US3824398A - Method for plasma treatment of substrates - Google Patents
Method for plasma treatment of substrates Download PDFInfo
- Publication number
- US3824398A US3824398A US00292348A US29234872A US3824398A US 3824398 A US3824398 A US 3824398A US 00292348 A US00292348 A US 00292348A US 29234872 A US29234872 A US 29234872A US 3824398 A US3824398 A US 3824398A
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- plasma
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- gas
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- 239000000758 substrate Substances 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000009832 plasma treatment Methods 0.000 title description 3
- 230000036470 plasma concentration Effects 0.000 claims abstract description 10
- 238000011109 contamination Methods 0.000 claims description 7
- 210000002381 plasma Anatomy 0.000 description 67
- 239000007789 gas Substances 0.000 description 30
- 239000000835 fiber Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 239000008246 gaseous mixture Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 241000894007 species Species 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002657 fibrous material Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001676573 Minium Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F11/00—Chemical after-treatment of artificial filaments or the like during manufacture
- D01F11/10—Chemical after-treatment of artificial filaments or the like during manufacture of carbon
- D01F11/16—Chemical after-treatment of artificial filaments or the like during manufacture of carbon by physicochemical methods
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M10/00—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
- D06M10/02—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements ultrasonic or sonic; Corona discharge
- D06M10/025—Corona discharge or low temperature plasma
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M14/00—Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials
- D06M14/18—Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials using wave energy or particle radiation
- D06M14/26—Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials using wave energy or particle radiation on to materials of synthetic origin
- D06M14/30—Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials using wave energy or particle radiation on to materials of synthetic origin of macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M14/34—Polyamides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/30—Plasma torches using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/336—Changing physical properties of treated surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S422/00—Chemical apparatus and process disinfecting, deodorizing, preserving, or sterilizing
- Y10S422/906—Plasma or ion generation means
Definitions
- ABSTRACT A method and apparatus for efficiently generating a gaseous plasma particularly for the treatment of substrates.
- a radio frequency electrical signal is applied to two electrodes disposed exteriorly of an electrically insulative, gas impervious envelope.
- a central passage extends into the envelope and one electrode is disposed in the central passage.
- the electrodes are separated at least in part by the envelope and the radio frequency signal applied to the electrodes excites the gas within the envelope to thereby generate a gaseous plasma therein.
- the gas conditions within the envelope differ from the gas conditions exteriorly thereof and the amplitude of the radio frequency signal is insufficient to generate a plasma outside the chamber defined by the envelope.
- the surface areas of the electrodes differ substantially thereby creating a plasma within the envelope which varies in concentration in a predetermined manner, with the concentration being greatest near the center of the envelope.
- a substrate may therefore be contacted by varying plasma concentration as it passes through the envelope and the outer wall of the envelope is not contaminated by the plasma.
- a vacuum lock for preventing gas leakage into the envelope is also disclosed.
- the present invention relates to a method for treating substrates and specifically to a method for more efficiently generating a plasma for the treatment of substrates and for subjecting a substrate to varying plasma concentrations during the treatment thereof.
- signal having a frequency of 13.6 megahertz in pulses of 100 microseconds duration at a pulse repetition rate of l kilohertz may be utilized to excite the gaseous mixture within a coating zone into which the substrate isintroduced to provide a smooth, firmly adhering layer of boron 1 to 2 mils in thickness.
- Carbonaceous fibrous materials have been treated in plasmas as is described in US. Pat. application Ser. No. 99,169 filed Dec. 17, 1970, for Surface Modification of Carbon Fibers," by Kenneth C. Hou and assigned to the assignee of the present invention.
- a carbonaceous fibrous material is contacted for a brief time with an excited gas species generated by applying high frequency electrical energy in pulsed form to a gaseous mixture of a monotonic inert gas and a surface modification gas.
- a carbonaceous yarn may be passed through a gaseous mixture of helium and oxygen wherein the oxygen is present in the mixture in a concentration of about 0.5 percent by weight.
- a 3 kilovolt peadk-to-peak a.c. signal having a frequency of 13.56 megahertz may be utilized to excite the gaseous mixture thereby contacting the yarn with the excited gas species to modify the surface thereof.
- the excited gas species or plasma is generated by electrically exciting the gas or gaseous mixture.
- energy may be imparted to gas capacitively and a plasma thereby generated.
- the plasma is highly electrically conductive and a high conduction current flows between the capacitor plates or electrodes because of the resultant decrease in the electrical resistance of the gas between the electrodes.
- the cost of the power required to generate the plasma becomes an important factor.
- the plasma may be utilized in a more efficient manner.
- the cost of treating substrates may also be dependent upon the length of time during which a reaction chamber may be operated without shutdown for maintenance. It may be necessary to frequently change the gas within the chamber if the gasis contaminated by the electrodes. Also, the useful life of the reaction chamber may be adversely affected by material buildup on the walls thereof during the treatment operation.
- the present invention isdesirable to selectively expose a substrate to a plasma to achieve selectable surface modification or coating of the substrate.
- the amount of time during which the substrate is exposed to the plasma may be selectively varied to provide the desired end product. This may be accomplished through control of the speed at which the substrate passes through the plasma, assuming that other conditions remain constant.
- the substrate may, for example, be adversely affected by excess heat or the sudden exposure to high temperatures. It may therefore be desirable to expose the substrate to the plasma in a controllable manner.
- FIG. 1 is a schematic representation of a reaction chamber embodying the present invention
- FIG. 2 is a view in cross section of the reaction chamber of FIG. 1, taken along the line 2-2;
- FIG. 3 is a schematic representation of the reaction chamber of FIG. 1 with a substrate being treated therein;
- FIG. 4 is a view in cross section of the reaction chamber of FIG. 3, taken along the line 4-4;
- FIG. 5 is a schematic representation of a reaction chamber similar to the chamber shown in FIG. 3 with a plurality of substrates being treated therein;
- FIG. 6 is a view in partial cross section of the reaction chamber of FIG. 5 illustrating the vacuum lock of the present invention.
- FIGS. 7A and 7B are end views of the vacuum lock of FIG. 6, taken along the line 77 thereof, and illustrate two of the alternative shapes which the vacuum lock may have.
- a reaction chamber 10 is formed by a substantially gas impervious, generally electrically non-conductive or insulative envelope 12 into which a central passage 14 extends.
- An electrode 16 extends into the central passage 14 and is isolated from the chamber 10 by the radially inward wall of the envelope 12.
- An electrode 18 is disposed radially outward of the envelope 12, and is separated at least in part from the centrally disposed electrode by at least a portion of the envelope 12, thereby defining an area within the envelope 12, i.e., at least a portion of the chamber 10, which is disposed between the electrodes 16 and 18.
- a high frequency electrical potential is applied between the electrodes 16 and 18 from a suitable source such as a variable frequency and amplitude radio frequency (FR) generator 20 to thereby subject the chamber as defined by the envelope 12 between the electrodes l6 and 18 to a selectable time varying electrical field.
- a suitable fill tube 22 may be provided communicating with the chamber 10 through the envelope 12 and having a valve or other suitable closure means 24 therein to selectively control the nature and pressure of the gas within the envelope 12.
- the envelope 12 defining the chamber 10 preferably comprises an outer elongated hollow glass cylindrical member 26, an inner elongated hollow glass cylindrical member 28, and apertured end plates and 32 sealed therebe- .tween in a suitable conventional manner.
- the cylindrical member 28 illustrated is substantially coextensive with the member 26 and is disposed in telescoping relationship thereto coaxially within the member 26 to define a chamber annular in cross section as is shown in FIG. 2.
- the central electrode 16 is preferably an elongaged metallic cylindrical member, e.g., a wire, telescoped within the central passage 14, but may be hollow.
- the outer electrode 18 is preferably a hollow cylindrical electrically conductive member circumferentially disposed round at least a portion of the insulative member 26 and may, for example, be a metallic foil conformed to the radially outer surface of the envelope.
- the central electrode 16 preferably extends axially into the central passage 14 sufficiently so that an elongated annular portion of the chamber 10 is located between the electrodes 16 and 18.
- the application of a potential between the electrodes 16 and 18 creates an electric field between these electrodes, as is indicated by the lines 34 in FIG. 2.
- the electrode configuration i.e., the relative positions of the electrode and the relative dimensions thereof, cause the electric field to be more concentrated or dense in the vicinity of the central electrode 16 near the axis of the annular chamber 10.
- the gas in the chamber 10 will be excited sufficiently to create a gaseous plasma in the chamber.
- the plasma generally comprises highly reactive species such as ions, electrons and neutral fragmented particles in highly excited states. Since the exciting of the gas by the electric field creates the plasma, the plasma concentration of density generally conforms to the electric field concentration or density. Thus, the concentration or density of the plasma generated within the gas impervious envelope 12 varies between the outer cylindrical member 26 and the inner cylindrical member 28 in a manner related to the electric field concentration of density.
- the plasma is thereby concentrated around the inner cylindrical member 28 rather than being dispersed evenly throughout the chamber 10.
- This central concentration permits more efficient utilization of the plasma for treating substrates and permits selective exposure of the substrate to the plasma as will hereinafter be described.
- this central concentration of the plasma prevents excessive buildup of material on the inner wall of the outer cylindrical member 26.
- the relationship between the gas conditions within the envelope 12 and the gas conditions exteriorly thereof is desirably such that the plasma may be confined to the chamber 10.
- the electric potential applied to the electrodesl6 and 18 may thus be lower and the current density will be correspondingly less.
- This desirable relationship may be obtained by utilizing selected gases at predetermined pressures within the chamber 10, while exposing the electrodes outside the envelope 12 to the atmosphere.
- a monatomic inert gas such as argon or helium at atmospheric or slightly less than atmospheric pressure may be utilized in the chamber 10.
- a plasma will be more readily generated within the chamber 10 than exteriorly thereof.
- the potential of the RF signal applied to the electrodes set at a value corresponding to the potential required to generate a plasma within the chamber 10, but below the potential required to generate a plasma in the vicinity of the electrodes 16 and 18 externally of the chamber 10, the current which fiows between the electrodes 16 and 18 will not be appreciably affected by the ion fiow within the highly electrically conductive plasma since these electrodes are electrically isolated from the plasma.
- plasma within the chamber 10 is not contacted by the electrodes 16 and 18 and therefore not contaminated by the electrodes.
- a substrate 36 to be treated within the generated plasma may be introduced into the chamber through a vacuum lock 38 subsequently described in greater detail in connection with FIGS. 6 and 7.
- the substrate 36 may be passed through the chamber 10 in contact with the plasma therein at a rate determined by the particular treatment process to which the substrate is being subjected.
- the substrate 36 may be an organic polymeric fiber, such as a thermoplastic or thermosetting polyester, polyamide, cellulosic or polyolefin material, the surface of which is to be treated in the plasma to obtain a paticular surface modification as is described in greater detail in the previously discussed US. Pat. application Ser. No. 93,350, by Florle et al.
- the substrate 36 may alternatively be a carbonaceous fibrous material to be treated in the plasma within the chamber 10 as is described in greater detail in the previously discussed U.S. Pat. application Ser. No. 99,169, by Kenneth C. Hou.
- a coating may be deposited on a suitable substrate by generating a suitable gaseous plasma and contacting the substrate with this plasma.
- a more detailed description of the substrate and gases utilized in one such coating technique may be had by reference to the previously discussed U.S. Pat. application Ser. No. 88,358, by Kenneth C. Hou.
- the above referenced Fortress and Hou patent applications are hereby incorporated herein by reference.
- the substrate 36 may be introduced into the chamber 10 at an a angle with respect to the central electrode 16 as is illustrated in FIG. 3.
- the substrate 36 might thereby follow a path generally indicated at 40 which subjects the substrate 36 to varying concentrations of the plasma as it passes through the chamber 10.
- one or more substrates 36 may be passed through the chamber 10 substantially parallel to the electrodes 16 at a selected radial distance thereform, thereby permitting the exposure of the substrates 36 to a selected plasma concentration.
- the vacuum One end 42 of the tube 40 is flared or funnel-shaped providing a transition zone for gently compressing the fiber bundle without damage thereto.
- the tube 40 may also narrow slightly along the length thereof to further compress the fiber bundle during the introduction thereof into the chamber 10. It should be noted that when the substrate is a tightly packed fiber bundle or a single filament substrate, the diameter of the tube 40 may be the same or slightly larger than the substrate to prevent damage thereto.
- At least two fluid passages 44 and 46 are spaced along the length of the tube 40 and communicate with the interior thereof. Each of the passages 44 and 46 is connected to associated pressure sources 48 and 50, respectively.
- the gas pressure applied to the passage 46 preferably approximates the pressure in the chamber 10, while the pressure applied through the passage 44 is preferably slightly higher than the pressure in the chamber 10, thereby creating a pressure differential along the interior of the tube 40.
- This pressure differential together with the mechanical compression of the substrate, prevents gas leakage into the chamber 10 when, for example, the pressure in the chamber 10 is less than the pressure outside the chamber 10.
- a hollow tube 40 sealed to the end plate 30 of the envelope 12 communicates interiorly with the chamber 10 and provides a passage through which the substrate 36 may be introduced into the chamber 10.
- the substrate 36 may be, for example, a loosely packed fiber bundle through which air leakage ordinarily occurs during the passage thereof between chambers at different pressures.
- the tube 40 generally conforms in cross-section to the shape of the substrate, i.e., the bundle of fibers, but is slightly smaller in cross-section than the bundle causing the fibers to be inwardly compressed against each other and against the internal wall of the tube 40.
- the fiber bundle is generally circular in a very slight pressure differential, e.g., 1 mm. Hg, can be maintained between the chamber 10 and the passage 46.
- An even smaller pressure differential between these two points may be obtained by increasing the number of lateral fluid passages 44 and 46, thereby providing even greater gas integrity between the spaces.
- the electrodes are isolated from the highly conductive plasma created within the envelope, resulting in greater efficiency as well as greater current control and eliminating contamination of the plasma by the electrodes.
- Control of the substrate treatment process is facilitated by the controlled plasma concentration achieved in'the present invention.
- the substrate may be selectively contacted by the proper concentration of plasma by selecting the path which the substrate follows through the generated plasma. Additionally, the plasma is concentrated in one location within the chamber resulting in more efficient substrate treatment and less material buildup on the interior walls of the envelope.
- continuous substrates may be treated without adverse effects on the conditions within the re action chamber since isolation is provided between the interior and exterior of the envelope.
- the substrate may pass from an area at one pressure, into the envelope which may be at another pressure, and then into an area at yet a different pressure without any substantial gas leakage.
- a method for creating a plasma for the treatment of a substrate without exposure of the substrate to a high current density comprising the steps of:
- a method for creating a plasma for the treatment of a substrate without contamination of the plasma comprising the steps of:
- the envelope defining a chamber isolated from the electrodes; modifying the gas conditions within the envelope;
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US00292348A US3824398A (en) | 1971-08-12 | 1972-09-26 | Method for plasma treatment of substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US17128271A | 1971-08-12 | 1971-08-12 | |
US00292348A US3824398A (en) | 1971-08-12 | 1972-09-26 | Method for plasma treatment of substrates |
Publications (1)
Publication Number | Publication Date |
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US3824398A true US3824398A (en) | 1974-07-16 |
Family
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US00292348A Expired - Lifetime US3824398A (en) | 1971-08-12 | 1972-09-26 | Method for plasma treatment of substrates |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4057064A (en) * | 1976-01-16 | 1977-11-08 | Valleylab, Inc. | Electrosurgical method and apparatus for initiating an electrical discharge in an inert gas flow |
US4123316A (en) * | 1975-10-06 | 1978-10-31 | Hitachi, Ltd. | Plasma processor |
US4524080A (en) * | 1982-06-16 | 1985-06-18 | House Food Industrial Company Limited | Method of improving quality of wheat flour |
US4656355A (en) * | 1985-06-24 | 1987-04-07 | Pfaff Ernest H | Corona treatment apparatus |
US4980196A (en) * | 1990-02-14 | 1990-12-25 | E. I. Du Pont De Nemours And Company | Method of coating steel substrate using low temperature plasma processes and priming |
US4981713A (en) * | 1990-02-14 | 1991-01-01 | E. I. Du Pont De Nemours And Company | Low temperature plasma technology for corrosion protection of steel |
US5576076A (en) * | 1993-04-29 | 1996-11-19 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Process for creating a deposit of silicon oxide on a traveling solid substrate |
WO1997021331A1 (en) * | 1995-12-05 | 1997-06-12 | Cambridge Fluid Limited | Apparatus for generating plasma |
US6514449B1 (en) | 2000-09-22 | 2003-02-04 | Ut-Battelle, Llc | Microwave and plasma-assisted modification of composite fiber surface topography |
WO2005049226A1 (en) * | 2003-11-18 | 2005-06-02 | Stanislav Begounov | Method and device for continuous treatment of the surface of an elongate object |
US20090277772A1 (en) * | 2006-04-15 | 2009-11-12 | Toho Tenax Co., Ltd. | Process for Continous Production of Carbon Fibres |
US7824495B1 (en) | 2005-11-09 | 2010-11-02 | Ut-Battelle, Llc | System to continuously produce carbon fiber via microwave assisted plasma processing |
US20110104489A1 (en) * | 2007-10-11 | 2011-05-05 | Toho Tenax Co., Ltd. | Hollow carbon fibres and process for their production |
US20120181162A1 (en) * | 2009-07-28 | 2012-07-19 | Marina Vladimirovna Soboleva | Method for Stabilizing Carbon-Containing Fibre and Method for Producing Carbon Fibre |
EP2966207A1 (en) * | 2014-07-09 | 2016-01-13 | La Navetta S.r.l. | Multi-purpose apparatus for processing yarns or threads and the like |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2939956A (en) * | 1958-06-02 | 1960-06-07 | Milprint Inc | Method and apparatus for treating plastic materials |
US2977475A (en) * | 1958-04-30 | 1961-03-28 | Inst Textile De France | Method of and apparatus for processing textile fibre materials |
US2985573A (en) * | 1957-04-30 | 1961-05-23 | Saint Gobain | Preparation of metallic elements |
US3655438A (en) * | 1969-10-20 | 1972-04-11 | Int Standard Electric Corp | Method of forming silicon oxide coatings in an electric discharge |
-
1972
- 1972-09-26 US US00292348A patent/US3824398A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2985573A (en) * | 1957-04-30 | 1961-05-23 | Saint Gobain | Preparation of metallic elements |
US2977475A (en) * | 1958-04-30 | 1961-03-28 | Inst Textile De France | Method of and apparatus for processing textile fibre materials |
US2939956A (en) * | 1958-06-02 | 1960-06-07 | Milprint Inc | Method and apparatus for treating plastic materials |
US3655438A (en) * | 1969-10-20 | 1972-04-11 | Int Standard Electric Corp | Method of forming silicon oxide coatings in an electric discharge |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US4123316A (en) * | 1975-10-06 | 1978-10-31 | Hitachi, Ltd. | Plasma processor |
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