US8129248B2

US8129248B2 - Method of producing bipolar transistor structures in a semiconductor process

Info

Publication number: US8129248B2
Application number: US12/833,573
Authority: US
Inventors: Thomas Scharnagl; Berthold Staufer
Original assignee: Texas Instruments Inc
Current assignee: Texas Instruments Inc
Priority date: 2009-07-13
Filing date: 2010-07-09
Publication date: 2012-03-06
Also published as: US20110165760A1; DE102009032854A1; DE102009032854B4

Abstract

In the method of producing bipolar transistor structures in a semiconductor process, an advanced epitaxial trisilane process can be used without the risk of poly stringers being formed. A base window is structured in a polycrystalline silicon layer covered with an oxide layer, and a further step is epitaxial growing of a silicon layer in the base window from trisilane. The window structuring is performed in a sequence of anisotropic etch and isotropic ash steps, thereby creating stepped and inwardly sloping window edges. Due to the inwardly sloping side walls of the window, the epitaxially grown silicon layer is formed without inwardly overhanging structures, and the cause of poly stringers forming is thus eliminated.

Description

FIELD OF THE INVENTION

The invention relates to a method of producing bipolar transistor structures in a semiconductor process, in particular transistor structures in BICOM (bipolar complementary) technology.

BACKGROUND

In a typical sequence of a BICOM fabricating process the window for a transistor base is usually structured by means of an anisotropic plasma etching step. The window defined by a patterned resist layer is thus structured with straight side walls that extend through a polycrystalline silicon layer (hereinafter “poly”) covered with an oxide layer. For epitaxial (“EPI”) growing of a silicon layer in the base window an advanced trisilane (Si₃H₈) epitaxial process is a preferred option due to the low cost and high yield of that process. With shrinking component dimensions and increasing thickness of the polycrystalline silicon layer, however, the trisilane epitaxial process is not applicable due to the forming of residual poly stringers after structuring that epitaxial layer by etching, as will be explained in more detail with reference to the appending drawings. These stringers affect operation of the resulting circuit component.

SUMMARY

In one aspect of the invention a method of producing bipolar transistor structures in a semiconductor process is provided, wherein an advanced epitaxial trisilane process can be used without the risk of poly stringers being formed. In accordance with the invention, the method of producing bipolar transistor structures in a semiconductor process comprises the step of structuring, by plasma etching, a base window in a polycrystalline silicon layer covered with an oxide layer, and the further step of epitaxial growing a silicon layer in the base window from trisilane. The plasma etching is performed in a sequence of anisotropic etch and isotropic ash steps, thereby creating stepped and inwardly sloping window edges. Due to the inwardly sloping side walls of the window, the epitaxially grown silicon layer is formed without inwardly overhanging structures, and the cause of poly stringers forming is thus eliminated.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 a to 1 e are schematic sectional views illustrating successive semiconductor process steps in the formation of a bipolar transistor base window that would result in the occurrence of poly stringers; and

FIGS. 2 a and 2 b are schematic sectional views illustrating alternative semiconductor process steps in the formation of a bipolar transistor base window that avoid the occurrence of poly stringers.

DETAILED DESCRIPTION OF AN EXAMPLE EMBODIMENT

In FIG. 1 a, a bipolar base window 10 is shown as defined by a patterned resist 12 and extending through a polycrystalline silicon layer 14 covered by an oxide layer 16. The window is structured using an anisotropic plasma etching step. As a result the window has straight side walls that extend all the way through the oxide layer 16 and the poly layer 14 down to an underlying oxide layer 18.

If, as illustrated in FIG. 1 b, an EPI layer 20 is subsequently grown in the exposed window and over the adjacent oxide layer 16 using an advanced trisilane epitaxial process, the EPI layer 20 is formed with inwardly bulged overhanging beads 20 a. Underneath the beads 20 a, outwardly directed recesses 20 b are formed.

In a subsequent process step, as illustrated in FIG. 1 c, dielectric layers 22 (oxide, nitride, etc.) are deposited over the EPI layer 20. The dielectric layers 22 completely fill the recesses 20 b left by the EPI layer 20.

In a further subsequent process step, as illustrated in FIG. 1 d, anisotropic plasma etching cannot remove the dielectric material from the recesses 20 b. An alternative wet etching step is not possible for reasons of process technology.

When the EPI layer 20 is then structured, as illustrated in FIG. 1 e, the residual dielectric material from the recesses 20 b acts like a screen to the anisotropic etching, and any material from the EPI layer that is located immediately underneath will not be removed, thereby leaving “poly stringers” 26 next to the structured part of the EPI layer. These poly stringers can make the semiconductor component inoperative.

Turning now to FIG. 2 a, the inventive method involves shaping of the base window with side walls that are stepped and slope inwardly of the window, as shown. This is achieved with a plasma etch process that consists of sequential anisotropic etch and isotropic ash steps. The sequential anisotropic etch and isotropic ash steps must be adjusted so as to achieve the desired shape of the window side walls.

When the EPI layer is then grown over the base window using a trisilane epitaxial process, as shown in FIG. 2 b, an EPI layer 28 is obtained free from overhanging beads, and the EPI layer can be structured without any risk of forming poly stringers.

Although the invention has been described hereinabove with reference to a specific embodiment, it is not limited to this embodiment and no doubt further alternatives will occur to the skilled person that lie within the scope of the invention as claimed.

Claims

The invention claimed is:

1. A method of producing bipolar transistor structures in a semiconductor process, comprising the steps of:

structuring, by plasma etching, a base window in a polycrystalline silicon layer covered with an oxide layer;

epitaxial growing a silicon layer in the base window from trisilane;

wherein said plasma etching is performed in a sequence of anisotropic etch and isotropic ash steps, thereby creating stepped and inwardly sloping window edges.