US6045743A - Method for drying resin-used electronic parts - Google Patents
Method for drying resin-used electronic parts Download PDFInfo
- Publication number
- US6045743A US6045743A US08/959,982 US95998297A US6045743A US 6045743 A US6045743 A US 6045743A US 95998297 A US95998297 A US 95998297A US 6045743 A US6045743 A US 6045743A
- Authority
- US
- United States
- Prior art keywords
- oxygen
- electronic parts
- drying
- moisture
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001035 drying Methods 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 29
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 117
- 239000001301 oxygen Substances 0.000 claims abstract description 117
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 117
- 239000002250 absorbent Substances 0.000 claims abstract description 86
- 230000002745 absorbent Effects 0.000 claims abstract description 86
- 239000007789 gas Substances 0.000 claims abstract description 72
- 238000010438 heat treatment Methods 0.000 claims abstract description 66
- 238000010521 absorption reaction Methods 0.000 claims abstract description 53
- 239000002274 desiccant Substances 0.000 claims abstract description 30
- 230000004888 barrier function Effects 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 15
- -1 unsaturated fatty acid compounds Chemical class 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 28
- 230000002378 acidificating effect Effects 0.000 claims description 23
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 15
- 239000002075 main ingredient Substances 0.000 claims description 13
- 150000002430 hydrocarbons Chemical class 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000004215 Carbon black (E152) Substances 0.000 claims description 8
- 229930195733 hydrocarbon Natural products 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 25
- 239000002184 metal Substances 0.000 abstract description 25
- 230000003647 oxidation Effects 0.000 abstract description 18
- 238000007254 oxidation reaction Methods 0.000 abstract description 18
- 230000015556 catabolic process Effects 0.000 abstract description 14
- 238000006731 degradation reaction Methods 0.000 abstract description 14
- 230000006866 deterioration Effects 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 229910052802 copper Inorganic materials 0.000 description 22
- 239000010949 copper Substances 0.000 description 22
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 230000008859 change Effects 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 239000010408 film Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 235000014113 dietary fatty acids Nutrition 0.000 description 12
- 239000000194 fatty acid Substances 0.000 description 12
- 229930195729 fatty acid Natural products 0.000 description 12
- 150000004665 fatty acids Chemical class 0.000 description 12
- 239000012298 atmosphere Substances 0.000 description 11
- 238000002474 experimental method Methods 0.000 description 11
- 230000008961 swelling Effects 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 230000032798 delamination Effects 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910021536 Zeolite Inorganic materials 0.000 description 7
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 7
- 239000000123 paper Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000010457 zeolite Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000003549 soybean oil Substances 0.000 description 6
- 235000012424 soybean oil Nutrition 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000003784 tall oil Substances 0.000 description 5
- 229910052723 transition metal Inorganic materials 0.000 description 5
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 4
- 239000000292 calcium oxide Substances 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052680 mordenite Inorganic materials 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 229960001866 silicon dioxide Drugs 0.000 description 4
- 241000894007 species Species 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- SFJBWZNTPHYOEH-UHFFFAOYSA-N cobalt Chemical compound [Co].[Co].[Co] SFJBWZNTPHYOEH-UHFFFAOYSA-N 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 229910052675 erionite Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000002808 molecular sieve Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 235000019198 oils Nutrition 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 150000001868 cobalt Chemical class 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- IJTNSXPMYKJZPR-UHFFFAOYSA-N parinaric acid Chemical compound CCC=CC=CC=CC=CCCCCCCCC(O)=O IJTNSXPMYKJZPR-UHFFFAOYSA-N 0.000 description 2
- 229910001562 pearlite Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- BYBCMKKXISPQGR-UHFFFAOYSA-N pyrrole-2,5-dione;styrene Chemical compound O=C1NC(=O)C=C1.C=CC1=CC=CC=C1 BYBCMKKXISPQGR-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- CSDQQAQKBAQLLE-UHFFFAOYSA-N 4-(4-chlorophenyl)-4,5,6,7-tetrahydrothieno[3,2-c]pyridine Chemical compound C1=CC(Cl)=CC=C1C1C(C=CS2)=C2CCN1 CSDQQAQKBAQLLE-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- 235000019774 Rice Bran oil Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Chemical class 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- IJTNSXPMYKJZPR-WVRBZULHSA-N alpha-parinaric acid Natural products CCC=C/C=C/C=C/C=CCCCCCCCC(=O)O IJTNSXPMYKJZPR-WVRBZULHSA-N 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000010775 animal oil Substances 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- NKQIMNKPSDEDMO-UHFFFAOYSA-L barium bromide Chemical compound [Br-].[Br-].[Ba+2] NKQIMNKPSDEDMO-UHFFFAOYSA-L 0.000 description 1
- 229910001620 barium bromide Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- FOBPTJZYDGNHLR-UHFFFAOYSA-N diphosphorus Chemical compound P#P FOBPTJZYDGNHLR-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 229960002969 oleic acid Drugs 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011369 resultant mixture Substances 0.000 description 1
- 239000008165 rice bran oil Substances 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 108010012137 spleen derived immunosuppressive peptide Proteins 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000003826 tablet Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a method for drying resin-used electronic parts, and specifically, to a method for drying resin-used electronic parts wherein no quality deterioration due to oxidation and degradation of a metal surface in a drying step of resin-used electronic parts occurs.
- Examples of the resin-used electronic parts of the present invention include printed wiring boards such as one side printed wiring boards, both sides printed wiring boards, multilayered printed wiring boards, flexible printed wiring boards, metal core printed wiring boards, discrete wire wiring boards, electrically conductive paint printed wiring boards, ceramic base printed wiring boards, electric resistor printed wiring boards, etc., electric semiconductors, typically including IC and LSI, electric resistors, electric condensers, etc. Further, the method of the present invention is applicable to not only finished products composed of the resin-used electronic parts, but also intermediate products and raw materials thereof.
- Printed wiring boards perform an important role in mounting since electronic parts are loaded and electrodes are connected. With recent tendency of change to a smaller type of electronic device, its high performance, its high reliability and its low cost, high density and high integration of wiring in electronic devices have been developed. Thus, dimension stability of printed wiring board, cleanliness of metal electric circuit surface, high reliability of printed wiring board during mounting of electronic parts has been required. Therefore, when electronic parts are mounted, moisture and low boiling point organic substances contained in a printed wiring board and remained liquid in washing after coating and etching are usually removed and the printed wiring board is dried in advance to prevent swelling and curvature. For example, a printed wiring board is dried in advance at a high temperature of 100° C. or above for several hours.
- An object of the present invention in order to solve the above-mentioned problems, and to provide a method for drying resin-used electronic parts in which no quality deterioration due to oxidation and degradation of a metal surface occurs.
- the present invention provides a method for drying resin-used electronic parts which comprises:
- the present invention provides also a method for drying resin-used electronic parts which comprises:
- the present invention provides also a method for drying resin-used electronic parts which comprises:
- the present invention provides a method for sealing resin-used electronic parts which comprises:
- the oxygen absorbent requiring no moisture for absorption of oxygen containing at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group (s) as the main ingredient and a substance to promote oxygen absorption is preferable.
- Examples of the resin-used electronic parts of the present invention include printed wiring boards, electric semiconductors used a resin in an insulating portion or an electrically conductive portion including typically, IC and LSI, electric resistors, electric condensers, etc. Further, the method of the present invention is applicable to not only finished products composed of the resin-used electronic parts, but also intermediate products and raw materials thereof.
- printed wiring boards examples include one side printed wiring boards, both sides printed wiring boards, multilayered printed wiring boards, flexible printing wiring boards, metal core printed wiring boards, discrete wire wiring boards, electrically conductive paint printed wiring boards, ceramic base printed wiring boards, electric resistor printed wiring boards, etc., printed wiring boards (PWB) formed electric circuits or electrodes with copper, aluminum, solder, silver, gold, palladium, etc.
- PWB printed wiring boards
- Examples of the package of electric semiconductor used a resin in an insulating portion, in which epoxy type resins are usually often used, include DIP (Dual Inline Package) and SDIP (Shrink-DIP) for through hole mounting, SOP (Small Outline Package) and SIP (Single Inline Package), etc, for surface mounting, QFP (Quad Flat Package), SMT-PGA (Pin Grid Array), TCP (Tape Carrier Package) formed electric circuits with a copper foil on a thin film such as polyimide and the like for surface mounting for fine pitch, BGA (Ball Grid Array) and CSP (Chip Size Package) applied flip chip bonding as so-called area type package. Further, epoxy resins and polyimide resins are used also in electric resistors and electric condensers.
- the resins to be used in electronic parts of the present invention insulating materials with low dielectric constant are mainly used.
- the resins include epoxy resins, polyimide resins, BT resins, thermosetting PPE resins, thermosetting PPO resins, PTFE resins, MS (maleimide-styrene) resins, cyanate ester resins, silicone resins, phenol resins, etc.
- an epoxy resin laminated a glass cloth is mainly used in printed wiring boards.
- PBGA IC chips are usually loaded on a substrate composed of BT resin, polyimide, etc.
- An epoxy resin is mainly used as underfill sealing material for flip chip.
- Electrically conductive adhesives such as electrically conductive bear chip adhesive dispersed a metal(s), in order to ensure electric conductivity or to ensure thermal conductivity for release of heat, are often used in electronic parts.
- resins to be used in such adhesive include epoxy resins, acrylic resins, etc.
- the container may be subjected to heating treatment. It is preferable to conduct heating treatment after oxygen has been removed.
- the oxygen concentration is high, there is possibility that oxidation of a metal surface in the resin-used electronic parts is promoted during drying treatment and discoloration of the metal surface occurs and furthermore bad influence is provided in post-bonding step such as soldering, wire bonding, etc.
- the oxygen absorbent to be used in the present invention is not limited on the condition that no moisture for absorption of oxygen is required.
- the oxygen absorbent examples include an oxygen absorbent containing at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group(s) or thermoplastics such as polyamides, polyolefines as main ingredient and a substance to promote oxygen absorption such as transition metal salts, among which an oxygen absorbent containing at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group(s) as main ingredient and a substance to promote oxygen absorption is preferable.
- the unsaturated fatty acid compound to be used herein is an unsaturated fatty acid having at least 10carbon atoms and at least one carbon-carbon double bond, and/or a salt or ester thereof.
- the unsaturated fatty acids, salts and esters thereof may contain optionally a substituted group(s), e.g., hydroxy group, formyl group, etc.
- the unsaturated fatty acid compound is not necessarily a kind of substance and may be a mixture of two species or above thereof.
- unsaturated fatty acid compound examples include unsaturated fatty acids such as oleic acid, linoleic acid, linolenic acid, arachidonic acid, parinaric acid, dimer acid, ricinoleic acid, etc., fats and oils containing esters, esters thereof and metal salts thereof.
- fatty acids obtained from vegetable oils and animal oils i.e., linseed oil fatty acid, soybean oil fatty acid, tung oil fatty acid, rice bran oil fatty acid, sesame oil fatty acid, cotton seed oil fatty acid, rapeseed oil fatty acid, tall oil fatty acid, and the like are usable in the present invention.
- the linear hydrocarbon polymer having an unsaturated group(s) means a polymer having at least 10 carbon atoms and at least one carbon-carbon double bond and derivatives thereof.
- the derivatives may optionally contain substituted groups including hydroxyl group(s), amino group(s), formyl group(s), carboxyl group(s), etc.
- linear hydrocarbon compound having an unsaturated group(s) includes an oligomer or polymer of butadiene, isoprene, 1,3-pentadiene etc.
- the linear hydrocarbon compound having an unsaturated group(s) is not necessarily a kind of substance and may be a copolymer thereof or a mixture of two species or above thereof and may be contain a small amount of impurities within the ordinary range such as residue of a solvent mixed in during production.
- Examples of the substance to promote oxygen absorption include metal salts and radical initiators to promote oxidation of organic compounds.
- metal salts transition metal salts such as those of Cu, Fe, Co, Ni, Cr, Mn, etc., are preferably used.
- transition metal salts for example, transition metal naphthenate or transition metal salts of unsaturated fatty acids are preferably used.
- the main ingredient of oxygen absorbent and a substance to promote oxygen absorption are liquid substances but is preferable to support them on a carrier substance.
- the carrier substance examples include paper or synthetic paper formed of natural pulp or synthetic pulp, non-woven fabric, porous film, silica gel, alumina, activated carbon, synthetic zeolite such as molecular sieves, natural zeolite such as mordenite, erionite, itc., clay minerals as pearlite, activated clay, etc. Further, it is a practical method for use also to select a carrier substance that has also been selected as the drying agent or the acidic gas absorbent and maintain the carrier drying ability and/or acidic gas absorbing ability.
- Each component in the oxygen absorbent is used in the following proportions. That is, per 100 parts by weight of a main ingredient, the amount of the substance used to promote oxygen absorption is in the range of 0.01 to 40 parts by weight; that of the carrier substance is in the range of 1 to 1,000 parts by weight.
- drying agent used in the present invention examples include paper or synthetic paper formed of natural pulp or synthetic pulp, silica gel, alumina, activated carbon, synthetic zeolite such as molecular sieves, natural zeolite such as mordenite, erionite, etc., pearlite, activated clay, calcium oxide, barium oxide, calcium chloride, barium bromide, calcium hydride, calcium sulfate, magnesium chloride, magnesium oxide, magnesium sulfate, aluminum sulfate, sodium sulfate, sodium carbonate, potassium carbonate, zinc chloride, etc.
- the drying agent is used alone or in a mixture of two species or above thereof. When a carrier substance of the oxygen absorbent having drying ability or an acidic gas absorbent having drying ability is selected, a drying agent need not be added.
- the acidic gas absorbent may be a substance capable of absorbing or adsorbing acidic substances existing in sealing atmosphere or generated during drying treatment.
- synthetic zeolite such as molecular sieves, natural zeolite such as mordenite, erionite, etc.
- porous substances typically, including activated carbon and oxides, hydroxides, carbonates and organic acid salts of alkali metals or alkaline earth metals and organic amines are usable.
- the acidic gas absorbent is used alone or in a mixture of two species or above. When a carrier substance having acidic gas absorbing function or a drying agent having acidic gas absorbing function is selected, acidic gas absorbent need not be added.
- the oxygen absorbent is used in an amount capable of absorbing at least the space volume of oxygen in the interior of a sealed container preferably in an amount of 1.1 to 10 times to the above-mentioned space volume.
- the drying agent is used in an amount capable of absorbing at least the space volume of moisture in the interior of a sealed container, preferably in an amount of 1.1 to 500 times to the above-mentioned space volume.
- the oxygen absorbent and the drying agent are suitably used in each respective amount in the above-mentioned ranges depending upon gas barrier performance of the container having a gas barrier property.
- the oxygen absorbent, the drying agent and the acidic gas absorbent can be used in a mixture.
- Each the components or the mixture is used in a form of powders, granules, tablets, sheets, etc.
- oxygen absorbent, the drying agent and the acidic gas absorbent are usually used as a parcel covered with a gas permeable packing material used a substrate, e.g., paper, non-woven fabric, plastic, etc.
- a portion or all of the oxygen absorbent may be used together with the drying agent and the acidic gas absorbent in one parcel or in separate parcels.
- the form of the parcel of the present invention is not limited and may optionally have the form, of e.g., small bag, sheet, blister parcel, etc. Packing materials and structures of the parcel are not limited.
- dust proofing treatment it is possible to cover a non-dust proofing parcel with material that does not hinder the permeation of either oxygen, moisture or acidic gas and releases no dust generated from the parcel into exterior, thus forming a double-packed parcel.
- the dust proofing treatment has been conducted for the parcel itself, the parcel need not be further covered with a dust proof material.
- the container having a gas barrier property of the present invention is selected depending upon its object and may be a plastic container, a film bag or metallic container, glass container, etc., among which a container having a excellent gas barrier property is preferable.
- the container have a heat resistant property above drying temperature for drying treatment.
- the container having a gas barrier property of the present invention has an oxygen permeability of 10 ml/m 2 .
- the gas barrier performance it is advantageous in cost to select the gas barrier performance to be so as not to provide excess performance.
- the interior of the container may be replaced with a dry inert gas such as nitrogen, argon, etc.
- a dry inert gas such as nitrogen, argon, etc.
- the method of the present invention comprises enclosing resin-used electronic parts together with an oxygen absorbent requiring no moisture and a drying agent in a container having a gas barrier property and then sealing the container, and usually, then conducting drying treatment of the container.
- the heating and drying treatment temperature is 20 to 200° C., more preferably 40 to 120° C. and most preferably 60 to 110° C.
- a heating and drying temperature below each heat resisting temperature of oxygen absorbent, drying agent acidic gas absorbent and a parcel thereof, a temperature below heat resisting temperature of a material of the container having a gas barrier property and a temperature below heat resisting temperature of resin-used electronic parts is preferable.
- the heating and drying treatment time is 1 to 24 hours in the case of 100° C. and one week or above in the case of 20 to 30° C., depending upon the heating and drying treatment temperature.
- the heating and drying treatment conditions vary depending upon an amount of intended resin-used electronic parts, moisture absorption proportion before heating and drying treatment and moisture absorption proportion as final target, an amount of the drying agent and its moisture absorption performance. For example, it is possible to shorten the heating and drying treatment time by conducting the drying treatment at a high temperature. On the other hand, it is possible to reduce treating cost and suppress degradation of parts due to heat by conducting the heating and drying treatment at a low temperature, though the treatment time becomes long.
- the heating and drying treatment may be conducted at a high temperature immediately after the container enclosed resin-used electronic parts has been sealed. It is preferable to conduct the drying and heating treatment after an oxygen concentration in the sealed container has been become low.
- the heating and drying treatment is conducted in the state that oxygen still remains in the sealed atmosphere, there is possibility that a metal surface of electronic parts suffers oxidation and degradation to a certain degree with remained oxygen. Therefore, in order to conduct the heating and drying treatment for the resin-used electronic parts without suffering substantially influence of oxygen, it is preferable to allow to stand the sealed container at a room temperature until the oxygen absorbent has completed absorption of oxygen in the sealed container.
- the time necessary to absorb oxygen in the sealed container depends upon absorption capacity and an amount of oxygen absorbent enclosed together and an amount of oxygen contained in the interior space of the sealed container.
- oxygen in the sealed container cannot be sufficiently absorbed, so that there is possibility that oxidation and degradation of metal surface occur during the heating and drying treatment.
- the standing time is long, it is preferable and no problem occurs since absorbing time is merely prolonged and the resin-used electronic parts can be preserved for a long time in such state as they are until the drying and heating treatment are conducted.
- moisture and acidic gas contained in the sealed container, vaporized from the resin-used electronic parts or generated from a material of enclosed case or cushion can be removed with the drying agent and the acidic gas absorbent during the standing time.
- very simple and easy method which comprises enclosing resin-used electronic particles together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent and further, preferably an acidic gas absorbent in a container having a gas barrier property and sealing the container to heat, is provided.
- resin-used electronic parts are easily dried without occurrence of their quality deterioration due to oxidation and degradation of metal surface in a drying step.
- gas absorbent A 5 g of oxygen absorbent thus obtained was mixed with 5 g of calcium oxide as drying agent and acidic gas absorbent and the mixture thus obtained was filled into a small bag (inner size: 5 cm ⁇ 10 cm) formed of paper, laminated porous polyethylene film on its inside, thus preparing the gas absorbent parcel A (hereinafter, referred to as "gas absorbent A").
- IPC multiobjective test pattern IPC-B-25
- a one side copper coated-glass epoxy substrate 101.6 mm ⁇ 114.3 mm ⁇ 1.6 mm, manufactured by Mitsubish Gas Chemical Co., Inc., Japan, EDOLITE, CCLEL 2-170NV
- EDOLITE CCLEL 2-170NV
- Al bag An aluminum foil laminate (stretched polypropylene/aluminum foil/polyethylene): size 220 mm ⁇ 300 mm (hereinafter, referred to as "Al bag") and then the opened portion of the Al bag was heat sealed to seal hermetically.
- Al bag aluminum foil laminate (stretched polypropylene/aluminum foil/polyethylene): size 220 mm ⁇ 300 mm
- Example 1 The experiments of heating and drying treatment and evaluation were conducted in the same manner as in Example 1 except that the heating and drying treatment of one board of printed wiring board A was conducted at 130° C. for 6 hours in comparative Example 1 and at 80° C. for 6 hours in Comparative Example 2 in an open state without enclosing the printed wiring board A in a container having a gas barrier property.
- Comparative Examples 1 and 2 the surface of copper wiring on the printed wiring board A presented reddish and increase of oxidized film thickness of copper was observed. The results were shown in Table 1.
- Example 2 The experiments of heating and drying treatment and evaluation were conducted in the same manner as in Example 1 except that both one board of printed wiring board A and one parcel containing 10 g of trademark Fuji Silicagel, A type, made by FUJI-DAVISONCHEMICAL LTD., Japan in Comparative Example 3, both one board of printed wiring board A and one parcel of moisture-holding type iron powder oxygen absorbent, trademark Ageless Z-100PT, made by Mitsubishi Gas Chemical Co., Inc., Japan in Comparative Example 4, and only one board of printed wiring board A without enclosing gas absorbent in Comparative Example 5, respectively were enclosed together with 500 ml of air at 25° C. and at 75% RH in Al bags and then all of the Al bags were hermetically sealed. The results were shown in Table 2.
- Example 2 the gas absorbents B, C and D were prepared in the same manner as in Example 1 except that the combination between main ingredient and a substance to promote oxygen absorption in the gas absorbent A of Example 1 was changed respectively as follows:
- gas absorbent E The gas absorbent parcel E (hereinafter, referred to as "gas absorbent E") was prepared in the same manner as in Example 1 except that 4 g of oxygen absorbent used in Example 1 and 4 g of calcium oxide were used instead of 5 g of oxygen absorbent and 5 g of calcium oxide.
- moisture absorption percentage moisture quantity/(weight of substrate in an absolutely dry state) ⁇ 100
- Substrate after test was placed in a dryer at 120° C. for 2 days and then weight of substrate in an absolutely dry state was measured.
- the sealed Al bag was opened and the printed wiring board B was taken out.
- the weight of the printed wiring board B thus taken out was measured and oxidized film thickness of copper wiring was measured.
- the delamination and swelling of the printed wiring board B were measured by immersing it in a soldering bath molten by heating to 260° C. for 30 seconds. The results were shown in Table 4.
- gas absorbents F, G and H 4 g of oxygen absorbent used in Example 1 was mixed with 4 g of calcium chloride anhydride in Example 7, 4 g of magnesium sulfate 1/2 hydrate in Example 8 and 4 g of diphosphorus pentaoxide in Example 9, respectively, as drying agent and the mixture thus obtained was filled into a small bag formed of paper laminated porous polyethylene film on its inside (inner size ; 5 cm ⁇ 10 cm), thus preparing the gas absorbent parcels F, G and H (hereinafter, referred to as "gas absorbents F, G and H”)
- BGA (manufactured by CITIZEN WATCH Co., LTD; Japan, PBGA-352 pin) was allowed to stand in a nitrogen for 3 days at 85° C. and at 85% RH and to absorb moisture. Immediately after 3 days, weight of the BGA was measured and moisture-absorption percentage was determined. 10 pieces of BGA thus moisture-absorbed and one parcel of gas absorbent E was enclosed with 500 ml of air at 25° C. and at 75% RH in Al bag used Example 5 and then the opened portion of the Al bag was heat sealed to seal hermetically. The hermetically sealed Al bag was allowed to stand for one day under an atmosphere of 25° C. and 60% RH.
- Example 7 The experiment of heating and drying treatment was conducted in the same manner as in Example 5 except that BGA absorbed moisture in the same manner as in Example 10 was used instead of printed wiring board B absorbed moisture and neither enclosed in Al bag nor hermetically sealed. Then, the same evaluation as in Example 10 was conducted. Slight cloudiness of soldering ball was observed and oxidation and degradation occurred in some degree. The results were shown in Table 7.
- QFP manufactured by Taiwan Memory Technology Inc., MQFP 100
- MQFP 100 was allowed to stand in a nitrogen for 3 days at 85° C. and at 85% RH and to absorb moisture. Immediately after 3 days, thus obtaining moisture-absorbed QFP. Moisture-absorption percentage of the QFP was determined and 0.30 wt %. 10 pieces of QFP thus moisture-absorbed and one bag of gas absorbent E was enclosed with 500 ml of air at 25° C. and at 75% RH in Al bag used Example 1 and then the opened portion of the Al bag was heat sealed to seal hermetically. The hermetically sealed Al bag was allowed to stand for one day under an atmosphere of 25° C. and 60% RH.
- Example 11 The experiment of heating and drying treatment was conducted in the same manner as in Example 11 except that QFP absorbed moisture in the same manner as in Example 11 was used and neither enclosed in Al bag nor hermetically sealed. Then, the same evaluation as in Example 11 was conducted. The results were shown in Table 8.
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Abstract
Provided is a method for drying resin-used electronic parts which comprises enclosing resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property and then sealing the container and removing oxygen and, preferably, then heating the sealed container. Thereby, no quality deterioration due to oxidation and degradation of a metal surface occurs in a drying step of resin-used electronic parts.
Description
1) Field of the Invention
The present invention relates to a method for drying resin-used electronic parts, and specifically, to a method for drying resin-used electronic parts wherein no quality deterioration due to oxidation and degradation of a metal surface in a drying step of resin-used electronic parts occurs.
Examples of the resin-used electronic parts of the present invention include printed wiring boards such as one side printed wiring boards, both sides printed wiring boards, multilayered printed wiring boards, flexible printed wiring boards, metal core printed wiring boards, discrete wire wiring boards, electrically conductive paint printed wiring boards, ceramic base printed wiring boards, electric resistor printed wiring boards, etc., electric semiconductors, typically including IC and LSI, electric resistors, electric condensers, etc. Further, the method of the present invention is applicable to not only finished products composed of the resin-used electronic parts, but also intermediate products and raw materials thereof.
2) Prior Art
Printed wiring boards perform an important role in mounting since electronic parts are loaded and electrodes are connected. With recent tendency of change to a smaller type of electronic device, its high performance, its high reliability and its low cost, high density and high integration of wiring in electronic devices have been developed. Thus, dimension stability of printed wiring board, cleanliness of metal electric circuit surface, high reliability of printed wiring board during mounting of electronic parts has been required. Therefore, when electronic parts are mounted, moisture and low boiling point organic substances contained in a printed wiring board and remained liquid in washing after coating and etching are usually removed and the printed wiring board is dried in advance to prevent swelling and curvature. For example, a printed wiring board is dried in advance at a high temperature of 100° C. or above for several hours. However, in the drying step, there sometimes occurred such troubles that a surface of metal electric circuit such as copper, aluminum on a printed wiring board was oxidized to cause discoloration of metal portion of the electric circuit; adhesiveness in soldering or wire bonding of electronic parts was lowered and curvature of a printed wiring board due the difference of thermal expansion coefficient between metal and resin was generated.
Also in electronic parts including electric semiconductors, electric resistors, electric condensers, etc., epoxy resin or polyimide resin has been used in package thereof. Thus, in order to remove moisture and low boiling point organic substances contained in the resin portion, electronic parts are dried in advance at a high temperature of 100° C. or above for several hours. Further, recently, even when a polyimide film, as in LOC type electric semiconductor (Lead on Chip), is used as insulating material, drying treatment is usually conducted since when polyimide film with high hygroscopicity absorbs moisture, its dimension is varied; degradation due to corrosion for a metal in a lead part occurs and thus mounting is impeded. However, in such drying treatment method, a metal surface in a lead part has been sometimes oxidized to cause discoloration and adhesiveness was sometimes lowered in the step for soldering or wire bonding of electronic parts.
As methods for preventing oxidation and degradation of metal surface in such drying step of electronic parts, it was attempted to lower the treating temperature or to shorten the drying time. However, although it would be expected to some extent to prevent oxidation of metal surface, there often occurred such problems that it was not perfect to prevent oxidation or drying and removal of evaporating components were insufficient, resulting in swell or crack in soldering during mounting of electronic parts. In drying treatment used a vacuum dryer, although it could be expected to prevent oxidation of a metal surface and to shorten the treating time, there was a problem in cost since expensive exclusive apparatus was necessary. Further although there was also a method for drying electronic parts comprises immersing resin-used electronic parts in advance in a readily vaporizable organic solvent such as flon (CFCs) to replace moisture with the organic solvent and then drying, there occurred environmental problems and a problem in danger of ignition and furthermore a problem that moisture in the atmosphere was re-absorbed during cooling after drying. Thus, under the present situation, no simple and easy method for drying resin-used electronic in which quality deterioration due to oxidation and degradation of a metal surface can be sufficiently prevented, has yet been found.
An object of the present invention, in order to solve the above-mentioned problems, and to provide a method for drying resin-used electronic parts in which no quality deterioration due to oxidation and degradation of a metal surface occurs.
As a result of an extensive study for solving the above-mentioned prior problems, the present inventors have found that it is necessary to dry resin-used electronic parts under the circumstance removed oxygen and thus to enclose resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property to heat the container, and accomplished the present invention. Surprisingly, it became possible to dry resin-used electronic parts without causing quality deterioration due to oxidation and degradation of a metal surface in a drying step by drying under the above-mentioned atmosphere and furthermore, fear of re-absorption of moisture in the atmosphere during cooling was dissipated since enclosing in the container and its sealing were conducted.
That is, the present invention provides a method for drying resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property and
then sealing the container to heat
The present invention provides also a method for drying resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property,
then sealing the container, thus removing oxygen and
then heating the sealed container.
The present invention provides also a method for drying resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with an oxygen absorbent requiring no moisture for absorption of oxygen, a drying agent and an acidic gas absorbent in a container having a gas barrier property and
then sealing the container to heat.
Further, the present invention provides a method for sealing resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with an oxygen absorbent requiring no moisture for absorption of oxygen, a drying agent and an acidic gas absorbent in a container having a gas barrier property,
then sealing the container, thus removing oxygen and
then heating the sealed container.
In the present invention, the oxygen absorbent requiring no moisture for absorption of oxygen containing at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group (s) as the main ingredient and a substance to promote oxygen absorption is preferable.
The present invention will be described in detail below.
Examples of the resin-used electronic parts of the present invention include printed wiring boards, electric semiconductors used a resin in an insulating portion or an electrically conductive portion including typically, IC and LSI, electric resistors, electric condensers, etc. Further, the method of the present invention is applicable to not only finished products composed of the resin-used electronic parts, but also intermediate products and raw materials thereof.
Examples of printed wiring boards include one side printed wiring boards, both sides printed wiring boards, multilayered printed wiring boards, flexible printing wiring boards, metal core printed wiring boards, discrete wire wiring boards, electrically conductive paint printed wiring boards, ceramic base printed wiring boards, electric resistor printed wiring boards, etc., printed wiring boards (PWB) formed electric circuits or electrodes with copper, aluminum, solder, silver, gold, palladium, etc.
Examples of the package of electric semiconductor used a resin in an insulating portion, in which epoxy type resins are usually often used, include DIP (Dual Inline Package) and SDIP (Shrink-DIP) for through hole mounting, SOP (Small Outline Package) and SIP (Single Inline Package), etc, for surface mounting, QFP (Quad Flat Package), SMT-PGA (Pin Grid Array), TCP (Tape Carrier Package) formed electric circuits with a copper foil on a thin film such as polyimide and the like for surface mounting for fine pitch, BGA (Ball Grid Array) and CSP (Chip Size Package) applied flip chip bonding as so-called area type package. Further, epoxy resins and polyimide resins are used also in electric resistors and electric condensers.
As the resins to be used in electronic parts of the present invention, insulating materials with low dielectric constant are mainly used. Examples of the resins include epoxy resins, polyimide resins, BT resins, thermosetting PPE resins, thermosetting PPO resins, PTFE resins, MS (maleimide-styrene) resins, cyanate ester resins, silicone resins, phenol resins, etc. For example, an epoxy resin laminated a glass cloth is mainly used in printed wiring boards. Further, in PBGA, IC chips are usually loaded on a substrate composed of BT resin, polyimide, etc. An epoxy resin is mainly used as underfill sealing material for flip chip. Electrically conductive adhesives such as electrically conductive bear chip adhesive dispersed a metal(s), in order to ensure electric conductivity or to ensure thermal conductivity for release of heat, are often used in electronic parts. Examples of resins to be used in such adhesive include epoxy resins, acrylic resins, etc.
In the present invention, it is necessary to enclose resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent and preferably, further an acidic gas absorbent in a container having a gas barrier property and then to seal the container. Immediately after sealing, the container may be subjected to heating treatment. It is preferable to conduct heating treatment after oxygen has been removed. When the oxygen concentration is high, there is possibility that oxidation of a metal surface in the resin-used electronic parts is promoted during drying treatment and discoloration of the metal surface occurs and furthermore bad influence is provided in post-bonding step such as soldering, wire bonding, etc.
The oxygen absorbent to be used in the present invention is not limited on the condition that no moisture for absorption of oxygen is required.
Examples of the oxygen absorbent include an oxygen absorbent containing at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group(s) or thermoplastics such as polyamides, polyolefines as main ingredient and a substance to promote oxygen absorption such as transition metal salts, among which an oxygen absorbent containing at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group(s) as main ingredient and a substance to promote oxygen absorption is preferable.
The unsaturated fatty acid compound to be used herein is an unsaturated fatty acid having at least 10carbon atoms and at least one carbon-carbon double bond, and/or a salt or ester thereof. The unsaturated fatty acids, salts and esters thereof may contain optionally a substituted group(s), e.g., hydroxy group, formyl group, etc. The unsaturated fatty acid compound is not necessarily a kind of substance and may be a mixture of two species or above thereof.
Examples of the unsaturated fatty acid compound include unsaturated fatty acids such as oleic acid, linoleic acid, linolenic acid, arachidonic acid, parinaric acid, dimer acid, ricinoleic acid, etc., fats and oils containing esters, esters thereof and metal salts thereof.
As the unsaturated fatty acid, fatty acids obtained from vegetable oils and animal oils, i.e., linseed oil fatty acid, soybean oil fatty acid, tung oil fatty acid, rice bran oil fatty acid, sesame oil fatty acid, cotton seed oil fatty acid, rapeseed oil fatty acid, tall oil fatty acid, and the like are usable in the present invention.
The linear hydrocarbon polymer having an unsaturated group(s) means a polymer having at least 10 carbon atoms and at least one carbon-carbon double bond and derivatives thereof. The derivatives may optionally contain substituted groups including hydroxyl group(s), amino group(s), formyl group(s), carboxyl group(s), etc.
Examples of the linear hydrocarbon compound having an unsaturated group(s) includes an oligomer or polymer of butadiene, isoprene, 1,3-pentadiene etc. The linear hydrocarbon compound having an unsaturated group(s) is not necessarily a kind of substance and may be a copolymer thereof or a mixture of two species or above thereof and may be contain a small amount of impurities within the ordinary range such as residue of a solvent mixed in during production.
Examples of the substance to promote oxygen absorption include metal salts and radical initiators to promote oxidation of organic compounds. As the metal salts, transition metal salts such as those of Cu, Fe, Co, Ni, Cr, Mn, etc., are preferably used. As the transition metal salts, for example, transition metal naphthenate or transition metal salts of unsaturated fatty acids are preferably used.
When the main ingredient of oxygen absorbent and a substance to promote oxygen absorption are liquid substances but is preferable to support them on a carrier substance.
Examples of the carrier substance include paper or synthetic paper formed of natural pulp or synthetic pulp, non-woven fabric, porous film, silica gel, alumina, activated carbon, synthetic zeolite such as molecular sieves, natural zeolite such as mordenite, erionite, itc., clay minerals as pearlite, activated clay, etc. Further, it is a practical method for use also to select a carrier substance that has also been selected as the drying agent or the acidic gas absorbent and maintain the carrier drying ability and/or acidic gas absorbing ability.
Each component in the oxygen absorbent is used in the following proportions. That is, per 100 parts by weight of a main ingredient, the amount of the substance used to promote oxygen absorption is in the range of 0.01 to 40 parts by weight; that of the carrier substance is in the range of 1 to 1,000 parts by weight.
Examples of the drying agent used in the present invention include paper or synthetic paper formed of natural pulp or synthetic pulp, silica gel, alumina, activated carbon, synthetic zeolite such as molecular sieves, natural zeolite such as mordenite, erionite, etc., pearlite, activated clay, calcium oxide, barium oxide, calcium chloride, barium bromide, calcium hydride, calcium sulfate, magnesium chloride, magnesium oxide, magnesium sulfate, aluminum sulfate, sodium sulfate, sodium carbonate, potassium carbonate, zinc chloride, etc. The drying agent is used alone or in a mixture of two species or above thereof. When a carrier substance of the oxygen absorbent having drying ability or an acidic gas absorbent having drying ability is selected, a drying agent need not be added.
The acidic gas absorbent may be a substance capable of absorbing or adsorbing acidic substances existing in sealing atmosphere or generated during drying treatment. For example, synthetic zeolite such as molecular sieves, natural zeolite such as mordenite, erionite, etc., porous substances, typically, including activated carbon and oxides, hydroxides, carbonates and organic acid salts of alkali metals or alkaline earth metals and organic amines are usable. Further, The acidic gas absorbent is used alone or in a mixture of two species or above. When a carrier substance having acidic gas absorbing function or a drying agent having acidic gas absorbing function is selected, acidic gas absorbent need not be added.
The oxygen absorbent is used in an amount capable of absorbing at least the space volume of oxygen in the interior of a sealed container preferably in an amount of 1.1 to 10 times to the above-mentioned space volume. Further, The drying agent is used in an amount capable of absorbing at least the space volume of moisture in the interior of a sealed container, preferably in an amount of 1.1 to 500 times to the above-mentioned space volume. The oxygen absorbent and the drying agent are suitably used in each respective amount in the above-mentioned ranges depending upon gas barrier performance of the container having a gas barrier property.
In the present invention, the oxygen absorbent, the drying agent and the acidic gas absorbent can be used in a mixture. Each the components or the mixture is used in a form of powders, granules, tablets, sheets, etc.
It is not preferable to permit direct contact between the oxygen absorbent, the drying agent and the acidic gas absorbent with the resin-used electronic parts. They are usually used as a parcel covered with a gas permeable packing material used a substrate, e.g., paper, non-woven fabric, plastic, etc. A portion or all of the oxygen absorbent may be used together with the drying agent and the acidic gas absorbent in one parcel or in separate parcels.
The form of the parcel of the present invention is not limited and may optionally have the form, of e.g., small bag, sheet, blister parcel, etc. Packing materials and structures of the parcel are not limited.
It is preferable to conduct dust proofing treatment on the parcel. As a dust proofing treatment, it is possible to cover a non-dust proofing parcel with material that does not hinder the permeation of either oxygen, moisture or acidic gas and releases no dust generated from the parcel into exterior, thus forming a double-packed parcel. However, when the dust proofing treatment has been conducted for the parcel itself, the parcel need not be further covered with a dust proof material.
The container having a gas barrier property of the present invention is selected depending upon its object and may be a plastic container, a film bag or metallic container, glass container, etc., among which a container having a excellent gas barrier property is preferable.
It is preferable that the container have a heat resistant property above drying temperature for drying treatment.
It is preferable that the container having a gas barrier property of the present invention has an oxygen permeability of 10 ml/m2. Day . atm or below at 25° C. at a relative humidity (hereinafter, referred to as "RH") of 60% and a water vapor permeability of 1 g/m2. Day or below at 40° C. at 90% RH.
It is advantageous in cost to select the gas barrier performance to be so as not to provide excess performance. On the other hand, when the resin-used electronic parts are enclosed in a container and then sealed, the interior of the container may be replaced with a dry inert gas such as nitrogen, argon, etc. Such gas replacement leads to reduction of amount of the oxygen absorbent and the drying agent, particularly, the oxygen absorbent.
The method of the present invention comprises enclosing resin-used electronic parts together with an oxygen absorbent requiring no moisture and a drying agent in a container having a gas barrier property and then sealing the container, and usually, then conducting drying treatment of the container.
The heating and drying treatment temperature is 20 to 200° C., more preferably 40 to 120° C. and most preferably 60 to 110° C. Usually, a heating and drying temperature below each heat resisting temperature of oxygen absorbent, drying agent acidic gas absorbent and a parcel thereof, a temperature below heat resisting temperature of a material of the container having a gas barrier property and a temperature below heat resisting temperature of resin-used electronic parts is preferable.
It is preferable that the heating and drying treatment time is 1 to 24 hours in the case of 100° C. and one week or above in the case of 20 to 30° C., depending upon the heating and drying treatment temperature.
The heating and drying treatment conditions vary depending upon an amount of intended resin-used electronic parts, moisture absorption proportion before heating and drying treatment and moisture absorption proportion as final target, an amount of the drying agent and its moisture absorption performance. For example, it is possible to shorten the heating and drying treatment time by conducting the drying treatment at a high temperature. On the other hand, it is possible to reduce treating cost and suppress degradation of parts due to heat by conducting the heating and drying treatment at a low temperature, though the treatment time becomes long.
The heating and drying treatment may be conducted at a high temperature immediately after the container enclosed resin-used electronic parts has been sealed. It is preferable to conduct the drying and heating treatment after an oxygen concentration in the sealed container has been become low. When the heating and drying treatment is conducted in the state that oxygen still remains in the sealed atmosphere, there is possibility that a metal surface of electronic parts suffers oxidation and degradation to a certain degree with remained oxygen. Therefore, in order to conduct the heating and drying treatment for the resin-used electronic parts without suffering substantially influence of oxygen, it is preferable to allow to stand the sealed container at a room temperature until the oxygen absorbent has completed absorption of oxygen in the sealed container. In such case, the time necessary to absorb oxygen in the sealed container depends upon absorption capacity and an amount of oxygen absorbent enclosed together and an amount of oxygen contained in the interior space of the sealed container. When the standing time at a room temperature is short, oxygen in the sealed container cannot be sufficiently absorbed, so that there is possibility that oxidation and degradation of metal surface occur during the heating and drying treatment. Further, when the standing time is long, it is preferable and no problem occurs since absorbing time is merely prolonged and the resin-used electronic parts can be preserved for a long time in such state as they are until the drying and heating treatment are conducted. On the other hand, moisture and acidic gas contained in the sealed container, vaporized from the resin-used electronic parts or generated from a material of enclosed case or cushion can be removed with the drying agent and the acidic gas absorbent during the standing time.
In the present invention, there is no fear of oxidation and degradation due to oxygen in the atmosphere during cooling and re-absorption of moisture since since the cooling after the drying and heating treatment of resin-used electronic parts can be conducted in the state of the sealed container. Further, after cooling, drying-treated resin-used electronic parts can be preserved in such form as they are until just before they are used.
According to the present invention, very simple and easy method which comprises enclosing resin-used electronic particles together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent and further, preferably an acidic gas absorbent in a container having a gas barrier property and sealing the container to heat, is provided. By such method, resin-used electronic parts are easily dried without occurrence of their quality deterioration due to oxidation and degradation of metal surface in a drying step.
Some of the preferred embodiments of the present invention will be described in detail below, referring to Examples, which are not intended to limit the scope of the present invention
350 parts by weight of natural zeolite (mordenite) and a mixture of 100 parts by weight of soybean oil as unsaturated organic compound of main ingredient with 20 parts by weight of cobalt naphthenate (Co content, 8% by weight) as a substance to promote absorption of oxygen were mixed with a blender. The resultant mixture was allowed to stand at 25° C. for 10 minutes to form a granular with flowability, thus obtaining the oxygen absorbent.
5 g of oxygen absorbent thus obtained was mixed with 5 g of calcium oxide as drying agent and acidic gas absorbent and the mixture thus obtained was filled into a small bag (inner size: 5 cm×10 cm) formed of paper, laminated porous polyethylene film on its inside, thus preparing the gas absorbent parcel A (hereinafter, referred to as "gas absorbent A").
Printed wiring board A wherein IPC multiobjective test pattern (IPC-B-25) was drawn on a one side copper coated-glass epoxy substrate of 101.6 mm×114.3 mm×1.6 mm, manufactured by Mitsubish Gas Chemical Co., Inc., Japan, EDOLITE, CCLEL 2-170NV) , was prepared.
One board of printed wiring board A and one parcel of gas absorbent A prepared above were enclosed with 500 ml of air at 25° C. and at 75% RH in a packing bag formed of an aluminum foil laminate (stretched polypropylene/aluminum foil/polyethylene): size 220 mm×300 mm (hereinafter, referred to as "Al bag") and then the opened portion of the Al bag was heat sealed to seal hermetically. The hermetically sealed Al bag was allowed to stand for 2 days under an atmosphere of 25° C. and 60% RH.
After standing for 2 days, removal of oxygen in the Al bath was confirmed. Then, heating and drying treatment of the Al bag after standing was conducted for 6 hours in a dryer of 80° C. After the completion of the heating and drying treatment, the Al bag was cooled to a room temperature. Then, both the oxygen concentration and moisture concentration in the sealed Al bag were determined by gas chromatography. It was found that neither oxygen nor moisture were substantially present in the interior of the sealed Al bag. The sealed Al bag was opened and the printed wiring board A was taken out. Observation of appearance of the printed wiring board A thus taken out, measurement of oxidized film thickness of copper wiring surface and evaluation of its delamination based upon Handaryflow (235° C., 5 minutes) and occurrence of swelling were conducted. No oxidation and degradation of the copper wiring occurred and furthermore neither delamination nor swelling occurred. Thus, it was confirmed that good heat and dry treatment was conducted. The results were shown in Table 1.
The experiments of heating and drying treatment and evaluation were conducted in the same manner as in Example 1 except that the heating and drying treatment of one board of printed wiring board A was conducted at 130° C. for 6 hours in comparative Example 1 and at 80° C. for 6 hours in Comparative Example 2 in an open state without enclosing the printed wiring board A in a container having a gas barrier property. In Comparative Examples 1 and 2, the surface of copper wiring on the printed wiring board A presented reddish and increase of oxidized film thickness of copper was observed. The results were shown in Table 1.
The experiments of heating and drying treatment and evaluation were conducted in the same manner as in Example 1 except that both one board of printed wiring board A and one parcel containing 10 g of trademark Fuji Silicagel, A type, made by FUJI-DAVISONCHEMICAL LTD., Japan in Comparative Example 3, both one board of printed wiring board A and one parcel of moisture-holding type iron powder oxygen absorbent, trademark Ageless Z-100PT, made by Mitsubishi Gas Chemical Co., Inc., Japan in Comparative Example 4, and only one board of printed wiring board A without enclosing gas absorbent in Comparative Example 5, respectively were enclosed together with 500 ml of air at 25° C. and at 75% RH in Al bags and then all of the Al bags were hermetically sealed. The results were shown in Table 2.
In Examples 2 to 4, the gas absorbents B, C and D were prepared in the same manner as in Example 1 except that the combination between main ingredient and a substance to promote oxygen absorption in the gas absorbent A of Example 1 was changed respectively as follows:
______________________________________
main ingredient
of oxygen
absorbent
substance to promote
(100 parts by
oxygen absorption
Example absorbent
weight)
(2 parts by weight)
______________________________________
1 A soybean oil cobalt naphthanate
2 tall oil fatty
cobalt salt of tall
acid oil fatty acid(**)
3 soybean oil
cobalt salt of tall
oil fatty acid(**)
4 soybean oil +
cobalt naphthenate
liquid
polyisoprene(*)
______________________________________
note:
(*) the mixture ratio of soybean oil: liquid polysioprene (trademark
Dynaclean R113, made by Japan Synthetic Rubber Co., Japan) = 6.4 (ratio b
weight)
(**) cobalt content: 6% by weight
The experiments of heating and drying treatment and evaluation were conducted in the same manner as in Example 1 except that gas absorbents B, C and D, respectively, in Examples 2 to 4 were used instead of gas absorbent A. The results were shown in Table 3. In Examples 2 to 4, after the heating and drying treatment, no change of appearance was observed and prevention effects of oxidation for copper wiring on printed wiring board A was confirmed.
The gas absorbent parcel E (hereinafter, referred to as "gas absorbent E") was prepared in the same manner as in Example 1 except that 4 g of oxygen absorbent used in Example 1 and 4 g of calcium oxide were used instead of 5 g of oxygen absorbent and 5 g of calcium oxide.
Four layers printed wiring board of 0.4 mm thickness wherein BT resin substrate of 150 mm×210 mm×0.1 mm, manufactured by Mitsubishi Gas Chemical Co., Inc., Japan, CCL-HL832, drawn IPC multiobjective test pattern (IPC-B-25) thereon as core material and GHPL830 as bonding sheet were used, was prepared. Further, IPC objective test pattern was drawn on both sides of the four layers printed wiring board thus obtained, thus obtaining printed wiring board B. The printed wiring board B thus obtained was allowed to stand in nitrogen at 40° C. and at 60% RH for 10 days, thus obtaining moisture-absorbed printed wiring board B. Immediately, its weight was measured. Moisture absorption percentage of moisture-absorbed printed wiring board B was calculated by using a measured weight of substrate in an absolutely dry state. It was 0.31 wt %.
Moisture absorption percentage
moisture absorption percentage=moisture quantity/(weight of substrate in an absolutely dry state)×100
Weight of substrate in an absolutely dry state
Substrate after test was placed in a dryer at 120° C. for 2 days and then weight of substrate in an absolutely dry state was measured.
Moisture quantity of substrate
Weight of substrate was measured.
moisture quantity of substrate=weight of substrate-(weight of substrate in an absolutely dry state)
Five boards of moisture-absorbed printed wiring board B and one bag of gas absorbent prepared above were enclosed with 500 ml of air at 25° C. and at 75% RH in Al bag : size 220 mm×300 mm and then the opened portion of the Al bag was heat sealed to seal hermetically. The hermetically sealed Al bag was allowed to stand for one day under an atmosphere of 25° C. and 60% RH. After standing for one day, removal of oxygen in the Al bag (oxygen concentration ; 0.08%) was confirmed. Then, heating and drying treatment of the Al bag after standing was conducted for 12 hours in a dryer of 80° C. After the completion of the heating and drying treatment, the Al bag was cooled to a room temperature. Then, the oxygen concentration in the Al bag was measured. The sealed Al bag was opened and the printed wiring board B was taken out. The weight of the printed wiring board B thus taken out was measured and oxidized film thickness of copper wiring was measured. The delamination and swelling of the printed wiring board B were measured by immersing it in a soldering bath molten by heating to 260° C. for 30 seconds. The results were shown in Table 4.
The experiment of heating and drying treatment and evaluation were conducted in the same manner as in Example 5 except that heating and drying treatment of the hermetically sealed Al bag was conducted immediately without allowing to stand for one day under an atmosphere of 25° C. and 60% RH. The results were shown in Table 4.
The experiments of heating and drying treatment and evaluation were conducted in the same manner as in Example 5 except that both five boards of printed wiring board B and one parcel containing 10 g of trademark Fuji Silicagel, A type, made by JUJI-DAVISONCHEMICAL LTD., Japan in Comparative Example 6, both five boards of printed wiring board B and one parcel of moisture-holding type iron powder oxygen absorbent, trademark Ageless Z-100PT, made by Mitsubishi Gas Chemical Co., Inc., Japan in Comparative Example 7, and only five boards of printed wiring board B without enclosing gas absorbent in Comparative Example 8, respectively were enclosed together with 500 ml of air at 25° C. and at 75% RH in Al bags and then all of the Al bags were hermetically sealed. The results were shown in Table 5.
4 g of oxygen absorbent used in Example 1 was mixed with 4 g of calcium chloride anhydride in Example 7, 4 g of magnesium sulfate 1/2 hydrate in Example 8 and 4 g of diphosphorus pentaoxide in Example 9, respectively, as drying agent and the mixture thus obtained was filled into a small bag formed of paper laminated porous polyethylene film on its inside (inner size ; 5 cm×10 cm), thus preparing the gas absorbent parcels F, G and H (hereinafter, referred to as "gas absorbents F, G and H")
The experiment of heating and drying treatment of printed wiring board B and evaluation were conducted in the same manner as in Example 5 except that gas absorbents F, G and H, respectively, were used instead of gas absorbent E. The results were shown in Table 6.
BGA (manufactured by CITIZEN WATCH Co., LTD; Japan, PBGA-352 pin) was allowed to stand in a nitrogen for 3 days at 85° C. and at 85% RH and to absorb moisture. Immediately after 3 days, weight of the BGA was measured and moisture-absorption percentage was determined. 10 pieces of BGA thus moisture-absorbed and one parcel of gas absorbent E was enclosed with 500 ml of air at 25° C. and at 75% RH in Al bag used Example 5 and then the opened portion of the Al bag was heat sealed to seal hermetically. The hermetically sealed Al bag was allowed to stand for one day under an atmosphere of 25° C. and 60% RH.
After standing for one day, removal of oxygen in the Al bag (oxygen concentration; 0.09%) was confirmed. Then, heating and drying treatment of the Al bag after standing was conducted for 24 hours in a dryer of 80° C. Immediately after the completion of the heating and drying treatment, the Al bag was cooled to a room temperature. Then, the oxygen concentration in the Al bag was measured. Then, the sealed Al bag was opened and the BGA was taken out. The weight of the BGA thus taken out was measured and moisture-absorption percentage was determined, and appearance of soldering ball in back side of BGA was observed by stereoscopic microscope of 20 magnifications. Further, the BGA was immersed for 30 seconds in a soldering bath molten by heating to 260° C. and appearance of the BGA was observed. The moisture-absorption percentage of the BGA was determined according to the method of printed wiring board B described in Example 5. The results were shown in Table 7.
The experiment of heating and drying treatment was conducted in the same manner as in Example 5 except that BGA absorbed moisture in the same manner as in Example 10 was used instead of printed wiring board B absorbed moisture and neither enclosed in Al bag nor hermetically sealed. Then, the same evaluation as in Example 10 was conducted. Slight cloudiness of soldering ball was observed and oxidation and degradation occurred in some degree. The results were shown in Table 7.
QFP (manufacture by Taiwan Memory Technology Inc., MQFP 100) was allowed to stand in a nitrogen for 3 days at 85° C. and at 85% RH and to absorb moisture. Immediately after 3 days, thus obtaining moisture-absorbed QFP. Moisture-absorption percentage of the QFP was determined and 0.30 wt %. 10 pieces of QFP thus moisture-absorbed and one bag of gas absorbent E was enclosed with 500 ml of air at 25° C. and at 75% RH in Al bag used Example 1 and then the opened portion of the Al bag was heat sealed to seal hermetically. The hermetically sealed Al bag was allowed to stand for one day under an atmosphere of 25° C. and 60% RH.
After standing for one day, removal of oxygen in the Al bag (oxygen concentration; 0.09%) was confirmed. Then, heating and drying treatment of the Al bag after standing was conducted for 24 hours in a dryer of 80° C. Immediately after the completion of the heating and drying treatment, the Al bag was cooled to a room temperature. Then, the oxygen concentration in the Al bag was measured. Then, the sealed Al bag was opened and the QFP was taken out. The weight of the QFP thus taken out was measured and moisture-absorption percentage was determined. and appearance of soldered lead of QFP was observed by stereoscopic microscope of 20 magnifications. No discoloration was observed and initial appearance was maintained. Then, immediately, the QFP was immersed piece by piece for 30 seconds in a soldering bath molten by heating to 260° C. to cut and polish and appearance of cross section of the QFP was observed and no crack was observed. The moisture-absorption percentage of the QFP was determined according to the method of printed wiring board B described in Example 5. The results were shown in Table 8.
The experiment of heating and drying treatment was conducted in the same manner as in Example 11 except that QFP absorbed moisture in the same manner as in Example 11 was used and neither enclosed in Al bag nor hermetically sealed. Then, the same evaluation as in Example 11 was conducted. The results were shown in Table 8.
TABLE 1
______________________________________
Example
Comp. Ex.
Comp. Ex.
Before
1 2 treatment
______________________________________
Heating and drying
treatment conditions
Temperature, ° C.
80 130 80
--
Time, hr 6 6
--
Interior of bag after
Open Open
heating and drying
system
system
treatment
Oxygen concentration, %
0.03 -- -- --
Humidity, % RH
--1 -- --
After heating and drying
treatment
Color change of copper
No color
Redness
Redness
--
wiring increasednge
increased
occurred
Oxidized film thickness
3.5 9.4
7.8 3.5
of copper, nm
Delamination not
not
occurred
occurred occurred
occurred
Swelling occurred
occurred occurred
occurred
______________________________________
TABLE 2
______________________________________
Example
Comp. Ex.
Comp. Ex.
Comp. Ex.
1 5
______________________________________
Treatment in bag
Gas Drying Moisture
No
agentbsorbent
holding
treatment
waspe
iront
conducted
powder
oxygen
absorbent
was
enclosed
Interior of bag after
heating and drying
treatment
Oxygen concentration, %
0.03 21 0.05
21
Humidity, % RH
85 75
After heating and drying
treatment
Color change of copper
No color
Slight No color
Redness
wiring rednesse
change
increased
occurred occurred
occurred
Oxidized film thickness
3.5 5.4
3.8 7.5
of copper, nm
Delamination not
not
occurred
occurred occurred
occurred
Swelling occurred
occurred occurred
occurred
______________________________________
TABLE 3
______________________________________
Example
Example Example Example
1 2
4
______________________________________
Oxygen absorbent
Organic compound
Tall oilean
Soybean
Soybean
as main ingredient
fattyl
oil +
poly-
isoprene
Substance to promote
Cobalt
Cobalt
Cobalt
Cobalt
oxygen absorption
naph-
salt of
salt of
naph-
tall oil thenate
tall oil
thenate
fatty
acid
Interior of bag after
heating and drying
treatment
Oxygen concentration, %
0.03 0.03 0.04
0.03
Humidity, % RH
<1 <1
After heating and drying
treatment
Color change of copper
No color
No color
No color
No color
wiring changege
change
occurred occurred
occurred
occurred
Oxidized film thickness
3.5 3.5
3.5 3.5
of copper, nm
Delamination not
not
not
occurred occurred
occurred
occurred
Swelling not
occurred occurred
occurred
occurred
______________________________________
TABLE 4
______________________________________
Before
Example 5
Example 6
treatment
______________________________________
Heating and drying treatment
conditions
Temperature, ° C.
25 --
--
Time, day -- 1
--
Temperature, ° C.
80 80
--
Time, hr 12 12
--
Interior of bag after heating
and drying treatment
Oxygen concentration, %
0.03
0.04
--
Moisture absorption
0.07
0.09
0.31
percentage of printed
wiring board B, %
After heating and drying
treatment
Color change of copper
No color
No color --
wiring changee
occurred occurred
Oxidized film thickness
3.5 3.8 3.5
of copper, nm
Delamination not occurred
occurred
Swelling not occurredrred
occurred
______________________________________
TABLE 5
______________________________________
Comp. Ex.
Comp. Ex.
Comp. Ex.
Before
6 treatment
______________________________________
Treatment in bag
Drying Moisture No --
holdingt
agent
wass
iron enclosed
used
powder
oxygen
absorbent
was
enclosed
Interior of bag after
heating and drying
treatment
Oxygen concentration, %
21 0.05 21 --
Moisture absorption
0.10
0.32
0.31
percentage of printed
wiring board B, %
After heating and drying
treatment
Color change of copper
Slight
No color
Slight
--
wiring change rednessss
occurred occurred
occurred
Oxidized film thickness
4.8 3.9
6.4 3.5
of copper, nm
Delamination occurred
occurred
occurred
occurred
Swelling occurredrred
occurred
______________________________________
TABLE 6
______________________________________
Example 7
Example 8 Example 9
______________________________________
Drying agent Calcium Magnesium Diphosphorus
sulfate chloride
pentaoxide
1/2 hydrate anhydride
Interior of bag after
heating and drying
treatment
Oxygen concentration, %
0.03 0.04 0.04
Moisture absorption
0.09
0.07
0.04
percentage of printed
wiring board B, %
After heating and drying
treatment
Color change of copper
No color
No color
No color
wiring change
change
occurred occurred
occurred
Oxidized film thickness
3.5 3.7
3.5
of copper, nm
Delamination not
not
occurred occurred
occurred
Swelling not
not
occurred occurred
occurred
______________________________________
TABLE 7
______________________________________
Before
Example 10
Comp. Ex. 9
treatment
______________________________________
Heating and drying treatment
conditions
Temperature, ° C.
25 25
--
Time, day 1 --
Temperature, ° C.
80 80
--
Time, hr 24 24
--
Interior of bag after heating
Open
and drying treatment
system
Oxygen concentration, %
0.03
-- --
Moisture absorption
0.08
0.05
0.28
percentage of BGA, %
After heating and drying
treatment
Appearance of solder ball
No color
Slight --
cloudiness change
occurred occurred
Swelling not occurredrred
occurred
______________________________________
TABLE 8
______________________________________
Comp. Before
Example 11
Ex. 10 treatment
______________________________________
Treatment in bag
Gas Open
system absorbent
of the
present
invention
was enclosed
Interior of bag after heating
and drying treatment
Oxygen concentration, %
0.03
-- --
Moisture absorption
0.05
0.04
0.30
percentage of QFP, %
After heating and drying
treatment
Color change of lead
No color
Slight --
portion cloudiness
occurred occurred
Inner cracking not occurredrred
occurred
______________________________________
Claims (8)
1. A method for drying resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property and
then sealing the container to heat at a temperature of 40 to 120° C.
2. A method for drying resin-used electronic parts according to claim 1, wherein the oxygen absorbent requiring no moisture for absorption of oxygen contains at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group (s) as the main ingredient and a substance to promote oxygen absorption.
3. A method for drying resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property,
then sealing the container, thus removing oxygen and
then heating the sealed container at a temperature of 40 to 120° C.
4. A method for drying resin-used electronic parts according to claim 3, wherein the oxygen absorbent requiring no moisture for absorption of oxygen contains at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group (s) as the main ingredient and a substance to promote oxygen absorption.
5. A method for drying resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with an oxygen absorbent requiring no moisture for absorption of oxygen, a drying agent and an acidic gas absorbent in a container having a gas barrier property and
then sealing the container to heat at a temperature of 40 to 120° C.
6. A method for drying resin-used electronic parts according to claim 5, wherein the oxygen absorbent requiring no moisture for absorption of oxygen contains at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group (s) as the main ingredient and a substance to promote oxygen absorption.
7. A method for drying resin-used electronic parts which comprises:
enclosing resin-used electronic parts together with an oxygen absorbent requiring no moisture for absorption of oxygen, a drying agent and an acidic gas absorbent in a container having a gas barrier property
then sealing the container thus removing oxygen and
then heating the sealed container at a temperature of 40 to 120° C.
8. A method for drying resin-used electronic parts according to claim 7, wherein the oxygen absorbent requiring no moisture for absorption of oxygen contains at least one compound selected from the group consisting of unsaturated fatty acid compounds and linear hydrocarbon polymers having an unsaturated group (s) as the main ingredient and a substance to promote oxygen absorption.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30035396 | 1996-11-12 | ||
| JP8-300353 | 1996-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US6045743A true US6045743A (en) | 2000-04-04 |
Family
ID=17883769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US08/959,982 Expired - Fee Related US6045743A (en) | 1996-11-12 | 1997-10-29 | Method for drying resin-used electronic parts |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6045743A (en) |
| EP (1) | EP0847232A3 (en) |
| KR (1) | KR19980042279A (en) |
| SG (1) | SG71732A1 (en) |
| TW (1) | TW421608B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6596192B2 (en) * | 2000-07-24 | 2003-07-22 | Mitsubishi Gas Chemical Company, Inc. | Oxygen absorbent composition absorbing water vapor |
| US20040064082A1 (en) * | 2002-06-21 | 2004-04-01 | Playtex Products, Inc. | Tapered tampon applicator |
| US20110084260A1 (en) * | 2003-08-28 | 2011-04-14 | Samsung Electronics Co., Ltd | Thin film transistor array panel using organic semiconductor and a method for manufacturing the same |
| US20190098768A1 (en) * | 2017-09-26 | 2019-03-28 | Brother Kogyo Kabushiki Kaisha | Electrode Connecting Method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124726B (en) * | 2013-04-25 | 2016-08-31 | 财团法人工业技术研究院 | Charging device and charging method |
| CN108138276B (en) * | 2015-10-09 | 2021-05-25 | 江阴贝卡尔特钢丝制品有限公司 | Elongated steel wire with a metal coating for corrosion resistance |
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| US5204080A (en) * | 1989-06-30 | 1993-04-20 | Kabushiki Kaisha Toshiba | Method of manufacturing an aluminum nitride structure |
| US5510166A (en) * | 1989-01-23 | 1996-04-23 | Mitsubishi Gas Chemical Company, Inc. | Inhibitor parcel and method for preserving electronic devices or electronic parts |
| JPH08151082A (en) * | 1994-11-25 | 1996-06-11 | Mitsubishi Gas Chem Co Inc | Preservation of part applied with metal vapor deposition film |
| JPH08276963A (en) * | 1995-02-08 | 1996-10-22 | Mitsubishi Gas Chem Co Inc | Method for preserving adhesive tape and product using the same |
| US5767230A (en) * | 1995-11-02 | 1998-06-16 | Ecoplast Corporation | Process for removing volatiles from post-consumer recycled polyolefin chips |
| US5885493A (en) * | 1997-11-04 | 1999-03-23 | Lockheed Martin Energy Research Corporation | Method of drying articles |
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| US4908151A (en) * | 1987-02-14 | 1990-03-13 | Mitsubishi Gas Chemical Co., Inc. | Oxygen absorbent |
| JP2539093B2 (en) * | 1990-10-25 | 1996-10-02 | 三菱マテリアル株式会社 | Lead frame, manufacturing method thereof, and semiconductor device |
| JP3480474B2 (en) * | 1994-07-28 | 2003-12-22 | 三菱瓦斯化学株式会社 | Oxygen scavenger |
-
1997
- 1997-10-13 TW TW086114939A patent/TW421608B/en not_active IP Right Cessation
- 1997-10-29 US US08/959,982 patent/US6045743A/en not_active Expired - Fee Related
- 1997-11-04 EP EP97119239A patent/EP0847232A3/en not_active Withdrawn
- 1997-11-11 KR KR1019970059234A patent/KR19980042279A/en not_active Application Discontinuation
- 1997-11-12 SG SG1997004028A patent/SG71732A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5510166A (en) * | 1989-01-23 | 1996-04-23 | Mitsubishi Gas Chemical Company, Inc. | Inhibitor parcel and method for preserving electronic devices or electronic parts |
| US5204080A (en) * | 1989-06-30 | 1993-04-20 | Kabushiki Kaisha Toshiba | Method of manufacturing an aluminum nitride structure |
| JPH08151082A (en) * | 1994-11-25 | 1996-06-11 | Mitsubishi Gas Chem Co Inc | Preservation of part applied with metal vapor deposition film |
| JPH08276963A (en) * | 1995-02-08 | 1996-10-22 | Mitsubishi Gas Chem Co Inc | Method for preserving adhesive tape and product using the same |
| US5767230A (en) * | 1995-11-02 | 1998-06-16 | Ecoplast Corporation | Process for removing volatiles from post-consumer recycled polyolefin chips |
| US5885493A (en) * | 1997-11-04 | 1999-03-23 | Lockheed Martin Energy Research Corporation | Method of drying articles |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6596192B2 (en) * | 2000-07-24 | 2003-07-22 | Mitsubishi Gas Chemical Company, Inc. | Oxygen absorbent composition absorbing water vapor |
| US20040064082A1 (en) * | 2002-06-21 | 2004-04-01 | Playtex Products, Inc. | Tapered tampon applicator |
| US20110084260A1 (en) * | 2003-08-28 | 2011-04-14 | Samsung Electronics Co., Ltd | Thin film transistor array panel using organic semiconductor and a method for manufacturing the same |
| US8319223B2 (en) * | 2003-08-28 | 2012-11-27 | Samsung Display Co., Ltd. | Thin film transistor array panel using organic semiconductor and a method for manufacturing the same |
| US20190098768A1 (en) * | 2017-09-26 | 2019-03-28 | Brother Kogyo Kabushiki Kaisha | Electrode Connecting Method |
| US10785880B2 (en) * | 2017-09-26 | 2020-09-22 | Brother Kogyo Kabushiki Kaisha | Electrode connecting method |
Also Published As
| Publication number | Publication date |
|---|---|
| SG71732A1 (en) | 2000-04-18 |
| TW421608B (en) | 2001-02-11 |
| EP0847232A2 (en) | 1998-06-10 |
| KR19980042279A (en) | 1998-08-17 |
| EP0847232A3 (en) | 1999-12-29 |
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Effective date: 20040404 |
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