US6717811B2 - Heat dissipating apparatus for interface cards - Google Patents

Heat dissipating apparatus for interface cards Download PDF

Info

Publication number
US6717811B2
US6717811B2 US10/301,792 US30179202A US6717811B2 US 6717811 B2 US6717811 B2 US 6717811B2 US 30179202 A US30179202 A US 30179202A US 6717811 B2 US6717811 B2 US 6717811B2
Authority
US
United States
Prior art keywords
heat
radiation
section
dissipating apparatus
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US10/301,792
Other versions
US20040017658A1 (en
Inventor
Chih-Ching Lo
Ching-Hung Chen
Cheng-Cheng Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universal Scientific Industrial Shanghai Co Ltd
Original Assignee
Abit Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abit Computer Corp filed Critical Abit Computer Corp
Assigned to ABIT COMPUTER CORPORATION reassignment ABIT COMPUTER CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHENG-CHENG, CHEN, CHING-HUNG, LO, CHIH-CHING
Publication of US20040017658A1 publication Critical patent/US20040017658A1/en
Application granted granted Critical
Publication of US6717811B2 publication Critical patent/US6717811B2/en
Assigned to UNIVERSAL ABIT HONDLING COMPANY LIMITED reassignment UNIVERSAL ABIT HONDLING COMPANY LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ABIT COMPUTER CORPORATION
Assigned to UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. reassignment UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: UNIVERSAL ABIT HOLDING CO., LTD.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipating apparatus for interface cards and particularly a heat dissipating apparatus mounted onto an interface card for discharging heat generated by the interface card outside the computer casing in order to achieve heat dissipation effectively.
  • heat dissipation is a problem that often baffles users.
  • the computers often malfunction or are not able to operate due to overheating.
  • heat dissipation has become a critical issue most vendors are trying to resolve.
  • Conventional heat dissipation apparatus include heat sinks, fans and heat pipes.
  • the heat sink usually has a plurality of metal fins located on one side thereof to reduce the temperature of computer devices.
  • the commonly used one is a passive heat sink. It can generate convection or does not need additional airflow to disperse heat.
  • the heat sink mainly aims at increasing the radiation area. While the heat sink can increase the radiation area, heat energy still has to be discharged by airflow in the surroundings.
  • the air fan aims at improving heat discharge.
  • the air fan generates airflow to carry heat energy away from the heat sink.
  • the heat pipe is an advanced technique adapted on electronic devices. It is made from pure oxygen-free copper tubes and copper meshes filled with pure water or acetone as a working fluid. The fluid at the heat receiving end is vaporized to become a vapor phase. The vapor flows in the hollow tube to a cooling end to be cooled and condensed to the fluid phase again. The condensate is seeped and returns to the heat receiving end through capillarity effect to complete the heat absorption and discharge cycle. By means of the phase changes of the working fluid, a great amount of heat energy can be transferred by a small temperature difference. However, all the heat dissipation techniques mentioned above neglect to discharge heat energy outside the machine casing. As a result, the discharged heat energy still remains inside the machine casing, and heat dissipation is not very effective.
  • CPU, disk drives and display cards are the devices that generate the most heat.
  • most vendors have mainly focused on providing solutions for heat dissipation of the CPU and disk drives.
  • a monitor consumes the greatest electric power, hence heat energy generation from the display card is also significant. If the heat energy generated by the display card cannot be discharged effectively, performance and service life of the display card will be severely affected.
  • the primary object of the invention is to resolve the aforesaid disadvantages.
  • the invention provides a heat dissipation apparatus on the interface card to discharge heat energy generated by the interface card outside the computer casing so that heat generated by the interface card won't be trapped inside the computer casing thereby to achieve effective heat dissipation and improve operation stability and service life of the interface card.
  • the heat dissipation apparatus of the invention includes a heat sink and a heat pipe located on the heat sink and an airflow generator located on the heat sink.
  • the heat sink is mounted onto an interface card to discharge heat generated by the interface card outside the computer casing so that the heat is not trapped inside the computer casing to achieve effective heat dissipation.
  • FIG. 1 is a perspective view of the heat dissipation apparatus of the invention.
  • FIG. 2 is an exploded view of the invention according to FIG. 1 .
  • FIG. 3 is a top view of the invention according to FIG. 1 .
  • FIG. 4 is a perspective view of the invention in use.
  • the heat dissipation apparatus of the invention includes a heat sink 1 , a heat pipe 2 located on the heat sink 1 and an airflow generator 3 located on the heat sink 1 .
  • the apparatus is mounted onto an interface card (not shown in the drawings) for discharging heat generated by the interface card (such as a VGA display card or other add-on cards) outside the computer casing (not shown in the drawings) so that heat is not trapped inside the computer casing to achieve effective heat dissipation.
  • the heat sink 1 has a first radiation section 11 located on one side thereof with a plurality of first radiation fins 12 located thereon.
  • the first radiation fins 12 have a first recess 13 .
  • the heat sink 1 also has a second radiation section 14 located on another side with a plurality of second radiation fins 15 located thereon.
  • the second radiation fins 15 have a second recess 16 .
  • the heat sink 1 further has a third radiation section 17 located on another side opposite to the second radiation fins 15 . Between the second radiation section 14 and the third radiation section 17 , there is a space 18 for housing the airflow generator 3 .
  • the space 18 has at least one aperture 19 for fastening the airflow generator 3 in the space 18 through fasteners 10 .
  • the heat pipe 2 is known in the art, thus its details are omitted here.
  • the heat pipe 2 is filled with working fluid inside (not shown in the drawings). It has one end forming a heat receiving section 21 located in the second recess 16 and another end forming a cooling section 22 located in the first recess 13 .
  • the working fluid in the heat receiving section 21 vaporizes to the vapor phase.
  • the vapor flows in the hollow tube of the heat pipe 2 to the cooling section 22 and to be cooled and condensed to liquid phase.
  • the cooled working fluid flows back to the heat receiving section 21 because of capillarity effect, thus completes a heat absorption and discharging cycle.
  • the airflow generator 3 is a general radial fan or an axial flow fan located in the space 18 . Airflow generated by the airglow generator 3 flows to the first radiation section 11 to discharge heat absorbed by the first radiation section 11 through channels formed by the first radiation fins 12 outside the computer casing to achieve effective heat dissipation.
  • the construction set forth above forms a novel heat dissipation apparatus for the interface card.
  • the heat pipe 2 and the airflow generator 3 are installed on the heat sink 1 .
  • Heat absorbed by the second radiation fins 15 of the second radiation section 14 of the heat sink 1 is transferred to the heat receiving section 21 of the heat pipe 2 , and the working fluid inside the heat receiving section 21 receives the heat and vaporizes to become vapor phase.
  • the vapor flows in the hollow tube of the heat pipe 2 to the cooling section 22 .
  • airglow generated by the airflow generator 3 flows to the first radiation section 11 and the cooling section 22 .
  • Heat discharged from the cooling section 22 is dispelled outside the computer casing through the channels formed by the first radiation fins 12 of the first heat radiation section 11 .
  • the cooling section 22 cools and condenses the working fluid to liquid phase.
  • the cooled working fluid flows back to the heat receiving section 21 because of capillarity effect to complete one heat absorption and discharging cycle.
  • the process is repeatedly carried out to discharge heat generated by the interface card outside the computer casing, and prevent the heat generated by the interface card from being trapped inside the computer casing.
  • the interface card can operate in a stable manner and duration of the interface can increase.
  • the heat dissipation apparatus of the invention is directly mounted onto an interface card 4 (VGA card), for example, a display card.
  • the heat sink 1 absorbs heat generated by the interface card 4 and discharges the heat through the first radiation section 11 of the heat sink 1 outside the computer casing so that heat generated by the interface card 4 is not trapped inside the computer casing to ensure that the interface card 4 can operate in a stable manner and its duration can increase.
  • a lid 5 may be mounted onto the heat sink 1 to enable the first radiation section 11 of the heat sink 1 to be closed. Heat may be discharged smoothly through the channels formed by the first radiation fins 12 of the first radiation section 11 to the outside of the computer casing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating apparatus for use with an interface card including a display card or other add-on card has a heat sink, a heat pipe located on the heat sink and an airflow generator located on the hear sink. The apparatus can discharge heat generated by the interface card to the outside of the computer casing so that heat is not trapped inside the computer casing thereby achieving effective heat dissipation.

Description

FIELD OF THE INVENTION
The present invention relates to a heat dissipating apparatus for interface cards and particularly a heat dissipating apparatus mounted onto an interface card for discharging heat generated by the interface card outside the computer casing in order to achieve heat dissipation effectively.
BACKGROUND OF THE INVENTION
In computer products, heat dissipation is a problem that often baffles users. The computers often malfunction or are not able to operate due to overheating. Thus, heat dissipation has become a critical issue most vendors are trying to resolve. Conventional heat dissipation apparatus include heat sinks, fans and heat pipes. The heat sink usually has a plurality of metal fins located on one side thereof to reduce the temperature of computer devices. The commonly used one is a passive heat sink. It can generate convection or does not need additional airflow to disperse heat. The heat sink mainly aims at increasing the radiation area. While the heat sink can increase the radiation area, heat energy still has to be discharged by airflow in the surroundings. The air fan aims at improving heat discharge. In general, the air fan generates airflow to carry heat energy away from the heat sink. The heat pipe is an advanced technique adapted on electronic devices. It is made from pure oxygen-free copper tubes and copper meshes filled with pure water or acetone as a working fluid. The fluid at the heat receiving end is vaporized to become a vapor phase. The vapor flows in the hollow tube to a cooling end to be cooled and condensed to the fluid phase again. The condensate is seeped and returns to the heat receiving end through capillarity effect to complete the heat absorption and discharge cycle. By means of the phase changes of the working fluid, a great amount of heat energy can be transferred by a small temperature difference. However, all the heat dissipation techniques mentioned above neglect to discharge heat energy outside the machine casing. As a result, the discharged heat energy still remains inside the machine casing, and heat dissipation is not very effective.
In general, in computer systems, CPU, disk drives and display cards are the devices that generate the most heat. However most vendors have mainly focused on providing solutions for heat dissipation of the CPU and disk drives. A monitor consumes the greatest electric power, hence heat energy generation from the display card is also significant. If the heat energy generated by the display card cannot be discharged effectively, performance and service life of the display card will be severely affected.
SUMMARY OF THE INVENTION
Therefore the primary object of the invention is to resolve the aforesaid disadvantages. The invention provides a heat dissipation apparatus on the interface card to discharge heat energy generated by the interface card outside the computer casing so that heat generated by the interface card won't be trapped inside the computer casing thereby to achieve effective heat dissipation and improve operation stability and service life of the interface card.
In order to achieve the foregoing object, the heat dissipation apparatus of the invention includes a heat sink and a heat pipe located on the heat sink and an airflow generator located on the heat sink. The heat sink is mounted onto an interface card to discharge heat generated by the interface card outside the computer casing so that the heat is not trapped inside the computer casing to achieve effective heat dissipation.
The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of the heat dissipation apparatus of the invention.
FIG. 2 is an exploded view of the invention according to FIG. 1.
FIG. 3 is a top view of the invention according to FIG. 1.
FIG. 4 is a perspective view of the invention in use.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to FIGS. 1 and 2, the heat dissipation apparatus of the invention includes a heat sink 1, a heat pipe 2 located on the heat sink 1 and an airflow generator 3 located on the heat sink 1. The apparatus is mounted onto an interface card (not shown in the drawings) for discharging heat generated by the interface card (such as a VGA display card or other add-on cards) outside the computer casing (not shown in the drawings) so that heat is not trapped inside the computer casing to achieve effective heat dissipation.
The heat sink 1 has a first radiation section 11 located on one side thereof with a plurality of first radiation fins 12 located thereon. The first radiation fins 12 have a first recess 13. The heat sink 1 also has a second radiation section 14 located on another side with a plurality of second radiation fins 15 located thereon. The second radiation fins 15 have a second recess 16. The heat sink 1 further has a third radiation section 17 located on another side opposite to the second radiation fins 15. Between the second radiation section 14 and the third radiation section 17, there is a space 18 for housing the airflow generator 3. The space 18 has at least one aperture 19 for fastening the airflow generator 3 in the space 18 through fasteners 10.
The heat pipe 2 is known in the art, thus its details are omitted here. The heat pipe 2 is filled with working fluid inside (not shown in the drawings). It has one end forming a heat receiving section 21 located in the second recess 16 and another end forming a cooling section 22 located in the first recess 13. When the heat receiving section 21 receives heat from the heat sink 1, the working fluid in the heat receiving section 21 vaporizes to the vapor phase. The vapor flows in the hollow tube of the heat pipe 2 to the cooling section 22 and to be cooled and condensed to liquid phase. The cooled working fluid flows back to the heat receiving section 21 because of capillarity effect, thus completes a heat absorption and discharging cycle.
The airflow generator 3 is a general radial fan or an axial flow fan located in the space 18. Airflow generated by the airglow generator 3 flows to the first radiation section 11 to discharge heat absorbed by the first radiation section 11 through channels formed by the first radiation fins 12 outside the computer casing to achieve effective heat dissipation. The construction set forth above forms a novel heat dissipation apparatus for the interface card.
Referring to FIG. 3, the heat pipe 2 and the airflow generator 3 are installed on the heat sink 1. Heat absorbed by the second radiation fins 15 of the second radiation section 14 of the heat sink 1 is transferred to the heat receiving section 21 of the heat pipe 2, and the working fluid inside the heat receiving section 21 receives the heat and vaporizes to become vapor phase. The vapor flows in the hollow tube of the heat pipe 2 to the cooling section 22. Meanwhile, airglow generated by the airflow generator 3 flows to the first radiation section 11 and the cooling section 22. Heat discharged from the cooling section 22 is dispelled outside the computer casing through the channels formed by the first radiation fins 12 of the first heat radiation section 11. The cooling section 22 cools and condenses the working fluid to liquid phase. Then the cooled working fluid flows back to the heat receiving section 21 because of capillarity effect to complete one heat absorption and discharging cycle. The process is repeatedly carried out to discharge heat generated by the interface card outside the computer casing, and prevent the heat generated by the interface card from being trapped inside the computer casing. Thus the interface card can operate in a stable manner and duration of the interface can increase.
Refer to FIG. 4 for the invention in use. The heat dissipation apparatus of the invention is directly mounted onto an interface card 4 (VGA card), for example, a display card. The heat sink 1 absorbs heat generated by the interface card 4 and discharges the heat through the first radiation section 11 of the heat sink 1 outside the computer casing so that heat generated by the interface card 4 is not trapped inside the computer casing to ensure that the interface card 4 can operate in a stable manner and its duration can increase.
Moreover, a lid 5 may be mounted onto the heat sink 1 to enable the first radiation section 11 of the heat sink 1 to be closed. Heat may be discharged smoothly through the channels formed by the first radiation fins 12 of the first radiation section 11 to the outside of the computer casing.
Further scope of the applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.

Claims (13)

What is claimed is:
1. A heat dissipating apparatus adapted for discharging heat generated by interface cards, the heat dissipating apparatus being in a computer casing and including:
a heat sink having a first radiation section located on one side thereof, a second radiation section located on a second side thereof and a third radiation section located on a third side thereof, the second and third sides being next to one another with a space being located between the second radiation section and the third radiation section, the first radiation section having a first recess and the second radiation section having a second recess;
a heat pipe having a heat receiving section and a cooling section, the heat receiving section being in the second recess and the cooling section being in the first recess; and
an airflow generator located in the space;
the heat receiving section receives heat from the heat sink to vaporize working fluid in the heat pipe to a vapor phase which flows to the cooling section to release heat and to be cooled by air from the airflow generator, heat released from the heat pipe being discharged to an outside of a computer casing through the first radiation section, the cooled working fluid flowing from the cooling section back to the heat receiving section through a capillary effect whereby vaporizing and cooling are repeated continuously to disperse heat generated by an interface card.
2. The heat dissipating apparatus of claim 1, wherein the first radiation section, the second radiation section and the third radiation section each have a plurality of radiation fins located thereon.
3. The heat dissipating apparatus of claim 1, wherein the space has at least one fastening aperture therein.
4. The heat dissipating apparatus of claim 1, wherein the airflow generator is one of a radial fan and an axial fan.
5. The heat dissipating apparatus of claim 1, further comprising a lid for the heat sink.
6. The heat dissipating apparatus of claim 1, further comprising means for mounting the heat sink directly on an interface card.
7. The heat dissipating apparatus of claim 1, wherein the first radiation section is next to the space and between the second and third radiation sections.
8. The heat dissipating apparatus of claim 1, wherein the first recess extends in a first direction and the second recess extends in a second direction, the first direction being perpendicular to the second direction.
9. The heat dissipating apparatus of claim 8, wherein the heat pipe has an L-shape.
10. The heat dissipating apparatus of claim 1, wherein the heat pipe has an L-shape.
11. The heat dissipating apparatus of claim 1, wherein the first, second and third radiation sections each have a plurality of radiation fins located thereon, the radiation fins in each of the radiation sections extend in a same longitudinal direction, airflow from the airflow generator generally moves in the longitudinal direction.
12. The heat dissipating apparatus of claim 11, wherein the heat section of the heat pipe extends in the same longitudinal direction as the radiation fins.
13. The heat dissipating apparatus of claim 12, wherein the heat pipe has an L-shape.
US10/301,792 2002-07-23 2002-11-22 Heat dissipating apparatus for interface cards Expired - Lifetime US6717811B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW091211178 2002-07-23
TW091211178U TW527101U (en) 2002-07-23 2002-07-23 Interface card heat sink
TW91211178U 2002-07-23

Publications (2)

Publication Number Publication Date
US20040017658A1 US20040017658A1 (en) 2004-01-29
US6717811B2 true US6717811B2 (en) 2004-04-06

Family

ID=28451994

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/301,792 Expired - Lifetime US6717811B2 (en) 2002-07-23 2002-11-22 Heat dissipating apparatus for interface cards

Country Status (4)

Country Link
US (1) US6717811B2 (en)
FR (1) FR2842987A1 (en)
RU (1) RU2239226C2 (en)
TW (1) TW527101U (en)

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030117760A1 (en) * 2000-05-22 2003-06-26 Ronen Meir Active cooling system for cpu and semiconductors also enabling thermal accelaration
US20030189815A1 (en) * 2002-04-06 2003-10-09 Lee Sang Cheol Chipset cooling device of video graphic adapter card
US20040066628A1 (en) * 2001-07-26 2004-04-08 Jefferson Liu Rapidly self-heat-conductive heat-dissipating module
US20040120115A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating assembly
US20050068727A1 (en) * 2003-09-29 2005-03-31 Chien-Chun Yu Heat dissipating structure of accelerated graphic port card
US20050201133A1 (en) * 2001-12-27 2005-09-15 Fujitsu Limited Storage device unit including cooling device
US20050243516A1 (en) * 2004-04-12 2005-11-03 Zoran Stefanoski System for efficiently cooling a processor
US6978828B1 (en) 2004-06-18 2005-12-27 Schlumberger Technology Corporation Heat pipe cooling system
US20060056153A1 (en) * 2004-09-16 2006-03-16 Industrial Design Laboratories Inc. Multi-heatsink integrated cooling device
US20060114657A1 (en) * 2004-11-29 2006-06-01 Ati Technologies, Inc. Thermal management apparatus
US20060164808A1 (en) * 2005-01-21 2006-07-27 Nvidia Corporation Cooling system for computer hardware
US20060181856A1 (en) * 2005-02-11 2006-08-17 Inventec Corporation Heatsink device of video graphics array and chipset
US20060221569A1 (en) * 2005-03-31 2006-10-05 Inventec Corporation Heat dissipating structure of interface card
US20070097646A1 (en) * 2005-11-02 2007-05-03 Xue-Wen Peng Heat dissipating apparatus for computer add-on cards
US20070097643A1 (en) * 2005-10-28 2007-05-03 Shuttle Inc. Thermal structure for electric devices
US20070211432A1 (en) * 2006-03-08 2007-09-13 Foxconn Technology Co.,Ltd. Heat dissipating device for computer add-on cards
US20070258218A1 (en) * 2006-05-02 2007-11-08 Foxconn Technology Co., Ltd. Heat dissipation device
US20070285899A1 (en) * 2006-06-09 2007-12-13 Chia-Chun Cheng Cooling structure for interface card
US20070285900A1 (en) * 2006-06-09 2007-12-13 Chia-Chun Cheng Cooling device for interface card
US7343962B2 (en) 2005-11-17 2008-03-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20080080143A1 (en) * 2006-10-03 2008-04-03 Foxconn Technology Co., Ltd. Video graphics array (vga) card assembly
US20080089026A1 (en) * 2006-10-13 2008-04-17 Foxconn Technology Co., Ltd. Heat dissipating apparatus for computer add-on cards
US20080101017A1 (en) * 2006-10-26 2008-05-01 Yukihiko Hata Cooling Device and Electronic Device
US20080137292A1 (en) * 2006-12-08 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device for computer add-on cards
US20080253080A1 (en) * 2006-09-22 2008-10-16 Forcecon Technology Co., Ltd. Panel-type heat sink module
US20080253083A1 (en) * 2007-04-11 2008-10-16 Kabushiki Kaisha Toshiba Electronic apparatus
US20090027855A1 (en) * 2007-07-23 2009-01-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fixing bracket
US20090059525A1 (en) * 2007-09-05 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US20090059524A1 (en) * 2007-08-27 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN101365325B (en) * 2007-08-10 2010-12-08 华硕电脑股份有限公司 Heat radiating module and dismountable extension card applying the cooling module
US20110235259A1 (en) * 2010-03-25 2011-09-29 Hon Hai Precision Industry Co., Ltd. Expansion card assembly and heat shielding cover for expansion card thereof
US20120170210A1 (en) * 2010-12-29 2012-07-05 Ocz Technology Group Inc. Mounting structure and method for dissipating heat from a computer expansion card
US8248806B1 (en) * 2008-12-01 2012-08-21 Nvidia Corporation System and method for directly coupling a chassis and a heat sink associated with a circuit board or processor
US8514574B2 (en) * 2010-09-10 2013-08-20 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating apparatus
US20130294030A1 (en) * 2012-05-04 2013-11-07 Inventec Corporation Electronic device and heat dissipation module thereof
US8654530B1 (en) * 2007-10-16 2014-02-18 Nvidia Corporation Heat transfer apparatus and method for transferring heat between integrated circuits
US20140071614A1 (en) * 2012-09-12 2014-03-13 Violin Memory Inc. Heat dissipation device
US10032356B1 (en) * 2017-07-05 2018-07-24 Evga Corporation Display card protection circuit monitoring structure
US20230171914A1 (en) * 2021-11-30 2023-06-01 Acer Incorporated Graphics card assembly

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8409846B2 (en) 1997-09-23 2013-04-02 The United States Of America As Represented By The Department Of Veteran Affairs Compositions, methods and devices for maintaining an organ
US8304181B2 (en) 2004-10-07 2012-11-06 Transmedics, Inc. Method for ex-vivo organ care and for using lactate as an indication of donor organ status
US12010987B2 (en) 2004-10-07 2024-06-18 Transmedics, Inc. Systems and methods for ex-vivo organ care and for using lactate as an indication of donor organ status
CA3178010A1 (en) 2004-10-07 2006-04-20 Transmedics, Inc. Systems and methods for ex-vivo organ care
US20060187638A1 (en) * 2005-02-24 2006-08-24 Vinson Wade D System and method for liquid cooling of an electronic device
US9078428B2 (en) 2005-06-28 2015-07-14 Transmedics, Inc. Systems, methods, compositions and solutions for perfusing an organ
US7724537B1 (en) * 2006-07-17 2010-05-25 The Grantham Family, L.P. Lock down device
US9457179B2 (en) 2007-03-20 2016-10-04 Transmedics, Inc. Systems for monitoring and applying electrical currents in an organ perfusion system
US10750738B2 (en) 2008-01-31 2020-08-25 Transmedics, Inc. Systems and methods for ex vivo lung care
CN103841824B (en) 2011-04-14 2016-12-14 特兰斯迈迪茨公司 Organ care solution for the in vitro machine perfusion of donor lung
IL303658B2 (en) 2014-06-02 2024-07-01 Transmedics Inc Ex vivo organ care system
CA2970117A1 (en) 2014-12-12 2016-06-16 Darren FREED Apparatus and method for organ perfusion
US20180067524A1 (en) * 2015-04-20 2018-03-08 Hewlett Packard Enterprise Development Lp Supplemental air cooling
ES2853027T3 (en) 2015-09-09 2021-09-14 Transmedics Inc Aortic cannula for ex vivo organ care system
EP3462861B9 (en) 2016-05-30 2023-12-20 Transmedics, Inc. Method for ex vivo lung ventilation with a varying exterior pressure
WO2019032080A1 (en) * 2017-08-11 2019-02-14 Сергей Сергеевич ТОВАРНИЦКИЙ Cooling device
WO2019032079A1 (en) * 2017-08-11 2019-02-14 Сергей Сергеевич ТОВАРНИЦКИЙ Housing for computing device
CN114253359B (en) * 2022-03-01 2022-07-22 荣耀终端有限公司 Heat conduction device and electronic apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6058012A (en) * 1996-08-26 2000-05-02 Compaq Computer Corporation Apparatus, method and system for thermal management of an electronic system having semiconductor devices
US6243263B1 (en) * 1997-11-12 2001-06-05 Pfu Limited Heat radiation device for a thin electronic apparatus
US6351382B1 (en) * 1999-03-25 2002-02-26 International Business Machines Corporation Cooling method and device for notebook personal computer
US6424528B1 (en) * 1997-06-20 2002-07-23 Sun Microsystems, Inc. Heatsink with embedded heat pipe for thermal management of CPU
US6512673B1 (en) * 2000-07-05 2003-01-28 Network Engines, Inc. Low profile equipment housing with angular fan
US6549404B1 (en) * 1999-06-15 2003-04-15 Pfu Limited Semiconductor module apparatus and cooling apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408934B1 (en) * 1998-05-28 2002-06-25 Diamond Electric Mfg. Co., Ltd. Cooling module
TW448711B (en) * 1999-07-22 2001-08-01 Foxconn Prec Components Co Ltd Heat dissipation device
US6373700B1 (en) * 2001-06-18 2002-04-16 Inventec Corporation Heat sink modular structure inside an electronic product

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6058012A (en) * 1996-08-26 2000-05-02 Compaq Computer Corporation Apparatus, method and system for thermal management of an electronic system having semiconductor devices
US6424528B1 (en) * 1997-06-20 2002-07-23 Sun Microsystems, Inc. Heatsink with embedded heat pipe for thermal management of CPU
US6243263B1 (en) * 1997-11-12 2001-06-05 Pfu Limited Heat radiation device for a thin electronic apparatus
US6351382B1 (en) * 1999-03-25 2002-02-26 International Business Machines Corporation Cooling method and device for notebook personal computer
US6549404B1 (en) * 1999-06-15 2003-04-15 Pfu Limited Semiconductor module apparatus and cooling apparatus
US6512673B1 (en) * 2000-07-05 2003-01-28 Network Engines, Inc. Low profile equipment housing with angular fan

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
USPGPUB 2002/0195232 A1, Feb. 20, 1998, Katsui. *

Cited By (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030117760A1 (en) * 2000-05-22 2003-06-26 Ronen Meir Active cooling system for cpu and semiconductors also enabling thermal accelaration
US6822861B2 (en) * 2000-05-22 2004-11-23 Active Cool Ltd. Active cooling system for CPU and semiconductors also enabling thermal acceleration
US20040066628A1 (en) * 2001-07-26 2004-04-08 Jefferson Liu Rapidly self-heat-conductive heat-dissipating module
US20050201133A1 (en) * 2001-12-27 2005-09-15 Fujitsu Limited Storage device unit including cooling device
US6937474B2 (en) * 2002-04-06 2005-08-30 Zalman Tech Co. Ltd. Chipset cooling device of video graphic adapter card
US20030189815A1 (en) * 2002-04-06 2003-10-09 Lee Sang Cheol Chipset cooling device of video graphic adapter card
US6920045B2 (en) * 2002-12-24 2005-07-19 Delta Electronics, Inc. Heat-dissipating assembly
US20040120115A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating assembly
US20050068727A1 (en) * 2003-09-29 2005-03-31 Chien-Chun Yu Heat dissipating structure of accelerated graphic port card
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US20050243516A1 (en) * 2004-04-12 2005-11-03 Zoran Stefanoski System for efficiently cooling a processor
US20080186677A1 (en) * 2004-04-12 2008-08-07 Zoran Stefanoski System For Efficiently Cooling A Processor
US7542292B2 (en) * 2004-04-12 2009-06-02 Nvidia Corporation System for efficiently cooling a processor
US6978828B1 (en) 2004-06-18 2005-12-27 Schlumberger Technology Corporation Heat pipe cooling system
US20050284613A1 (en) * 2004-06-18 2005-12-29 Schlumberger Technology Corporation [heat pipe cooling system]
US7265974B2 (en) * 2004-09-16 2007-09-04 Industrial Design Laboratories Inc. Multi-heatsink integrated cooling device
US20060056153A1 (en) * 2004-09-16 2006-03-16 Industrial Design Laboratories Inc. Multi-heatsink integrated cooling device
US7283364B2 (en) * 2004-11-29 2007-10-16 Ati Technologies Inc. Thermal management apparatus
US20060114657A1 (en) * 2004-11-29 2006-06-01 Ati Technologies, Inc. Thermal management apparatus
US7382616B2 (en) * 2005-01-21 2008-06-03 Nvidia Corporation Cooling system for computer hardware
US20060164808A1 (en) * 2005-01-21 2006-07-27 Nvidia Corporation Cooling system for computer hardware
US7304846B2 (en) * 2005-02-11 2007-12-04 Inventec Corporation Heatsink device of video graphics array and chipset
US20060181856A1 (en) * 2005-02-11 2006-08-17 Inventec Corporation Heatsink device of video graphics array and chipset
US7272000B2 (en) * 2005-03-31 2007-09-18 Inventec Corporation Heat dissipating structure of interface card
US20060221569A1 (en) * 2005-03-31 2006-10-05 Inventec Corporation Heat dissipating structure of interface card
US20070097643A1 (en) * 2005-10-28 2007-05-03 Shuttle Inc. Thermal structure for electric devices
US7262965B2 (en) * 2005-10-28 2007-08-28 Shuttle Inc. Thermal structure for electric devices
US20070097646A1 (en) * 2005-11-02 2007-05-03 Xue-Wen Peng Heat dissipating apparatus for computer add-on cards
US7343962B2 (en) 2005-11-17 2008-03-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US7365989B2 (en) 2006-03-08 2008-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device for computer add-on cards
US20070211432A1 (en) * 2006-03-08 2007-09-13 Foxconn Technology Co.,Ltd. Heat dissipating device for computer add-on cards
US20070258218A1 (en) * 2006-05-02 2007-11-08 Foxconn Technology Co., Ltd. Heat dissipation device
US7369412B2 (en) * 2006-05-02 2008-05-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20070285900A1 (en) * 2006-06-09 2007-12-13 Chia-Chun Cheng Cooling device for interface card
US20070285899A1 (en) * 2006-06-09 2007-12-13 Chia-Chun Cheng Cooling structure for interface card
US7468885B2 (en) * 2006-06-09 2008-12-23 Cooler Master Co., Ltd. Cooling device for interface card
US7414846B2 (en) * 2006-06-09 2008-08-19 Cooler Master Co., Ltd. Cooling structure for interface card
US20080253080A1 (en) * 2006-09-22 2008-10-16 Forcecon Technology Co., Ltd. Panel-type heat sink module
US20080080143A1 (en) * 2006-10-03 2008-04-03 Foxconn Technology Co., Ltd. Video graphics array (vga) card assembly
US7443672B2 (en) 2006-10-03 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Video graphics array (VGA) card assembly
US20080089026A1 (en) * 2006-10-13 2008-04-17 Foxconn Technology Co., Ltd. Heat dissipating apparatus for computer add-on cards
US7382618B2 (en) * 2006-10-13 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating apparatus for computer add-on cards
US20080101017A1 (en) * 2006-10-26 2008-05-01 Yukihiko Hata Cooling Device and Electronic Device
US7742295B2 (en) * 2006-10-26 2010-06-22 Kabushiki Kaisha Toshiba Cooling device and electronic device
US20080137292A1 (en) * 2006-12-08 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device for computer add-on cards
US7447023B2 (en) * 2006-12-08 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US7697288B2 (en) * 2007-04-11 2010-04-13 Kabushiki Kaisha Toshiba Electronic apparatus
US20080253083A1 (en) * 2007-04-11 2008-10-16 Kabushiki Kaisha Toshiba Electronic apparatus
US7495923B2 (en) * 2007-07-23 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fixing bracket
US20090027855A1 (en) * 2007-07-23 2009-01-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fixing bracket
CN101365325B (en) * 2007-08-10 2010-12-08 华硕电脑股份有限公司 Heat radiating module and dismountable extension card applying the cooling module
US20090059524A1 (en) * 2007-08-27 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090059525A1 (en) * 2007-09-05 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US8654530B1 (en) * 2007-10-16 2014-02-18 Nvidia Corporation Heat transfer apparatus and method for transferring heat between integrated circuits
US8248806B1 (en) * 2008-12-01 2012-08-21 Nvidia Corporation System and method for directly coupling a chassis and a heat sink associated with a circuit board or processor
US20110235259A1 (en) * 2010-03-25 2011-09-29 Hon Hai Precision Industry Co., Ltd. Expansion card assembly and heat shielding cover for expansion card thereof
US8514574B2 (en) * 2010-09-10 2013-08-20 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating apparatus
US20120170210A1 (en) * 2010-12-29 2012-07-05 Ocz Technology Group Inc. Mounting structure and method for dissipating heat from a computer expansion card
US8885336B2 (en) * 2010-12-29 2014-11-11 OCZ Storage Solutions Inc. Mounting structure and method for dissipating heat from a computer expansion card
US20140362524A1 (en) * 2010-12-29 2014-12-11 OCZ Storage Solutions Inc. Mounting structure and method for dissipating heat from a computer expansion card
US9342120B2 (en) * 2010-12-29 2016-05-17 Toshiba Corporation Mounting structure and method for dissipating heat from a computer expansion card
US20130294030A1 (en) * 2012-05-04 2013-11-07 Inventec Corporation Electronic device and heat dissipation module thereof
US8897012B2 (en) * 2012-05-04 2014-11-25 Inventec (Pudong) Technology Corporation Electronic device and heat dissipation module thereof
US20140071614A1 (en) * 2012-09-12 2014-03-13 Violin Memory Inc. Heat dissipation device
US9013874B2 (en) * 2012-09-12 2015-04-21 Sk Hynix Memory Solutions Inc. Heat dissipation device
US10032356B1 (en) * 2017-07-05 2018-07-24 Evga Corporation Display card protection circuit monitoring structure
US20230171914A1 (en) * 2021-11-30 2023-06-01 Acer Incorporated Graphics card assembly

Also Published As

Publication number Publication date
RU2239226C2 (en) 2004-10-27
TW527101U (en) 2003-04-01
US20040017658A1 (en) 2004-01-29
FR2842987A1 (en) 2004-01-30

Similar Documents

Publication Publication Date Title
US6717811B2 (en) Heat dissipating apparatus for interface cards
US9013874B2 (en) Heat dissipation device
US6981543B2 (en) Modular capillary pumped loop cooling system
US5339214A (en) Multiple-fan microprocessor cooling through a finned heat pipe
US6288895B1 (en) Apparatus for cooling electronic components within a computer system enclosure
US6937472B2 (en) Apparatus for cooling heat generating components within a computer system enclosure
US6394175B1 (en) Top mounted cooling device using heat pipes
US7140422B2 (en) Heat sink with heat pipe in direct contact with component
US6894900B2 (en) Heat sink with heat pipe and base fins
US5966286A (en) Cooling system for thin profile electronic and computer devices
US7743818B2 (en) Heat exchange module
JP3757200B2 (en) Electronic equipment with cooling mechanism
US6459576B1 (en) Fan based heat exchanger
US6639797B2 (en) Computer having cooling device
US7457118B1 (en) Method and apparatus for dispersing heat from high-power electronic devices
US20020159233A1 (en) Cooling plate arrangement for electronic components
US20060291168A1 (en) Heat dissipating module and heat sink assembly using the same
US20190069444A1 (en) Phase Change Evaporator with Heat-Dissipating Fins and Phase Change Cooling Device Using the Same
KR20120006522A (en) Refrigeration system for compact equipment
US6608751B2 (en) Electronic device
US20070097646A1 (en) Heat dissipating apparatus for computer add-on cards
JP4744280B2 (en) Electronic equipment with cooling mechanism
JP6164089B2 (en) Cooling structure for thin electronic device and electronic device using the same
JP2005285132A (en) Cooling device for electronic device
US20050092468A1 (en) Water tray of liquid based cooling device

Legal Events

Date Code Title Description
AS Assignment

Owner name: ABIT COMPUTER CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LO, CHIH-CHING;CHEN, CHING-HUNG;CHEN, CHENG-CHENG;REEL/FRAME:013521/0548

Effective date: 20021111

STCF Information on status: patent grant

Free format text: PATENTED CASE

AS Assignment

Owner name: UNIVERSAL ABIT HONDLING COMPANY LIMITED, CAYMAN IS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ABIT COMPUTER CORPORATION;REEL/FRAME:018746/0131

Effective date: 20060609

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LT

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:UNIVERSAL ABIT HOLDING CO., LTD.;REEL/FRAME:025714/0045

Effective date: 20101224

REMI Maintenance fee reminder mailed
FEPP Fee payment procedure

Free format text: PAT HOLDER NO LONGER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: STOL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 8

SULP Surcharge for late payment

Year of fee payment: 7

SULP Surcharge for late payment
FPAY Fee payment

Year of fee payment: 12