US7051800B2 - Hot plate cooling system - Google Patents

Hot plate cooling system Download PDF

Info

Publication number
US7051800B2
US7051800B2 US09/727,946 US72794600A US7051800B2 US 7051800 B2 US7051800 B2 US 7051800B2 US 72794600 A US72794600 A US 72794600A US 7051800 B2 US7051800 B2 US 7051800B2
Authority
US
United States
Prior art keywords
hot plate
cooling
cooling system
pipeline
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US09/727,946
Other versions
US20020020520A1 (en
Inventor
Ching-Yu Chang
I-Pien Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Macronix International Co Ltd
Original Assignee
Macronix International Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix International Co Ltd filed Critical Macronix International Co Ltd
Assigned to MACRONIX INTERNATIONAL CO., LTD. reassignment MACRONIX INTERNATIONAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, CHING-YU, WU, I-PIEN
Publication of US20020020520A1 publication Critical patent/US20020020520A1/en
Application granted granted Critical
Publication of US7051800B2 publication Critical patent/US7051800B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels

Definitions

  • the present invention relates to a hot plate cooling system. More particularly, the present invention relates to the cooling system inside a hot plate to be used mainly in rapid thermal processing, baking and chemical vapor deposition for rapidly cooling the hot plate after heating.
  • a silicon wafer has to go through a series of thermal operations. Besides growing thin films, other processes such as diffusion and photoresist baking also require heating as well.
  • semiconductor fabrication also involves many thermal treatments including annealing or heat reflow operation. In general, thermal oxidation, annealing, heat reflow, diffusion and material curing operations are conducted in a furnace.
  • photoresist baking is usually conducted on a hot plate instead of inside a furnace. Photoresist baking is a low temperature (at about 200° C.) heat solidification process. To facilitate incorporation with other photolithographic processes and to prevent uneven vaporization of solvent inside the photoresist, a soft baking, post exposure baking and hard baking are all conducted using a hot plate.
  • FIGS. 1A and 1B show respectively the top view and the side view of a conventional hot plate.
  • a conventional hot plate uses natural convection current for cooling. Natural convection cooling is able to achieve a cooling rate of about 0.8° C. per minute on average. Therefore, lowering the hot plate by 40° C. requires about 50 minutes.
  • the hot plate After treating a batch of wafers, the hot plate needs to be cooled by natural convection because temperature of the hot plate is not too high.
  • natural convection cooling is relatively slow process and hence the next batch of wafers has to be put aside for the long wait while the hot plate cools down.
  • one object of the present invention is to provide a rapid cooling system inside a hot plate so that temperature of the hot plate can be lowered within a relatively short period.
  • a second object of this invention is to provide a rapid cooling system inside a hot plate so that the hot plate can be cooled rapidly so that overall processing time can be reduced.
  • a third object of this invention is to provide cooling pipelines inside a hot plate so that the heat can be rapidly channel away by running liquid or air within the pipelines.
  • the invention provides a cooling system inside a hot plate.
  • a plurality of pipelines is laid inside the hot plate.
  • a sealed close-loop non-crossing pipeline system is used so that flow interference is avoided.
  • Each pipeline has an inlet and an outlet. Cooling fluid enters each pipeline from the inlet. After flowing through an interior section of the hot plate or interior of the entire hot plate, the cooling fluid exhausts from the outlet. The liquid flowing through the interior of the hot plate picks up heat from the hot plate and the hot plate rapidly cools.
  • the cooling fluid can be a liquid or a gas. Cooling gas and liquid include air, nitrogen, carbon dioxide, inert gas, water and various cooling and heating media.
  • a valve may be added to the inlet for controlling the amount of fluid flowing into the cooling plate and hence the cooling rate of the hot plate.
  • FIGS. 1A and 1B show respectively the top view and the side view of a conventional hot plate
  • FIGS. 2A and 2B shown respectively the top view and the side view of a hot plate according to a first preferred embodiment of this invention.
  • FIGS. 3A and 3B shown respectively the top view and the side view of a hot plate according to a second preferred embodiment of this invention.
  • FIGS. 2A and 2B shown respectively the top view and the side view of a hot plate according to a first preferred embodiment of this invention.
  • a plurality of pipelines 210 is laid inside the hot plate 200 .
  • a sealed close-loop non-crossing pipeline system is used so that flow interference is avoided.
  • Each pipeline 210 has an inlet 220 and an outlet 230 . Cooling fluid enters each pipeline from the inlet 220 . After flowing through an interior section of the hot plate 200 or interior of the entire hot plate 200 , the cooling fluid exhausts from the outlet 230 . The liquid flowing through the interior of the hot plate 200 picks up heat from the hot plate and the hot plate rapidly cools.
  • the cooling fluid can be a liquid or a gas.
  • Cooling gas and liquid include air, nitrogen, carbon dioxide, inert gas, water and various cooling and heating media.
  • a valve (not shown) may be added to the inlet 220 for controlling the amount of fluid flowing into the hot plate 200 and hence controlling the cooling rate of the hot plate 200 .
  • FIG. 2 B The alternating arrangement of the fluid inlets 220 and outlets 230 on the side of the hot plate 200 is shown in FIG. 2 B.
  • FIGS. 3A and 3B shown respectively the top view and the side view of a hot plate according to a second preferred embodiment of this invention.
  • a plurality of pipelines 310 is laid inside the hot plate 300 .
  • a close-loop pipeline system is used so that flow interference is avoided.
  • the ends of the pipelines 310 are joined together to form a common inlet 320 and a common outlet 330 respectively.
  • Cooling fluid enters the pipeline system via the inlet 320 and branches out to the pipelines 310 . After flowing through an interior section of the hot plate 300 or interior of the entire hot plate 300 , the cooling fluid merges and exhausts from the outlet 330 .
  • the liquid flowing through the interior of the hot plate 300 picks up heat from the hot plate and the hot plate rapidly cools.
  • the cooling fluid can be a liquid or a gas. Cooling gas and liquid include air, nitrogen, carbon dioxide, inert gas, water and various cooling and heating media.
  • a valve (not shown) may be added to the inlet 320 for controlling the amount of fluid flowing into the hot plate 300 and hence controlling the cooling rate of the hot plate 300 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A cooling system for a hot plate. The cooling system includes a plurality of pipelines inside the hot plate. Each pipeline has an inlet and an outlet. The inlet permits a cooling fluid to enter and the outlet permits the cooling fluid to leave. The cooling fluid running inside the pipelines picks up heat from the hot plate and carries away so that the hot plate is cooled.

Description

CROSS-REFERENCE TO RELATED APPLICATION
This application claims the priority benefit of Taiwan application Ser. No. 89116611, filed Aug. 17, 2000.
BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates to a hot plate cooling system. More particularly, the present invention relates to the cooling system inside a hot plate to be used mainly in rapid thermal processing, baking and chemical vapor deposition for rapidly cooling the hot plate after heating.
2. Description of Related Art
In the manufacturing of integrated circuits, a silicon wafer has to go through a series of thermal operations. Besides growing thin films, other processes such as diffusion and photoresist baking also require heating as well. In addition, semiconductor fabrication also involves many thermal treatments including annealing or heat reflow operation. In general, thermal oxidation, annealing, heat reflow, diffusion and material curing operations are conducted in a furnace. However, photoresist baking is usually conducted on a hot plate instead of inside a furnace. Photoresist baking is a low temperature (at about 200° C.) heat solidification process. To facilitate incorporation with other photolithographic processes and to prevent uneven vaporization of solvent inside the photoresist, a soft baking, post exposure baking and hard baking are all conducted using a hot plate.
FIGS. 1A and 1B show respectively the top view and the side view of a conventional hot plate. As shown in FIGS. 1A and 1B, a conventional hot plate uses natural convection current for cooling. Natural convection cooling is able to achieve a cooling rate of about 0.8° C. per minute on average. Therefore, lowering the hot plate by 40° C. requires about 50 minutes.
After treating a batch of wafers, the hot plate needs to be cooled by natural convection because temperature of the hot plate is not too high. However, natural convection cooling is relatively slow process and hence the next batch of wafers has to be put aside for the long wait while the hot plate cools down.
SUMMARY OF THE INVENTION
Accordingly, one object of the present invention is to provide a rapid cooling system inside a hot plate so that temperature of the hot plate can be lowered within a relatively short period.
A second object of this invention is to provide a rapid cooling system inside a hot plate so that the hot plate can be cooled rapidly so that overall processing time can be reduced.
A third object of this invention is to provide cooling pipelines inside a hot plate so that the heat can be rapidly channel away by running liquid or air within the pipelines.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides a cooling system inside a hot plate. A plurality of pipelines is laid inside the hot plate. A sealed close-loop non-crossing pipeline system is used so that flow interference is avoided. Each pipeline has an inlet and an outlet. Cooling fluid enters each pipeline from the inlet. After flowing through an interior section of the hot plate or interior of the entire hot plate, the cooling fluid exhausts from the outlet. The liquid flowing through the interior of the hot plate picks up heat from the hot plate and the hot plate rapidly cools. The cooling fluid can be a liquid or a gas. Cooling gas and liquid include air, nitrogen, carbon dioxide, inert gas, water and various cooling and heating media. In addition, a valve may be added to the inlet for controlling the amount of fluid flowing into the cooling plate and hence the cooling rate of the hot plate.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
FIGS. 1A and 1B show respectively the top view and the side view of a conventional hot plate;
FIGS. 2A and 2B shown respectively the top view and the side view of a hot plate according to a first preferred embodiment of this invention; and
FIGS. 3A and 3B shown respectively the top view and the side view of a hot plate according to a second preferred embodiment of this invention.
 DESCRIPTION OF THE PREFERRED EMBODIMENTS
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
FIGS. 2A and 2B shown respectively the top view and the side view of a hot plate according to a first preferred embodiment of this invention. As shown in FIG. 2A, a plurality of pipelines 210 is laid inside the hot plate 200. A sealed close-loop non-crossing pipeline system is used so that flow interference is avoided. Each pipeline 210 has an inlet 220 and an outlet 230. Cooling fluid enters each pipeline from the inlet 220. After flowing through an interior section of the hot plate 200 or interior of the entire hot plate 200, the cooling fluid exhausts from the outlet 230. The liquid flowing through the interior of the hot plate 200 picks up heat from the hot plate and the hot plate rapidly cools. The cooling fluid can be a liquid or a gas. Cooling gas and liquid include air, nitrogen, carbon dioxide, inert gas, water and various cooling and heating media. In addition, a valve (not shown) may be added to the inlet 220 for controlling the amount of fluid flowing into the hot plate 200 and hence controlling the cooling rate of the hot plate 200.
The alternating arrangement of the fluid inlets 220 and outlets 230 on the side of the hot plate 200 is shown in FIG. 2B.
FIGS. 3A and 3B shown respectively the top view and the side view of a hot plate according to a second preferred embodiment of this invention. As shown in FIG. 3A, a plurality of pipelines 310 is laid inside the hot plate 300. A close-loop pipeline system is used so that flow interference is avoided. The ends of the pipelines 310 are joined together to form a common inlet 320 and a common outlet 330 respectively. Cooling fluid enters the pipeline system via the inlet 320 and branches out to the pipelines 310. After flowing through an interior section of the hot plate 300 or interior of the entire hot plate 300, the cooling fluid merges and exhausts from the outlet 330. The liquid flowing through the interior of the hot plate 300 picks up heat from the hot plate and the hot plate rapidly cools. The cooling fluid can be a liquid or a gas. Cooling gas and liquid include air, nitrogen, carbon dioxide, inert gas, water and various cooling and heating media. In addition, a valve (not shown) may be added to the inlet 320 for controlling the amount of fluid flowing into the hot plate 300 and hence controlling the cooling rate of the hot plate 300.
In the invention, two layout designs for the cooling pipelines inside the hot plate are described. However, these are by no means the only layout of pipelines in the cooling system. Other cooling pipeline layouts using different cooling fluid for increasing the cooling rate is also possible.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims (8)

1. A cooling system for a hot plate, comprising:
a hot plate having a plurality of radially arranged internal pipelines, wherein each pipeline has an inlet and an outlet positioned adjacent to each other and along a plane parallel to the hot plate, and wherein each pipeline is separate from the other pipeline.
2. The cooling system of claim 1, wherein the cooling fluid is a gas.
3. The cooling system of claim 2, wherein the cooling gas is selected from a group consisting of air, nitrogen, carbon dioxide and inert gas.
4. The cooling system of claim 1, wherein the cooling fluid is a liquid.
5. The cooling system of claim 4, wherein the cooling liquid is selected from a group consisting of water, cold medium or hot medium.
6. The cooling system of claim 1, wherein the cooling fluid is a mixture of gas and liquid.
7. The cooling system of claim 6, wherein the mixture of gas and liquid is selected from a group consisting of air, nitrogen, carbon dioxide, inert gas, water, cold medium and hot medium.
8. The system of claim 1, wherein the inlet and the outlet of each pipeline are on a same side or within a same quadrant of the hot plate.
US09/727,946 2000-08-17 2000-12-01 Hot plate cooling system Expired - Lifetime US7051800B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW089116611A TW461063B (en) 2000-08-17 2000-08-17 Cooling device for hot plate
TW89116611 2000-08-17

Publications (2)

Publication Number Publication Date
US20020020520A1 US20020020520A1 (en) 2002-02-21
US7051800B2 true US7051800B2 (en) 2006-05-30

Family

ID=21660822

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/727,946 Expired - Lifetime US7051800B2 (en) 2000-08-17 2000-12-01 Hot plate cooling system

Country Status (2)

Country Link
US (1) US7051800B2 (en)
TW (1) TW461063B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060096748A1 (en) * 2000-12-22 2006-05-11 Hitachi, Ltd. Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100676203B1 (en) * 2005-06-21 2007-01-30 삼성전자주식회사 Cooling apparatus of electrostatic chuck for semiconductor equipment
TWI487923B (en) * 2013-06-18 2015-06-11 Chroma Ate Inc Test the temperature control module

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4003641A (en) * 1975-07-25 1977-01-18 The United States Of America As Represented By The Secretary Of The Navy Low distortion high energy laser mirror
US4003687A (en) * 1974-06-13 1977-01-18 Aktiebolaget Motala Verkstad Press plate having heating means and adapted for use in single-storey or multi-storey presses for the manufacture of fibreboard, chipboard, laminarboard and the like
US4006972A (en) * 1975-05-12 1977-02-08 United Technologies Corporation Laser mirror coolant pressure balance means
US4013062A (en) * 1975-08-20 1977-03-22 Laird Gary W Solar heat absorber
US4628991A (en) * 1984-11-26 1986-12-16 Trilogy Computer Development Partners, Ltd. Wafer scale integrated circuit testing chuck
US5034688A (en) * 1988-05-05 1991-07-23 Ets Gourdon Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support
US5168924A (en) * 1991-06-28 1992-12-08 Hughes Danbury Optical Systems, Inc. Low surface distortion monochromator
US5209291A (en) * 1991-06-28 1993-05-11 Hughes Aircraft Company Cooling apparatus for optical devices
US5484015A (en) * 1993-12-03 1996-01-16 Kyees; Melvin Cold plate and method of making same
US5582238A (en) * 1994-04-10 1996-12-10 Plastic Magen Heat exchanger
US5846375A (en) * 1996-09-26 1998-12-08 Micron Technology, Inc. Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4003687A (en) * 1974-06-13 1977-01-18 Aktiebolaget Motala Verkstad Press plate having heating means and adapted for use in single-storey or multi-storey presses for the manufacture of fibreboard, chipboard, laminarboard and the like
US4006972A (en) * 1975-05-12 1977-02-08 United Technologies Corporation Laser mirror coolant pressure balance means
US4003641A (en) * 1975-07-25 1977-01-18 The United States Of America As Represented By The Secretary Of The Navy Low distortion high energy laser mirror
US4013062A (en) * 1975-08-20 1977-03-22 Laird Gary W Solar heat absorber
US4628991A (en) * 1984-11-26 1986-12-16 Trilogy Computer Development Partners, Ltd. Wafer scale integrated circuit testing chuck
US5034688A (en) * 1988-05-05 1991-07-23 Ets Gourdon Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support
US5168924A (en) * 1991-06-28 1992-12-08 Hughes Danbury Optical Systems, Inc. Low surface distortion monochromator
US5209291A (en) * 1991-06-28 1993-05-11 Hughes Aircraft Company Cooling apparatus for optical devices
US5484015A (en) * 1993-12-03 1996-01-16 Kyees; Melvin Cold plate and method of making same
US5582238A (en) * 1994-04-10 1996-12-10 Plastic Magen Heat exchanger
US5846375A (en) * 1996-09-26 1998-12-08 Micron Technology, Inc. Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060096748A1 (en) * 2000-12-22 2006-05-11 Hitachi, Ltd. Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof

Also Published As

Publication number Publication date
TW461063B (en) 2001-10-21
US20020020520A1 (en) 2002-02-21

Similar Documents

Publication Publication Date Title
US20120000629A1 (en) Substrate processing apparatus
KR100836607B1 (en) Apparatus and method for processing substrate, and apparatus and method for supplying energy consumed therin
JPH03224217A (en) Heat-treating device
US20010013515A1 (en) Heat and cooling treatment apparatus and substrate processing system
KR19990072527A (en) Semiconductor thermal processor with recirculating heater exhaust cooling system
US6261365B1 (en) Heat treatment method, heat treatment apparatus and treatment system
US7051800B2 (en) Hot plate cooling system
JP4355441B2 (en) Heat treatment apparatus, heat treatment method, and semiconductor device manufacturing method
JP2009016635A (en) Substrate processor
JPH0758696B2 (en) Semiconductor wafer heating device
JPH11288893A (en) Semiconductor manufacturing apparatus and manufacture of semiconductor device
KR20020063178A (en) Liquid gas exchanger
KR100639712B1 (en) Furnace apparatus and heat treatment method using the apparatus
JP4791303B2 (en) Substrate processing apparatus, cooling means used in this apparatus, and IC manufacturing method
JPH07273101A (en) Single sheet heat treatment system
JP3485538B2 (en) Plasma processing equipment
JPH07135182A (en) Heat-treating device
JPH11260744A (en) Heat treating furnace
JP3279727B2 (en) Heat treatment equipment
JP2004023060A (en) Substrate processing device
KR100677989B1 (en) Vertical type furnace
KR20050058842A (en) Apparatus for manufacturing semiconductors
JPH11274064A (en) Treatment apparatus
KR100539386B1 (en) Furnace apparatus
KR200360036Y1 (en) Furnace apparatus

Legal Events

Date Code Title Description
AS Assignment

Owner name: MACRONIX INTERNATIONAL CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHANG, CHING-YU;WU, I-PIEN;REEL/FRAME:011359/0228

Effective date: 20000922

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553)

Year of fee payment: 12