US3883409A - Gold alloy electroplating bath - Google Patents
Gold alloy electroplating bath Download PDFInfo
- Publication number
- US3883409A US3883409A US377471A US37747173A US3883409A US 3883409 A US3883409 A US 3883409A US 377471 A US377471 A US 377471A US 37747173 A US37747173 A US 37747173A US 3883409 A US3883409 A US 3883409A
- Authority
- US
- United States
- Prior art keywords
- amount
- bath
- gold
- improved
- water soluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 13
- 239000003353 gold alloy Substances 0.000 title claims abstract description 13
- 238000009713 electroplating Methods 0.000 title description 5
- 150000003839 salts Chemical class 0.000 claims abstract description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000010931 gold Substances 0.000 claims abstract description 31
- 229910052737 gold Inorganic materials 0.000 claims abstract description 31
- -1 alkali metal gold sulfite Chemical class 0.000 claims abstract description 22
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 19
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 150000002903 organophosphorus compounds Chemical class 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 18
- 239000002738 chelating agent Substances 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 17
- 230000008021 deposition Effects 0.000 claims abstract description 8
- 239000010938 white gold Substances 0.000 claims abstract description 6
- 229910000832 white gold Inorganic materials 0.000 claims abstract description 6
- 238000005275 alloying Methods 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- 150000002739 metals Chemical class 0.000 claims description 10
- 125000001118 alkylidene group Chemical group 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- 239000010941 cobalt Substances 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 6
- 125000005238 alkylenediamino group Chemical group 0.000 claims description 5
- ZWZLRIBPAZENFK-UHFFFAOYSA-J sodium;gold(3+);disulfite Chemical group [Na+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O ZWZLRIBPAZENFK-UHFFFAOYSA-J 0.000 claims description 5
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 3
- 150000003018 phosphorus compounds Chemical class 0.000 claims description 3
- XQRLCLUYWUNEEH-UHFFFAOYSA-N diphosphonic acid Chemical compound OP(=O)OP(O)=O XQRLCLUYWUNEEH-UHFFFAOYSA-N 0.000 claims description 2
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical group [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract description 8
- 239000008139 complexing agent Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000002191 fatty alcohols Chemical class 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RSOOXPFMVKSKNN-UHFFFAOYSA-N 2-acetyloxyethyl acetate;amino acetate Chemical compound CC(=O)ON.CC(=O)ON.CC(=O)OCCOC(C)=O RSOOXPFMVKSKNN-UHFFFAOYSA-N 0.000 description 1
- 235000013162 Cocos nucifera Nutrition 0.000 description 1
- 244000060011 Cocos nucifera Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910052936 alkali metal sulfate Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001495 arsenic compounds Chemical class 0.000 description 1
- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 1
- 229910000331 cadmium sulfate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- AZMMUMQYPBKXHS-UHFFFAOYSA-N gold sodium Chemical group [Na].[Au] AZMMUMQYPBKXHS-UHFFFAOYSA-N 0.000 description 1
- 229940093920 gynecological arsenic compound Drugs 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- This invention relates to an improved bath for the electrolytic deposition of gold or gold alloys on electrically conductive objects. More particularly, the improvement comprises employing a water soluble salt of cadmium, a water soluble salt of copper, a water soluble salt of nickel, and an organic phosphorus compound in an aqueous galvanic bath containing an alkali metal gold sulfite, a gold alloy metal, an electrically conductive salt, and a chelating or complexing agent.
- Aqueous alkaline electrolytic baths for depositing gold or gold alloys on objects are known.
- Such baths typically contain the gold as an alkali metal gold sulfite.
- Arsenic compounds can be added to the bath to improve luster characteristics.
- such baths can contain a chelating agent, alloying metals and conducting salts (German published application No. 2 042 127). lt is not possible with these baths, however, to deposit white gold on objects.
- this invention provides an aqueous bath for the electrolytic deposition of gold or gold alloys on electrically conductive objects. More particularly, this invention provides an improvement in such a bath which makes possible the deposition of white gold alloys.
- the improvement comprises incorporating in the plating bath at least one water soluble salt of cadmium, at least one water soluble salt of copper, at least one water soluble salt of nickel, and at least one chelating or complexing agent.
- the plating bath contains an organic phosphorus compound of either a. a compound of the formula in which R is a hydrogen atom or about C C lower alkyl radical. R is about a-C C alkylene radical and n is a whole number of about 1 3; or
- l-hydroxy ethylidene-1,l-diphosphonic acid which has the formula HZPOQ t CH C OH I H PO
- the electroplating bath of this invention has a pH of about 8.5 -11.
- alkylene diamino tetra -(methylphosphonic acids) are: ethylene diamino tetra-(methylphosphonic acid) and hexamethylene diamino tetra-(methyl phosphonic acid).
- Other suitable compounds will be apparent to persons skilled in the art.
- the phosphorus compounds employed in the plating bath are typically in quantities of about 0.01 10 g/l, preferably about 0.5 2 g/l.
- the alloying metals contained in the plating bath are well known in the art. These are soluble salts of cadmium, copper and nickel. Preferably, the alloying metals are employed in the form of their sulfates. Besides these metals, the bath can also contain the water soluble salts of indium, cobalt and iron.
- the bath typically contains the gold in a quantity of about 1 8 g/l, preferably about 3 5 g/l, in the form of an alkali metal gold sulfite.
- the preferred compound is sodium gold sulfite.
- the cadmium is employed in an amount of about 0.1 30 g/l, preferably about 8 14 g/l.
- the copper is generally employed in an amount of about 0.001 0.5 g/l, preferably about 0.01 0.08 g/l.
- the nickel is typically present in an amount of about 0.001 10 g/l, preferably about 4 6 g/l. All other alloying metals which might be present are typically employed in amounts of about 0.01 10 g/l. The aforementioned quantities are calculated on the basis of the metal in the plating bath.
- the chelating and complexing agents present in the plating bath of this invention are well known in the art. Their use in galvanic baths is well known in the art and are described in German published application No. 2 042 127, the entire disclosure of which is incorporated herein by reference. Persons skilled in the art will recognize that the chelating and complexing agents are employed in quantities which will result in the substantially complete complexing of all metals present. While the amount generally employed is typically about 20 30 g/l, it is recommended to use an excess.
- a particularly preferred agent for use in the bath of this invention is ethylene diamino tetra acetate.
- the pH of the plating bath of this invention is about 8.5 11, preferably about 9.5 10.2
- the bath of this invention can contain conventional conductive salts or free sulfite in quantities of, for example, about 0.5 100 g/l.
- Alkali metal sulfates and alkali metal sulfites are preferred for this purpose.
- the electroplating bath of this invention can be operated at temperatures of about 50 70 C., preferably about 60 65 C. It is advantageous to employ current densities of about 0.1 1.0 A/l00 cm preferably about 0.5 0.8 A/ cm
- the use of conventional wetting agents in the bath of this invention is optional. Such wetting agents, however, are particularly effective when coatings of more than about 5 microns are desired on the object being coated. All of the wetting agents known in the art to be useful in alkaline galvanic baths, and which are stable in such baths can be used.
- Preferred wetting agents are the fatty alcohol polyglycol ether phosphates and their sodium salts.
- EXAMPLE 1 In one liter of water are dissolved: 5 g gold as sodium gold sulfite 15 g cadmium as cadmium sulfate 2.5 g nickel as nickel sulfate 0.01 g copper as copper sulfate g ethylene diaminotetraacetate as sodium salt and 100 g sodium sulfite.
- the pH value is adjusted to 10.0 by addition of a diluted aqueous solution of sodium hydroxide or sulfuric acid. To this solution are added:
- the bath is operated at a temperature of 58 C. and a current density of 0.5 to 0.7 amperes/lOO cm with vigorous agitation of the bath. There'is obtained a lus trous deposit of white gold on an object being coated.
- alkali metal refers to a metal selected from Group I A of the Periodic Table of Elements.
- an improved aqueous bath for the electrolytic deposition of gold or gold alloys on electrically conduc tive objects said bath containing at least one chelating agent, an alkali metal gold sulfite, at least one gold alloying metal, and about 0.5-100 g/l of at least one electrically conductive salt other than said alkali metal gold sulfite, said gold alloying metal and said chelating agent, the improvement wherein white gold is deposited on said object and wherein said at least one gold alloying metal is at least one water soluble salt of cadmium, at least one water soluble salt of copper, at least water soluble salt of nickel, and additionally there is incorporated in said bath an organic phosphorus compound of either a.
- R is a hydrogen atom or about a C C lower alkyl radical, R is about a C C alkylene radical, and n is a whole number of about 1 3;
- a water soluble salt of compounds of a or b said bath having a pH of about 8.5 11, and further wherein said bath contains gold in an amount of about 1 8 g/l, cadmium in an amount of about 0.1 30 g/l, copper in an amount of about 0.001 0.5 g/l, nickel in an amount of about 0.001 10 g/l and the organic phosphorous compounds in an amount of about 0.01 10 g/l; wherein said at least one chelating agent is other than a, b and c and is present in an amount sufficient to substantially completely complex all of the metals present in the plating bath.
- organic phosphorus compound is an alkylene diamino tetra-(methylphosphonic acid) in which the alkylene group has about 1 6 carbon atoms.
- the organic phosphorus compound is a 1- hydroXyalkylidene-l ,l-diphosphonic acid the alkylidene group of which contains about 1 6 carbon atoms.
- the organic phosphorous compound is ethylene diamino tetra-(methylphosphonic acid) or hexamethylene diamino tetra-(methyl phosphonic acid).
- an improved aqueous bath for the electrolytic deposition of gold or gold alloys on electrically conductive objects said bath containing at least one chelating agent, an alkali metal gold sulfite, at least one gold alloying metal, and about 0.5 g/l of at least one electrically conductive salt other than said alkali metal gold sulfite, said gold alloying metal and said chelating agent, the improvement wherein there is incorporated in said bath at least one water soluble salt of cadmium, at least one water soluble salt of copper, at least one water soluble salt of nickel, and additionally a 1- hydroxyalkylidene-l,l-diphosphonic acid, the alkylidene group of which contains 1 12 carbon atoms, or a water soluble salt of the diphosphonic acid; said bath having a pH of about 8.5 l l, and further wherein said bath contains gold in an amount of about 1 8 g/l, cadmium in an amount of about 0.1 30 g/l, copper
- Improved bath acco ding to claim 24 in which the water soluble gold alloying metal salts are metal sulfates and the alkali metal gold sulfite is sodium gold sul- 26. Improved bath according to claim 25 in which the alkylidene group contains 1 6 carbon atoms.
- iron in an amount of about 0.01 10 g/l calculated on the basis of metal in the bath.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1033272 | 1972-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3883409A true US3883409A (en) | 1975-05-13 |
Family
ID=4362071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US377471A Expired - Lifetime US3883409A (en) | 1972-07-10 | 1973-07-09 | Gold alloy electroplating bath |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US3883409A (cs) |
| JP (1) | JPS4953138A (cs) |
| AT (1) | AT334707B (cs) |
| AU (1) | AU471580B2 (cs) |
| BE (1) | BE802117A (cs) |
| BR (1) | BR7305054D0 (cs) |
| DE (1) | DE2334813C2 (cs) |
| ES (1) | ES416671A1 (cs) |
| FR (1) | FR2192188B1 (cs) |
| GB (1) | GB1434237A (cs) |
| IT (1) | IT991757B (cs) |
| NL (1) | NL7309611A (cs) |
| SE (1) | SE385715B (cs) |
| ZA (1) | ZA734253B (cs) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3990954A (en) * | 1973-12-17 | 1976-11-09 | Oxy Metal Industries Corporation | Sulfite gold plating bath and process |
| US4012294A (en) * | 1972-08-10 | 1977-03-15 | Oxy Metal Industries Corporation | Gold sulfite baths containing organophosphorous compounds |
| US4358351A (en) * | 1980-05-31 | 1982-11-09 | Degussa Aktiengesellschaft | Alkaline bath for the electrolytic deposition of low carat yellow colored gold alloy layers |
| US4374006A (en) * | 1980-04-03 | 1983-02-15 | Degussa Aktiengesellschaft | Electrolytic bath for the deposition of high gloss white gold coatings |
| US4391679A (en) * | 1980-04-03 | 1983-07-05 | Degussa Aktiengesellschaft | Electrolytic bath and process for the deposition of gold alloy coatings |
| EP1013799A1 (en) * | 1998-12-23 | 2000-06-28 | Half Tone Ltd. | Solution and process for the electrodeposition of gold and gold alloys |
| ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823478B2 (ja) * | 1979-06-28 | 1983-05-16 | 日本電鍍工業株式会社 | 硬質金合金被膜の製造方法 |
| DE3905705A1 (de) * | 1989-02-24 | 1990-08-30 | Degussa | Bad zur galvanischen abscheidung von feingoldueberzuegen |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3057789A (en) * | 1959-02-26 | 1962-10-09 | Paul T Smith | Gold plating bath and process |
| US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
| US3672969A (en) * | 1970-10-26 | 1972-06-27 | Lea Ronal Inc | Electrodeposition of gold and gold alloys |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH530473A (fr) * | 1969-08-19 | 1972-11-15 | Sel Rex Corp | Procédé pour le dépôt électrolytique d'or brillant et bain électrolytique pour la mise en oeuvre de ce proédé |
-
1973
- 1973-06-22 ZA ZA00734253A patent/ZA734253B/xx unknown
- 1973-06-29 AU AU57546/73A patent/AU471580B2/en not_active Expired
- 1973-07-06 BR BR5054/73A patent/BR7305054D0/pt unknown
- 1973-07-09 US US377471A patent/US3883409A/en not_active Expired - Lifetime
- 1973-07-09 AT AT601073A patent/AT334707B/de not_active IP Right Cessation
- 1973-07-09 JP JP48077397A patent/JPS4953138A/ja active Pending
- 1973-07-09 BE BE6044233A patent/BE802117A/xx unknown
- 1973-07-09 DE DE2334813A patent/DE2334813C2/de not_active Expired
- 1973-07-09 IT IT69043/73A patent/IT991757B/it active
- 1973-07-10 GB GB3274173A patent/GB1434237A/en not_active Expired
- 1973-07-10 SE SE7309695A patent/SE385715B/xx unknown
- 1973-07-10 FR FR7325281A patent/FR2192188B1/fr not_active Expired
- 1973-07-10 NL NL7309611A patent/NL7309611A/xx unknown
- 1973-09-15 ES ES416671A patent/ES416671A1/es not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3057789A (en) * | 1959-02-26 | 1962-10-09 | Paul T Smith | Gold plating bath and process |
| US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| US3672969A (en) * | 1970-10-26 | 1972-06-27 | Lea Ronal Inc | Electrodeposition of gold and gold alloys |
| US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4012294A (en) * | 1972-08-10 | 1977-03-15 | Oxy Metal Industries Corporation | Gold sulfite baths containing organophosphorous compounds |
| US3990954A (en) * | 1973-12-17 | 1976-11-09 | Oxy Metal Industries Corporation | Sulfite gold plating bath and process |
| US4374006A (en) * | 1980-04-03 | 1983-02-15 | Degussa Aktiengesellschaft | Electrolytic bath for the deposition of high gloss white gold coatings |
| US4391679A (en) * | 1980-04-03 | 1983-07-05 | Degussa Aktiengesellschaft | Electrolytic bath and process for the deposition of gold alloy coatings |
| US4358351A (en) * | 1980-05-31 | 1982-11-09 | Degussa Aktiengesellschaft | Alkaline bath for the electrolytic deposition of low carat yellow colored gold alloy layers |
| EP1013799A1 (en) * | 1998-12-23 | 2000-06-28 | Half Tone Ltd. | Solution and process for the electrodeposition of gold and gold alloys |
| ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
| EP2669407A1 (en) * | 2012-06-01 | 2013-12-04 | Bluclad S.R.L. | Galvanic baths for obtaining a low-carat gold alloy, and galvanic process that uses said baths |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2334813A1 (de) | 1974-01-31 |
| FR2192188A1 (cs) | 1974-02-08 |
| JPS4953138A (cs) | 1974-05-23 |
| AU5754673A (en) | 1975-01-09 |
| IT991757B (it) | 1975-08-30 |
| AU471580B2 (en) | 1976-04-29 |
| ZA734253B (en) | 1975-02-26 |
| NL7309611A (cs) | 1974-01-14 |
| GB1434237A (en) | 1976-05-05 |
| ATA601073A (de) | 1976-05-15 |
| ES416671A1 (es) | 1976-06-01 |
| AT334707B (de) | 1976-02-10 |
| DE2334813C2 (de) | 1982-08-19 |
| BR7305054D0 (pt) | 1974-08-15 |
| BE802117A (fr) | 1974-01-09 |
| FR2192188B1 (cs) | 1978-07-21 |
| SE385715B (sv) | 1976-07-19 |
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