US495375A

US495375A - Process of chipping or ornamenting glass

Info

Publication number: US495375A
Authority: US
Publication date: 1893-04-11
Anticipated expiration: 1910-04-11

Description

(Specimens.)

E. A. SAVARY. I PROCESS OF GHIPPING OR ORNAMEN TI No. 495,375. V

Patente i a C z ATTORNEYS% TATES PATENT FFICE.

EUGENE A. SAVARY, OF WEST I-IOBOKEN, NEWV JERSEY.

SPECIFICATION forming part of Letters Patent No. 495,375, dated April 11, 1893. Application filed September 29, 1892. Serial No. 447,270. ($pecimens.)

To all whom it may concern:

Be it known that I, EUGENE A. SAVARY, a citizen of the United States, residing at West Hoboken, in the county of Hudson, in the State of New Jersey, have invented new and useful Improvements in Processes of Clipping or Ornamenting Glass, of which the following is a specification.

This invention relates to a process of chipping or ornamenting glass and the object of this invention is to enable the process to be carried on with ease and accuracy as set forth in the following specification and claims and illustrated in the accompanying drawings, in which Figure 1, shows a glass plate prepared for chipping. Fig. 2, shows a modification in preparing the glass for chipping. Fig. 3, shows theglass plate after the chipping is done.

It is a well known fact that by covering a ground glass surface with glue allowing the same to set and then removing it from the glass a crystalline appearance is imparted to the glass or in other words the glass becomes chipped. A disadvantage of the process is that when the glass is to be chipped along certain outlines, figures or characters on the glass the chipping is apt to extend beyond the outlines thus causing a ragged or distasteful appearance.

In carrying out my process I etch or sink the outline of the figure or design into the glass and coat the glass to be chipped with a layer of hot or liquid glue or other contracting adhesive. The outline of the design is then cut through the glue while still soft or jelly like by running a needle or tool along the etched outline and the glue is then rolled 01f or picked from the parts not to be chipped or crystallized. The etched or sunken outline I have found prevents the remaining glue in hardening from chipping or ripping beyond the boundary formed by said outline so that the neatness sought in glass ornamentation is not spoiled. The glue in setting or drying removes itself together with glass particles from the main body of the glass to such an extent that the set glue together with such glass particles will either drop off when the main glass is inclined or turned face down,

'festly the part A might be left unchipped and or such set glue with the glass particles can be readily scraped off from the main glass.

Instead of etching or sinking only the outline the entire figure or design might be sunken or etched leaving the background or remaining portion raised or the background might be sunken or edged and the design left raised but in all cases there is an etched or sunken outline which as above stated pro vents the glue from chipping or tearing beyond said outline.

While cutting the outline through the glue which of course is still adhesive or soft the hand of the operator might be apt to adhere to avoid which I render the glue non-adhesive to the touch by pouncing or covering the glue with a powdered substance such as pumice stone powder, whiting or similar material. This pouncing or dusting enables the hand or an instrument to be placed on the glue without adhering to the latter.

By taking a glass plate A and surrounding the figure or design B with a sunken or etched outline O and then causing the part A to be chipped the outline C will remain clear and perfect as in Fig. 3. Or instead of sinking or etching only the outline a part as for example the design B might be sunken or etched as in Fig. 3 and the part A then chipped. Manithe design B chipped.

In all cases it is noticed the outline 0 either alone or with other parts is sunken or depressed below a contiguous part so that the chipping does not extend beyond the outline. The part not to be chipped may be ground as for example the design B in Fig. 3 or left plain or smooth as in Fig. 2.

What I claim as new, and desire to secure by Letters Patent, is-

1. The process of preparing glass for chipping which consists in covering the glass with a layer of glue and applying a powdered substance to the glue for the purpose of rendering the latter non adhesive to enable the hand or an instrument to rest upon the glue with out adhering substantially as described.

2. The process of chipping or ornamenting glass which consists in etching an outline on the glass, covering the glass with a layer of glue, cutting through the glue along the outmy hand in the presence of two subscribing line stripping or removing the glue before the witnesses. Y same has set from the parts not to be chipped and then allowing the remainder of the glue EUGENE SAVARY' 5 to set or dry so as to chip the corresponding Witnesses:

portion of the glass, substantially as set forth. WM. 0. HAUFF,

In testimony whereof I have hereunto set E. F. KASTENHUBERo