US3811062A

US3811062A - Gas discharge panel

Info

Publication number: US3811062A
Application number: US00352061A
Authority: US
Inventors: S Andoh; N Nakayama; Y Shirouchi
Original assignee: Fujitsu Ltd
Current assignee: Fujitsu Ltd
Priority date: 1972-04-18
Filing date: 1973-04-17
Publication date: 1974-05-14
Anticipated expiration: 1991-05-14
Also published as: FR2180980B1; FR2180980A1; NL7305442A; NL176617B; DE2319738A1; GB1431093A; NL176617C; DE2319738B2

Abstract

The gas discharge panel disclosed in this application is composed of parallel electrode groups, a dielectric layer for covering the electrodes and a gas discharge space or gap in which a firing spot is produced through the discharge space via the dielectric layer when an electric signal is applied to the electrode pairs. The above-mentioned dielectric layers provide a suppression layer having a predetermined pattern which partially decreases leakage from the discharge field into the gas discharge space, that is, decreases the gas discharge in a position where a gas discharge is not required. In the gas discharge panel having a function of self-shift, this suppression layer has the form of a metallic strip, positioned at a right angle to these electrodes, or of a dielectric strip having a high dielectric constant, and constitutes a shift channel for the gas discharge spot. Further this supression layer is useful for carrying out a read-only memory type gas discharge by providing a predetermined pattern.

Description

United States Patent 1191 Andoh et al.

1451 May 14, 1974 GAS DISCHARGE PANEL [75] Inventors: Shizuo Andoh; Norihiko Nakayama,

both of Kobe; Yasunari Shirouchi, Akashi, all of Japan [73] Assignee: Fujitsu Limited, Kanagawa-ken,

Japan [22] Filed: Apr. 17, 1973 [2]] App]. No.: 352,061

Primary Examine rHerman Karl Saalbach Assistant Examiner-Darwin R, Hostetter Attorney, Agent, or Firm-Maleson, Kimmelman and Ratner 5 7 ABSTRACT The gas discharge panel disclosed in this application is composed of parallel electrode groups, a dielectric layer for covering the electrodes and a gas discharge space or gap in which a firing spot is produced through the discharge space via the dielectric layer when an electricsignal is applied to the electrode pairs.'The above-mentioned dielectric layers provide a suppression layer having a predetermined pattern which partially decreases leakage from the discharge field into the gas discharge space, that is,'decreases the gas discharge in a position where a gas discharge is not required. In the gas discharge panel having a function of self-shift, this suppression layer has the form of a metallic strip, positioned at a right angle to these electrodes, or of a dielectric strip having a high dielectric constant, and constitutes a shift channel for the gas discharge spot. Further this supression layer is useful for carrying out a read-only memory type gas discharge by providing a predetermined pattern.

7 Claims, 25 Drawing Figures PATENTEDHAY 14 1914 381 1.062

SHEET an? 7- PATENTEDHAY 14 1974 3.81 l, 0632

sum

5 or 7 F79. m Hg. /05 F/g. /06

Hg /00 Fig. /0E

PATENTED MAY 14 1974 SHEET 6 BF 7 F/g. lZB

PATENTEDMAY 14 1974 3.81 1.062

SHEET 7 OF 7 GAS DISCHARGE PANEL The present invention relates to a gas discharge panel used for memory or display, and especially to a novel construction which is preferable to a self-shift type gas discharge panel utilizing surface discharge.

Generally, in a self-shift type panel utilizing gas discharge having a function of shifting a discharge spot, a plurality of parallel shift electrodes connected to a polyphase electric source are faced, via a dielectric layer, to a discharge gap filled with ionizable gas. When a discharge spot is produced by applying a voltage to a first shift electrode, the discharge spot can be shifted in turn in the direction which is at right angles to the shift electrodes by applying a polyphase sustaining voltage to shift electrodes successively. However, it is necessary to electrically or mechanically limit the direction of the shift action for the purpose of carrying out said shift action in the direction which is at right angles to the shift electrodes. If this is not done, the direction of the shift action of the discharge spot deviates from the right angle with regard to the shift electrodes. For the purpose of determining the shift direction of the discharge spot, it has been proposed that electrical or mechanical insulation barriers be provided in a direction parallel to the shifting direction. However, such insulation barriers not only make the structure complicated but also assembly of the structure is very troublesome. Further, the spaces between electrode columns become inevitably large and displayed figures become unsightly.

An object of the present invention is to provide a gas discharge panel which provides a construction distinguishing a portion where gas discharge is required from a portion where gas discharge is not required.

Another object of the present invention is to provide an improved construction of a self shift type gas discharge panel which can determine the shift direction of the gas discharge spot.

A further object of the present invention is to provide a means for setting a shift channel having simple construction and a reliable separating function of gas discharge, in a self-shift type gas discharge panel.

A stillfurther object of the present invention is to provide a gas discharge panel having a predetermined pattern so that a read-only memory type gas discharge is carried out along said predetermined pattern.

According to a principal characteristic feature of the present invention, a suppression layer is formed on the dielectric layer for covering an electrode group, so that a leakage discharge field in. the discharge gapis partiallyv decreased, thereby distingwishing a portion where a discharge is produced from a portion a discharge is not produced.

According to another feature of the present invention, the above-mentioned suppression layer is formed on a dielectric layer as metallic films arranged so as to cross the shift electrodes of a surface type self-shift gas discharge panel, thereby separating the discharge and v defining the shift direction of the discharge spot.

According to another characteristic feature of the present invention, the above-mentioned suppression layer is formed on a dielectric layer as a high dielectric constant layer arranged so as to cross the shift electrodes of the above-mentioned surface self-shift type discharge panel, thereby separating the discharge and defining the shift direction of the discharge spot.

According to a further characteristic feature of the present invention, suppression layers with resistance films, each having a narrow width, are formed on a dielectric layer and arranged so as to cross the shift electrodes, thereby separating the discharge and defining the shift direction of the discharge spot.

According to still another characteristic feature of the present invention, metallic film strips, each having a very narrow width, are formed on a dielectric layer and arranged so as to cross the shift electrodes thereby separating the discharge and defining the shift direction of the discharge spot.

According to a still further characteristic feature of the present invention, suppression means, such as metallic or resistance films, are formed on a dielectric layer and arranged in a direction so as to cross said electrodes to be shifted, and further each of these films is covered with an insulator so as to carry out the discharge spot shifting operation or scanning operation along these films by surface discharge or vertical discharge.

According to a still further characteristic feature of the present invention, surface portions of a dielectric layer of a plasma display panel where the discharge is not necessary are covered with conductive films of predetermined patterns, thereby creating a difference in firing voltages between the surface portions of the dielectric layer where the discharge is necessary and where the discharge is not necessary, thereby constituting a gas discharge panel in the form of a read-only memory.

Further objects, features and advantages of the present invention will be apparent from the ensuing description, with reference to the accompanying drawings, to which, however, the scope of the invention is in no way limited.

FIG. I isa general view of a typical plasma display panel;

FIG. 2 is a sectional view of the plasma display panel shown in FIG. 1;

FIGS. 3A and 3B show a plan view and sectional view, respectively, of a conventional plasma display panel having a function of self-shifting discharge spot due to surface discharge; I

FIG. 4 shows a partial perspective view of the first embodiment of a surface type gas discharge panel according to the present invention;

FIGS. 5, 6A and 6B are respectively explanatory diagrams of operations of the discharge panel shown in FIG. 4; I

FIG. 7 is a second embodiment of the surface type gas discharge panel according to the present invention;

FIGS. 12A and 12B are afifth embodiment of the present invention applied to a double surface type gas discharge panel;

FIGS. 13A to 13C are respectively explanatorydiagrams of operations of the double surface type gas discharge panel shown in FIG. 12A, and;

FIG. 14 is a last embodiment of the double surface type gas discharge panel according to the present invention.

Referring to FIG. 1, a display panel 1 utilizing gas discharge has a pair of supporting substrates of electrodes 2 and 2a. The supporting substrate of electrodes 2 provides a group of electrodes 3 arranged in columns parallel to a vertical axis, and a dielectric layer 4 covers the group of electrodes 3. The supporting substrate of electrodes 2a provides a group of electrodes 30 arranged in rows parallel to a horizontal axis, and a dielectric layer 40 covers the group of electrodes 3a. The supporting substrates of electrodes 2 and 2a are positioned in a spaced parallel relation as shown in FIGS. 1 and 2. The parallel columns and rows of electrodes are separated from each other by a discharge gap or space 5 as shown in FIG. 2. The gap 5 is filled with a gas having a suitable pressure and capable of ionization. When the panel 1 is utilized for a display purpose, it is necessary that at least either the substrate 2 and the dielectric layer 4 or the substrate 2a and the dielectric layer 4a are transparent. I

In the above-mentioned display panel 1 utilizing gas discharge shown .in FIGS. 1 and 2, when an electric voltage higher than a firing voltage V; is selectively applied between the groups of electrodes in columns 3 and rows 31:, each cross point of the electrodes in columns and rows discharge into the gap 5 filled'with an ionizable gas. At the time of this discharge, a wall charge is formed on the surfaces of the

dielectric layers

4 and 40 corresponding to the above-mentioned cross point. By the effect of this wall charge, the discharge which is generated, is sustained by a pulsive sustaining voltage V, smaller than the firing voltage V and is continued. That is, an information which inputs as the voltage exceeding the firing voltage V; is kept in memory by the effect of the abovementioned wall charge.

Next, a plasma display panel utilizing gas discharge having a function of self-shifting the discharge spots of a surface discharge type according to the prior art will be illustrated with reference to FIGS. 3A and 38. Referring to FIGS. 3A and 3B, this device provides a plurality of

shift electrodes

6, 7, 8, 9, ..which' are arranged in parallel on a base plate 13, covered with a dielectric layer 14 and connected at intervals of two electrodes to a common buss ofa three-phase alternate current electric source. The dielectric layer 14 faces the base plate 16 via a space filled with an ionizable rare gas. A plurality of write electrodes 5 are longitudinally arranged in every column along the first shift electrode 6 and provided on the base plate 13. These

electrodes

5, 6, 7, 8, 9 etc., are covered with the dielectric layer 14 and face a discharge space 15 filled with gas capable of ionization.

When a firing voltage V, is supplied between a selected write electrode 5 and the first shift electrode 6, a discharge spot 10 is produced between these two

electrodes

5 and 6. In this case, when a three-phase sustaining voltage is commutated to the shift electrodes in order, the above-mentioned discharge spot 10 is shifted in a direction perpendicular to the shift electrodes in order by a primary current effect. The primary current supplying of electrons, ions and metastable atoms produced by discharge. However, to carry out the abovementioned shift operation in each column respectively, it is required that each column be mechanically or electrically separated in the direction of the shifting of the discharge spot. To achieve this purpose, it has been proposed that mechanical insulation barriers ll be proeffect is a phenomenon by which the firing voltage of an adjacent dischargeable point is decreased due to the vided between each column for the purpose of preventing'the deviation of the discharge spot as shown in the direction 12 in FIG. 38. However, these mechanical barriers 11 make the structure complex and the assembly work becomes very troublesome. Further the space between columns becomes inevitably large and the display figure becomes unsightly.

Hereinafter, several embodiments of gas discharge panels according to the present invention will be illustrated with reference to FIGS. 4 thru 14.

Referring to FIG. 4, which is a first embodiment of a gas discharge panel utilizing a surface type gas discharge according to the present invention, the

shift electrodes

6, 7, 8, 9, are covered with a dielectric layer 14. On the surface of the dielectric layer 14, as a suppression means, small metallic strip films 17 are formed with a certain space between them. This metallic layer 17 may be of either a thin film or a thick film. The materials of this metallic film are, for example, such as Au, Pt, Ag, etc. In FIG. 4, some elements shown in FIG. 3A, such as the gas discharge gap 15, glass base plate 16 and write electrodes 5 are not shown, however, the relation of these elements will be apparent from FIG.'3A.

When the metallic films 17 are attached on the surface of the dielectric layer 14 in the form of strips as shown in FIG. 4, the discharge is not produced in the portion which is attached the metallic films 17. This is because the surface discharge is carried out by the leakage flux of the electric field in thecells between adjacent electrodes into the discharge gap l5.-Accordingly, at the surface portions ofthe dielectric layer 14 where the metallic films 17 are attached, penetration of the above-mentioned leakage flux into the gap 15- is suppressed or shielded, and the above-mentioned electric field in the cells between adjacent electrodes becomes zero, with the result that the discharge is not produced. However, at the surface portions of the dielectric layer 14 where the metallic films 17 are not attached, the above-mentioned electric field leaks .into the gap 15 when an electric signalis applied between electrodes, so that the surface discharge can be carried out. Then a shift channel of the discharge spot is provided by the metallic film strips 17 and the generated discharge spot is separated and shifted in the direction along the surface portions of the dielectric layer 14 where the metallic films 17 are not attached. Although, the effect for carrying out the surface discharge shifting operation can be sufficiently produced by providing only these metallic films 17, the above-mentioned effect can be further enhanced if the metallic films 17 are given an earth potential, or a certain potential.

The surface type gas discharge panel according to the above-mentioned first embodiment is preferable for reliable shift action of the discharge spot as a scanning layer of firing spots for theabove-mentioned self -shift type panel or a self-shift memory type panel combined with a scanning panel and a display panel.

According to the first embodiment shown in FIG. 4,

a self-shift channel can be determined very effectively.

C are capacitances for an electric field of the vertical component to the dielectric layer 14;

C, is a capacitance for the electric field of the horizontal component to the dielectric layer 14';

C, is a capacitance for a leakage electric field component from the dielectric layer 14 (as the value of this capacitance C, is generally very large, the surface discharge is possible) and;

C is a capacitance for an electric field component passing through the base plate 13.

FIG. 6A shows the load capacitance when the metallic film is not used. FIG. 6B shows the load capacity between adjacent electrodes at the surface portions covered with the metallic films 17 as shown in FIG. 4. In FIG. 68, a resistance R is the resistance of the metallic film. The value of the total capacitance between respective adjacent electrodes C can be expressed as CL CA(P2 2) a 2 where, P is a pitch between the adjacent metallic filaments 17, W is a width of the each metallic film l7, and C and C are respectively the capacities between adjacent electrodes when the metallic films are not used and are used.

In this case, the value of a resistance R of the each metallic film 17 can be considered'as being very small and approximately zero, so that the capacitance C is considered as a short-circuited condition. Further, since each capacitance C has a very large value, the capacitance C between respective adjacent electrodes at the portion where the metallic films 17 are provided suddenly increases, which results in an undesirable increase in the load capacitance C According to the second embodiment of the present invention, the above-mentioned resistance R shown in FIG. 6B isconstructed to have a sufficiently high resistance so as to prevent increase in the load capacitance C That is, referring to FIG. 7, small strip resistance films 18 are formed on a dielectric layer 14 in such a manner that the surface resistivity R of the each resis tance film 18 is sufficiently high. If the resistance films 18 are used, each having a very narrow width and a small value of the coefficient of secondary electron emission, the effect of the surface resitance films 18 is, of course, further enhanced.

As for the materials of the resistance film 18 for this purpose, oxide films such as Sn, Ti, In, etc. and TaN oxide film are used. This surface resistance film 18 is used for preventing the discharge produced in a portion of the surface resistance film, by decreasing the leakage electric flux into a discharge space from the dielectric layer 14 without increasing the load capacitance C very much. Further, it is apparent from the foregoing equation (1) that the load capacitance C, can be decreased by making the width W; of the resistance film 18 smaller. As for an example of this embodiment, satisfactory results could be obtained when the distance between the centers of adjacent resistance films P 0.6 mm, and the width of the resistance film W 0.] mm. Further, it is required that the metallic film should not deteriorate the dielectric layer 14.

As stated previouslyv generally the surface discharge type plasma display panel utilizes a phenomenon that the electric field leaks from the dielectric layer 14 into the gas discharge space 15. Accordingly, if the amount of the leakage flux is suppressed and made sufficiently small, the surface discharge from this portion is not produced. Fordecreasing this leakage flux, two methods can be considered, that is suppressing or shielding by a metallic film and suppressing or shielding by a dielectric substance having a high dielectric constant.

Referring to FIG. 8, which is a third embodiment of the surface type gas discharge panel, high dielectric layers 19 are attached on a dielectric layer 14 covering the surfaces of write electrides 5 (not shown) and. shift

electrodes

6, 7, 8, 9, This high dielectric con- 1 stant layer 19 may be a sufficiently thick film on a portion of dielectric layer 14. In FIG. 8, some elements such as the gas discharge space 15, glass base plate 16 and write electrodes 5 which are considered similar to FIG. 3A are not shown. However, the relation of these elements will be apparent from FIG. 3A.

The surface discharge utilizes the leakage flux of the electricfield between adjacent electrodes into a discharge space. Consequently, if the high dielectric constant layer 19', having strip form or sufficient thickness, is attached on a dielectric layer 14 for covering electrodes, the'leakage in the portion where the high dielectric constant lay'eris formed, is suppressed and the field in said portion in the discharge cell decreases and, therefore,'the discharge is not produced. However, in a portion of dielectric layer 14 wherethe high dielectric constant layer 19 does not. exist, the electric field leaks into the gas discharge space. Therefore, if an electric signal is supplied to a shift electrode, the discharge can be produced in the gas discharge space, and this produced discharge is separated by the high dielectric layer 19 and shifted along the portion of dielectric layer 14 where said high dielectric constant layer 19 is not attached.

FIGS. 9A, 9B and 9C are diagrams showing states of leakage flux when a high dielectric constant surface layer 20 and a low dielectric constant surface layer 21 are used in the surface-type gas discharge panel. It can be clearly seen from these drawings that the leakage flux 22 can bev minimized by using the high dielectric constant surface layers 20 as shown in FIGS. 9A and 9C, so that the surface discharge can not be produced at this high'dielectric constant layer portion.

FIGS. 10A to are several embodiments of sur face layers when high and low dielectric

constant layers

20 and 21 are used together in the surface type gas discharge panel.

FIG. 10A shows a method of dividing a dielectric I layer into a high dielectric constant layer portion 20 and a low dielectric constant layer portion 21. FIG. 108 shows a method of forming a high dielectric con stant layer 20 on the low dielectric constant layer portion 21. FIG. 10C is more effective than FIG. 10A, because the thickness of the high dielectric constant layer portion 20 is selected larger than that of the low dielectric constant layer portion 21. In FIG. 10D, a low dielectric constant layer portion 21 is formed on the high dielectric constant layer portion 20. FIG. 10E is the case where the thickness of low dielectric constant layer is larger than that of high dielectric constant layers, contrary to the case of FIG. 10C.

For a material for the low dielectric constant insulation layer a glass containing a large quantity of lead and having a low melting point and a dielectric constant of about 10 is used. And for a material for the high dielectric constant insulation layer a commercial high dielectric constant substance, for example, BaTiO having a dielectric constant of about 1000, is used. These dielectric layers are manufactured by evaporative deposition, sputtering, or printing techniques.

When the metallic films 17 (FIG. 4) or the resistance.

films 18 (FIG. 7) are used for separating the zones of the surface discharge, it is noticeable that a part of the wall charges which are produced by discharge flows into these films since each of these films has conductivity, andthis phenomenon results in the following desirable and undesirable effects:

l. in the self-shift panel this phenomenon decreases unnecessary coupling between adjacent columns and resolution can be improved;

2. the wall charge flows into the films, with the result that the memory function decreases.

For the purpose of preventing the undesirable effect of item (2), it is preferable that the surfaces of the above-mentioned metallic or resistance films are further covered with a surface reinforcing dielectric layer 23 as shown in FIG. 11, so as to prevent the wall charge produced by the discharge from flowing into the films. In the fourth embodiment shown in FIG. 11, the dielectric layer 24 covers entire surfaces of metallic or resistance films 23 for separating the firing spot.

The following methods may be used to actually form an insulation layer 24.

l. The metallic or resistance film 23 is formed by the oxidation method such as, a thermal or chemical treatment, or anode-oxidize method.

2. As shown in FIG. 11, after forming the metallic o resistance films 24, the dielectric layer 24 is attached to them by an evaporation technique or sputtering evaporation. In this case suitable materials for the dielectric layer film 24 are Al O SiO and CeO The thickness of the dielectric layer 24 is several thousand A, and that of the base dielectric layer 14 is about 2O;L. Consequently, the influence on the firing voltage is almost negligible. Particularly, the oxidize-cesium CeO protects the surface of the dielectric layer 14 from sputtering caused by ion-bombardment and the gas discharge panel can be provided with long operation life as well as enhanced property of discharge spots.

In the above-mentioned four embodiments according to the invention, the case of the shift panel using a surface discharge was explained. However, the suppression layer according to the invention can be naturally applied to a dot matrix type gas discharge panel as shown in FIGS. 12A and 128.

A plasma display panel shown in FIGS. 12A and 128 comprises: a pair of inside

dielectric layers

25 and 26 sandwiching a gas discharge space or gap 27; a pair of outside

glass base plates

28 and 29; two pairs of X and

Y electrode groups

30 and 31, and; a plurality of negative pattern metallic films or resistance films 32, corresponding to a character A as shown in FIG. 12A, attached to the inside surface of the lower dielectric constant layer 25 by some heat evaporation method. In

this construction of' the panel, when an electric signal is applied between the electrode pairs 30 and 31, firing spots can be produced. The preferable materials for the respective conductive metallic and resistance thin films 32 are metals such as Au, Pt, Al, Ag or resistive conduction films, such as SnO Sb O etc.

In FIGS. 12A and 128, the films 32 are attached on the lower dielectric constant layer 25 only, however, it is also possible to further attach them on the upper dielectric layer 26.

In the above-mentioned construction, when the thin conductive film 32, having a predetermined pattern, is

connected to an earth potential, a portion shielded by cancels an electric field in the discharge space, to the conductive film 32 and decreasing more considerably the electric field in the portion masked by said film.

FIG. 13A shows a time relationship of voltages X, Y and M respectively impressed on the X-electrodes 30, Y-electrodes 31 and conductive films 32 shown in FIG. 12B. At the time t Y-electrode 31 and a conductive film receive a voltage having a positive polarity, and X-electrode receives no voltage. As a result the electric field between the Y-electrodes 31 and the conductive films 32 is the difference between two voltages and the voltage Y is directly impressed on a portion unmasked.

by the conductive film as shown in FIG. 133. Next, at the time t,,, a positive voltage is applied only to X- electrode and no voltage is supplied to Y electrode and the conductive film 32.

As a result the above-mentioned electric field between the Y-electrodes 31 and the conductive films 32.

is zero and the voltage applied to X-electrode is directly impressed on the portion unmasked by the conductive film as shown in FIG. 13C. That'is to say, the voltage M is not always impressed on the portions 32 masked by conductive film. However, the voltages X and Y are alternately and successively impressed on the portions unmasked by conductive film, so that the firing spot is produced.

FIG. 14 is a last embodiment of the present invention applied to the dot matrix type gas discharge panel utilizing surface type gas discharge. FIG. 14 comprises; a

pair of outside

glass base plates

33 and 36; a plurality of electrodes 34 for carrying out the surface discharge arranged on the lower glass base plate 33; a dielectric layer 35 for covering the electrodes 34; a gas discharge gap 37 formed between the dielectric layer 35 and the upper-glass base plate 36, and; conductive films 38, each having a predetermined pattern, partly covering the dielectric layer 35, provided at the portions where the discharge is not required. In this construction, the firing spot is not produced at the conductive film portions on the dielectric layer 35, since no electric field leaks from here to the gas discharge gap 37. However, at the non-conductive portions on the ,dielectric layer 35, the surface discharge is not prevented, so that this method is very effective.

As already stated in the gas discharge panel according to the present invention, (l)the desired suppression layers can be easily attached to the dielectric layer by some method such as an evaporative deposition or electric plating according to the present technique. However, as the suppression layers, the resistance films are more preferably used than the metallic films because the former have a smaller load capacitance between respective adjacent electrodes of the panel. Also, (2) the present invention can be very effectively practised by applying a voltage, having an inverse polarity which cancels the electric field produced by the firing voltage at the conductive film portions, to the conductive films. Further, (3) a shielding effect can be increased by connecting the suppression layers to an earth potential.

What is claimed is:

l. A gas discharge panel for generating a discharge in a gas discharge space through a dielectric layer by applying an electric signal to electrodes, which are covered by said dielectric layer the surface portions of said dielectric layer characterized in that a suppression layer which decreases leakage of an electric field to said gas discharge space is formed on said dielectric layer with a predetermined pattern.

2. A gas discharge panel according to claim 1, wherein said suppression layer having said predetermined pattern is composed of a metallic film.

3. Aigas discharge panel according to claim 1, wherein said suppression layer having said predetermined pattern is composed of a resistance film.

4. A gas discharge panel according to claim 1, wherein said suppression layer having said predetermined pattern is-composed of another dielectric layer having a higher dielectric constant than that of said dielectric layer for covering said electrodes.

5. A gas discharge panel according to claim 2, wherein, the surface of said metal film is further covered with a dielectric layer.

6. A gas discharge panel according to claim 3, wherein the surface of said resistance film is further covered with a dielectric layer.

7. A gas discharge panel which is composed of a plurality of shift electrodes provided in parallel on a base plate, a dielectric layer formed on said shift electrodes for covering said shift electrodes, a gas discharge space filled with ionizable gas and provided on said dielectric layer, and means for connecting said electrodes in turn to a poli-phase electric source via a group of common buss, characterized in that a suppression layer which partially prevents an electric field between adjacent shift electrodes from penetratingto said gas discharge space is provided on said dielectric layer at a right angle to said shift electrodes.

Claims

1. A gas discharge panel for generating a discharge in a gas discharge space through a dielectric layer by applying an electric signal to electrodes, which are covered by said dielectric layer the surface portions of said dielectric layer characterized in that a suppression layer which decreases leakage of an electric field to said gas discharge space is formed on said dielectric layer with a predetermined pattern.

3. A gas discharge panel according to claim 1, wherein said suppression layer having said predetermined pattern is composed of a resistance film.

4. A gas discharge panel according to claim 1, wherein said suppression layer having said predetermined pattern is composed of another dielectric layer having a higher dielectric constant than that of said dielectric layer for covering said electrodes.

7. A gas discharge panel which is composed of a plurality of shift electrodes provided in parallel on a base plate, a dielectric layer formed on said shift electrodes for covering saiD shift electrodes, a gas discharge space filled with ionizable gas and provided on said dielectric layer, and means for connecting said electrodes in turn to a poli-phase electric source via a group of common buss, characterized in that a suppression layer which partially prevents an electric field between adjacent shift electrodes from penetrating to said gas discharge space is provided on said dielectric layer at a right angle to said shift electrodes.