometer for temperature measurement with automatic correction of the influence of emissivity | |
US20040079888A1 (en) | Infrared detection device | |
KR100959829B1 (en) | Temperature-compensated gas measurement apparatus for nano device gas sensor and method thereof | |
JP2002538425A (en) | Sensor module with integrated signal processing | |
Pertijs | Calibration and Self‐Calibration of Smart Sensors | |
US8283634B2 (en) | Device for detecting electromagnetic radiation | |
JP2004177272A (en) | Infrared detector | |
CN115574980B (en) | Temperature calibration method and electronic equipment | |
JP4156962B2 (en) | Weighing device | |
WO2001071299A2 (en) | Method and apparatus for correction of microbolometer output | |
McHugh et al. | System response function: a new approach to minimize IR testing errors |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: PERKINELMER OPTOELECTRICS GMBH & CO. KG, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIESS, MARTIN;SCHILZ, JUERGEN;REEL/FRAME:021695/0775 Effective date: 20081014 |
|
AS | Assignment |
Owner name: PERKINELMER TECHNOLOGIES GMBH & CO. KG, GERMANY Free format text: CHANGE OF NAME;ASSIGNOR:PERKINELMER OPTOELECTRONICS GMBH & CO. KG;REEL/FRAME:025134/0710 Effective date: 20090915 |
|
AS | Assignment |
Owner name: EXCELITAS TECHNOLOGIES GMBH & CO KG, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PERKINELMER TECHNOLOGIES GMBH & CO KG;REEL/FRAME:028080/0453 Effective date: 20101129 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
AS | Assignment |
Owner name: EXCELITAS TECHNOLOGIES SINGAPORE PTE. LTD., SINGAP Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:EXCELITAS TECHNOLOGIES GMBH & CO KG;REEL/FRAME:030076/0567 Effective date: 20130321 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 12 |