US6821692B1 - Kind of thin films for microsystem technology and microstructuring and their use - Google Patents
Kind of thin films for microsystem technology and microstructuring and their use Download PDFInfo
- Publication number
- US6821692B1 US6821692B1 US09/230,975 US23097599A US6821692B1 US 6821692 B1 US6821692 B1 US 6821692B1 US 23097599 A US23097599 A US 23097599A US 6821692 B1 US6821692 B1 US 6821692B1
- Authority
- US
- United States
- Prior art keywords
- biopolymer
- layer
- thin layer
- gelatin
- enzymatically degradable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005516 engineering process Methods 0.000 title claims abstract description 5
- 239000010409 thin film Substances 0.000 title 1
- 229920001222 biopolymer Polymers 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 28
- 108010010803 Gelatin Proteins 0.000 claims description 36
- 229920000159 gelatin Polymers 0.000 claims description 36
- 239000008273 gelatin Substances 0.000 claims description 36
- 235000019322 gelatine Nutrition 0.000 claims description 36
- 235000011852 gelatine desserts Nutrition 0.000 claims description 36
- 239000003112 inhibitor Substances 0.000 claims description 16
- 239000000243 solution Substances 0.000 claims description 16
- 102000004190 Enzymes Human genes 0.000 claims description 15
- 108090000790 Enzymes Proteins 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 230000015556 catabolic process Effects 0.000 claims description 10
- 238000006731 degradation reaction Methods 0.000 claims description 10
- 230000002255 enzymatic effect Effects 0.000 claims description 10
- 239000007853 buffer solution Substances 0.000 claims description 9
- 238000004528 spin coating Methods 0.000 claims description 9
- 108091005804 Peptidases Proteins 0.000 claims description 7
- 102100037486 Reverse transcriptase/ribonuclease H Human genes 0.000 claims description 7
- 150000002632 lipids Chemical class 0.000 claims description 7
- 229920000936 Agarose Polymers 0.000 claims description 6
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical group C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 claims description 6
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 5
- 239000004365 Protease Substances 0.000 claims description 5
- 239000008121 dextrose Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 claims description 4
- 229960000587 glutaral Drugs 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 6
- 239000003431 cross linking reagent Substances 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 230000005855 radiation Effects 0.000 claims 3
- 150000003254 radicals Chemical class 0.000 claims 3
- 239000007864 aqueous solution Substances 0.000 claims 2
- 238000005406 washing Methods 0.000 claims 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 6
- 238000012360 testing method Methods 0.000 abstract description 3
- 238000003556 assay Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 47
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- -1 carboxy- Chemical class 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- QKNYBSVHEMOAJP-UHFFFAOYSA-N 2-amino-2-(hydroxymethyl)propane-1,3-diol;hydron;chloride Chemical compound Cl.OCC(N)(CO)CO QKNYBSVHEMOAJP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 102000008186 Collagen Human genes 0.000 description 2
- 108010035532 Collagen Proteins 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- 108010067770 Endopeptidase K Proteins 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- 102100030951 Tissue factor pathway inhibitor Human genes 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920001436 collagen Polymers 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 108010013555 lipoprotein-associated coagulation inhibitor Proteins 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 1
- JZNWSCPGTDBMEW-UHFFFAOYSA-N Glycerophosphorylethanolamin Natural products NCCOP(O)(=O)OCC(O)CO JZNWSCPGTDBMEW-UHFFFAOYSA-N 0.000 description 1
- 206010024769 Local reaction Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000004141 Sodium laurylsulphate Substances 0.000 description 1
- JLCPHMBAVCMARE-UHFFFAOYSA-N [3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[5-(2-amino-6-oxo-1H-purin-9-yl)-3-[[3-[[3-[[3-[[3-[[3-[[5-(2-amino-6-oxo-1H-purin-9-yl)-3-[[5-(2-amino-6-oxo-1H-purin-9-yl)-3-hydroxyoxolan-2-yl]methoxy-hydroxyphosphoryl]oxyoxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxyoxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methyl [5-(6-aminopurin-9-yl)-2-(hydroxymethyl)oxolan-3-yl] hydrogen phosphate Chemical class Cc1cn(C2CC(OP(O)(=O)OCC3OC(CC3OP(O)(=O)OCC3OC(CC3O)n3cnc4c3nc(N)[nH]c4=O)n3cnc4c3nc(N)[nH]c4=O)C(COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3CO)n3cnc4c(N)ncnc34)n3ccc(N)nc3=O)n3cnc4c(N)ncnc34)n3ccc(N)nc3=O)n3ccc(N)nc3=O)n3ccc(N)nc3=O)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)n3cc(C)c(=O)[nH]c3=O)n3cc(C)c(=O)[nH]c3=O)n3ccc(N)nc3=O)n3cc(C)c(=O)[nH]c3=O)n3cnc4c3nc(N)[nH]c4=O)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)O2)c(=O)[nH]c1=O JLCPHMBAVCMARE-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003275 alpha amino acid group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 230000000035 biogenic effect Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 150000008104 phosphatidylethanolamines Chemical class 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0046—Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q1/00—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
- C12Q1/001—Enzyme electrodes
- C12Q1/002—Electrode membranes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00274—Sequential or parallel reactions; Apparatus and devices for combinatorial chemistry or for making arrays; Chemical library technology
- B01J2219/00277—Apparatus
- B01J2219/00497—Features relating to the solid phase supports
- B01J2219/00527—Sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
Definitions
- the present invention relates to novel thin layers for microsystem techniques and microstructuring which may be employed within the range of such technologies in various manners.
- the thin layers heretofore employed according to the state of art in the microsystem technique and in microstructuring, as for example for manufacturing membranes, sandwiched system contacts and circuits are based on the use of inorganic layers, such as layers of SiO 2 , Si 3 N 4 , and Al 2 O 3 frequently employed, and metal layers and metal layer systems, respectively.
- Poisonous chemicals and such being harmful to health as for example strong acids, alkalies, and oxidants, are employed to produce the desired structures, or extremely expensive processes, such as reactive ion etching and plasma etching, respectively, are required therefor (refer to S. Büittgenbach, Mikromechanik, B. G. Teubner, Stuttgart, 1994).
- the only organic layers which are to be used in structuring processes are photoresists which after the desired structure being imparted to the layer to be structurized are removed, as a rule.
- biopolymer films also within the range of thickness relevant for the thin layer techniques of from 30 nm to 3 ⁇ m to satisfy very high quality standards.
- certain dyestuffs or photoactivatable groups effect a cross-linking of the biopolymer layer subsequent to a photochemical activation so that their enzymatic decomposition rate considerably slows down compared to unexposed layer ranges.
- the layer thicknesses are reproducible within a range of a few 10 nm from solutions with a solids content from 1 to 30% by spin coating which itself is known. Layers applied in such a manner are even in such an extremely thin layer range unexpectedly homogeneous and free of defects. They also resist tempering steps of up to 250° C. without any problems and without any signs of degradation during the further process of microstructuring.
- a hydrosoluble gelatin changes to a water-insoluble material after a cross-linkage in that molecules are enclosed therein or, alternatively, are bound thereto covalently or non-covalently.
- the proposed thin layers in the field of application concerned, can be used to various ends.
- the entire sandwich assembly is inserted into a receptacle containing an enzymic bath.
- the enzymic bath preferably consists of a protease K-buffer substantially constituted of 10% SDS, 10 mM NaCl, 10 mM EDTA and Tris-HCl, and to which 10 mg/ml protease K is added.
- the pH-value of said bath is set to 8.5.
- a gelatin layer of about 200 nm thickness is entirely degraded at ambient temperature within about 8 h.
- the biopolymer layer was used as a sacrificial layer for generating a self-supporting novolac structure.
- diazo-naphthoquinone which is in AZ-photoresists a usual photosensitive component, binds to OH-groups of the gelatin and, hence, inhibits a protease applied in a buffer solution of being degraded.
- diazo-naphthoquinone is converted into a carboxyl acid which is salified and separated from the gelatin. At such locations the degradation can take place uninhibited.
- di-acidostilbene being dissolved in water and having its maximum sensitivity at about 345 nm, is employed as a photoactive component with a spectral sensitivity in the visible or in the ultraviolet spectral range, wherein a sodium salt of 4,4-di-acidostilbene-2,2-sulpho acid which has been dissolved in water at a mixing ratio of from 1:50 to 1:100 has proven as particularly advantageous.
- a solid gelatin for example Quality Bloom 60 made of pigskin is added to the aqueous di-acidostilbene solution at a quantity ratio of from 10:1 to 100:1, depending on the desired degree of cross-linking in the biopolymeric layer to be produced. In the present example, about 40 mg gelatin per ml.
- di-acidostilbene solution are added. After the gelatin has dissolved the solution is filtered through a microfilter to 200 nm. The solution obtained in this way is spun onto a substrate, for example, consisting of a metal, a polymer, silicon, coated silicon or glass, as common use in microlithography. In this manner according to the present example a plane homogeneous gelatin layer having a thickness of about 100 nm is formed on a silicon substrate. The thin layer is provided with a mask adapted to a subsequent and desired structure and is subjected to an UV-exposure at a wavelength of 360 nm for about 400 s.
- the degradation rates obtainable in the present example lie at about 20-30 nm/min. According to the manner described hereinabove, it is feasible to produce sizes of structures down to 1 ⁇ m.
- biopolymers to provide defined functions for covalent but also non-covalent coupling to further molecules (so, for example, it is feasible to couple to a gelatin layer by way of amino-, carboxy-, hydroxy-and thio-functions but also by way of hydrogen bridge linkage), can be particularly advantageously exploited in thin layer structures suitably structurized and generated according to the above specifications for a special application, as will be described in the following.
- Local reaction spaces are defined by way of structurized gelatin pads. Due to the chemical diversity of the functional groups of the collagen polymer it is feasible to bind diverse molecules after a specific activation. In other words, the same matrix can be utilized for coupling molecules having a diversity of functional groups, the expensive modification of the molecules for immobilization is omitted.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Zoology (AREA)
- Wood Science & Technology (AREA)
- Proteomics, Peptides & Aminoacids (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Biotechnology (AREA)
- Immunology (AREA)
- General Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Genetics & Genomics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Biochemistry (AREA)
- Molecular Biology (AREA)
- Microbiology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Biophysics (AREA)
- Analytical Chemistry (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19634120A DE19634120A1 (en) | 1996-08-23 | 1996-08-23 | Thin film for microsystem technology and microstructuring |
DE19634120 | 1996-08-23 | ||
DE19705909 | 1997-02-15 | ||
DE19705909A DE19705909A1 (en) | 1996-08-23 | 1997-02-15 | Novel thin films for microsystem technology and microstructuring as well as their use |
PCT/EP1997/004582 WO1998008086A1 (en) | 1996-08-23 | 1997-08-22 | New kind of thin films for microsystem technology and microstructuring and their use |
Publications (1)
Publication Number | Publication Date |
---|---|
US6821692B1 true US6821692B1 (en) | 2004-11-23 |
Family
ID=26028675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/230,975 Expired - Fee Related US6821692B1 (en) | 1996-08-23 | 1997-08-22 | Kind of thin films for microsystem technology and microstructuring and their use |
Country Status (6)
Country | Link |
---|---|
US (1) | US6821692B1 (en) |
EP (1) | EP0920618B1 (en) |
JP (1) | JP3624382B2 (en) |
AT (1) | ATE313078T1 (en) |
DE (2) | DE19705909A1 (en) |
WO (1) | WO1998008086A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060244118A1 (en) * | 2001-01-31 | 2006-11-02 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
US20060277778A1 (en) * | 2005-06-10 | 2006-12-14 | Mick Stephen E | Reusable template for creation of thin films; method of making and using template; and thin films produced from template |
CN103528866A (en) * | 2013-10-18 | 2014-01-22 | 江苏蓝拓生物科技有限公司 | Preparation method of carbon supporting film |
WO2021038058A1 (en) | 2019-08-30 | 2021-03-04 | Westfaelische Wilhelms-Universitaet Muenster | Method for manufacturing a holey film, in particular for electron microscopy applications |
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US6797393B2 (en) | 2001-11-30 | 2004-09-28 | Eastman Kodak Company | Method for making biochip substrate |
JP2009207381A (en) * | 2008-03-03 | 2009-09-17 | Kaneka Corp | Device for capturing monocyte |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060244118A1 (en) * | 2001-01-31 | 2006-11-02 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
US7489031B2 (en) * | 2001-01-31 | 2009-02-10 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
US20060277778A1 (en) * | 2005-06-10 | 2006-12-14 | Mick Stephen E | Reusable template for creation of thin films; method of making and using template; and thin films produced from template |
US7713053B2 (en) | 2005-06-10 | 2010-05-11 | Protochips, Inc. | Reusable template for creation of thin films; method of making and using template; and thin films produced from template |
US20100221488A1 (en) * | 2005-06-10 | 2010-09-02 | Protochips, Inc. | Reusable template for creation of thin films; method of making and using template; and thin films produced from template |
CN103528866A (en) * | 2013-10-18 | 2014-01-22 | 江苏蓝拓生物科技有限公司 | Preparation method of carbon supporting film |
CN103528866B (en) * | 2013-10-18 | 2016-01-20 | 江苏蓝拓生物科技有限公司 | The preparation method of carbon supporting film |
WO2021038058A1 (en) | 2019-08-30 | 2021-03-04 | Westfaelische Wilhelms-Universitaet Muenster | Method for manufacturing a holey film, in particular for electron microscopy applications |
Also Published As
Publication number | Publication date |
---|---|
ATE313078T1 (en) | 2005-12-15 |
WO1998008086A1 (en) | 1998-02-26 |
EP0920618A1 (en) | 1999-06-09 |
EP0920618B1 (en) | 2005-12-14 |
JP2001501728A (en) | 2001-02-06 |
JP3624382B2 (en) | 2005-03-02 |
DE19705909A1 (en) | 1998-08-20 |
DE59712525D1 (en) | 2006-01-19 |
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