US5657879A - Combination wafer carrier and storage device - Google Patents
Combination wafer carrier and storage device Download PDFInfo
- Publication number
- US5657879A US5657879A US08/596,956 US59695696A US5657879A US 5657879 A US5657879 A US 5657879A US 59695696 A US59695696 A US 59695696A US 5657879 A US5657879 A US 5657879A
- Authority
- US
- United States
- Prior art keywords
- radiused
- wafer
- container
- end plates
- insert plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
Definitions
- This invention relates to improvements in handling and storage containers for silicon semiconductor wafers during the course of their manufacture.
- the present invention comprises a basket-like container for handling and storage of semiconductor wafers that are in production, the container being adjustable both with respect to the size of wafers it can accommodate and in overall capacity and further being adaptable to receive wafers in the same orientation they are found in a conventional semiconductor wafer production line.
- FIG. 1 is a combination perspective and cutaway view of an exemplary device of the present invention.
- FIG. 2 is an end view of the same device.
- FIG. 3 is a plan view of the same device.
- FIG. 4 is a cross-sectional view of the device, taken through the plane 4--4 of FIG. 3.
- FIG. 5 is a front view of one type of a stabilizer plate of the device of the present invention.
- FIG. 6 is a side view of the stabilizer plate shown in FIG. 5.
- FIG. 7 is a perspective view of an insertable sleeve to accommodate a smaller diameter wafer, also showing the stabilizer plate of FIG. 8 in place.
- FIG. 8 is a front view of another type of stabilizer plate to be used in connection with the insert shown in FIG. 7.
- FIGS. 1-4 a silicon wafer basket 10 comprising end plates 12 secured to a longitudinal U-shaped radiused wafer retainer 14 and longitudinal rails 16.
- Wafer retainer 14 may be provided with appropriately sized insertable sleeves (described below) so as to accommodate wafer discs of smaller diameters.
- the upper portions of wafer retainer 14 and rails 16 are provided with notches 15 and 17, respectively, for engaging stabilizer plates, also described below.
- the radius of the lower portion of wafer retainer 14 is approximately the same as that of the wafers that are desired to be accommodated.
- End plates 12 are preferably provided with a circular resilient pad 12' for compressive engagement with a stack of edge-stacked wafers, and are cut out in their upper portions so as to provide handles 13, which in turn may be padded with grips 13'.
- Wafer retainer 14 has holes or slots in its lower portion that function as drain trenches 14'.
- FIGS. 5-6 show one type of a stabilizer plate 18 provided with lower and upper lugs 20 and 21, respectively, for engagement with wafer retainer notches 15 and rail notches 17, respectively.
- the upper portion of stabilizer plate 18 may also be cut out to provide a handle 19 for ease in insertion into and removal from the wafer basket 10, and one or both faces of the stabilizer plate may be provided with circular pads of resilient polymer 18' for compressive engagement with the end of one or more stacks of edge-stacked wafers.
- the radius of the lower portion of stabilizer plate 18 is slightly less than that of wafer retainer 14, so as to be readily engagable and disengagable therewith.
- Stabilizer plate 18 is inserted into engagement with the notches in the upper portions of wafer retainer 14 and rails 16 at the desired location so as to permit wafer basket 10 to accommodate an adjustable number of wafers. Multiple stabilizer plates may be utilized to secure and segregate different types of wafers within the same basket.
- FIG. 7 depicts a basket-like insertable sleeve 30 to accommodate smaller diameter wafers, the sleeve comprising two radiused end plates 32 provided with circular resilient pads 32', and joined together by U-shaped radiused insert wafer retainer 34, which in turn is provided with holes or slots to function as insert drains 34'.
- Radiused end plates 32 are provided with insert lugs 33 to engage notches 15 of rails 16, the notches preferably being in close proximity to end plates 12, and the radii thereof are approximately the same as that of wafer retainer 14 so as to fit snugly within silicon wafer basket 10.
- the radius of sleeve wafer retainer 34 is approximately the same as that of the wafers desired to be accommodated therein, and it will readily be understood that any size sleeve may be fabricated to accommodate virtually any size wafers.
- FIG. 8 depicts a sleeve stabilizer plate 40, preferably provided with resilient pads 40' on one or both sides for compressive engagement with the end of one or more stacks of edge-stacked wafers.
- Sleeve stabilizer plate 40 is also provided with a cut-out portion so as to form a sleeve stabilizer plate handle 41, and is further provided with sleeve stabilizer plate lugs 42 for engagement with notches 15 of rails 16.
- the radius of the lower portion of sleeve stabilizer plate 40 is preferably slightly less than the radius of insert wafer retainer 34, so as to be readily engagable and disengagable therewith.
- multiple insert stabilizer plates 40 may be used to secure and segregate different types of wafers within the same insertable sleeve.
- the silicon wafer basket 10 is lowered into a water tub containing sliced wafers that are stacked on edge in the same manner as coins in a coin counter, and under the wafers, then raised so that the edges of the wafers engage the bottom portion of wafer retainer 14, thereby to remove the wafers from the tub and hold them in storage for the next production step such as edge grinding, lapping or etching.
- edge grinding, lapping or etching Excess water drains out through the drain trenches, and to the extent necessary, one or more stabilizer plates are put in place with their resilient pads compressively engaging the ends of a stack of edge-stacked wafers.
- the wafer basket of the present invention holds approximately four times the number of wafers as conventional cassette storage devices. Furthermore, because of its design, it is much easer to handle, requiring little or no flexing of the wrist joints of the user.
Landscapes
- Packaging Frangible Articles (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/596,956 US5657879A (en) | 1996-02-05 | 1996-02-05 | Combination wafer carrier and storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/596,956 US5657879A (en) | 1996-02-05 | 1996-02-05 | Combination wafer carrier and storage device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US5657879A true US5657879A (en) | 1997-08-19 |
Family
ID=24389440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US08/596,956 Expired - Fee Related US5657879A (en) | 1996-02-05 | 1996-02-05 | Combination wafer carrier and storage device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US5657879A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2775675A1 (en) * | 1998-03-09 | 1999-09-10 | Soitec Silicon On Insulator | WAFER HOLDER FOR MICROELECTRONICS AND METHOD OF USING THE SAME |
| US6176377B1 (en) * | 1999-08-18 | 2001-01-23 | Ali Industries, Inc. | Rack for supporting abrasive discs or the like |
| US7055702B1 (en) * | 2000-06-06 | 2006-06-06 | Saint-Gobain Ceramics & Plastics, Inc. | Slip resistant horizontal semiconductor wafer boat |
| US20070029268A1 (en) * | 2005-08-04 | 2007-02-08 | King Yuan Electronics Co., Lt | Wafer cassette used in high temperature baking process |
| US20110250039A1 (en) * | 2008-12-16 | 2011-10-13 | Q-Cells Se | Modular carrier |
| CN105070677A (en) * | 2015-09-11 | 2015-11-18 | 南通皋鑫电子股份有限公司 | silicon carbide boat for silicon wafer PN diffusion |
| CN106784145A (en) * | 2016-12-23 | 2017-05-31 | 中赣新能源股份有限公司 | A kind of silicon chip inserted sheet method |
| US10020213B1 (en) * | 2016-12-30 | 2018-07-10 | Sunpower Corporation | Semiconductor wafer carriers |
| US10068787B2 (en) * | 2016-12-30 | 2018-09-04 | Sunpower Corporation | Bowing semiconductor wafers |
| JP2019087706A (en) * | 2017-11-10 | 2019-06-06 | 三菱電機株式会社 | Wafer container |
| JP2020033052A (en) * | 2018-08-29 | 2020-03-05 | 凸版印刷株式会社 | Substrate storage cassette |
| US20260011589A1 (en) * | 2024-07-08 | 2026-01-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cassette carrier used in wet bench process |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4388140A (en) * | 1980-07-15 | 1983-06-14 | Shin-Etsu Chemical Co., Ltd. | Apparatus for wet treatment of wafer materials |
| US4743156A (en) * | 1986-05-09 | 1988-05-10 | Motorola, Inc. | Dump transfer wafer carrier |
| US4872554A (en) * | 1987-07-02 | 1989-10-10 | Fluoroware, Inc. | Reinforced carrier with embedded rigid insert |
| US4949848A (en) * | 1988-04-29 | 1990-08-21 | Fluoroware, Inc. | Wafer carrier |
| US4993559A (en) * | 1989-07-31 | 1991-02-19 | Motorola, Inc. | Wafer carrier |
| US5193682A (en) * | 1991-06-28 | 1993-03-16 | Shin-Etsu Handotai Co., Ltd. | Wafer basket |
| US5228568A (en) * | 1991-08-30 | 1993-07-20 | Shin-Etsu Handotai Co., Ltd. | Semiconductor wafer basket |
| USD338991S (en) | 1991-06-28 | 1993-08-31 | Shin-Etsu Handotai Co., Ltd. | Wafer basket |
| USD344386S (en) | 1991-06-28 | 1994-02-15 | Shin-Etsu Handotai Co., Ltd. | Wafer basket |
| US5390811A (en) * | 1991-08-30 | 1995-02-21 | Shin-Etsu Handotai Co., Ltd. | Wafer basket for containing semiconductor wafers |
-
1996
- 1996-02-05 US US08/596,956 patent/US5657879A/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4388140A (en) * | 1980-07-15 | 1983-06-14 | Shin-Etsu Chemical Co., Ltd. | Apparatus for wet treatment of wafer materials |
| US4743156A (en) * | 1986-05-09 | 1988-05-10 | Motorola, Inc. | Dump transfer wafer carrier |
| US4872554A (en) * | 1987-07-02 | 1989-10-10 | Fluoroware, Inc. | Reinforced carrier with embedded rigid insert |
| US4949848A (en) * | 1988-04-29 | 1990-08-21 | Fluoroware, Inc. | Wafer carrier |
| US4993559A (en) * | 1989-07-31 | 1991-02-19 | Motorola, Inc. | Wafer carrier |
| US5193682A (en) * | 1991-06-28 | 1993-03-16 | Shin-Etsu Handotai Co., Ltd. | Wafer basket |
| USD338991S (en) | 1991-06-28 | 1993-08-31 | Shin-Etsu Handotai Co., Ltd. | Wafer basket |
| USD344386S (en) | 1991-06-28 | 1994-02-15 | Shin-Etsu Handotai Co., Ltd. | Wafer basket |
| US5228568A (en) * | 1991-08-30 | 1993-07-20 | Shin-Etsu Handotai Co., Ltd. | Semiconductor wafer basket |
| US5390811A (en) * | 1991-08-30 | 1995-02-21 | Shin-Etsu Handotai Co., Ltd. | Wafer basket for containing semiconductor wafers |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2775675A1 (en) * | 1998-03-09 | 1999-09-10 | Soitec Silicon On Insulator | WAFER HOLDER FOR MICROELECTRONICS AND METHOD OF USING THE SAME |
| WO1999046802A1 (en) * | 1998-03-09 | 1999-09-16 | S.O.I.Tec Silicon On Insulator Technologies | Installation and method for chemical treatment of microelectronics wafers |
| US6576065B1 (en) | 1998-03-09 | 2003-06-10 | S.O.I.Tech Silicon On Insulator Technologies | Installation and method for chemical treatment of microelectronics wafers |
| US6176377B1 (en) * | 1999-08-18 | 2001-01-23 | Ali Industries, Inc. | Rack for supporting abrasive discs or the like |
| US7055702B1 (en) * | 2000-06-06 | 2006-06-06 | Saint-Gobain Ceramics & Plastics, Inc. | Slip resistant horizontal semiconductor wafer boat |
| US20070029268A1 (en) * | 2005-08-04 | 2007-02-08 | King Yuan Electronics Co., Lt | Wafer cassette used in high temperature baking process |
| US20110250039A1 (en) * | 2008-12-16 | 2011-10-13 | Q-Cells Se | Modular carrier |
| CN105070677A (en) * | 2015-09-11 | 2015-11-18 | 南通皋鑫电子股份有限公司 | silicon carbide boat for silicon wafer PN diffusion |
| CN106784145A (en) * | 2016-12-23 | 2017-05-31 | 中赣新能源股份有限公司 | A kind of silicon chip inserted sheet method |
| US10020213B1 (en) * | 2016-12-30 | 2018-07-10 | Sunpower Corporation | Semiconductor wafer carriers |
| US10068787B2 (en) * | 2016-12-30 | 2018-09-04 | Sunpower Corporation | Bowing semiconductor wafers |
| US20180337080A1 (en) * | 2016-12-30 | 2018-11-22 | Sunpower Corporation | Semiconductor wafer carriers |
| US20180374730A1 (en) * | 2016-12-30 | 2018-12-27 | Sunpower Corporation | Bowing semiconductor wafers |
| US10553466B2 (en) * | 2016-12-30 | 2020-02-04 | Sunpower Corporation | Semiconductor wafer carriers |
| US10720351B2 (en) * | 2016-12-30 | 2020-07-21 | Sunpower Corporation | Bowing semiconductor wafers |
| JP2019087706A (en) * | 2017-11-10 | 2019-06-06 | 三菱電機株式会社 | Wafer container |
| JP2020033052A (en) * | 2018-08-29 | 2020-03-05 | 凸版印刷株式会社 | Substrate storage cassette |
| US20260011589A1 (en) * | 2024-07-08 | 2026-01-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cassette carrier used in wet bench process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: SEH AMERICA, INC., WASHINGTON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ANDERSON, DOUGLAS G.;JORDAN, JASON D.;REEL/FRAME:007914/0832 Effective date: 19960201 |
|
| FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| AS | Assignment |
Owner name: SEH AMERICA, INC., WASHINGTON Free format text: CORRECTION OF PREVIOUSLY RECORDED ASSIGNMENT AT REEL 7914, FRAME 0832. TO CORRECT STATE OF INCORPORATION.;ASSIGNORS:ANDERSON, DOUGLAS G.;JORDAN, JASON D.;REEL/FRAME:010603/0049 Effective date: 19960205 |
|
| FPAY | Fee payment |
Year of fee payment: 4 |
|
| REMI | Maintenance fee reminder mailed | ||
| LAPS | Lapse for failure to pay maintenance fees | ||
| STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
| FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20050819 |