US3914466A - Method for coating an article - Google Patents

Method for coating an article Download PDF

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Publication number
US3914466A
US3914466A US435577A US43557774A US3914466A US 3914466 A US3914466 A US 3914466A US 435577 A US435577 A US 435577A US 43557774 A US43557774 A US 43557774A US 3914466 A US3914466 A US 3914466A
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United States
Prior art keywords
article
suspension
ethane
chlorofluoro
particles
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Expired - Lifetime
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US435577A
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English (en)
Inventor
Akihiro Ohkuma
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00—Coating with enamels or vitreous layers
    • C23D5/02—Coating with enamels or vitreous layers by wet methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H01J17/49—Display panels, e.g. with crossed electrodes, e.g. making use of direct current
    • H01J17/492—Display panels, e.g. with crossed electrodes, e.g. making use of direct current with crossed electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/10—Organic solvent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1355—Powder coating of insulating material

Definitions

  • the suspension is kept at a temperature higher than 299 331 375 430 the freezing point of chlorofluoro ethane, and the article is immersed in said suspension so as to form a fro- [56] R f r Ci zen layer of the suspension on the surface of the arti- UNITED STATES PATENTS cle by freezing of the chlorofluoro ethane.
  • the article is taken out of the suspension and the chlorofluoro ethane contained in the frozen layer is removed by 2:427:417 9/1947 Prickettfi' /8 UX heating the art1cle at a temperature higher than the 2,976,188 3/1961 Kohl 7/8 X boiling point of the chlorofluoro ethane to leave 21 3,167,451 1/1965 Tierman 117/47 R layer of PertieleS Oh the article
  • the article is then 3,200,471 8/1965 Johnson et al 29/613 x ther heated so that the Particles remaining on the 3,584,379 6/1971 Loose 29/610 face of the article form a layer of the coating material 3,722,077 3/1973 Armstrong 117/49 X on the article, 3,728,144 4/1973 Van Poucke 117/1 19.2 X 3,736,179 5/1973 Gier et a1 117/113 X 8 Claims, 7 Drawing Figures IIIIIIIIII/IIIj/IIIIIII' l
  • FIGZ 0 0 ,0 e no u a v a vi a FIG] FIGZ
  • This invention relates to a method for coating an article, and more especially to a method of cool dip coating of an article suitable for mass-production.
  • Another object of this invention is to provide a method for coating with a coating of resin or glass having no pin-holes and bubbles therein.
  • a further object of this invention is to provide a method for coating articles which is particularly effective for mass-production.
  • a further object of this invention is to provide a method for coating electronic components having lead wires attached thereto in which the lead wires are not contaminated by the coating material.
  • a method for coating an article with coating particles comprising; cooling said article to a temperature lower than the freezing point of chlorofluoro ethane which is a non-solvent for said coating particles, said chlorofluoro ethane being the suspending medium for a suspension with said coating particles of said resin dispersed therein; immersing said article in said suspension so as to form a layer of said suspension on the surface of said article by freezing of said chlorofluoro ethane, said suspension being kept at a temperature higher than the freezing point of chlorofluoro ethane; taking said article out of said suspension; removing chlorofluoroethane contained in said frozen layer by heating said article at a temperature higher than the boiling point of chlorofluoro ethane; and forming a layer of said resin of the remained particles on the surface of said article by heating.
  • FIGS. 1 and 2 are schematic views of an apparatus for carrying out the coating method according to the present invention
  • particles of coating material such as resin or glass to be coated are dispersed in a suspending medium which is a non-solvent for these particles, and a suspension of the coating particles is formed.
  • a suspending medium which is a non-solvent for these particles
  • a suspension of the coating particles is formed.
  • the suspension is kept at a temperature higher than the freezing point of the non-solvent suspending medium, it is in a fluid state.
  • the viscosity of the suspension is set so as to be suitable for immersing the article to be coated in the suspension by controlling the concentration of the particles of resin dispersed therein.
  • a preferable concentration of the particles is nearly 10 to 50 weight with respect to the non-solvent suspending medium.
  • a concentration of more than 50 weight the fluidity of the suspension is decreased undesirably for immersing thearticle in the suspension.
  • a preferable concentration is higher than that for the resin coating because the specific gravity of the glass particles is higher than that of the resin particles.
  • the article to be coated is cooled to a temperature lower than the freezing point of the non-solvent suspending medium and immersed in the suspension. Then, due to freezing of the non-solvent, a frozen layer of the suspension is formed on the surface of the article.
  • This frozen layer is a mixture of the non-solvent suspending medium and the coating particles. If the article is left in the suspension having the temperature higher than a freezing point of the non-solvent suspending medium, the formed layer will be melted in the suspension. Therefore, the article on the surface of which the frozen layer is formed is taken out of the suspension, and at once the article is heated so as to evaporate the non-solvent suspending medium and to form a resultant layer consisting of only the coating particles. Then, by further heating the coating particles are cured and there is formed a uniform layer on the article.
  • the coating method described above is useful for mass-production because of its simplicity, and the fonned layer is characterized by having a rather large thickness and no pin-holes. Further, because of the cooling method, it is convenient to coat the article such as a film capacitor for which heating is undesirable so that coating thereof is difficult by the conventional method. Further, according to this method, an article of any shape such as a tubular article can be easily coated. Some articles having a complex shape are difficult to be coat the conventional methods such as spraying.
  • An operable material which can be used as the nonsolvent suspending medium for the resin particles includes a chlorofluoro ethane system having a preferable freezing point near room temperature.
  • a chlorofluoro ethane system having a preferable freezing point near room temperature.
  • the freezing point is too low, there are the problems in that it is difficult and expensive to cool the article to be coated to a temperature lower than that freezing point. Further, as the article is apt to be wet due to the water content of the air, pin-holes are caused in the formed layer.
  • the freezing point of the non-solvent suspending medium is too high, there is caused loss of the non-solvent due to heating of the suspension.
  • the resin particles are melted before the non-solvent is evaporated fully and so the formed layer becomes uneven because it contains the nonsolvent component therein.
  • increasing the temperature of the suspension is undesirable because it decreases the pot life of the coating particles.
  • chlorofluoro ethanes there are various kinds of chlorofluoro ethanes, from the point of practical working operation for cooling the article and evaporating the non-solvent, the preferrable ones are CCl FCCl F (designated by the international code 112), CCI CCIF (1 12a) and CCl FCClF (1 13a) which have freezing points of 23.5C, 406C and 14C, respectively and have the boiling points of 92.8C, 91.5 C and 45.7C, respectively.
  • the temperature of the suspension is kept slightly higher than freezing point of the non-solvent suspending medium. When it is too high, the cooled article immersed therein is heated too quickly and the frozen layer of the suspension is not formed.
  • the suspension has a low concentration of the coating particles, when the non-solvent is evaporated from the frozen layer of the suspension formed on the article during heating, there is sometimes caused slipping down of the layer of the remaining particles. In this case, it is effective to include a binder in the suspension. Then, the layer does not slip down but is transferred to the next curing process.
  • the binder should be soluble in the nonsolvent suspending medium for the resin particle, particles with which the article is being coated.
  • materials operable as a binder include polystyrene and denatured silicon resin. The latter dissolves epoxy resin, which is preferably used as the coating material for the method of the invention,
  • the preferable concentration of the binder ranges 0.1 to 5.0 weight Too much binder has an undesirable influence on the properties of the resin particles and causes uneveness of the resultant layer.
  • Disk type resistors were coated with epoxy resin as described hereinafter referring to FIGS. 1 and 2.
  • the disk type resistors designated by the reference numeral 1 were cooled to a temperature of nearly 5C in a cooling room 2. Dried air was continuously fed into the cooling room 2 and an immersing room 3 from an inlet 4. The cooled resistors were transferred to the immersing room 3 past a heat shielding wall 5, and immersed in a suspension 6 contained in an immersing tank 9.
  • the suspension 6 was formed by particles of epoxy resin having the hereinafter described composition as the coating material and a mixture of 90 weight parts of 1,2-difluoro, l,1,2,2- tetrachloro ethane (CCl FCCl F) and 10 weight parts of 2,2-difluoro 1,l,1,2-tetrachloro ethane (CCl CClF which was a non-solvent for the particles.
  • CCl FCCl F 1,2-difluoro, l,1,2,2- tetrachloro ethane
  • CCl CClF 2,2-difluoro 1,l,1,2-tetrachloro ethane
  • Such a mixture is avalable on the market under the trade name Daiflon S (made by Daikin-kogyo Co., Japan), which has a freezing point of 26C and a boiling point of 91 to 93C.
  • the composition of the epoxy resin is as follows:
  • the resistors were immersed in the suspension for 5 seconds, the resistors were taken out therefrom. There was a frozen layer 13 of the suspension, i.e., the mixture of the particles of epoxy resin and the nonsolvent suspending medium Daiflon 5;, on the surface of each resistor.
  • the resistors 1 taken out of the suspension were instantly transferred to the next step of the process. That is, the non-solvent was evaporated by heating the resistors in a drying room 14 shown in FIG. 2. Then, there was formed a layer 15 consisting of only the particles of epoxy resin.
  • the layer 15 may slip down if some vibration is applied to the resistor. Also, with a low concentration of the particles of epoxy resin in the suspension, there may be caused a similar problem.
  • the slipping down of the layer 15 can be prevented by adding polystyrene in a concentration of 100 ppm to the suspension as a binder. Denatured silicon resin was also effective for preventing the slipping down of the layer 15.
  • the dried layer 15 was further heated at C, the curing temperature for the epoxy resin, for 20 minutes, and then there was formed a cured layer 16.
  • the thickness of the resultant layer was 1.0 to 1.2 mm.
  • the transferring of the resistors into and out of the rooms 2, 3 and 14 were carried out continuously by providing shutter mechanism.
  • the vapor of the nonsolvent in the drying room 14 was absorbed by a vacuum pump 17 and condensed by a cooler 18.
  • the condensed vapor can be collected in a container 19. This is desirable for reducing the coating cost.
  • the thickness of the formed layer increases in accordance with an increase of temperature difference between the article to be coated and the suspension.
  • FIG. 3 shows such a relation between the temperature of the article and the thickness of the resultant layer for the conditions indicated in the figure.
  • EXAMPLE 2 A suspension similar to that of Example 1 was used. The concentration of the particles of epoxy resin was 35 to 45 weight and the temperature of the suspension was kept at 27 to 32C. Three resistors, of the axial of electronic component having two lead wires extending longitudinally from both ends, one 8 mm in diameter and 40 mm in length, 8 mm in diameter and 20 mm in length, and one 1.5 mm in diameter and 8 mm in length, were cooled to a temperature of 9 to 15C, and immersed in the suspension 41 for 5 to 10 seconds to a depth such that 1.5 mm of one lead wire 44 above the upper end of the resistor body 42 was covered, as shown in FIG. 4(a). Then, the frozen layer 43 of the suspension was formed, as shown in FIG. 4(a) and FIG. 4(b), on the surface of the resistor body 42, the other lead wire 44 and the part of the lead wire 44, which were immersed in the suspension 41.
  • a cutter 45 was pressed into the frozen layer formed on the lead wire 44 from a horizontal direction A, as shown in FIG. 4(0), so as to cut that layer, and then the cutter 45 was moved as while being held in the cutting position downwardly in the direction B sliding along the lead wire 44'. By this operation, the frozen layer 46 formed on the lead wire 44 was easily separated therefrom.
  • the resistors were put in the drier at 120C, wherein at first the non-solvent was evaporated and the surface of the particles of epoxy resin were partially melted, by which means slipping down of the layer due to heating could be prevented.
  • the particles of epoxy resin melted and there was formed a uniform layer 47 as shown in FIG. 4(d).
  • the thickness of the resultant layer was 0.6 to 1.0 mm.
  • EXAMPLE 3 A suspension was made with the same non-solvent suspending medium as that of the example 1 and 30 weight of particles of nylon 12, and 2 weight of polystylene were dissolved in the suspension as a binder. The same resistor as that of the example 2 was immersed in the suspension, and the frozen layer of the suspension was formed similarly. After separating the layer on the lead wire similarly to example 2, the remaining layer was cured by heating the resistor at 200C. Then, there was formed a uniform layer of nylon 12.
  • EXAMPLE 4 33 weight of particles of polyvinyl chloride were dispersed in the same non-solvent suspending medium as that of example 1, and a cooled iron plate was immersed in the resultant suspension. The frozen layer of the suspension formed on the surface of the iron plate was cured at 120C, and there was provided an iron plate coated a uniform layer of polyvinyl chloride.
  • glass powder 100g binder; ethylcellulose 2.15g non-solvent suspending medium; 193.2g
  • the glass powder consisted of 88 weight of PbO and 12 weight of B 0 and had a 1.011 average grain size.
  • the suspension was kept at 27C, and the wirewound resistors cooled at -l 2C were immersed in the suspension, so that the frozen layer of the suspension was formed on the surface of the resistor.
  • the non-solvent was evaporated, and then the resistors were kept at nearly 300C for 30 minutes so that the binder was burned away completely. After that, the resistor was further heated at 350C for 10 minutes to melt the glass powder completely. Then, the resistor was cooled to room temperature at a rate of 10C/minute, and a uniform glass layer having no pin-holes and having a thickness of 0.8 mm was formed on the surface of the wirewound resistor.
  • a method for coating an article with a layer of coating material comprising:
  • chlorofluoro ethane is selected from the group consisting of CCl FCCl F, CCl CClF and CCI FCClF 3.
  • said coating particles are particles of resin.
  • said suspension contains a binder which is soluble in chlorofluoro ethane in a concentration of 0.1 to 5.0 weight said binder being selected from the group consisting of polystyrene and denatured silicone resin.
  • said electronic component is an axial type component having two lead wires extending longitudinally from both ends thereof, one of said two lead wires and the whole body of said electronic component being immersed in said suspension, including the step of cutting off the layer of said suspension formed on the surface of said immersed lead wire, after the step of taking said component out of said suspension.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
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US435577A 1974-01-25 1974-01-22 Method for coating an article Expired - Lifetime US3914466A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009306A (en) * 1974-09-26 1977-02-22 Matsushita Electric Industrial Co., Ltd. Encapsulation method
US5211992A (en) * 1990-02-16 1993-05-18 International Partners In Glass Research Method and apparatus for coating articles
US20070000131A1 (en) * 2005-05-04 2007-01-04 Sonion Nederland Bv Solid coated coil and a method of coating a coil
US20140248784A1 (en) * 2013-03-01 2014-09-04 Tokyo Electron Limited Microwave processing apparatus and microwave processing method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485806A1 (fr) * 1980-06-24 1981-12-31 Lignes Telegraph Telephon Procede d'encapsulation d'un circuit electronique et circuit obtenu par ce procede
FR2488767A1 (fr) * 1980-08-13 1982-02-19 Thomson Csf Procede de vernissage de carte equipee de broches de connexion et carte ainsi obtenue

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US597277A (en) * 1898-01-11 Method of producing engravings
US2191352A (en) * 1937-01-19 1940-02-20 Julia Oprean Frozen confection and coating
US2427417A (en) * 1945-07-14 1947-09-16 Western Electric Co Method of manufacturing electrical resistors
US2976188A (en) * 1955-11-25 1961-03-21 Gen Mills Inc Method of producing a humidity senser
US3167451A (en) * 1959-08-26 1965-01-26 Sprague Electric Co Method of resistor production
US3200471A (en) * 1963-10-03 1965-08-17 Corning Glass Works Apparatus for manufacturing electrical components
US3584379A (en) * 1968-12-27 1971-06-15 Corning Glass Works Method of forming a fused substrate resistor
US3722077A (en) * 1971-03-05 1973-03-27 South Wire Co A method of cooling and drying a wire utilizing an induced air wipe
US3728144A (en) * 1970-04-24 1973-04-17 Bekaert Sa Nv Method for coating metal substrates with molten metal
US3736179A (en) * 1970-05-15 1973-05-29 Philips Corp Dip lacquering of electrical components
US3773579A (en) * 1971-07-15 1973-11-20 Olin Corp Method of treating aluminum strip

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US597277A (en) * 1898-01-11 Method of producing engravings
US2191352A (en) * 1937-01-19 1940-02-20 Julia Oprean Frozen confection and coating
US2427417A (en) * 1945-07-14 1947-09-16 Western Electric Co Method of manufacturing electrical resistors
US2976188A (en) * 1955-11-25 1961-03-21 Gen Mills Inc Method of producing a humidity senser
US3167451A (en) * 1959-08-26 1965-01-26 Sprague Electric Co Method of resistor production
US3200471A (en) * 1963-10-03 1965-08-17 Corning Glass Works Apparatus for manufacturing electrical components
US3584379A (en) * 1968-12-27 1971-06-15 Corning Glass Works Method of forming a fused substrate resistor
US3728144A (en) * 1970-04-24 1973-04-17 Bekaert Sa Nv Method for coating metal substrates with molten metal
US3736179A (en) * 1970-05-15 1973-05-29 Philips Corp Dip lacquering of electrical components
US3722077A (en) * 1971-03-05 1973-03-27 South Wire Co A method of cooling and drying a wire utilizing an induced air wipe
US3773579A (en) * 1971-07-15 1973-11-20 Olin Corp Method of treating aluminum strip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009306A (en) * 1974-09-26 1977-02-22 Matsushita Electric Industrial Co., Ltd. Encapsulation method
US5211992A (en) * 1990-02-16 1993-05-18 International Partners In Glass Research Method and apparatus for coating articles
US20070000131A1 (en) * 2005-05-04 2007-01-04 Sonion Nederland Bv Solid coated coil and a method of coating a coil
US20140248784A1 (en) * 2013-03-01 2014-09-04 Tokyo Electron Limited Microwave processing apparatus and microwave processing method

Also Published As

Publication number Publication date
FR2258965A1 (ja) 1975-08-22
DE2405429A1 (de) 1975-08-07
FR2258965B1 (ja) 1976-10-08
DE2405429B2 (de) 1975-11-27
GB1440148A (en) 1976-06-23

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