US7656650B2 - Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly - Google Patents

Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly Download PDF

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Publication number
US7656650B2
US7656650B2 US11/207,884 US20788405A US7656650B2 US 7656650 B2 US7656650 B2 US 7656650B2 US 20788405 A US20788405 A US 20788405A US 7656650 B2 US7656650 B2 US 7656650B2
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United States
Prior art keywords
printed board
plasma display
frame
board assemblies
chassis base
Prior art date
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Expired - Fee Related, expires
Application number
US11/207,884
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English (en)
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US20060077628A1 (en
Inventor
Yeung-ki Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung SDI Co Ltd
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Samsung SDI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to SAMSUNG SDI CO., LTD. reassignment SAMSUNG SDI CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM YEUNG-KI
Publication of US20060077628A1 publication Critical patent/US20060077628A1/en
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Publication of US7656650B2 publication Critical patent/US7656650B2/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/02—Details
    • H01J17/16—Vessels; Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

  • the present invention relates to a modular printed board assembly for a plasma display apparatus, a plasma display apparatus including the same, and a method of fabricating the printed board assembly. More particularly, the present invention relates to a printed board assembly modulated by being mounted on a frame, and a plasma display apparatus including the printed board assembly.
  • a plasma display apparatus is a flat panel display that displays images using a gas discharge phenomenon, and is highlighted as a next generation flat panel display that can substitute for the cathode ray tube (CRT) since it has excellent display characteristics, such as display capacity, brightness, contrast, residual image, and viewing angle.
  • the plasma display apparatus comprises a plasma display panel which includes glass substrates, and a chassis base supporting the plasma display panel.
  • the plasma display panel of the plasma display apparatus includes a front substrate, a rear substrate, and a thermal conductive sheet attached to a rear surface of the rear substrate.
  • the plasma display panel is supported by the chassis base which is formed of a metal such as aluminum.
  • the plasma display panel is attached to a front surface of the chassis base using a dual-adhesive tape.
  • Printed board assemblies are installed on a back surface of the chassis base, and the printed board assemblies are separated from the chassis base by a stud mounted on the surface of the chassis base.
  • Various electronic components are disposed on the printed board assemblies.
  • a signal transmission cable connects electrodes, disposed on the front substrate or the rear substrate, with connectors disposed on the printed board assemblies. The components are installed in a case.
  • the present invention provides a modular printed board assembly for a plasma display apparatus, a plasma display apparatus which includes the modular printed board assembly, and a method of fabricating the modular printed board assembly.
  • a modular printed board assembly comprises: a frame of plate shape fixed on a chassis base; and a plurality of printed board assemblies installed on the frame, a plurality of electronic elements being mounted on the printed board assemblies.
  • a plasma display apparatus comprises: a plasma display panel including a front substrate and a rear substrate; a chassis base disposed on a rear surface of the plasma display panel; a frame of plate shape fixed on the chassis base; and a plurality of printed board assemblies installed on the frame, a plurality of electronic elements being mounted on the printed board assemblies.
  • a method of fabricating a plasma display apparatus comprises the steps of: mounting a plurality of printed board assemblies on a frame of plate shape; mounting a plurality of electronic elements on the printed board assemblies; and fixing the frame on a chassis base of the plasma display apparatus.
  • FIG. 1 is a schematic perspective view of a plasma display apparatus
  • FIG. 2 is a schematic perspective view of a plasma display apparatus according to the present invention.
  • FIG. 1 is a schematic perspective view of a plasma display apparatus.
  • the plasma display panel of the plasma display apparatus includes a front substrate 11 and a rear substrate 12 , and a thermal conductive sheet 14 is attached to a rear surface of the rear substrate 12 .
  • the plasma display panel is supported by a chassis base 13 which is formed of a metal such as aluminum.
  • the plasma display panel is attached to a front surface of the chassis base 13 using a dual-adhesive tape (not shown).
  • Printed board assemblies 14 , 16 and 17 are installed on a rear surface of the chassis base 13 , and the printed board assemblies 14 , 16 and 17 are separated from the chassis base 13 by a stud 19 mounted on the rear surface of the chassis base 13 .
  • Various electronic components 15 are disposed on the printed board assemblies 14 , 16 and 17 .
  • Reference numerals 16 and 17 denote buffer printed board assemblies, and a signal transmission cable (not shown) connects electrodes disposed on the front substrate 11 or the rear substrate 12 with connectors (not shown) disposed on the buffer printed board assemblies 16 and 17 .
  • the components of FIG. 1 are installed in a case (not shown).
  • the printed board assemblies 14 are directly mounted on the rear surface of the chassis base 13 in the plasma display apparatus of FIG. 1 , processing time for mounting the printed board assemblies 14 on the chassis base 13 increases.
  • the printed board assemblies 14 are fixed onto the stud 19 that is fixed on the chassis base 13 using screws.
  • the number of screws increases when the number of printed board assemblies 14 increases. Accordingly, the processing time also increases, and thus productivity is lowered and the cost of fabricating the apparatus also increases.
  • FIG. 2 is a schematic exploded perspective view of a plasma display apparatus according to the present invention.
  • the plasma display apparatus comprises a plasma display panel which includes a front substrate 21 and a rear substrate 22 , and a thermal conductive sheet 24 is attached to a rear surface of the rear substrate 22 .
  • the plasma display panel is supported by a chassis base 23 formed of a metal material such as aluminum.
  • the plasma display panel is attached on a front surface of the chassis base 23 using a dual-adhesive tape (not shown).
  • a frame 25 on which a plurality of printed board assemblies 28 , 30 and 31 are mounted, is installed on a rear surface of the chassis base 23 . It is desirable that the frame 25 be formed of plastic in the shape of a plate. In addition, it is desirable that the frame 25 be supported so as to be separated from the chassis base 23 by studs 32 .
  • the printed board assemblies 28 , 30 and 31 are mounted on the frame 25 .
  • Reference numerals 28 and 31 denote buffer printed board assemblies, and signal transmission cables 26 connect electrodes formed on the front substrate 21 or the rear substrate 22 to connectors 27 disposed on the buffer printed board assemblies 28 and 31 .
  • the connectors 27 are installed on the buffer printed board assemblies 28 and 31 , and the signal transmission cables 26 are connected to the connectors 27 .
  • Each of the signal transmission cables 26 is connected to electrodes formed on the inner surface of the rear substrate 22 .
  • Other signal transmission cables (not shown) are connected to the front substrate 21 .
  • a plurality of various types of electronic elements 29 for driving the plasma display apparatus are mounted on the other printed board assembly 30 .
  • the substrates 21 and 22 , the chassis base 23 , the frame 25 , and the printed board assemblies 28 , 30 and 31 mounted on the frame 25 are installed in a case (not shown) so as to form the plasma display apparatus.
  • the frame 25 and the printed board assemblies 28 , 30 and 31 are provided in one module. That is, before assembling the frame 25 on the chassis base 23 , the printed board assemblies 28 , 30 and 31 are all mounted on the frame 25 , and thus a modular printed board assembly for the plasma display apparatus is formed.
  • the modular printed board assembly includes the frame 25 and the printed board assemblies 28 , 30 and 31 , on which a plurality of electronic elements 29 are mounted, disposed on the frame 25 .
  • the process of assembling each printed board assembly separately onto the chassis base 23 can be omitted, and thus the fabrication process of the plasma display apparatus can be simplified and performed rapidly. Since the process for assembling each of the printed board assemblies 28 , 30 and 31 onto the chassis base 23 requires manual work on the part of the assembler, the entire operation tends to be slow. However, the process for mounting each of the printed board assemblies 28 , 30 and 31 onto the frame 25 may be carried out in various ways, so that a number of options are provided. For example, the printed board assemblies 28 , 30 and 31 can be mounted on the frame 25 by welding, using adhesive, using dual-adhesive tape, and screwing.
  • the module that is formed by mounting the printed board assemblies on the frame is used, and thus the assembly process can be simplified and can be performed rapidly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
US11/207,884 2004-10-13 2005-08-22 Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly Expired - Fee Related US7656650B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040081756A KR100659066B1 (ko) 2004-10-13 2004-10-13 플라즈마 디스플레이 장치를 위한 모듈화된 인쇄 기판조립체, 그것을 구비한 플라즈마 디스플레이 장치 및,그것의 제조 방법
KR10-2004-0081756 2004-10-13

Publications (2)

Publication Number Publication Date
US20060077628A1 US20060077628A1 (en) 2006-04-13
US7656650B2 true US7656650B2 (en) 2010-02-02

Family

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Application Number Title Priority Date Filing Date
US11/207,884 Expired - Fee Related US7656650B2 (en) 2004-10-13 2005-08-22 Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly

Country Status (4)

Country Link
US (1) US7656650B2 (ko)
JP (1) JP2006113536A (ko)
KR (1) KR100659066B1 (ko)
CN (1) CN1780525A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100669753B1 (ko) * 2004-11-10 2007-01-16 삼성에스디아이 주식회사 플라즈마 디스플레이 패널 지지용 부재 및, 그것을 구비한플라즈마 디스플레이 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002116710A (ja) 2000-10-11 2002-04-19 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置およびその製造方法
US6771517B2 (en) * 2000-07-20 2004-08-03 Silicon Graphics, Inc. Printed circuit board stiffener
US20040232838A1 (en) * 2002-03-14 2004-11-25 Shinji Masuda Plasma display

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771517B2 (en) * 2000-07-20 2004-08-03 Silicon Graphics, Inc. Printed circuit board stiffener
JP2002116710A (ja) 2000-10-11 2002-04-19 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置およびその製造方法
US20040232838A1 (en) * 2002-03-14 2004-11-25 Shinji Masuda Plasma display

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Office Action from the Japanese Patent Office issued in Applicant's corresponding Japanese Patent Application No. 2005-170738 dated Nov. 6, 2007.

Also Published As

Publication number Publication date
KR20060032789A (ko) 2006-04-18
KR100659066B1 (ko) 2006-12-19
US20060077628A1 (en) 2006-04-13
CN1780525A (zh) 2006-05-31
JP2006113536A (ja) 2006-04-27

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Owner name: SAMSUNG SDI CO., LTD.,KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KIM YEUNG-KI;REEL/FRAME:016915/0180

Effective date: 20050818

Owner name: SAMSUNG SDI CO., LTD., KOREA, REPUBLIC OF

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STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

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Effective date: 20140202