US6186316B1 - Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems - Google Patents
Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems Download PDFInfo
- Publication number
- US6186316B1 US6186316B1 US09/331,099 US33109999A US6186316B1 US 6186316 B1 US6186316 B1 US 6186316B1 US 33109999 A US33109999 A US 33109999A US 6186316 B1 US6186316 B1 US 6186316B1
- Authority
- US
- United States
- Prior art keywords
- plant
- contact
- plant part
- contact elements
- fact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19653272A DE19653272C1 (en) | 1996-12-20 | 1996-12-20 | Circuit board blank electroplating in continuous plant |
DE19653272 | 1996-12-20 | ||
PCT/DE1997/002945 WO1998028468A1 (en) | 1996-12-20 | 1997-12-10 | Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductor foils in continuous systems |
Publications (1)
Publication Number | Publication Date |
---|---|
US6186316B1 true US6186316B1 (en) | 2001-02-13 |
Family
ID=7815516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/331,099 Expired - Fee Related US6186316B1 (en) | 1996-12-20 | 1997-12-10 | Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems |
Country Status (6)
Country | Link |
---|---|
US (1) | US6186316B1 (en) |
EP (1) | EP0946794A1 (en) |
JP (1) | JP3891593B2 (en) |
CA (1) | CA2275261A1 (en) |
DE (1) | DE19653272C1 (en) |
WO (1) | WO1998028468A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6294060B1 (en) | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
WO2004022814A3 (en) * | 2002-09-04 | 2005-07-14 | Atotech Deutschland Gmbh | Device and method for electrolytically treating an at least superficially electrically conducting work piece |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4589541A (en) * | 1983-04-25 | 1986-05-20 | Peter Lisec | Device for the conveyance of tabular elements |
EP0254030A1 (en) | 1986-07-19 | 1988-01-27 | Schering Aktiengesellschaft | Device for the electrolytic treatment of platelike articles |
US5915525A (en) * | 1995-05-01 | 1999-06-29 | International Business Machines Corporation | Parts processing system with notched conveyor belt transport |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4205660C1 (en) * | 1991-12-31 | 1993-05-06 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
DE19504517C1 (en) * | 1995-02-11 | 1996-08-08 | Atotech Deutschland Gmbh | Process for electroplating plate-shaped items to be treated in horizontal continuous systems and device for carrying out the process |
-
1996
- 1996-12-20 DE DE19653272A patent/DE19653272C1/en not_active Expired - Lifetime
-
1997
- 1997-12-10 JP JP52822298A patent/JP3891593B2/en not_active Expired - Lifetime
- 1997-12-10 EP EP97953640A patent/EP0946794A1/en not_active Withdrawn
- 1997-12-10 US US09/331,099 patent/US6186316B1/en not_active Expired - Fee Related
- 1997-12-10 CA CA002275261A patent/CA2275261A1/en not_active Abandoned
- 1997-12-10 WO PCT/DE1997/002945 patent/WO1998028468A1/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4589541A (en) * | 1983-04-25 | 1986-05-20 | Peter Lisec | Device for the conveyance of tabular elements |
EP0254030A1 (en) | 1986-07-19 | 1988-01-27 | Schering Aktiengesellschaft | Device for the electrolytic treatment of platelike articles |
US5915525A (en) * | 1995-05-01 | 1999-06-29 | International Business Machines Corporation | Parts processing system with notched conveyor belt transport |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6294060B1 (en) | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
US6607652B2 (en) | 1999-10-21 | 2003-08-19 | Teledyne Technologies Incorporated | Electroplating method |
WO2004022814A3 (en) * | 2002-09-04 | 2005-07-14 | Atotech Deutschland Gmbh | Device and method for electrolytically treating an at least superficially electrically conducting work piece |
US20060076241A1 (en) * | 2002-09-04 | 2006-04-13 | Reinhard Schneider | Device and method for electrolytically treating an at least superficially electrically conducting work piece |
US7767065B2 (en) | 2002-09-04 | 2010-08-03 | Atotech Deutschland Gmbh | Device and method for electrolytically treating an at least superficially electrically conducting work piece |
Also Published As
Publication number | Publication date |
---|---|
EP0946794A1 (en) | 1999-10-06 |
JP2001506318A (en) | 2001-05-15 |
JP3891593B2 (en) | 2007-03-14 |
DE19653272C1 (en) | 1998-02-12 |
CA2275261A1 (en) | 1998-07-02 |
WO1998028468A1 (en) | 1998-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ATOTECH DEUTSCHLAND GMBH, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DENIS, JACQUES;REEL/FRAME:010217/0321 Effective date: 19990527 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20090213 |
|
AS | Assignment |
Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK Free format text: SECURITY INTEREST;ASSIGNORS:ATOTECH DEUTSCHLAND GMBH;ATOTECH USA INC;REEL/FRAME:041590/0001 Effective date: 20170131 |
|
AS | Assignment |
Owner name: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT, NEW YORK Free format text: SECURITY INTEREST;ASSIGNORS:ATOTECH DEUTSCHLAND GMBH;ATOTECH USA, LLC;REEL/FRAME:055650/0093 Effective date: 20210318 Owner name: ATOTECH USA, LLC, SOUTH CAROLINA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC, AS COLLATERAL AGENT;REEL/FRAME:055653/0714 Effective date: 20210318 Owner name: ATOTECH DEUTSCHLAND GMBH, GERMANY Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC, AS COLLATERAL AGENT;REEL/FRAME:055653/0714 Effective date: 20210318 |
|
AS | Assignment |
Owner name: ATOTECH USA, LLC, SOUTH CAROLINA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT;REEL/FRAME:061521/0103 Effective date: 20220817 Owner name: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH), GERMANY Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT;REEL/FRAME:061521/0103 Effective date: 20220817 |