US3820596A - Heat transporting device - Google Patents

Heat transporting device Download PDF

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Publication number
US3820596A
US3820596A US00218174A US21817472A US3820596A US 3820596 A US3820596 A US 3820596A US 00218174 A US00218174 A US 00218174A US 21817472 A US21817472 A US 21817472A US 3820596 A US3820596 A US 3820596A
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US
United States
Prior art keywords
container
heat transmission
heat
transmission wall
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00218174A
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English (en)
Inventor
E Weinhardt
Wit C De
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US Philips Corp
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US Philips Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Philips Corp filed Critical US Philips Corp
Application granted granted Critical
Publication of US3820596A publication Critical patent/US3820596A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • Theinvention relates to a heat transporting device comprising a closed container having at one end at least one first and at the other end at least one second heat transmission wall; the container comprises a heat transporting medium which absorbs ther rnalen ergy through the first heat-transmission wall while changing from the liquid phase into the vapor phase, and delivers thermal energy to the second heat transmission wall while changing from the vapor phase into the liquid phase.
  • the container furthermore comprises a porous mass which corn rnunicatesthe first heat trans mission wall with the second heat transmission wall in such manner that medium condensed through said mass on the second heat transmission wall can flow back to the first heat transmission wall by capillary ac- Devices of this type are known from the U. S. Pat. Nos. 3,229,759 and 3,402,767. With such devices, large amounts of thermal energy can be transported substantially without drop in temperature and without using a pumping device and without further moving components. Liquid heat transporting medium which evaporates near the first heat transmission wall moves in the vapor phase to the second heat transmission wall as a result of the lower vapor pressure prevailing there as a result of the slightly lower temperature at that area.
  • the vapor then condenses on the second heat transmission wall while delivering the heat of evaporation to said wall, after which the condensate is returned via the porous mass by capillary action, while using the surface stress of the condensate, to the first heat transmission wall to be evaporated there again.
  • por ou's mass ensures that condensate can flow back from the second to the first heat transmission wall in all circumstances,even against gravity or without the use of gravity.
  • Porous masses often consist of ceramic materials, sintered metal powders, a composition of gauzes of wire-shaped or band-shaped material, arrangements of (glass) fibres or pipes or of combinations thereof the porous mass communicating the first heat transmission wall with the second heat transmission wall may cover the surface of the wall of the container entirely or only partly. In the latter case said mass may also be provided inside the container in such manner that it has direct contact only with the two heat transmission walls and is not in contact with the remaining walls of the container. 7' in order to hold tfi' porous massinside the container in its place, it is known from FIGS.
  • a problem is, however, that, at the usually high operating temperatures of the heat transporting device, the resilience of the spring decreases under the influence of said high temperatures to such an extent and associated or not associated with plastic elongation, that the force of pressure becomes too low and the porous mass works loose from the wall of the container during operation.
  • a capillary structure of the porous mass can be damaged to such an extent that said mass is no longer useful for the return of condensate.
  • the working loose may also result in an entire or partial blocking by the porous mass of the duct through which the transport of medium vapor takes place. The operation of the device is disturbed in both cases and boiling dry and consequently tearing of the heat transmission wall to which thermal energy is supplied may occur.
  • the heat transporting device comprises a closed container in which at least one resilient element is arranged which keeps the porous mass in its place relative to the container by resilience action.
  • the resilient element is internally hollow and the cavity inside the element forms a closed space in which a filling medium is present,
  • the resilient element exerts an extra force on the proous mass under the influence of the pressure differential across these for maintaining the place of the said mass within the container.
  • the resilience of the resilient element at room temperature will often be sufficient to keep the porous mass in its place, on the other hand it is not always objectionable that the porous mass, for example gauze, is not rigidly pressed at room temperature, because transport of condensate does not take place all the same
  • the pressure in the container at room temperature is usually low, since the container is often evacuated so that the process of evaporation condensation of the transporting medium can be performed readily.
  • the resilient element need not specially exert a pressure force on the porous mass (compression spring), but it is also possible that said mass is kept in its space in that a pulling force is exerted on it (tension spring). All this depends of course on the arrangement of the porous mass in the container.
  • a rise in pressure of the filling medium in the resilient element results in an increase of the compression and pulling force, respectively, on the porous mass.
  • a rise in pressure of the filling medium-herein may result in an increase of the diameter of the spring and a decrease in the length of the spring.
  • the increase in diameter may be used to increase the pressure force exerted on a porous mass, while the decrease in length may be used in the case in which the pulling force on a porous mass should be increased.
  • filling media are to be considered all kinds of materials which may be solid, liquid or gaseous at room temperature, provided the vapor and gas pressures, re spectively, of said materials, at any rate at the operating temperature of the device and possibly also at room temperature, are higher than the pressure in the container.
  • irT'a' container as a heat transporting medium, which container is otherwise evacuated, potassium or caesium,
  • the device in a favorable embodiment of the deviceaccording provides the advantage that, in the case of unexpected leakage of the resilient element, no chemical reactions occur between the heat transporting medium and the filling medium, so that the operation of the device is not disturbed and the device is not damaged.
  • mass 4 whichhas a capillary structure and in this caseconsists of layers of gauze is provided on the inner wall of the container.
  • the container comprises a suitably chosen quantity of sodium as a heat transporting medium and is otherwise evacuated. Furthermore, a helical spring 3 is arranged in the container as a resilient element which exerts a special force on the layers of gauze 4 by which said layers are pressed against the wall of the container.
  • the helical spring 3 is internally hollow which is shown in detail in a broken-away part 6.
  • the cavity inside the spring constitutes a closed space in which a quantity of argon is present as a filling medium.
  • liquid sodium absorbs thermal energy through the first heat transmission wall 2 from a heat source, not shown, as a result of which said sodium evaporates.
  • the vapor then flows to the second heat transmission wall 3 as a result of the lower vapor pressure prevailing there owing to the slightly lower temperature at the area and condenses on said wall while supplying the heat of evaporation absorbed near the 4 first heat transmission wall 2.
  • the return of condensate takes place irrespective of the position of the container so even against gravity or without the use of gravity.
  • the vapor pressure of the sodium in the evacuated container is 459 Torr g l Torr i mm mercury pressure).
  • bf 'argbifiii'tii helical spring Sit is achieved that at the said high temperature the argon pressure in the spring is higher than 450 Torr, for example 2 atm.
  • a heat transporting device comprising a closed container having at one end at least one first and at the other end at least one second heat transmission wall, said container comprising a heat transporting medium which absorbs thermal energy through the first heat transmission wall while changing from the liquid phase into the vapor phase and delivers thermal energy to the second heat transmission wall while changing from the vapor phase into the liquid phase, the container comprising a porous mass which communicates the first heat transmission wall with the second heat transmission wall in such manner that medium condensed through said mass on the second heat transmission wall can flow back by capillary action to the first heat transmission wall, at least one resilient element being furthermore arranged in the container and keeping the porous mass in its place relative to the container by resilience action, characterized in that the resilient element is internally hollow and the cavity inside the element forms a closed space in which a filling medium is present thev pressure of which, at least at the operating temperature of the device, is higher than the pressure in the container and the resilient elements exerts an extra force on the porous mass under the influence of the pressure differential across these for maintaining the place of the
  • the filling medium is an inert gas.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
US00218174A 1971-01-27 1972-01-17 Heat transporting device Expired - Lifetime US3820596A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101035A NL7101035A (zh) 1971-01-27 1971-01-27

Publications (1)

Publication Number Publication Date
US3820596A true US3820596A (en) 1974-06-28

Family

ID=19812336

Family Applications (1)

Application Number Title Priority Date Filing Date
US00218174A Expired - Lifetime US3820596A (en) 1971-01-27 1972-01-17 Heat transporting device

Country Status (7)

Country Link
US (1) US3820596A (zh)
JP (1) JPS4715741A (zh)
CA (1) CA940117A (zh)
DE (1) DE2164970A1 (zh)
FR (1) FR2123459B1 (zh)
IT (1) IT946883B (zh)
NL (1) NL7101035A (zh)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753154A (en) * 1984-05-10 1988-06-28 Fuji Electric Corporate Research And Development Ltd. Gun barrel for tank
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6446706B1 (en) * 2000-07-25 2002-09-10 Thermal Corp. Flexible heat pipe
US20040040696A1 (en) * 2002-08-21 2004-03-04 Samsung Electronics Co., Ltd. Flat heat transferring device and method of fabricating the same
US20070119571A1 (en) * 2005-11-30 2007-05-31 Fujitsu Limited Electronic device cooling apparatus
US20080203081A1 (en) * 2006-12-01 2008-08-28 Honeywell International Inc. Variable thermal resistor system
US20090288808A1 (en) * 2008-05-26 2009-11-26 Chi-Te Chin Quick temperature-equlizing heat-dissipating device
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US20150144315A1 (en) * 2013-11-27 2015-05-28 Subtron Technology Co., Ltd. Heat dissipation substrate
US9086229B1 (en) 2006-10-13 2015-07-21 Hrl Laboratories, Llc Optical components from micro-architected trusses
US9229162B1 (en) 2006-10-13 2016-01-05 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US9546826B1 (en) * 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US9758382B1 (en) 2011-01-31 2017-09-12 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US11112186B2 (en) * 2019-04-18 2021-09-07 Furukawa Electric Co., Ltd. Heat pipe heatsink with internal structural support plate

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU165381B (zh) * 1972-06-20 1974-08-28
JPS5729149B2 (zh) * 1974-11-11 1982-06-21
JPS51130585A (en) * 1975-05-02 1976-11-12 Sanraku Inc Process for producing microbial cells
DE2532888C3 (de) * 1975-07-23 1981-07-09 Basf Ag, 6700 Ludwigshafen Stoffentlüfter für die Papierfabrikation
JPS5229656U (zh) * 1975-07-31 1977-03-02
US4050250A (en) * 1975-10-30 1977-09-27 Eaton Corporation Heat transfer element
JPS5264952U (zh) * 1976-09-29 1977-05-13
JPS5459390A (en) * 1977-10-14 1979-05-12 Mitsubishi Gas Chem Co Inc Preparation of yeast cells
DE2834593A1 (de) * 1978-08-07 1980-02-28 Kabel Metallwerke Ghh Waermetauscher in form eines rohres

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414050A (en) * 1967-04-11 1968-12-03 Navy Usa Heat pipe control apparatus

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753154A (en) * 1984-05-10 1988-06-28 Fuji Electric Corporate Research And Development Ltd. Gun barrel for tank
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6446706B1 (en) * 2000-07-25 2002-09-10 Thermal Corp. Flexible heat pipe
US20040040696A1 (en) * 2002-08-21 2004-03-04 Samsung Electronics Co., Ltd. Flat heat transferring device and method of fabricating the same
US7044201B2 (en) * 2002-08-21 2006-05-16 Samsung Electronics Co., Ltd. Flat heat transferring device and method of fabricating the same
US8230901B2 (en) * 2005-11-30 2012-07-31 Fujitsu Limited Electronic device cooling apparatus
US20070119571A1 (en) * 2005-11-30 2007-05-31 Fujitsu Limited Electronic device cooling apparatus
US9086229B1 (en) 2006-10-13 2015-07-21 Hrl Laboratories, Llc Optical components from micro-architected trusses
US9229162B1 (en) 2006-10-13 2016-01-05 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US20080203081A1 (en) * 2006-12-01 2008-08-28 Honeywell International Inc. Variable thermal resistor system
US20090288808A1 (en) * 2008-05-26 2009-11-26 Chi-Te Chin Quick temperature-equlizing heat-dissipating device
US8813834B2 (en) * 2008-05-26 2014-08-26 Chi-Te Chin Quick temperature-equlizing heat-dissipating device
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US9546826B1 (en) * 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US9758382B1 (en) 2011-01-31 2017-09-12 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US20150144315A1 (en) * 2013-11-27 2015-05-28 Subtron Technology Co., Ltd. Heat dissipation substrate
US11112186B2 (en) * 2019-04-18 2021-09-07 Furukawa Electric Co., Ltd. Heat pipe heatsink with internal structural support plate

Also Published As

Publication number Publication date
DE2164970A1 (zh) 1972-08-17
FR2123459A1 (zh) 1972-09-08
CA940117A (en) 1974-01-15
NL7101035A (zh) 1972-07-31
JPS4715741A (zh) 1972-08-25
IT946883B (it) 1973-05-21
FR2123459B1 (zh) 1975-06-13

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