US3832219A - Methods of treating steel surfaces to modify their structure - Google Patents
Methods of treating steel surfaces to modify their structure Download PDFInfo
- Publication number
- US3832219A US3832219A US00238619A US23861972A US3832219A US 3832219 A US3832219 A US 3832219A US 00238619 A US00238619 A US 00238619A US 23861972 A US23861972 A US 23861972A US 3832219 A US3832219 A US 3832219A
- Authority
- US
- United States
- Prior art keywords
- ions
- modify
- carbon
- treated
- methods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract description 19
- 229910000831 Steel Inorganic materials 0.000 title description 6
- 239000010959 steel Substances 0.000 title description 6
- 150000002500 ions Chemical class 0.000 abstract description 12
- 238000002513 implantation Methods 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 229910052799 carbon Inorganic materials 0.000 description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 229910001430 chromium ion Inorganic materials 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 6
- -1 carbon ions Chemical class 0.000 description 5
- 239000007943 implant Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910000619 316 stainless steel Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
Definitions
- the present invention relates to methods of treating steel surfaces to modify their structure.
- a hard, resistant surface' may be produced on a low carbon (tough) steel core by subjecting a low carbon steel article, maintained at elevated temperatures (about 910 C.), to an atmosphere rich in carbon. This may be achieved by use of a hydrocarbon gas or by packing in charcoal. The carbon diffuses into the surface of the steel to a depth of about 0.05 in., forming a high carbon content surface which is subsequently quenched to martensite for maximum hardness and wear resistance. The hardness is dependent on the carbon content and increases as the carbon content increases.
- the thermal hardening process involves subjecting the articles to be treated to relatively high temperatures; in some circumstances, for example with stainless steel, this may be undesirable and it is one object of the present invention to provide a method of hardening stainless steel which does not involve the use of high temperatures.
- a method of treating a stainless steel surface to modify the structure of the surface wherein the surface is hardened by subjecting the surface to bombardment of carbon ions to implant carbon in the surface and thereby to' modify its structure.
- composition of the surface will be modified in addition to the structure of the surface.
- a somewhat similar technique may be applied to modifying the surface structure of mild steel by ion implantation, in the surface, of chromium ions.
- the depths of penetration of ions may be greater than is measured as Angstroms and can be such that a hardened structure is formed within a body rather than right at the surface.
- a hardened surface may be produced at a depth of say 0.001 in.
- a body can thus be formed in which a soft outer region is provided on a harder inner region.
- a body so treated to have a buried layer may have its outer region removed, down to the hardened surface, by abrading, grinding, etc.
- the depth to which ions are implanted depends on the energy of the ions, high energy giving rise to buried layers.
- Implantation may be carried out from low energies up to energies of several thousand kev.
- a typical working range is from l-200 kev. with energies in the range 50- kev. being practically convenient.
- the introduction of carbon into the surfaces by this ion implantation method offers advantages over methods involving the use of high temperatures and carbon rich atmospheres.
- the term low temperature is used in this specification to indicate temperatures of approximately room temperature.
- the implantation process may cause the temperature of the specimen undergoing implantation to rise slightly, say 1 or 2 0.; however, this is insignificant.
- surface hardened ball bearings, watch bearings and similar articles may be produced after they have been fabricated to the required tolerances in stainless steel; a hardened edge may be produced on a stainless steel razor blade.
- the cost of such a hardening process would be very small per item in the case of watch bearings, where, by virtue of their size, it would be possible to treat a multiplicity (perhaps several hundred) articles in one implantation operation.
- the regions of the surface to be treated by appropriate control of the ion beam, which may be typically a few millimetres in width; alternatively a mask may be used which permits the ion beam to contact only the exposed regions of the surface to be treated.
- regions of 316 stainless steel surfaces were treated with a beam of carbon ions.
- a sample of 316 stainless steel was mounted in the sample chamber of a linear accelerator and the chamber was evacuated.
- the linear accelerator was switched on and run-up in accordance with normal linear accelerator operating procedures until a beam of ions impinged on the target.
- the ions in this implantation operation had energies in the 100 kev. range.
- a carbon dioxide gas source was used and magnetic analysis was utilised to separate and select, from the ions produced by the source, carbon ions for implantation.
- the treated regions, where carbon ions had been implanted to a depth of a few thousand Angstroms, were found to be completely resistant to vibratory polishing, whilst the untreated regions of the surfaces were removed rather easily.
- mild steel surfaces were treated with a beam of chromium ions having energies in the 100 kev. range, using a linear acceleratorin a manner similar to that described above.
- a method of treating a mild steel surface to modify the structure of the surface whereby the corrosion resistance of the surface is increased comprising the steps of producing chromium ions, forming the chromium ions into a beam of predetermined energy such that the ions can penetrate the mild steel surface to be treated and directing the beam of chromium ions at the region to be treated thereby to cause chromium ions to be implanted into the 2.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB901371A GB1392811A (en) | 1971-04-07 | 1971-04-07 | Methods for treating steel to modify the structure thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
US3832219A true US3832219A (en) | 1974-08-27 |
Family
ID=9863673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00238619A Expired - Lifetime US3832219A (en) | 1971-04-07 | 1972-03-27 | Methods of treating steel surfaces to modify their structure |
Country Status (6)
Country | Link |
---|---|
US (1) | US3832219A (enrdf_load_stackoverflow) |
DE (1) | DE2216628C2 (enrdf_load_stackoverflow) |
FR (1) | FR2132712B1 (enrdf_load_stackoverflow) |
GB (1) | GB1392811A (enrdf_load_stackoverflow) |
NL (1) | NL179833C (enrdf_load_stackoverflow) |
SE (1) | SE384538B (enrdf_load_stackoverflow) |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3988955A (en) * | 1972-12-14 | 1976-11-02 | Engel Niels N | Coated steel product and process of producing the same |
DE2703392A1 (de) * | 1976-01-28 | 1977-08-04 | Atomic Energy Authority Uk | Verfahren zur behandlung von metallbearbeitungswerkzeugen, diese werkzeuge und ihre verwendung |
US4486247A (en) * | 1982-06-21 | 1984-12-04 | Westinghouse Electric Corp. | Wear resistant steel articles with carbon, oxygen and nitrogen implanted in the surface thereof |
US4565710A (en) * | 1984-06-06 | 1986-01-21 | The United States Of America As Represented By The Secretary Of The Navy | Process for producing carbide coatings |
US4629631A (en) * | 1984-09-14 | 1986-12-16 | United Kingdom Atomic Energy Authority | Surface treatment of metals |
US4640169A (en) * | 1982-01-25 | 1987-02-03 | Westinghouse Electric Corp. | Cemented carbide cutting tools and processes for making and using |
US4645715A (en) * | 1981-09-23 | 1987-02-24 | Energy Conversion Devices, Inc. | Coating composition and method |
US4704168A (en) * | 1984-10-16 | 1987-11-03 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ion-beam nitriding of steels |
US4764394A (en) * | 1987-01-20 | 1988-08-16 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma source ion implantation |
US4915746A (en) * | 1988-08-15 | 1990-04-10 | Welsch Gerhard E | Method of forming high temperature barriers in structural metals to make such metals creep resistant at high homologous temperatures |
DE4238784C1 (de) * | 1992-11-17 | 1994-01-20 | Multi Arc Oberflaechentechnik | Verfahren zur Verringerung der Korrosionsanfälligkeit und Erhöhung der Verschleißbeständigkeit von Gegenständen aus niedrig legierten Stählen |
US5985742A (en) * | 1997-05-12 | 1999-11-16 | Silicon Genesis Corporation | Controlled cleavage process and device for patterned films |
US6027988A (en) * | 1997-05-28 | 2000-02-22 | The Regents Of The University Of California | Method of separating films from bulk substrates by plasma immersion ion implantation |
US6098655A (en) * | 1996-12-03 | 2000-08-08 | Carolina Power & Light Company | Alleviating sticking of normally closed valves in nuclear reactor plants |
US6221740B1 (en) | 1999-08-10 | 2001-04-24 | Silicon Genesis Corporation | Substrate cleaving tool and method |
US6263941B1 (en) | 1999-08-10 | 2001-07-24 | Silicon Genesis Corporation | Nozzle for cleaving substrates |
US6284631B1 (en) | 1997-05-12 | 2001-09-04 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US6291326B1 (en) | 1998-06-23 | 2001-09-18 | Silicon Genesis Corporation | Pre-semiconductor process implant and post-process film separation |
US6291313B1 (en) | 1997-05-12 | 2001-09-18 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US6500732B1 (en) | 1999-08-10 | 2002-12-31 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses |
US6548382B1 (en) | 1997-07-18 | 2003-04-15 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process |
US20030124815A1 (en) * | 1999-08-10 | 2003-07-03 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses |
US20040067644A1 (en) * | 2002-10-04 | 2004-04-08 | Malik Igor J. | Non-contact etch annealing of strained layers |
US20090277314A1 (en) * | 2008-05-07 | 2009-11-12 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region |
US7776717B2 (en) | 1997-05-12 | 2010-08-17 | Silicon Genesis Corporation | Controlled process and resulting device |
US7811900B2 (en) | 2006-09-08 | 2010-10-12 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a thick layer transfer process |
US20100323113A1 (en) * | 2009-06-18 | 2010-12-23 | Ramappa Deepak A | Method to Synthesize Graphene |
US8293619B2 (en) | 2008-08-28 | 2012-10-23 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled propagation |
US8329557B2 (en) | 2009-05-13 | 2012-12-11 | Silicon Genesis Corporation | Techniques for forming thin films by implantation with reduced channeling |
US8330126B2 (en) | 2008-08-25 | 2012-12-11 | Silicon Genesis Corporation | Race track configuration and method for wafering silicon solar substrates |
US8993410B2 (en) | 2006-09-08 | 2015-03-31 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE668639C (de) * | 1932-07-20 | 1938-12-07 | Bernhard Berghaus | Verfahren zum Vergueten von Metallgegenstaenden |
CH342980A (de) * | 1950-11-09 | 1959-12-15 | Berghaus Elektrophysik Anst | Verfahren zur Diffusionsbehandlung von Rohren aus Eisen und Stahl oder deren Legierungen |
-
1971
- 1971-04-07 GB GB901371A patent/GB1392811A/en not_active Expired
-
1972
- 1972-03-27 US US00238619A patent/US3832219A/en not_active Expired - Lifetime
- 1972-04-06 DE DE2216628A patent/DE2216628C2/de not_active Expired
- 1972-04-06 FR FR7212086A patent/FR2132712B1/fr not_active Expired
- 1972-04-06 SE SE7204441A patent/SE384538B/xx unknown
- 1972-04-07 NL NLAANVRAGE7204711,A patent/NL179833C/xx not_active IP Right Cessation
Cited By (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3988955A (en) * | 1972-12-14 | 1976-11-02 | Engel Niels N | Coated steel product and process of producing the same |
DE2703392A1 (de) * | 1976-01-28 | 1977-08-04 | Atomic Energy Authority Uk | Verfahren zur behandlung von metallbearbeitungswerkzeugen, diese werkzeuge und ihre verwendung |
US4105443A (en) * | 1976-01-28 | 1978-08-08 | United Kingdom Atomic Energy Authority | Metal-forming dies |
US4645715A (en) * | 1981-09-23 | 1987-02-24 | Energy Conversion Devices, Inc. | Coating composition and method |
US4640169A (en) * | 1982-01-25 | 1987-02-03 | Westinghouse Electric Corp. | Cemented carbide cutting tools and processes for making and using |
US4486247A (en) * | 1982-06-21 | 1984-12-04 | Westinghouse Electric Corp. | Wear resistant steel articles with carbon, oxygen and nitrogen implanted in the surface thereof |
US4565710A (en) * | 1984-06-06 | 1986-01-21 | The United States Of America As Represented By The Secretary Of The Navy | Process for producing carbide coatings |
US4629631A (en) * | 1984-09-14 | 1986-12-16 | United Kingdom Atomic Energy Authority | Surface treatment of metals |
US4704168A (en) * | 1984-10-16 | 1987-11-03 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ion-beam nitriding of steels |
US4764394A (en) * | 1987-01-20 | 1988-08-16 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma source ion implantation |
US4915746A (en) * | 1988-08-15 | 1990-04-10 | Welsch Gerhard E | Method of forming high temperature barriers in structural metals to make such metals creep resistant at high homologous temperatures |
DE4238784C1 (de) * | 1992-11-17 | 1994-01-20 | Multi Arc Oberflaechentechnik | Verfahren zur Verringerung der Korrosionsanfälligkeit und Erhöhung der Verschleißbeständigkeit von Gegenständen aus niedrig legierten Stählen |
US6098655A (en) * | 1996-12-03 | 2000-08-08 | Carolina Power & Light Company | Alleviating sticking of normally closed valves in nuclear reactor plants |
US7348258B2 (en) | 1997-05-12 | 2008-03-25 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US7410887B2 (en) | 1997-05-12 | 2008-08-12 | Silicon Genesis Corporation | Controlled process and resulting device |
US6013563A (en) * | 1997-05-12 | 2000-01-11 | Silicon Genesis Corporation | Controlled cleaning process |
US7846818B2 (en) | 1997-05-12 | 2010-12-07 | Silicon Genesis Corporation | Controlled process and resulting device |
US6048411A (en) * | 1997-05-12 | 2000-04-11 | Silicon Genesis Corporation | Silicon-on-silicon hybrid wafer assembly |
US5994207A (en) * | 1997-05-12 | 1999-11-30 | Silicon Genesis Corporation | Controlled cleavage process using pressurized fluid |
US6146979A (en) * | 1997-05-12 | 2000-11-14 | Silicon Genesis Corporation | Pressurized microbubble thin film separation process using a reusable substrate |
US6155909A (en) * | 1997-05-12 | 2000-12-05 | Silicon Genesis Corporation | Controlled cleavage system using pressurized fluid |
US6159824A (en) * | 1997-05-12 | 2000-12-12 | Silicon Genesis Corporation | Silicon-on-silicon wafer bonding process using a thin film blister-separation method |
US6159825A (en) * | 1997-05-12 | 2000-12-12 | Silicon Genesis Corporation | Controlled cleavage thin film separation process using a reusable substrate |
US6162705A (en) * | 1997-05-12 | 2000-12-19 | Silicon Genesis Corporation | Controlled cleavage process and resulting device using beta annealing |
US6187110B1 (en) | 1997-05-12 | 2001-02-13 | Silicon Genesis Corporation | Device for patterned films |
US7776717B2 (en) | 1997-05-12 | 2010-08-17 | Silicon Genesis Corporation | Controlled process and resulting device |
US6245161B1 (en) | 1997-05-12 | 2001-06-12 | Silicon Genesis Corporation | Economical silicon-on-silicon hybrid wafer assembly |
US7759217B2 (en) | 1997-05-12 | 2010-07-20 | Silicon Genesis Corporation | Controlled process and resulting device |
US6284631B1 (en) | 1997-05-12 | 2001-09-04 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US6010579A (en) * | 1997-05-12 | 2000-01-04 | Silicon Genesis Corporation | Reusable substrate for thin film separation |
US6291313B1 (en) | 1997-05-12 | 2001-09-18 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US6294814B1 (en) | 1997-05-12 | 2001-09-25 | Silicon Genesis Corporation | Cleaved silicon thin film with rough surface |
US6391740B1 (en) | 1997-05-12 | 2002-05-21 | Silicon Genesis Corporation | Generic layer transfer methodology by controlled cleavage process |
US6458672B1 (en) | 1997-05-12 | 2002-10-01 | Silicon Genesis Corporation | Controlled cleavage process and resulting device using beta annealing |
US6486041B2 (en) | 1997-05-12 | 2002-11-26 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US7371660B2 (en) | 1997-05-12 | 2008-05-13 | Silicon Genesis Corporation | Controlled cleaving process |
US6511899B1 (en) | 1997-05-12 | 2003-01-28 | Silicon Genesis Corporation | Controlled cleavage process using pressurized fluid |
US5985742A (en) * | 1997-05-12 | 1999-11-16 | Silicon Genesis Corporation | Controlled cleavage process and device for patterned films |
US6528391B1 (en) | 1997-05-12 | 2003-03-04 | Silicon Genesis, Corporation | Controlled cleavage process and device for patterned films |
US20070123013A1 (en) * | 1997-05-12 | 2007-05-31 | Silicon Genesis Corporation | Controlled process and resulting device |
US7160790B2 (en) | 1997-05-12 | 2007-01-09 | Silicon Genesis Corporation | Controlled cleaving process |
US6558802B1 (en) | 1997-05-12 | 2003-05-06 | Silicon Genesis Corporation | Silicon-on-silicon hybrid wafer assembly |
US20030113983A1 (en) * | 1997-05-12 | 2003-06-19 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US20050186758A1 (en) * | 1997-05-12 | 2005-08-25 | Silicon Genesis Corporation | Controlled cleaving process |
US6632724B2 (en) | 1997-05-12 | 2003-10-14 | Silicon Genesis Corporation | Controlled cleaving process |
US20050070071A1 (en) * | 1997-05-12 | 2005-03-31 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US6790747B2 (en) | 1997-05-12 | 2004-09-14 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
US6027988A (en) * | 1997-05-28 | 2000-02-22 | The Regents Of The University Of California | Method of separating films from bulk substrates by plasma immersion ion implantation |
US6548382B1 (en) | 1997-07-18 | 2003-04-15 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process |
US6890838B2 (en) | 1997-07-18 | 2005-05-10 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process |
US20040097055A1 (en) * | 1997-07-18 | 2004-05-20 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process |
US6291326B1 (en) | 1998-06-23 | 2001-09-18 | Silicon Genesis Corporation | Pre-semiconductor process implant and post-process film separation |
US6221740B1 (en) | 1999-08-10 | 2001-04-24 | Silicon Genesis Corporation | Substrate cleaving tool and method |
US6513564B2 (en) | 1999-08-10 | 2003-02-04 | Silicon Genesis Corporation | Nozzle for cleaving substrates |
US6500732B1 (en) | 1999-08-10 | 2002-12-31 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses |
US7056808B2 (en) | 1999-08-10 | 2006-06-06 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses |
US6554046B1 (en) | 1999-08-10 | 2003-04-29 | Silicon Genesis Corporation | Substrate cleaving tool and method |
US6263941B1 (en) | 1999-08-10 | 2001-07-24 | Silicon Genesis Corporation | Nozzle for cleaving substrates |
US20030124815A1 (en) * | 1999-08-10 | 2003-07-03 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses |
US20040067644A1 (en) * | 2002-10-04 | 2004-04-08 | Malik Igor J. | Non-contact etch annealing of strained layers |
US8187377B2 (en) | 2002-10-04 | 2012-05-29 | Silicon Genesis Corporation | Non-contact etch annealing of strained layers |
US8993410B2 (en) | 2006-09-08 | 2015-03-31 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions |
US7811900B2 (en) | 2006-09-08 | 2010-10-12 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a thick layer transfer process |
US9640711B2 (en) | 2006-09-08 | 2017-05-02 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions |
US9356181B2 (en) | 2006-09-08 | 2016-05-31 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions |
US20090277314A1 (en) * | 2008-05-07 | 2009-11-12 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region |
US9362439B2 (en) | 2008-05-07 | 2016-06-07 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region |
US11444221B2 (en) | 2008-05-07 | 2022-09-13 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region |
US8330126B2 (en) | 2008-08-25 | 2012-12-11 | Silicon Genesis Corporation | Race track configuration and method for wafering silicon solar substrates |
US8293619B2 (en) | 2008-08-28 | 2012-10-23 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled propagation |
US8329557B2 (en) | 2009-05-13 | 2012-12-11 | Silicon Genesis Corporation | Techniques for forming thin films by implantation with reduced channeling |
US20100323113A1 (en) * | 2009-06-18 | 2010-12-23 | Ramappa Deepak A | Method to Synthesize Graphene |
Also Published As
Publication number | Publication date |
---|---|
NL179833C (nl) | 1986-11-17 |
SE384538B (sv) | 1976-05-10 |
GB1392811A (en) | 1975-04-30 |
DE2216628A1 (de) | 1972-10-19 |
FR2132712A1 (enrdf_load_stackoverflow) | 1972-11-24 |
FR2132712B1 (enrdf_load_stackoverflow) | 1976-10-29 |
NL179833B (nl) | 1986-06-16 |
NL7204711A (enrdf_load_stackoverflow) | 1972-10-10 |
DE2216628C2 (de) | 1982-07-15 |
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