US3915739A - Method of cleaning foreign matter from a cavity in a semiconductor - Google Patents

Method of cleaning foreign matter from a cavity in a semiconductor Download PDF

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Publication number
US3915739A
US3915739A US488063A US48806374A US3915739A US 3915739 A US3915739 A US 3915739A US 488063 A US488063 A US 488063A US 48806374 A US48806374 A US 48806374A US 3915739 A US3915739 A US 3915739A
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United States
Prior art keywords
cavity
outlets
pressurized gas
suction
inlet
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Expired - Lifetime
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US488063A
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Terrence Maahs
Dieter Marx
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Montreal
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Montreal
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Definitions

  • a cleaning tool for removing loose foreign matter from cavities in devices, especially in electronic devices including a head which has a central vacuum or suction inlet and a series of pressurized gas outlets or jets positioned around the vacuum inlet.
  • the gas outlets are inclined and eject the gas generally tangentially of the vacuum inlet to create a swirl.
  • the gas supply is shut-off slightly before the vacuum or suction.
  • the head rests on the device and seals the cavity, and the gas outlets are preferably p0- sitioned adjacent the periphery of the cavity.
  • This invention relates to a cavity cleaning tool and is particularly concerned with a tool for cleaning cavities of electronic devices, and to the method of operation of the tool.
  • the present invention provides for a tool, and a method of operating the tool, whereby any loose foreign matter is removed from a cavity.
  • the tool comprises a cleaning head having a central vacuum inlet and a series of peripherally positioned pressurized gas outlets, the outlets angled to produce swirl, together with control valves and actuating means for applying and shutting off vacuum and pressurized gas flow to the head, in a predetermined sequence.
  • the cavity in a device is sealed by the cleaning head of the tool.
  • FIG. 1 is a schematic illustration of the apparatus
  • FIG. 2 is a bottom plan view of the base of the tool head, on the line IIII of FIG. 1;
  • FIG. 3 is a cross-section on the line IIIIII of FIG. 2;
  • FIG. 4 is a bottom plan view of a part of the tool head, on the line IVIV of FIG. 3.
  • a cleaning tool is indicated at 10, having a cleaning head 11.
  • the head 11 rests on a device 12 in which there is a cavity 13 to be cleaned.
  • the devices 12 slide on and are supported by a support 14.
  • the head 11, in the present example comprises two plates 15 and 16, plate 16 having a central aperture for suction and peripherally positioned pressurized gas jets.
  • Plate 15 has a cavity to which pressurized gas is fed via pipe 17, the cavity feeding the pressurized gas to the gas jets in plate 16.
  • valve 18 controls the vacuum connection to the central suction aperture of plate 16 via a bore in the body of the tool 10 and valve 19 controls the supply of pressurized gas to plate 15, via the pipe 17.
  • a debris collecting chamber 20 is inserted in the vacuum line 21, and also a main shut-off valve 22.
  • the cleaning head is illustrated in more detail in FIGS. 2, 3 and 4.
  • the tool 10 has a tool head 11 comprising two plates 15 and 16.
  • the lower plate 16 seen in bottom plan view in FIG. 2 has a central aperture and four gas outlets orjets 31 positioned around the central aperture 30.
  • the lower plate 16 fits tightly against the upper plate 15.
  • Plate 15 has a large cavity or recess 32 to which pressurized gas is fed via pipe 17.
  • the outlets or jets 31 in plate 16 communicate at their upper ends with the cavity 32.
  • the jets 31 are inclined so as to eject the pressurized gas with a swirl, the
  • the apparatus is operated as follows.
  • the tool is lowered over a device, indicated in chain dotted outline at 12 in FIG. 3.
  • the lower face of plate 16 seats down on the upper surface of the device 12.
  • Vacuum is applied to the cavity of the device, the cavity indicated in chain dotted outline at 13 in FIG. 3.
  • the vacuum is started by opening shut-off valve 18.
  • a pressurized gas for example nitrogen, is then applied to the jets or outlets 31 via gas line 23, valve 19, pipe 17 and cavity or recess 32.
  • the gas is ejected at an angle to create swirl which detaches any unattached foreign matter, which matter is then removed by the suction created by the vacuum applied via central recess 30.
  • the gas flow is maintained for a predetermined period, and as an example a flow for a period as short as approximately two seconds has given satisfactory results.
  • the gas flow is then shut-off, by valve 19, followed by shutting off of the vacuum or suction by valve 18.
  • the tool is then removed from the device.
  • This sequence has been found to give good results as any particles which were still moving in the cavity were removed by the suction.
  • This sequence can be obtained by a pivotally mounted control lever 35 which is arranged to actuate valve 19 prior to actuation of valve 18.
  • a typical pressure range for the gas is 25-35 lb. /sq.in, and for the vacuum 26-30 inches mercury.
  • the jets or outlets in a particular example, were 0.025 inch diameter and inclined at an angle of 15 from the vertical.
  • the outlets 31 are arranged to be within, but, close to, a peripheral outline or contour which corresponds to the size and shape of the cavity 13 in the device 12.
  • heads 11 having different sizes and also different arrangements of outlets or jets 31, to suit differing sizes and shapes of cavities in devices.
  • the gas flow from the central bore 34 passes via the valve 18 and the vacuum lines 21 to the debris collector 20.
  • the gas supply to the jets 31 is controlled by two shut-off valves 19 and 25 and also the pressure is set at the gas supply for example at the cylinder outlet for nitrogen.
  • the plates 15 and 16 of the tool head can be held together by screws or permanently connected together as by adhesive or other means. The plates are held on the lower end of the tool by frictional engagement with the cylindrical portion 33.
  • a method of cleaning loose foreign matter from a cavity in a semiconductor device comprising:
  • said cleaning head positioning a cleaning head over a semiconductor device, a surface on said cleaning head seating on a surface of the semiconductor device around the cavity in the device.
  • said cleaning head having a central inlet and a plurality of outlets positioned around said central inlet, said outlets and said central inlet positioned over said cavity;

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  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A cleaning tool for removing loose foreign matter from cavities in devices, especially in electronic devices, the tool including a head which has a central vacuum or suction inlet and a series of pressurized gas outlets or jets positioned around the vacuum inlet. The gas outlets are inclined and eject the gas generally tangentially of the vacuum inlet to create a swirl. Preferably the gas supply is shut-off slightly before the vacuum or suction. The head rests on the device and seals the cavity, and the gas outlets are preferably positioned adjacent the periphery of the cavity.

Description

United States Patent Maahs et a1.
[75] Inventors: Terrence Maahs, Kanata; Dieter Marx, Stittsville, both of Canada [73] Assignee: Montreal, Montreal, Quebec,
Canada [22] Filed: July 12, 1974 [21] Appl. No.: 488,063
[52] US. Cl 134/21; 134/22 R; 134/37 [51] Int. Cl. B08B 5/02; B08B 5/04; B0813 7/04; B0813 9/00 [58] Field of Search 134/21, 37, 22 R; 15/345, 15/346 [56] References Cited UNITED STATES PATENTS 2,226,630 12/1940 McCord 15/346 X 2,232,218 2/1941 2,238,541 4/1941 2,864,119 12/1958 2,916,761 12/1959 3,161,900 12/1964 Hornschuch et a1 15/345 N SUPPLY Z4 "23 GAGE 5 2 "1 N MAIN SHUT-O VALVE 2? 5HUTOFF VA L\) E METI -IOD OF CLEANING FOREIGN MATTER FROM A CAVITY IN A SEMICONDUCTOR 3,215,560 11/1965 Kredit 15/345 X 3,328,827 7/1967 Lake et a1 15/345 X 3,436,785 4/1969 Kantor 15/345 X 3,489,607 l/l970 Babcock 134/21 FOREIGN PATENTS OR APPLICATIONS 1,925,860 12/1969 Germany 15/345 1,925,859 12/1969 Germany 15/345 Primary E.\'aminerBarry S. Richman Assistant Examiner-Bradley R. Garris Attorney, Agent, or FirmSidney T. Jelly 5 7 ABSTRACT A cleaning tool for removing loose foreign matter from cavities in devices, especially in electronic devices, the tool including a head which has a central vacuum or suction inlet and a series of pressurized gas outlets or jets positioned around the vacuum inlet. The gas outlets are inclined and eject the gas generally tangentially of the vacuum inlet to create a swirl. Preferably the gas supply is shut-off slightly before the vacuum or suction. The head rests on the device and seals the cavity, and the gas outlets are preferably p0- sitioned adjacent the periphery of the cavity.
3 Claims, 4 Drawing Figures METHOD OF CLEANING FOREIGN MATTER FROM A CAVITY IN A SEMICONDUCTOR This invention relates to a cavity cleaning tool and is particularly concerned with a tool for cleaning cavities of electronic devices, and to the method of operation of the tool.
In electronic devices, particularly semiconductors and similar devices, which are to be packaged after manufacture, the presence of loose foreign matter in any cavity may cause electrical shorting between two unpassivated areas, or between leads or similar situations.
The present invention provides for a tool, and a method of operating the tool, whereby any loose foreign matter is removed from a cavity. Broadly the tool comprises a cleaning head having a central vacuum inlet and a series of peripherally positioned pressurized gas outlets, the outlets angled to produce swirl, together with control valves and actuating means for applying and shutting off vacuum and pressurized gas flow to the head, in a predetermined sequence. Conveniently the cavity in a device is sealed by the cleaning head of the tool.
The invention will be readily understood by the following description of one embodiment, by way of example, in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic illustration of the apparatus;
FIG. 2 is a bottom plan view of the base of the tool head, on the line IIII of FIG. 1;
FIG. 3 is a cross-section on the line IIIIII of FIG. 2;
FIG. 4 is a bottom plan view of a part of the tool head, on the line IVIV of FIG. 3.
Referring to FIG. 1 a cleaning tool is indicated at 10, having a cleaning head 11. The head 11 rests on a device 12 in which there is a cavity 13 to be cleaned. The devices 12 slide on and are supported by a support 14. As will be described in more detail later with reference to FIGS. 2 to 4, the head 11, in the present example, comprises two plates 15 and 16, plate 16 having a central aperture for suction and peripherally positioned pressurized gas jets. Plate 15 has a cavity to which pressurized gas is fed via pipe 17, the cavity feeding the pressurized gas to the gas jets in plate 16.
Mounted on the tool 10 are two shut-off valves 18 and 19. Valve 18 controls the vacuum connection to the central suction aperture of plate 16 via a bore in the body of the tool 10 and valve 19 controls the supply of pressurized gas to plate 15, via the pipe 17. A debris collecting chamber 20 is inserted in the vacuum line 21, and also a main shut-off valve 22. In the pressurized gas line 23, is a pressure gauge 24 and a main shut-off valve 25.
The cleaning head is illustrated in more detail in FIGS. 2, 3 and 4. As described above, the tool 10 has a tool head 11 comprising two plates 15 and 16. The lower plate 16, seen in bottom plan view in FIG. 2 has a central aperture and four gas outlets orjets 31 positioned around the central aperture 30. The lower plate 16 fits tightly against the upper plate 15. Plate 15 has a large cavity or recess 32 to which pressurized gas is fed via pipe 17.
The outlets or jets 31 in plate 16 communicate at their upper ends with the cavity 32. The jets 31 are inclined so as to eject the pressurized gas with a swirl, the
0 shut-off valve 18.
The apparatus is operated as follows. The tool is lowered over a device, indicated in chain dotted outline at 12 in FIG. 3. The lower face of plate 16 seats down on the upper surface of the device 12. Vacuum is applied to the cavity of the device, the cavity indicated in chain dotted outline at 13 in FIG. 3. The vacuum is started by opening shut-off valve 18. A pressurized gas, for example nitrogen, is then applied to the jets or outlets 31 via gas line 23, valve 19, pipe 17 and cavity or recess 32. The gas is ejected at an angle to create swirl which detaches any unattached foreign matter, which matter is then removed by the suction created by the vacuum applied via central recess 30. The gas flow is maintained for a predetermined period, and as an example a flow for a period as short as approximately two seconds has given satisfactory results.
The gas flow is then shut-off, by valve 19, followed by shutting off of the vacuum or suction by valve 18. The tool is then removed from the device. This sequence has been found to give good results as any particles which were still moving in the cavity were removed by the suction. This sequence can be obtained by a pivotally mounted control lever 35 which is arranged to actuate valve 19 prior to actuation of valve 18. A typical pressure range for the gas is 25-35 lb. /sq.in, and for the vacuum 26-30 inches mercury. The jets or outlets, in a particular example, were 0.025 inch diameter and inclined at an angle of 15 from the vertical. The outlets 31 are arranged to be within, but, close to, a peripheral outline or contour which corresponds to the size and shape of the cavity 13 in the device 12. Thus it is possible to provide heads 11 having different sizes and also different arrangements of outlets or jets 31, to suit differing sizes and shapes of cavities in devices.
The gas flow from the central bore 34 passes via the valve 18 and the vacuum lines 21 to the debris collector 20. The gas supply to the jets 31 is controlled by two shut-off valves 19 and 25 and also the pressure is set at the gas supply for example at the cylinder outlet for nitrogen. The plates 15 and 16 of the tool head can be held together by screws or permanently connected together as by adhesive or other means. The plates are held on the lower end of the tool by frictional engagement with the cylindrical portion 33.
What is claimed is:
1. A method of cleaning loose foreign matter from a cavity in a semiconductor device, comprising:
positioning a cleaning head over a semiconductor device, a surface on said cleaning head seating on a surface of the semiconductor device around the cavity in the device. said cleaning head having a central inlet and a plurality of outlets positioned around said central inlet, said outlets and said central inlet positioned over said cavity;
ejecting pressurized gas from said outlets in a direction tangential to said central inlet;
applying a suction to said central inlet, and controlling the flow of pressurized gas to said outlets and 4 3. A method as claimed in claim 1, including supplying the pressurized gas at a pressure of from 25 to 35 lb./sq.in. for a time of less than 5 seconds, and wherein the applied suction creates a vacuum of from 26-30 inches mercury.

Claims (3)

1. A METHOD OF CLEANING LOOSE FOREIGN MATTER FROM A CAVITY IN A SEMICONDUCTOR DEVICE COMPRISING: POSITIONING A CLEAING HEAD OVER A SEMICONDUCTOR DEVICE A SURFACE ON SAID CLEANING HEAD SEATING ON A SURFACE OF THE SEMICONDUCTOR DEVICE AROUND THE CAVITY IN THE DEVICE SAID CLEANING HEAD HAVING A CENTRAL INLET AND A PLURALITY OF OUTLETS POSITIONED AROUND SAID CENTRAL INLET SAID OUTLETS AND SAID ENTRAL INLET POSITIONED OVER SAID CAVITY, EJECTING PRESSURIZED GAS FROM SAID OUTLETS IN A DIRECTION TANGENTIAL TO CENTRAL INLET, APPLYING A SUCTION TO SAID CENTRAL INLET AND CONTROLLING THE FLOW OF PRESSURIZED GAS TO SAID OUTLETS AND THE APPLICATION OF SAID SUCTION TO SAID INLET IN A PREDETERMINED SEQUENCE AND TIME PROGRAM TO SHUT OFF THE FLOW OF PRESSURIZED GAS BEFORE SHUTTING OFF SAID SUCTION.
2. A method as claimed in claim 1, including ejecting the pressurized gas at positions adjacent the periphery of the cavity.
3. A method as claimed in claim 1, including supplying the pressurized gas at a pressure of from 25 to 35 lb./sq.in. for a time of less than 5 seconds, and wherein the applied suction creates a vacuum of from 26-30 inches mercury.
US488063A 1974-07-12 1974-07-12 Method of cleaning foreign matter from a cavity in a semiconductor Expired - Lifetime US3915739A (en)

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2589758A1 (en) * 1985-11-12 1987-05-15 Socapex TOOL FOR CLEANING AN OPTICAL SURFACE
EP0324435A3 (en) * 1988-01-11 1990-10-31 The Perkin-Elmer Corporation Non-contacting method of cleaning surfaces with a planar gas bearing
EP0540830A1 (en) * 1991-08-15 1993-05-12 Kraft Foods Limited Method and apparatus for extracting particles from containers
US5224235A (en) * 1991-06-28 1993-07-06 Digital Equipment Corporation Electronic component cleaning apparatus
EP0640411A1 (en) * 1993-08-31 1995-03-01 Shinko Co., Ltd. Dust removing system
US5531861A (en) * 1993-09-29 1996-07-02 Motorola, Inc. Chemical-mechanical-polishing pad cleaning process for use during the fabrication of semiconductor devices
EP0743097A1 (en) * 1995-05-15 1996-11-20 Reynolds Wheels International Ltd. A method and equipment for the removal of paint from wheel hubs
US5603892A (en) * 1994-06-09 1997-02-18 Fujitsu Limited System for maintaining a controlled atmosphere in an electronic circuit package
US5690544A (en) * 1995-03-31 1997-11-25 Nec Corporation Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad
GB2337325A (en) * 1998-05-13 1999-11-17 Ricoh Kk Device for removing dust by blowing and sucking
US6098640A (en) * 1997-04-08 2000-08-08 Advanced Micro Devices, Inc. Pressurized cleaning of developer dispenser nozzles
US6395097B1 (en) * 1999-12-16 2002-05-28 Lsi Logic Corporation Method and apparatus for cleaning and removing flux from an electronic component package
US20030101561A1 (en) * 2000-03-22 2003-06-05 Nikolaos Kefalas Method for removing a seal
WO2003095115A1 (en) * 2002-05-07 2003-11-20 Sustainable Technologies International Pty Ltd Method and device for local treatment of substrates
US20090173227A1 (en) * 2006-08-23 2009-07-09 Egon Kaske Cleaning Device and Method for Cleaning a Workpiece
WO2015146887A1 (en) * 2014-03-27 2015-10-01 福井県 Suction method, suction device, laser processing method, and laser processing device
US20180095021A1 (en) * 2016-10-03 2018-04-05 Tokyo Electron Limited Particle collecting apparatus, particle collecting method, and particle collecting system
EP4685996A4 (en) * 2023-09-27 2026-08-12 Lg Energy Solution Ltd DEVICE FOR ELECTROLYTE REMOVAL

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US2226630A (en) * 1936-12-19 1940-12-31 Alvin C Mccord Cleaning device
US2232218A (en) * 1939-09-11 1941-02-18 Arthur A Doty Implement for treating the scalp and hair
US2238541A (en) * 1940-03-20 1941-04-15 Spagnolo Vincent Cleaning and massaging device
US2864119A (en) * 1953-09-14 1958-12-16 Wilford P Crise Vacuum cleaner for drawing air through and intermittently over surface being cleaned
US2916761A (en) * 1954-11-08 1959-12-15 Asbrink & Co Ab Suction cleaning nozzles for street cleaning apparatus
US3161900A (en) * 1962-02-14 1964-12-22 Ingersoll Rand Co Vacuum cleaning head
US3215560A (en) * 1963-09-27 1965-11-02 Kredit William Method of cleaning hot air furnaces and duct systems associated therewith
US3328827A (en) * 1965-12-01 1967-07-04 Carl G Lake Hand held air operated vacuum cleaner
US3436785A (en) * 1964-11-30 1969-04-08 Radiation Inc Apparatus for cleaning electrical contacts
US3489607A (en) * 1967-10-02 1970-01-13 Earl Babcock Method and apparatus for handling allergen laden dust

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2226630A (en) * 1936-12-19 1940-12-31 Alvin C Mccord Cleaning device
US2232218A (en) * 1939-09-11 1941-02-18 Arthur A Doty Implement for treating the scalp and hair
US2238541A (en) * 1940-03-20 1941-04-15 Spagnolo Vincent Cleaning and massaging device
US2864119A (en) * 1953-09-14 1958-12-16 Wilford P Crise Vacuum cleaner for drawing air through and intermittently over surface being cleaned
US2916761A (en) * 1954-11-08 1959-12-15 Asbrink & Co Ab Suction cleaning nozzles for street cleaning apparatus
US3161900A (en) * 1962-02-14 1964-12-22 Ingersoll Rand Co Vacuum cleaning head
US3215560A (en) * 1963-09-27 1965-11-02 Kredit William Method of cleaning hot air furnaces and duct systems associated therewith
US3436785A (en) * 1964-11-30 1969-04-08 Radiation Inc Apparatus for cleaning electrical contacts
US3328827A (en) * 1965-12-01 1967-07-04 Carl G Lake Hand held air operated vacuum cleaner
US3489607A (en) * 1967-10-02 1970-01-13 Earl Babcock Method and apparatus for handling allergen laden dust

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2589758A1 (en) * 1985-11-12 1987-05-15 Socapex TOOL FOR CLEANING AN OPTICAL SURFACE
EP0223084A1 (en) * 1985-11-12 1987-05-27 Socapex S.A. Tool for cleaning an optical surface
EP0324435A3 (en) * 1988-01-11 1990-10-31 The Perkin-Elmer Corporation Non-contacting method of cleaning surfaces with a planar gas bearing
US5224235A (en) * 1991-06-28 1993-07-06 Digital Equipment Corporation Electronic component cleaning apparatus
EP0540830A1 (en) * 1991-08-15 1993-05-12 Kraft Foods Limited Method and apparatus for extracting particles from containers
AU649862B2 (en) * 1991-08-15 1994-06-02 Kraft Foods Limited Method and apparatus for extracting particles from containers
EP0640411A1 (en) * 1993-08-31 1995-03-01 Shinko Co., Ltd. Dust removing system
US5531861A (en) * 1993-09-29 1996-07-02 Motorola, Inc. Chemical-mechanical-polishing pad cleaning process for use during the fabrication of semiconductor devices
US5603892A (en) * 1994-06-09 1997-02-18 Fujitsu Limited System for maintaining a controlled atmosphere in an electronic circuit package
US5690544A (en) * 1995-03-31 1997-11-25 Nec Corporation Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad
EP0743097A1 (en) * 1995-05-15 1996-11-20 Reynolds Wheels International Ltd. A method and equipment for the removal of paint from wheel hubs
US5735965A (en) * 1995-05-15 1998-04-07 Reynolds Wheels International Ltd. Method for the removal of paint from wheel hubs
US5911259A (en) * 1995-05-15 1999-06-15 Reynolds Wheels International Ltd. Equipment for the removal of paint from wheel hubs
US6427929B1 (en) 1997-04-08 2002-08-06 Advanced Micro Devices, Inc. Pressurized cleaning of developer dispenser nozzles
US6098640A (en) * 1997-04-08 2000-08-08 Advanced Micro Devices, Inc. Pressurized cleaning of developer dispenser nozzles
FR2778587A1 (en) * 1998-05-13 1999-11-19 Ricoh Kk DUST EXTRACTION APPARATUS
GB2337325A (en) * 1998-05-13 1999-11-17 Ricoh Kk Device for removing dust by blowing and sucking
GB2337325B (en) * 1998-05-13 2000-03-29 Ricoh Kk Device for removing dust deposited on an assembly
US6395097B1 (en) * 1999-12-16 2002-05-28 Lsi Logic Corporation Method and apparatus for cleaning and removing flux from an electronic component package
US20030101561A1 (en) * 2000-03-22 2003-06-05 Nikolaos Kefalas Method for removing a seal
US6779239B2 (en) * 2000-03-22 2004-08-24 Siemens Aktiengesellschaft Method for removing a seal
EP2218522A1 (en) * 2002-05-07 2010-08-18 Dyesol Ltd Method and device for local treatment of substrates
WO2003095115A1 (en) * 2002-05-07 2003-11-20 Sustainable Technologies International Pty Ltd Method and device for local treatment of substrates
US20090173227A1 (en) * 2006-08-23 2009-07-09 Egon Kaske Cleaning Device and Method for Cleaning a Workpiece
US8062409B2 (en) 2006-08-23 2011-11-22 Dürr Ecoclean GmhB Cleaning device and method for cleaning a workpiece
WO2015146887A1 (en) * 2014-03-27 2015-10-01 福井県 Suction method, suction device, laser processing method, and laser processing device
US20170136576A1 (en) * 2014-03-27 2017-05-18 Fukui Prefectural Government Suction method, suction device, laser processing method, and laser processing device
US10456863B2 (en) * 2014-03-27 2019-10-29 Fukui Prefectural Government Suction method, suction device, laser processing method, and laser processing device
US20180095021A1 (en) * 2016-10-03 2018-04-05 Tokyo Electron Limited Particle collecting apparatus, particle collecting method, and particle collecting system
US10768089B2 (en) * 2016-10-03 2020-09-08 Tokyo Electron Limited Particle collecting apparatus and particle collecting system
EP4685996A4 (en) * 2023-09-27 2026-08-12 Lg Energy Solution Ltd DEVICE FOR ELECTROLYTE REMOVAL

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