US3872278A - Method for heat treatment of substrates - Google Patents
Method for heat treatment of substrates Download PDFInfo
- Publication number
- US3872278A US3872278A US389502A US38950273A US3872278A US 3872278 A US3872278 A US 3872278A US 389502 A US389502 A US 389502A US 38950273 A US38950273 A US 38950273A US 3872278 A US3872278 A US 3872278A
- Authority
- US
- United States
- Prior art keywords
- substrate
- envelope
- plasma
- current
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F29/00—Variable transformers or inductances not covered by group H01F21/00
- H01F29/08—Variable transformers or inductances not covered by group H01F21/00 with core, coil, winding, or shield movable to offset variation of voltage or phase shift, e.g. induction regulators
- H01F29/12—Variable transformers or inductances not covered by group H01F21/00 with core, coil, winding, or shield movable to offset variation of voltage or phase shift, e.g. induction regulators having movable coil, winding, or part thereof; having movable shield
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/52—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
- C21D9/54—Furnaces for treating strips or wire
- C21D9/56—Continuous furnaces for strip or wire
Definitions
- the present invention relates to a method and apparatus for highly concentrated electrical heating and more specifically to a method and apparatus for efficiently heating a substrate through the generation of a plasma in the vicinity of the substrate.
- carbon graphite fibers may be treated at elevated temperatures to modify the surface or overall characteristics of the fiber.
- substrates have been heated in various manners to provide the desired modification of the substrate characteristics.
- resistance heating i.e., passing an electrical current through the fiber
- the current flow and therefore the cost of heating fibers by resistance heating may necessarily be excessively high in order to reach the temperatures required.
- FIG. 1 is a schematic representation of a heating chamber constructed in accordance with the principles of the present invention
- FIG. 2 is a view in cross section of the heating chamber of FIG. 1, taken along the line 2-2;
- FIG. 2A is a schematic representation of a second embodiment of a heating chamber constructed in accordance with the principles of the present invention.
- FIG. 3 is a functional diagram of the RF source of FIG. 1;
- FIG. 4 is a perspective view of the output transformer of FIG. 3.
- a plasma chamber 10 is formed within a central passage 14 extending into a substantially gas impervious, generally electrically nonconductive or insulative envelope 12.
- the substrate to be heated provides a central electrode 16 which extends through the central passage 14 and is isolated from the chamber 10 by the radially inward wall of the envelope 12.
- An electrode 18 is disposed radially outward of the envelope l2 and is separated at least in part from the centrally disposed electrode 16 by at least a portion of the envelope 12, thereby defining an area within the envelope 12, i.e., at least a portion of the chamber 10, which is disposed between the electrodes l6 and 18.
- High frequency electrical potential is applied between the electrodes 16 and 18 from a suitable source such as a variable frequency and amplitude radio frequency (RF) source 20 to thereby subject the chamber defined by the envelope 12 between the electrodes 16 and 18, to a selectable time varying electrical field.
- a suitable fill tube 22 may be provided communicating with the chamber 10 through the envelope 12 and having a valve or other suitable closure means 24 therein to selectively control the gas pressure and gas constituency within the envelope 12.
- the envelope 12 defining the chamber 10 preferably comprises an outer elongated hollow glass cylindrical member 26, an inner elongated hollow glass cylindrical member 28, and apertured end plates 30 and 32 sealed therebetween in a suitable conventional manner.
- the cylindrical member 28 illustrated is substantially coextensive with the member 26 and is disposed in telescoping relationship thereto coaxially within the member 26 to define a chamber annular in cross section as is shown in FIG. 2.
- the substrate to be heated preferably forms the central electrode 16.
- the substrate may be passed through the central passage 14 from a feed reel 36, over suitable guides such as the rollers 38, and onto a take-up reel 40.
- Either or both of the rollers 38 may be connected to one output terminal of the RF source, for example, by grounding the rollers 38 and one output terminal of the RF source as is illustrated in FIG. 1.
- the outer electrode 18 is preferably a hollow cylindrical electrically conductive member circumferentially disposed round at least a portion of the insulative member 26 and may be, for example, a metallic foil conformed to the radially outer surface of the envelope.
- the central electrode 16 preferably extends axially into the central passage 14 sufficiently so that an elongated annular portion of the chamber 10 is located bet ee t e e ec rode and1
- the application of a potential from the RF source 20 between the electrodes 16 and 18 creates an electric field between these electrodes, as is indicated by the lines 34 in FIG. 2.
- the electrode configuration i.e., the relative positions of the electrodes and the relative dimensions thereof, cause the electric field to be more concentrated or dense in the vicinity of the central 3 electrode 16 near the axis of the annular chamber 10.
- the gas in the chamber will be excited sufficiently to create a gaseous plasma in the chamber.
- the plasma generally comprises highly reactive species such as ions, electrons and neutral fragmented particles in highly excited states. Since the exciting of the gas by the electric field creates the plasma, the plasma concentration or density generally conforms to the electric field concentration or density. Thus, the concentration or density of the plasma generated within the gas impervious envelope 12 varies between the outer cylindrical member 26 and the inner cylindrical member 28 in a manner related to the electric field concentration or density.
- the relationship between the gas conditions within the envelope l2 and the gas conditions exteriorly thereof is desirably such that the plasma may be confined to the chamber 10.
- the electric potential applied to the electrodes 16 and 18 may thus be lower and the current density will be correspondingly less.
- This desirable relationship may be obtained by utilizing selected gases at predetermined pressures within the chamber 10, while exposing the electrodes outside the envelope 12 to the atmosphere.
- a monatomic inert gas such as argon or helium at atmospheric or slightly less than atmospheric pressure may be utilized in the chamber 10.
- a plasma will be more readily generated within the chamber 10 than exteriorly thereof.
- the potential of the RF signal applied to the electrodes set at a value above the potential required to generate a plasma within the chamber 10, but below the potential required to generate a plasma in the vicinity of the electrodes 16 and 18 externally of the chamber 10, the current which flows between the electrodes 16 and 18 will depend primarily upon the capacitive coupling between the electrodes rather than on the ion flow within the plasma.
- the current flowing through the substrate causes resistive heating of the substrate apparently due to the intense magnetic and electrical fields in the plasma.
- the heating of the substrate as described above results in highly efficient use of the energy supplied by the RF source 20.
- the required substrate temperature may be achieved more efficiently than by other conventional heating methods and the substrate temperature may be easily controlled in a number of ways, for example, by controlling the amplitude ofthe RF signal, varying the diameter of the inner cylindrical member 28, or varying the distance between the electrodes along the length of the envelope 12 as shown in FIG. 2A. 1
- the RF source 20 of FIG. 1 preferably supplies a high frequency RF signal at selectable power levels to the heating apparatus of FIG. 1.
- the RF source 20 may include a high power RF oscillator 42 connected to the load (e.g., the electrodes 16 and 18 of FIG. 1) through a balun transformer 44.
- the balun transformer 44 may form a portion of the tank circuit of the oscillator 42. Maximum power transfer between the oscillator 42 and the load is thus obtained when an impedance match exists between the oscillator tank circuit and the load impedance reflected back to the tank circuit. Since it may be desirable to vary the oscillator output power and frequency to suit the requirements of the heating apparatus, it may be necessary to vary the oscillator output impedance to retain the desired impedance match.
- Impedance matching for maximum efficiency and control of the power transfer to the load is preferably accomplished by providing a balun transformer arrangement as is illustrated in FIG. 4.
- the balun transformer 44 of FIG. 3 preferably includes a primary coil 46 wound in a helical groove 47 on an electrically insulative core 48.
- a secondary coil 50 is wound in a helical groove 51 on an electrically insulative core 52 disposed coaxially with respect to the core 48.
- the coils 46 and 50 may be, for example, helically wound, hollow copper tubes generally conforming to the shapes of the helical grooves in the respective cores 48 and 52.
- the coil 46 may be secured to a pair ofoutput terminal blocks 53 and the coil 50 may be terminated with a suitable transmission line connector 55 such as a 50 ohm connector.
- the core 52 may be fixedly connected to a shaft 54 which extends through a central passage in the core 48 so that the core 48 is freely rotatable on the shaft 54.
- a shoulder 56 may be provided on the shaft 54 to in sure a fixed spacing between the cores 48 and 52, and the end 58 of the shaft 54 may be threaded and may protrude out of the core 48 so that a nut 60 may be utilized to prevent removal of the shaft 54 from the central passage in the core 48.
- An insulative knob 62 having a position indicator 64 thereon may be connected to the core 52 to facilitate the rotation of the core 52 and to provide an indication of the relative positions of the cores 48 and 52.
- the secondary coil 50 moves axially along the core 52 varying the spacing between the coils and thereby varying the mutual inductance between the coils.
- the coil spacing may be varied until an impedance match and/or a desired output power is obtained as may be indicated on a suitable wattmeter (not shown).
- the axial spacing between the cores 48 and 52 remains substantially constant as the core 52 is rotated.
- the minimum spacing between the coils cannot be decreased below a predetermined distance, preventing accidental arcing between the coils.
- the grooves which receive the coils aid in preventing arcing by interposing a material having a high dielectric strength than that of air at least partially between the coils 46 and 50 and between adjacent coil windings.
- the cores 48 and 52 may be connected for axial rotation together with the cores being grooved in opposite directions, Le, a left-handed thread or groove on the core 48 and a right-handed thread or groove on the core 52.
- the coils may both be movable axially in response to the rotation of the cores.
- the present invention is particularly advantageous for the efficient and controlled electrical heating of substrates such as conductive fibers or wire.
- the substrate is heated both directly and indirectly, thereby making the most efficient use of the electrical power supplying the heating energy.
- the generated energy of the plasma acting indirectly on the substrate through thermal conduction and radiation is concentrated in the vicinity of the substrate and also acts indirectly on the substrate to improve the heating efficiency.
- the balun transformer used in conjunction with the present invention provides a convenient way to maximize power transfer and to control the power applied to the electrodes between which the plasma is generated. Moreover, the entire transformer core assembly may be easily and inexpensively constructed by conventional molding techniques and the coils maybe constructed from commercially available tubing and commercially available fittings. Also, accidental arcing between the transformer windings is prevented by the novel structure of the transformer.
- the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
- a method for heat treating substrates comprising the steps of:
- gaseous plasma is generated by applying a high frequency electrical signal to said substrate and an electrode disposed exteriorly of said envelope, said substrate thereby being resistively heated by current flow therethrough.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US389502A US3872278A (en) | 1971-09-30 | 1973-08-20 | Method for heat treatment of substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18501471A | 1971-09-30 | 1971-09-30 | |
US389502A US3872278A (en) | 1971-09-30 | 1973-08-20 | Method for heat treatment of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
US3872278A true US3872278A (en) | 1975-03-18 |
Family
ID=26880697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US389502A Expired - Lifetime US3872278A (en) | 1971-09-30 | 1973-08-20 | Method for heat treatment of substrates |
Country Status (1)
Country | Link |
---|---|
US (1) | US3872278A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5383019A (en) * | 1990-03-23 | 1995-01-17 | Fisons Plc | Inductively coupled plasma spectrometers and radio-frequency power supply therefor |
US6254738B1 (en) * | 1998-03-31 | 2001-07-03 | Applied Materials, Inc. | Use of variable impedance having rotating core to control coil sputter distribution |
US6345588B1 (en) | 1997-08-07 | 2002-02-12 | Applied Materials, Inc. | Use of variable RF generator to control coil voltage distribution |
US6359250B1 (en) | 1998-07-13 | 2002-03-19 | Applied Komatsu Technology, Inc. | RF matching network with distributed outputs |
US6358481B1 (en) | 2000-11-14 | 2002-03-19 | Lockheed Martin Corporation | Electrically safe dual electrode plasma treatment chamber system |
US6514449B1 (en) | 2000-09-22 | 2003-02-04 | Ut-Battelle, Llc | Microwave and plasma-assisted modification of composite fiber surface topography |
US6579426B1 (en) | 1997-05-16 | 2003-06-17 | Applied Materials, Inc. | Use of variable impedance to control coil sputter distribution |
US6652717B1 (en) | 1997-05-16 | 2003-11-25 | Applied Materials, Inc. | Use of variable impedance to control coil sputter distribution |
US9870853B1 (en) * | 2015-07-20 | 2018-01-16 | The United States Of America As Represented By The Secretary Of The Navy | Adjustable inductor |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2282317A (en) * | 1940-12-31 | 1942-05-12 | Okonite Co | Method of and apparatus for the electrostatic curing of heat curable materials, while under pressure |
US3090737A (en) * | 1960-02-24 | 1963-05-21 | Rca Corp | Plasma heating apparatus and process |
US3146336A (en) * | 1962-11-15 | 1964-08-25 | Donald P Whitacre | Method and apparatus for heat treating metal |
US3182982A (en) * | 1962-08-15 | 1965-05-11 | Universal Oil Prod Co | Infra-red wire annealing apparatus |
US3203768A (en) * | 1961-08-01 | 1965-08-31 | Westinghouse Electric Corp | Apparatus of zone refining and controlling solute segregation in solidifying melts by electromagnetic means |
US3383163A (en) * | 1964-01-24 | 1968-05-14 | Little Inc A | Treatment of surfaces |
US3405301A (en) * | 1965-06-21 | 1968-10-08 | Matsushita Electric Ind Co Ltd | Apparatus for producing quiescent plasma |
US3572286A (en) * | 1967-10-09 | 1971-03-23 | Texaco Inc | Controlled heating of filaments |
US3571551A (en) * | 1968-04-03 | 1971-03-23 | Furukawa Electric Co Ltd | High frequency heating apparatus |
US3636300A (en) * | 1969-01-30 | 1972-01-18 | Phillips Petroleum Co | Method for the production of high-temperature gases |
US3671195A (en) * | 1968-08-19 | 1972-06-20 | Int Plasma Corp | Method and apparatus for ashing organic substance |
-
1973
- 1973-08-20 US US389502A patent/US3872278A/en not_active Expired - Lifetime
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2282317A (en) * | 1940-12-31 | 1942-05-12 | Okonite Co | Method of and apparatus for the electrostatic curing of heat curable materials, while under pressure |
US3090737A (en) * | 1960-02-24 | 1963-05-21 | Rca Corp | Plasma heating apparatus and process |
US3203768A (en) * | 1961-08-01 | 1965-08-31 | Westinghouse Electric Corp | Apparatus of zone refining and controlling solute segregation in solidifying melts by electromagnetic means |
US3182982A (en) * | 1962-08-15 | 1965-05-11 | Universal Oil Prod Co | Infra-red wire annealing apparatus |
US3146336A (en) * | 1962-11-15 | 1964-08-25 | Donald P Whitacre | Method and apparatus for heat treating metal |
US3383163A (en) * | 1964-01-24 | 1968-05-14 | Little Inc A | Treatment of surfaces |
US3405301A (en) * | 1965-06-21 | 1968-10-08 | Matsushita Electric Ind Co Ltd | Apparatus for producing quiescent plasma |
US3572286A (en) * | 1967-10-09 | 1971-03-23 | Texaco Inc | Controlled heating of filaments |
US3571551A (en) * | 1968-04-03 | 1971-03-23 | Furukawa Electric Co Ltd | High frequency heating apparatus |
US3671195A (en) * | 1968-08-19 | 1972-06-20 | Int Plasma Corp | Method and apparatus for ashing organic substance |
US3636300A (en) * | 1969-01-30 | 1972-01-18 | Phillips Petroleum Co | Method for the production of high-temperature gases |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5383019A (en) * | 1990-03-23 | 1995-01-17 | Fisons Plc | Inductively coupled plasma spectrometers and radio-frequency power supply therefor |
US6579426B1 (en) | 1997-05-16 | 2003-06-17 | Applied Materials, Inc. | Use of variable impedance to control coil sputter distribution |
US6652717B1 (en) | 1997-05-16 | 2003-11-25 | Applied Materials, Inc. | Use of variable impedance to control coil sputter distribution |
US6345588B1 (en) | 1997-08-07 | 2002-02-12 | Applied Materials, Inc. | Use of variable RF generator to control coil voltage distribution |
US6719883B2 (en) | 1997-08-07 | 2004-04-13 | Applied Materials, Inc. | Use of variable RF generator to control coil voltage distribution |
US6254738B1 (en) * | 1998-03-31 | 2001-07-03 | Applied Materials, Inc. | Use of variable impedance having rotating core to control coil sputter distribution |
US6359250B1 (en) | 1998-07-13 | 2002-03-19 | Applied Komatsu Technology, Inc. | RF matching network with distributed outputs |
US6552297B2 (en) | 1998-07-13 | 2003-04-22 | Applied Komatsu Technology, Inc. | RF matching network with distributed outputs |
US6514449B1 (en) | 2000-09-22 | 2003-02-04 | Ut-Battelle, Llc | Microwave and plasma-assisted modification of composite fiber surface topography |
US6358481B1 (en) | 2000-11-14 | 2002-03-19 | Lockheed Martin Corporation | Electrically safe dual electrode plasma treatment chamber system |
US9870853B1 (en) * | 2015-07-20 | 2018-01-16 | The United States Of America As Represented By The Secretary Of The Navy | Adjustable inductor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3780255A (en) | Apparatus for heat treatment of substrates | |
US5234529A (en) | Plasma generating apparatus employing capacitive shielding and process for using such apparatus | |
US3872278A (en) | Method for heat treatment of substrates | |
US7777152B2 (en) | High AC current high RF power AC-RF decoupling filter for plasma reactor heated electrostatic chuck | |
CA2504939C (en) | Apparatus for inductive and resistive heating of an object | |
US2585582A (en) | Electron gun | |
US3572286A (en) | Controlled heating of filaments | |
US3705284A (en) | Inductor for the thermal treatment of a material which is not very or non-electrically conducting containing ferromagnetic or electrically conductive particles | |
JPH0740468B2 (en) | High frequency plasma generator | |
US2360108A (en) | High-frequency desiccator | |
CN217117529U (en) | Atomizer and electronic atomization device | |
JP4414507B2 (en) | Apparatus for generating plasma | |
US3824398A (en) | Method for plasma treatment of substrates | |
US3458755A (en) | Crossed-field discharge device and microwave circuits incorporating the same | |
US2075876A (en) | Cathode organization | |
Goode et al. | A review of instrumentation used to generate microwave-induced plasmas | |
CN103229369A (en) | Radio frequency-excited laser assembly | |
US2252118A (en) | Electron tube | |
US5183985A (en) | Contactless heating frequency heating of thin filaments | |
DE2659859A1 (en) | DEVICE FOR MAINTAINING AN ELECTRICAL DISCHARGE | |
US3895254A (en) | Charged particle accelerator with integral transformer and shielding means | |
US3760148A (en) | Apparatus for treating hair utilizing dielectric losses | |
US3723289A (en) | Method and apparatus for plasma treatment of substrates | |
US4156159A (en) | Self crossed field type ion source | |
US5880427A (en) | Method and apparatus for providing a stabilized plasma arc |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CCF, INC., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:CELANESE CORPORATION;REEL/FRAME:004413/0650 Effective date: 19850510 |
|
AS | Assignment |
Owner name: BASF STRUCTURAL MATERIALS, INC., 1501 STEELE CREEK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:INMONT CORPORATION, A CORP. OF DE.;REEL/FRAME:004540/0948 Effective date: 19851231 |
|
AS | Assignment |
Owner name: INMONT CORPORATION Free format text: MERGER;ASSIGNORS:NARMCO MATERIALS, INC.;QUANTUM, INCORPORATED;CCF, INC.;REEL/FRAME:004580/0870 Effective date: 19860417 |
|
AS | Assignment |
Owner name: BASF AKTIENGESELLSCHAFT, D-6700 LUDWIGSHAFEN, GERM Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:BASF STRUCTURAL MATERIALS INC.;REEL/FRAME:004718/0001 Effective date: 19860108 Owner name: SUBJECT TO AGREEMENT RECITED SEE DOCUMENT FOR DETA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:BASF STRUCTURAL MATERIALS INC.;REEL/FRAME:004718/0001 Effective date: 19860108 |