US5473191A - Hybrid integrated circuit device with apertured cover - Google Patents

Hybrid integrated circuit device with apertured cover Download PDF

Info

Publication number
US5473191A
US5473191A US08/314,620 US31462094A US5473191A US 5473191 A US5473191 A US 5473191A US 31462094 A US31462094 A US 31462094A US 5473191 A US5473191 A US 5473191A
Authority
US
United States
Prior art keywords
integrated circuit
hybrid integrated
circuit device
resin
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US08/314,620
Other languages
English (en)
Inventor
Katsunori Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TANAKA, KATSUNORI
Application granted granted Critical
Publication of US5473191A publication Critical patent/US5473191A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Definitions

  • This invention relates to a hybrid integrated circuit device to be used as, for example, a controller for an AC generator for a car.
  • FIG. 1 is a circuit diagram showing an AC generator for a car and its controller.
  • reference numeral 1 designates an AC generator having, for example, armature coils 101 connected with one another in the three-phase star connection and a field coil 102.
  • Reference numeral 2 designates a rectifier, for example a full wave rectifier having a rectified output terminal 201, a grounded terminal 202 and input terminals 203 connected to the outer ends of the armature coils 101, and further having diodes connected between the input terminals 203 and the rectified output terminal 201 or between the input terminals 203 and the grounded terminal 202 respectively.
  • Reference numeral 3 designates a voltage regulator having voltage dividing resistors 301 and 302 for detecting the voltage of the generator 1, which resistors 301 and 302 are connected in series mutually between the rectified output terminal 201 of the rectifier 2 and ground, a capacitor 308 connected between the node 301a of these voltage dividing resistors 301, 302 and ground, a Zener diode 303 the cathode of which is connected to the node 301a, a control transistor 304 the base of which is connected to the anode of the Zener diode 303 and the emitter of which is grounded, a base current supplying resistor 305 one end of which is connected to the collector of the control transistor 304, a switching device, for example, a power transistor 306 the base of which is connected to the collector of the control transistor 304 and the emitter of which is Grounded and further the collector of which is connected to the rectified output terminal 201 of the rectifier 2 through the field coil 102 of the AC Generator 1, and suppression diode 30
  • Reference numeral 4 designates storage batteries connected between the rectified output terminal 201 of the rectifier 2 and ground
  • reference numeral 5 designates a key switch connected between the positive terminal of the storage batteries 4 and the base current supplying resistor 305 in the voltage regulator 3
  • reference numerals 6 and 7 respectively designate a starter switch and a starter connected in series with each other and in parallel to the storage batteries 4.
  • the rectifier 2, the voltage regulator 3, the storage batteries 4, the key switch 5, the starter switch 6 and the starter 7 compose the controller.
  • the Zener diode 303 and the control transistor 304 is not conductive, and the power transistor 306 remains in its conductive state. Thereby, the field current flowing in the field coil 102 increases, and the output voltage of the AC generator 1 is further raised.
  • the Zener diode 303 and the control transistor 304 become conductive, and the power transistor 306 becomes non-conductive. As a result, the field current decreases, and the output voltage also falls.
  • the capacitor 308 performs the function of smoothing the voltage detected by the dividing resistors 301 and 302.
  • the capacitor 308, the power transistor 306, the dividing resistors 301, 302, the Zener diode 303, the control transistor 304, the base current supplying resistor 305, the suppression diode 307 and the like of the controller are mounted on a printed board to compose a hybrid integrated circuit device.
  • FIG. 2 is a perspective view of its appearance
  • FIG. 3 is a longitudinal sectional view of the device shown in FIG. 2.
  • reference numeral 8 designates an integrated circuit board. External terminals 801 are disposed at suitable positions on it, and function elements 802, 803 and 804 are mounted on it.
  • the function element 802 corresponds to the power transistor 306 shown in the circuit diagram of FIG. 1
  • the function element 803 similarly corresponds to the dividing resistors 301, 302, the Zener diode 303, the control transistor 304, the base current supplying resistor 305, and the suppression diode 307 shown in the circuit diagram of FIG. 1
  • the function element 804 corresponds to the capacitor 308 shown in the circuit diagram of FIG. 1.
  • Reference numeral 9 designates a ring enclosing the function elements 802, 803 and 804 on the integrated circuit board 8
  • reference numeral 10 designates a protection resin (for example, silicon in a gel state) which is filled in the ring 9 so as to cover the function elements 802, 803 and 804.
  • the protection resin 10 is injected into the ring 9 from the opening 9a of the ring.
  • the hybrid integrated circuit device constructed as mentioned above protects the function elements 802, 803 and 804 from the stress caused by vibrations or heat, and from moisture and so on.
  • the device Because the top part of the ring 9 of the conventional hybrid integrated circuit device is open as shown in FIGS. 2 and 3, the device has the danger of damaging the function elements 802, 803 and 804, or the danger of breaking its reed parts when a force holding down the device is imposed on the opening 9a of the ring 9 in case of handling or carrying the device in the opened state. And the device has a problem that the effect of protecting the function elements 802, 803 and 804 from the stress caused by vibrations, heat or the like, and from moisture etc. is too small in the case where the protection resin 10 exposed to the outside at the opening 9a is damaged by being scraped and so on.
  • a hybrid integrated circuit device provided with an opened cover on its ring enclosing its function elements.
  • the hybrid integrated circuit device is provided with an opened cover on its ring, and consequently, the device can be protected from influence from the outside on the top part of the ring in case of being handled and being carried.
  • the opened cover has an opening, the function element can be protected from damage due to the thermal expansion of its resin in the case where the function element is shut closely with the cover, and further its protection resin can be injected after the cover is disposed on the ring.
  • the influence on the function element due to the thermal stress of the protection resin is small.
  • a hybrid integrated circuit device the opened cover of which is a planar member provided with plural polygonal apertures.
  • a hybrid integrated circuit device the polygonal apertures of the opened cover of which are triangular apertures.
  • a hybrid integrated circuit device the polygonal apertures of the opened cover of which are rectangular apertures.
  • a hybrid integrated circuit device the opened cover of which is a planar member provided with plural circular or elliptical apertures.
  • the hybrid integrated circuit device has an opened cover being a planar member provided with plural apertures having various shapes, and consequently, the cover resists the external force to prevent the influence of the force to the function element of the device in the case where the external force is imposed on the device, and further the resin surface in the device has no possibility of being scraped by the force.
  • a hybrid integrated circuit device the opened cover of which is constructed in one body with the ring of the device.
  • the opened cover of the hybrid integrated circuit device according to the sixth aspect of the present invention is constructed in one body with the ring, and consequently, the number of the parts of the device does not increase, and the device can be constructed cheaply.
  • a hybrid integrated circuit device enclosed in a case of a voltage regulator for a motor car with a resin.
  • the hybrid integrated circuit device according to the seventh aspect of the present invention is enclosed in the case of a voltage regulator for a motor car with a resin, and consequently, the number of the parts of the device does not increase in case of mounting the device in a motor car, and the device can be constructed cheaply, and further the device can easily be built in.
  • FIG. 1 is a circuit diagram showing a conventional AC generator for a motor car and its controller
  • FIG. 2 is a perspective view of a conventional hybrid integrated circuit device
  • FIG. 3 is a longitudinal sectional view of the conventional hybrid integrated circuit device shown in FIG. 2;
  • FIG. 4 is a perspective view of a hybrid integrated circuit device of embodiment 1 of the present invention.
  • FIG. 5 is a longitudinal sectional view of the hybrid integrated circuit device shown in FIG. 4;
  • FIG. 6 is a perspective view of a hybrid integrated circuit device of embodiment 2 of the present invention.
  • FIG. 7 is a longitudinal sectional view of the hybrid integrated circuit device shown in FIG. 6;
  • FIG. 8 is a perspective view of an opened cover of the hybrid integrated circuit device of embodiment 2 of the present invention.
  • FIG. 9 is a perspective view of another opened cover of the hybrid integrated circuit device of embodiment 2 of the present invention.
  • FIG. 10 is a perspective view of a different opened cover of the hybrid integrated circuit device of embodiment 2 of the present invention.
  • FIG. 11 is a perspective view of the hybrid integrated circuit device of embodiment 3 of the present invention.
  • FIG. 12 is a longitudinal sectional view of the hybrid integrated circuit device shown in FIG. 11;
  • FIG. 13 is a front view showing a regulator case in which the hybrid integrated circuit device of embodiment 4 of the present invention is mounted.
  • FIG. 14 is a sectional view along the line XI--XI of FIG. 13.
  • FIGS. 4 and 5 designates an opened or apertured cover disposed on the ring 9 so as to close up the opening 9a of the ring 9.
  • the opened cover 11 is shaped as a grid which is a plate-state member having plural rectangular openings.
  • Reference numeral 12 designates the rectangular openings.
  • the function devices 802, 803 and 804 are protected from being damaged by the thermal expansion of the protection resin 10 in case of being sealed up by the opened cover 11, since the openings 12 provide expansion space.
  • the protection resin 10 can be injected into the ring 9 through the openings 12 of the opened cover 11 disposed on the ring 9, the opened cover 11 can be disposed on the ring 9 before filling the protection resin 10 inside the ring 9. Thereby, the efficiency of the work is improved.
  • the hybrid integrated circuit device constructed as mentioned above is protected by the opened cover 11 from an external force imposed on the opened cover 11 when the device is handled or carried, and consequently, the function elements 802, 803 and 804 are not influenced by the force, and the resin surface has no possibility of being scraped by the external force because of being protected by the opened cover 11. Furthermore, because the top of the ring 9 is made in the grid-like construction being in an almost opened state, the influence of the thermal stress of the protection resin 10 to the function elements 802, 803 and 804 is not larger than that of the conventional construction.
  • the shape of the opened cover 11 is not restricted to the grid-like shape.
  • the following opened covers may be applicable: the opened cover 11A having four circular openings 12 as shown in FIG. 6 and FIG. 7, the opened cover 11B having eight elliptical openings 12a as shown in FIG. 8, the opened cover 11C having six rectangular openings 12b as shown in FIG. 9, and the opened cover 11D having four triangular openings 12c as shown in FIG. 10.
  • the opened covers 11, 11A, 11B, 11C and 11D separated from the ring 9 were shown as planar members, the opened covers may be formed as shallow, box-like bodies together with the ring 9. If an opened cover is made as a ring 9A having a ceiling provided with plural rectangular openings, for example, as shown in FIG. 11 and FIG. 12, the number of parts of the device and its attendant cost decrease, in addition to retaining the effects obtained in embodiments 1 and 2. In this case, the protection resin 10 is injected through the openings 12 of the ring 9A.
  • reference numeral 13 designates a regulator case
  • reference numeral 14 designates a board housing part formed on the regulator case
  • reference numeral 15 designates a heat sink composed of a radiating plate 15a and a radiating fin 15b
  • reference numeral 16 designates a sealing resin for sealing a board inside the board housing part 14 with the resin.
  • the hybrid integrated circuit devices of each of the aforementioned embodiments 1-3 can be incorporated in a voltage regulator for a motor car. That is to say, the devices can be housed in a case formed in a body with a brush holder (or a regulator case) which is made from resin, and consequently, the number of parts decreases and the formation of the case can easily done. Furthermore, because the protection resin 10 of the hybrid integrated circuit device and the sealing resin 16 are directly connected through the openings of the opened cover 11 in the incorporated state, the thermal stress of the protection resin 10 escapes to the outside through the sealing resin 16 to prevent any adverse the influence on the function elements.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
US08/314,620 1994-02-16 1994-09-29 Hybrid integrated circuit device with apertured cover Expired - Lifetime US5473191A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6019435A JPH07231176A (ja) 1994-02-16 1994-02-16 混成集積回路装置
JP6-019435 1994-02-16

Publications (1)

Publication Number Publication Date
US5473191A true US5473191A (en) 1995-12-05

Family

ID=11999217

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/314,620 Expired - Lifetime US5473191A (en) 1994-02-16 1994-09-29 Hybrid integrated circuit device with apertured cover

Country Status (3)

Country Link
US (1) US5473191A (ko)
JP (1) JPH07231176A (ko)
KR (1) KR0171460B1 (ko)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719760A (en) * 1995-06-06 1998-02-17 Nippondenso Co., Ltd. Direct-mounted vehicle generator using low heat producing SiC rectifiers
US5744860A (en) * 1996-02-06 1998-04-28 Asea Brown Boveri Ag Power semiconductor module
GB2318929A (en) * 1996-10-29 1998-05-06 Mitsubishi Electric Corp Vehicle generator control device
US6137671A (en) * 1998-01-29 2000-10-24 Energenius, Inc. Embedded energy storage device
US6294831B1 (en) * 1998-11-05 2001-09-25 International Business Machines Corporation Electronic package with bonded structure and method of making
US6403881B1 (en) * 1998-08-26 2002-06-11 Elliott Industries, Ltd. Electronic component package assembly and method of manufacturing the same
US20090001555A1 (en) * 2007-06-26 2009-01-01 Nec Electronics Corporation Semiconductor device having metal cap
US7629674B1 (en) 2004-11-17 2009-12-08 Amkor Technology, Inc. Shielded package having shield fence
US20100127376A1 (en) * 2008-11-25 2010-05-27 Karim Nozad O System and method to provide rf shielding for a mems microphone package
US7745910B1 (en) 2007-07-10 2010-06-29 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
US7851894B1 (en) 2008-12-23 2010-12-14 Amkor Technology, Inc. System and method for shielding of package on package (PoP) assemblies
US7898066B1 (en) 2007-05-25 2011-03-01 Amkor Technology, Inc. Semiconductor device having EMI shielding and method therefor
US20110049685A1 (en) * 2009-08-26 2011-03-03 Sung Sun Park Semiconductor device with electromagnetic interference shielding
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8008753B1 (en) 2008-04-22 2011-08-30 Amkor Technology, Inc. System and method to reduce shorting of radio frequency (RF) shielding
US8012868B1 (en) 2008-12-15 2011-09-06 Amkor Technology Inc Semiconductor device having EMI shielding and method therefor
US8093691B1 (en) 2009-07-14 2012-01-10 Amkor Technology, Inc. System and method for RF shielding of a semiconductor package
US8102032B1 (en) 2008-12-09 2012-01-24 Amkor Technology, Inc. System and method for compartmental shielding of stacked packages
US8129824B1 (en) 2008-12-03 2012-03-06 Amkor Technology, Inc. Shielding for a semiconductor package
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
US8299610B1 (en) 2006-02-28 2012-10-30 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
US20130114235A1 (en) * 2011-11-04 2013-05-09 Invensas Corporation Emi shield
US8508023B1 (en) 2010-06-17 2013-08-13 Amkor Technology, Inc. System and method for lowering contact resistance of the radio frequency (RF) shield to ground
US8946886B1 (en) 2010-05-13 2015-02-03 Amkor Technology, Inc. Shielded electronic component package and method
US10177095B2 (en) 2017-03-24 2019-01-08 Amkor Technology, Inc. Semiconductor device and method of manufacturing thereof
US10497650B2 (en) 2017-04-13 2019-12-03 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7130198B2 (en) * 2001-12-06 2006-10-31 Rohm Co., Ltd. Resin-packaged protection circuit module for rechargeable batteries and method of making the same
JP6228526B2 (ja) * 2014-09-29 2017-11-08 株式会社クボタ 電子制御装置、並びにその取り付け方法とその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523647A (en) * 1975-05-21 1977-01-12 British Industrial Plastics Thermosetting resin compound containing thixotropic agent
JPS63117454A (ja) * 1986-11-06 1988-05-21 Fujitsu Ltd 混成集積回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523647A (en) * 1975-05-21 1977-01-12 British Industrial Plastics Thermosetting resin compound containing thixotropic agent
JPS63117454A (ja) * 1986-11-06 1988-05-21 Fujitsu Ltd 混成集積回路

Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719760A (en) * 1995-06-06 1998-02-17 Nippondenso Co., Ltd. Direct-mounted vehicle generator using low heat producing SiC rectifiers
US5744860A (en) * 1996-02-06 1998-04-28 Asea Brown Boveri Ag Power semiconductor module
GB2318929A (en) * 1996-10-29 1998-05-06 Mitsubishi Electric Corp Vehicle generator control device
GB2318929B (en) * 1996-10-29 1998-10-28 Mitsubishi Electric Corp Control device for a vehicle generator
US5932993A (en) * 1996-10-29 1999-08-03 Mitsubishi Denki Kabushiki Kaisha Control device for a vehicle generator
US6137671A (en) * 1998-01-29 2000-10-24 Energenius, Inc. Embedded energy storage device
US6403881B1 (en) * 1998-08-26 2002-06-11 Elliott Industries, Ltd. Electronic component package assembly and method of manufacturing the same
US6562662B2 (en) * 1998-11-05 2003-05-13 International Business Machines Corporation Electronic package with bonded structure and method of making
US6294831B1 (en) * 1998-11-05 2001-09-25 International Business Machines Corporation Electronic package with bonded structure and method of making
US7629674B1 (en) 2004-11-17 2009-12-08 Amkor Technology, Inc. Shielded package having shield fence
US9123718B1 (en) 2004-11-17 2015-09-01 Amkor Technology, Inc. Shielded package having shield lid
US8552539B1 (en) 2004-11-17 2013-10-08 Amkor Technology, Inc. Shielded package having shield lid
US8362597B1 (en) 2004-11-17 2013-01-29 Amkor Technology, Inc. Shielded package having shield lid
US8299610B1 (en) 2006-02-28 2012-10-30 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
US7898066B1 (en) 2007-05-25 2011-03-01 Amkor Technology, Inc. Semiconductor device having EMI shielding and method therefor
US8076771B2 (en) * 2007-06-26 2011-12-13 Renesas Electronics Corporation Semiconductor device having metal cap divided by slit
US20090001555A1 (en) * 2007-06-26 2009-01-01 Nec Electronics Corporation Semiconductor device having metal cap
US7745910B1 (en) 2007-07-10 2010-06-29 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
US8008753B1 (en) 2008-04-22 2011-08-30 Amkor Technology, Inc. System and method to reduce shorting of radio frequency (RF) shielding
US20100127376A1 (en) * 2008-11-25 2010-05-27 Karim Nozad O System and method to provide rf shielding for a mems microphone package
US7915715B2 (en) 2008-11-25 2011-03-29 Amkor Technology, Inc. System and method to provide RF shielding for a MEMS microphone package
US8129824B1 (en) 2008-12-03 2012-03-06 Amkor Technology, Inc. Shielding for a semiconductor package
US8102032B1 (en) 2008-12-09 2012-01-24 Amkor Technology, Inc. System and method for compartmental shielding of stacked packages
US8012868B1 (en) 2008-12-15 2011-09-06 Amkor Technology Inc Semiconductor device having EMI shielding and method therefor
US7851894B1 (en) 2008-12-23 2010-12-14 Amkor Technology, Inc. System and method for shielding of package on package (PoP) assemblies
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8729682B1 (en) 2009-03-04 2014-05-20 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8093691B1 (en) 2009-07-14 2012-01-10 Amkor Technology, Inc. System and method for RF shielding of a semiconductor package
US20110049685A1 (en) * 2009-08-26 2011-03-03 Sung Sun Park Semiconductor device with electromagnetic interference shielding
US8362598B2 (en) 2009-08-26 2013-01-29 Amkor Technology Inc Semiconductor device with electromagnetic interference shielding
US10424556B2 (en) 2010-02-18 2019-09-24 Amkor Technology, Inc. Shielded electronic component package
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
US12040305B2 (en) 2010-02-18 2024-07-16 Amkor Technology Singapore Holding Pte. Ltd. Shielded electronic component package
US9433117B1 (en) 2010-02-18 2016-08-30 Amkor Technology, Inc. Shield lid interconnect package and method
US11646290B2 (en) 2010-02-18 2023-05-09 Amkor Technology Singapore Holding Pte. Ltd. Shielded electronic component package
US11031366B2 (en) 2010-02-18 2021-06-08 Amkor Technology Singapore Pte. Ltd. Shielded electronic component package
US8946886B1 (en) 2010-05-13 2015-02-03 Amkor Technology, Inc. Shielded electronic component package and method
US8508023B1 (en) 2010-06-17 2013-08-13 Amkor Technology, Inc. System and method for lowering contact resistance of the radio frequency (RF) shield to ground
US9196588B2 (en) * 2011-11-04 2015-11-24 Invensas Corporation EMI shield
US20130114235A1 (en) * 2011-11-04 2013-05-09 Invensas Corporation Emi shield
US10410973B2 (en) 2017-03-24 2019-09-10 Amkor Technology, Inc. Semiconductor device and method of manufacturing thereof
US11063001B2 (en) 2017-03-24 2021-07-13 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device and method of manufacturing thereof
US10177095B2 (en) 2017-03-24 2019-01-08 Amkor Technology, Inc. Semiconductor device and method of manufacturing thereof
US10497650B2 (en) 2017-04-13 2019-12-03 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
KR950026319A (ko) 1995-09-18
KR0171460B1 (ko) 1999-05-01
JPH07231176A (ja) 1995-08-29

Similar Documents

Publication Publication Date Title
US5473191A (en) Hybrid integrated circuit device with apertured cover
KR101070177B1 (ko) 전기 기계용 전자 패키지
MXPA05000189A (es) Modulo de control y de potencia de un alternador-motor de arranque integrable.
US3439255A (en) Encapsulated semiconductor device including a ceramic substrate
JP2006196678A (ja) コンデンサ装置
US5915367A (en) Igniter for internal combustion engine having outer packing case equipped with coil and igniter unit
CA1067574A (en) Battery temperature compensated battery-charging system
US4600969A (en) Protective apparatus for encapsulating electrical circuits
US6348797B1 (en) Combustion state detecting apparatus for internal combustion engine
EP0384482A2 (en) Composite semiconductor device
US6727555B2 (en) Device for protecting electronic components
JPH05219704A (ja) 車両用交流発電機のコンデンサの固定構造
EP1808950B1 (en) Voltage controller of ac generator for vehicle
JPH0124025B2 (ko)
US7538522B2 (en) Specially improved automotive replacement voltage regulator
US3988594A (en) Electric fences
US3323021A (en) Combination terminal block and electrical component assembly
JP4411086B2 (ja) 電気機械のためのレギュレータおよびレクティファイヤならびに電気機械
GB2068177A (en) Electrical connection system for rectifiers
EP0075320A1 (en) Rectifying apparatus for automotive A.C. generator
US7498669B2 (en) Semiconductor device
JP2001128427A (ja) 自動車の発電機用の整流デバイス
ES2373092T3 (es) Módulo eléctrico para alternador de vehículo, en particular automóvil, y conjunto que incluye tal alternador y tal módulo.
US5900721A (en) Control device for a vehicle a.c. generator
JPS62210833A (ja) 本質安全防爆回路ユニツト

Legal Events

Date Code Title Description
AS Assignment

Owner name: MITSUBISHI DENKI KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TANAKA, KATSUNORI;REEL/FRAME:007168/0454

Effective date: 19940927

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12