US3793717A - Method of controlling resistance values of thick-film resistors - Google Patents

Method of controlling resistance values of thick-film resistors Download PDF

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US3793717A
US3793717A US00130316A US3793717DA US3793717A US 3793717 A US3793717 A US 3793717A US 00130316 A US00130316 A US 00130316A US 3793717D A US3793717D A US 3793717DA US 3793717 A US3793717 A US 3793717A
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resistors
furnace
resistivity
units
mean
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R Degenkolb
T Allington
Y Wang
M Oakes
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RCA Licensing Corp
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RCA Corp
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Assigned to RCA LICENSING CORPORATION, TWO INDEPENDENCE WAY, PRINCETON, NJ 08540, A CORP. OF DE reassignment RCA LICENSING CORPORATION, TWO INDEPENDENCE WAY, PRINCETON, NJ 08540, A CORP. OF DE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: RCA CORPORATION, A CORP. OF DE
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/26—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material
    • H01C17/265—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material by chemical or thermal treatment, e.g. oxydation, reduction, annealing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Definitions

  • hybrid integrated circuits of thick-film type normally include a pattern of conductors deposited on an insulating substrate and passive components such as resistors, capacitors and inductors also deposited as thick films on the substrate and connected to the conductors. Active components such as transistors and diodes and even more complex circuit portions on semiconductor chips, are usually mounted on terminals in the circuit.
  • a common type of resistor is that made of a viscous ink comprising particles of metals and/or metal oxides, glass frit, organic or inorganic binders and organic solvents. Oils are also sometimes included.
  • This type of resistor is usually referred to as a Cermet resistor.
  • Cermet resistors are usually deposited by screenprinting a carefully controlled quantity of the resistor ink on a ceramic substrate. In making a production run of many thousands of circuits, a machine successively prints the resistor units on a succession of small ceramic plates over a period of time which may cover a production shift or several shifts.
  • the resistor units are printed on the substrate, they are dried in air (usually at elevated temperature) to permit the solvent to evaporate, then subjected to a firing operation to fuse the glass frit and burn off the binder.
  • Most Cermet resistor compositions contain particles of silver and palladium as the metallic portion. When the composition is fired, some of the palladium alloys with the silver and the excess palladium is oxidized to a state which depends upon time and temperature in the furnace.
  • resistor compositions such as those based on ruthenium
  • the firing may be carried out by placing the ceramic substrates on a metal belt which moves at a slow, constant speed through a furnace which has a particular heating profile. When the glass frit fuses, it freezes the oxidation state of the palladium oxide, thus stabilizing one of the most important factors contributing to the resistance value of the fired resistor.
  • the engineer who designsthe circuit knows the resistance value he must have in a particular resistor. He also knows how much tolerance he can permit as percent deviation from the desired resistance value. Knowing also what area he has available to allot to the resistor, he selects a resistor ink that is designed to produce a resistor having the value of resistivity required to provide the desired resistance value when fired at a specified temperature. There are many other factors, however, which enter into a selection of a resistor ink for a particular circuit application. There are electrical factors to be considered such as wattage the resistor will have to carry, voltage gradient'across the resistor and noise factor. An ink must be selected that has been designed to carry the wattage required, without burnout or change, produce noise below a certain desired level and operate properly at the voltage gradient selected.
  • the resistivity or resistance value that will be obtained with a given ink, given firing temperature and time, given film thickness, given screen mesh, given printing pressure, and given wire diameter can be predicted only approximately. Some of these variables are: stretching of the screen, changes in screen wire tension, wearing of the screen, gradual thickening of the composition due to evaporation of the solvent, and variations in composition and purity of materials occurring from lot to lot and bottle to bottle. After samples are run and measured, additional adjustments must be made to bring the resistance of the initial part of a production run within the desired tolerance range.
  • FIG. 1 is a temperature profile from entrance to exit, of a laboratory size belt furnace used in making experimental runs to test the method of the present invention
  • FIG. 2 is a graph of resistivity (p) for a particular fired Cermet resistor ink composition vs. peak firing temperature for a constant time in a furnace of the type having a profile like that of FIG. 1; l
  • FIG. 3 is a graph of normalized resistance (R vs. time in furnace at constant temperature profile for Cermet resistors of a particular composition, using a furnace having a profile similar to that of FIG. 1;
  • FIG. 4 is a graph of resistivity vs. belt speed for six different inks fired at the same temperature
  • FIG. 5 is a schematic diagram of apparatus for computer control of belt speed in a thick-film resistor firing operation.
  • FIG. 6 is a temperature profile of a production type furnace used in making production runs of hybrid circuits utilizing the methods of the present invention.
  • the peak firing temperature of the furnace and/or the time the resistor is in the furnace are controlled to produce resistors having a resistance value within a desired tolerance range. Changes in resistance value away from the desired range, due to the many processing variables referred to above, are compensated for by changing belt speed or peak firing temperature (or both) by a known amount.
  • resistivity in this case, means sheet resistivity which is measured in ohms per square.
  • the working temperature is that range of firing temperatures at which the glass frit fuses and the metal oxide content becomes established at a desired value.
  • the maturing temperature may have a range of about 30 C.
  • the slope of peak firing temperature vs. resistivity be effective as a processing control
  • the slope should be within the range of about 1-5 percent. That is, for every degree (C.) change in temperature there should be a change in the resistivity, in ohms per square, of about l-5 percent. If the slope is less than about 1 percent it is too shallow to be used as a control because it requires too great a temperature change to provide a given change in resistivity. If the slope is greater than about 5 percent, a change of 1 degree in temperature produces too great a change'in resistivity to bereadily used for control purposes. Preferably, the slope of the curve should be 22.5 percent.
  • FIG. 1 shows a typicaltemperature profile in a laboratory size belt type furnace, designed to properly fire a particular resistor ink.
  • the furnace is about eight feet long.
  • a preferred firing profile is supplied for producing a desired resistivity.
  • the preferred profile is different for each different ink composition.
  • nominal firing time suggested by the manufacturer is minutes from the furnace entrance to its exit.
  • the circuit designer must first decide which particular ink to use, from those available, to accomplish a particular result. He selects an ink that will permit the geometry of the resistor to fall within a certain range of geometries and must also take into account restrictions on electrical characteristics such as noise factor permissible and voltage gradients and wattage that the resistor must handle. I-Ie picks a resistivity in accordance with a geometry dictated by the other factors and which will therefore produce a resistance of desired circuit value in a resistor having certain given dimensions.
  • the circuit designer should also select a resistor ink having a peak firing temperature vs. resistivity curve slope as discussed above.
  • peak firing temperature can be adjusted to bring the resistances back to a desired value. This is done by reference to a curve such as shown in FIG. 2.
  • This curve is a plot of the resistivity in ohms/square vs. peak firing temperature obtained by firing twenty-five samples of duPont resistor ink No. 8023 at peak temperatures of 725 C., 740 C. and 750 C. The curve was drawn through the means values. If, say, 740 C.
  • a mean value of 9,700 ohms/square should be obtained in the resistors produced.
  • the mean resistivity may change and become, say, 11,000 ohms/square.
  • the operator reads off the curve the temperature change needed to bring the resistivity back' down to 9,700 ohms/square and makes the adjustment. In this case the temperature change needed is a reduction of 10 C.
  • FIG. 3 One example of how the resistance (in ohms) of resistors made from a particular resistor ink, varies with time in the furnace, is shown in FIG. 3.
  • the time axis shows time decreasing from left to right.
  • the curve illustrates that, for one composition, resistance decreases at a changing rate as firing time decreases.
  • the graph shows that for all six inks, resistivities decrease with increasing belt. speed (decreasing time in furnace).
  • speed decreasing time in furnace.
  • any one ink to make a belt speed correction to compensate for relatively small variations in mean resistivity during a production run, one consults the original curve, reads off the speed correction necessary to effect a particular resistivity change and then either slows down or speeds up the belt drive motor accordingly. This is true, however, only when the initial sample run and the production run are close together in time and when the production run is short.
  • the computer can continuously calculate mean resistivity of all resistors being produced, can, by having a voltage change converted to a binary number, sense a change in mean resistivity, and can calculate change in belt speed needed to bring mean resistivity back to its desired value.
  • Belt speed can either be changed manually by an operator or automatically.
  • Peak temperature and time can both be used to control resistivities in making production runs of resistors in hybrid circuits. Temperatures can be used to make coarse adjustments. Together, these adjustments can be used to compensate for changes in ink from lot to lot or jar to jar and also changes in print thickness on a long time-constant basis. Thus, changes in print dimensions due to screen wear or other screen changes,
  • the present method does not completely eliminate the need for final correction of resistance values by abrasive or shorting out methods, but it greatly lessens this task.
  • the equipment '(FIG. 5) may comprise resistance measuring means 2 which includes sets of test probes (not shown) which can be lowered to contact pairs of metal pads connected to the ends of all resistors in the circuit.
  • a scanner (not shown) is used to read values from each resistor in turn, after each circuit emerges from the furnace 4 on belt 6 and a digital resistance meter (not shown) (Vidar 521) is used to convert the values which are read, to ohms.
  • the equipment may also include two computers such as Digitalv Equipment Corporations PDP8, one of which (not shown) stores data on magnetic tape.
  • the other computer 8 receives data measurements from the resistance meter during production and issues commands to reject or accept circuits and to vary the speed of furnace belt 6, if necessary.
  • the reject high and the reject low limits can be set. If any single resistor 'is outside its allowed range, that entire circuit must be rejected.
  • the computer must also be informed of the number of resistors in the circuit and the number of the control resistor which is to be used for recommending belt speed changes.
  • the control resistor selected should be one with the closest tolerances.
  • a typical circuit may have many resistors of widely different resistance values, more than one ink composition will usually be involved.
  • all inks used in the same circuit should have similar characteristics. That is, resistors made from all of them should change in resistivity in the same direction and to about the same extent with changes in peak firing temperature and change in time-in-fumace. This is preferable so that measurements taken on one of them can be applied to control all of them.
  • the constants required for the belt speed for the control resistor should also be recorded on the punched paper tape as should also the maximum number of outof-tolerance circuits acceptable for the sample.
  • a range constant is also entered for each resistor on the circuit identifying the range to which the digital measuring equipment is to be set.
  • the PDP8/l computers used in hybrid circuit runs had two core banks, Bank and Bank 1. Each bank of cores was divided into 40 octal pages of 177 octal words. Since this was a 12-bit word machine, indirect addressing was required for crossing page boundaries and for linking the banks.
  • Bank 0 the system bank, was built of:
  • Initialization routines b. Work waiting list c. Teletype service routine d. Arithmetic and calculation programs for measuring, sampling and predicting changes in production e. Data storage programs for historic analysis.
  • a command is typed to begin and to indicate that a new batch of circuits, possibly a different circuit configuration, is about to be measured. This is followed by typing the production circuit number, batch number, and then feeding in the above mentioned punched paper tape of circuit constants.
  • the computer then prints out the measured value of each resistor. If all the resistors in the circuit are within tolerance range, the circuit is recorded as good and is directed to a particular bin holding all the good circuits. If any single resistor is below the reject low limit or above the reject high limit, the entire circuit is directed to a reject bin. If any single resistor is below the adjust value but above the reject low limit, that circuit is directed to the adjust bin. The readings of resistance for each resistor are accumulated to calculate the mean value of each one for some selected number of consecutive circuits.
  • the required belt speed change is calculated as follows:
  • RT Resistance target value x
  • Mean resistance value of sample dR/ds Coefficient of change in resistance with belt speed Sn Present belt speed.
  • the change in belt speed can be made automatically.
  • the information output of the computer 8 is fed to a digital-to-analog converter 10 which changes the voltage across the motor of belt drive means 12 to either speed it up or slow it down.
  • Resistors numbers 1 to 6 were made of the same resistor ink which was made up of about a 50-50 blend of Du Pont No. 8279 giving a nominal value of sheet resistivity of about 015 KQ/square when fired at a peak temperature of 740 C and corrected to a thickness of 1 mil, and No. 8281 giving a nominal value of about l.8 K-Q/Square under the same conditions.
  • Resistors Nos. 7 and 8 were made of an ink giving a resistivity of about KQ/square.
  • Table I shows design value and design tolerance for each resistor.
  • Resistor No. Design Value Design Tolerance R 39000 :20% R 10 K! 15% R; 100 0 +30% -40% R 180 0 :IO% R I00 0 +20% R 220 9 (Ratio of RJR, .022i8%) R, 2.2 M! :20% 220 K! r2096 Most of these resistors were actually designed as pairs of resistors of equal value and, by either being connected in series or parallel, designed to give the values listed above. However, resistors Nos. 1 and 6 were simple rectangles with the following dimensions:
  • the units were then fired in an E. I. Hayes Co. F-4 production type furnace.
  • the furnace had a length of 35 ft. and had a temperature profile as shown in FIG. 6. No temperature figures are given for the final 8 ft. of the furnace since the temperature is decreasing and immaterial to the resistance values of the fired units.
  • Table II gives a summary'of values for a 100 unit sample run through the furnace.
  • Resistor No. 2 was taken as the control resistor because it had the closest tolerance limits (Table I) of :Spercent. Note that, in this run, the mean value of the control resistor was outside its tolerance limits.
  • the value BS 12,304 is a measure of the actual belt speed.
  • the number represents the number of gear wheel teeth passing a transducer in a given time, in this case ten seconds.
  • the actual belt speed was about 26 inches per minute. Since the control resistor was out of tolerance, the computer recommended that the belt speed be changed to a new target speed, TS of 12,228 in order to raise the mean resis- In this Example the belt speed adjustment was made manually by an operator turning an adjustment knob. The operator did not adjust the belt speed to the exact figure recommended by the computer because, at this stage of production, there were additional factors to be taken into consideration that were not programmed into the computer. v
  • Table III below, is a copy of the computer printout for the next 100 circuits run after the belt speed had been changed by the operator after the run of Table II.
  • thick-film Cermet resistors having a certain desired mean resistivity within a certain percent tolerance range, said resistors being of the type made by depositing a continuing series of resistor ink units, made from the same resistor ink, on insulating substrates, permitting said units to dry by evaporation of solvent, and firing the dired units in a furnace having a particular peak temperature, to mature the composition and obtain resistors having a desired mean resistivity, the steps of:
  • thick-film Cermet resistors having a certain desired mean resistance within a certain percent tolerance range, said resistors being of the type made by depositing a continuing series of resistor ink units on insulating substrates, permitting said units to dry by evaporation of solvent, and passing the dried units at a known rate of speed through a belt furnace having a particulartemperature profile and peak temperature, to mature the ink composition, the steps of:
  • measuring the amount of drift, if any, of said measured production run means resistance away from the desired resistance

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
US00130316A 1971-04-01 1971-04-01 Method of controlling resistance values of thick-film resistors Expired - Lifetime US3793717A (en)

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JP (1) JPS5316518B1 (OSRAM)
CA (1) CA930481A (OSRAM)
DE (1) DE2144571A1 (OSRAM)
FR (1) FR2133387A5 (OSRAM)
GB (1) GB1342973A (OSRAM)
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4245210A (en) * 1979-03-19 1981-01-13 Rca Corporation Thick film resistor element and method of fabricating
US4756923A (en) * 1986-07-28 1988-07-12 International Business Machines Corp. Method of controlling resistivity of plated metal and product formed thereby
US5055144A (en) * 1989-10-02 1991-10-08 Allied-Signal Inc. Methods of monitoring precipitates in metallic materials
US5487014A (en) * 1994-08-26 1996-01-23 The United States Of America As Represented By The Secretary Of The Army Low cost automated system for evaluating the electrical characteristics of ferroelectric materials
US5527377A (en) * 1994-10-05 1996-06-18 Kabushiki Kaisha Kobe Seiko Sho Manufacturing method of metal or alloy
WO2000062310A1 (de) * 1999-04-07 2000-10-19 Robert Bosch Gmbh Temperaturfühler mit wenigstens einer leiterbahn und verfahren zur herstellung eines temperaturfühlers
US6283379B1 (en) 2000-02-14 2001-09-04 Kic Thermal Profiling Method for correlating processor and part temperatures using an air temperature sensor for a conveyorized thermal processor
US6453219B1 (en) 1999-09-23 2002-09-17 Kic Thermal Profiling Method and apparatus for controlling temperature response of a part in a conveyorized thermal processor
US6470239B1 (en) 1999-09-23 2002-10-22 Kic Thermal Profiling Method for maximizing throughput of a part in a conveyorized thermal processor
US20060134892A1 (en) * 2002-09-11 2006-06-22 Evans Michael J Method of enhancing the photoconductive properities of a semiconductor and method of producing a semiconductor with enhanced photoconductive properties
US20060170077A1 (en) * 2005-01-28 2006-08-03 Semiconductor Energy Laboratory Co., Ltd. Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same
US20060176350A1 (en) * 2005-01-14 2006-08-10 Howarth James J Replacement of passive electrical components

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3723052A1 (de) * 1987-07-11 1989-01-19 Kernforschungsz Karlsruhe Herstellung von inerten, katalytisch wirksamen oder gassensitiven keramikschichten fuer gassensoren

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261082A (en) * 1962-03-27 1966-07-19 Ibm Method of tailoring thin film impedance devices
US3457636A (en) * 1964-11-12 1969-07-29 Bunker Ramo Thin-film resistor adjustment
US3520051A (en) * 1967-05-01 1970-07-14 Rca Corp Stabilization of thin film transistors
US3607386A (en) * 1968-06-04 1971-09-21 Robert T Galla Method of preparing resistive films
US3665599A (en) * 1970-04-27 1972-05-30 Corning Glass Works Method of making refractory metal carbide thin film resistors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261082A (en) * 1962-03-27 1966-07-19 Ibm Method of tailoring thin film impedance devices
US3457636A (en) * 1964-11-12 1969-07-29 Bunker Ramo Thin-film resistor adjustment
US3520051A (en) * 1967-05-01 1970-07-14 Rca Corp Stabilization of thin film transistors
US3607386A (en) * 1968-06-04 1971-09-21 Robert T Galla Method of preparing resistive films
US3665599A (en) * 1970-04-27 1972-05-30 Corning Glass Works Method of making refractory metal carbide thin film resistors

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4245210A (en) * 1979-03-19 1981-01-13 Rca Corporation Thick film resistor element and method of fabricating
US4756923A (en) * 1986-07-28 1988-07-12 International Business Machines Corp. Method of controlling resistivity of plated metal and product formed thereby
US5334461A (en) * 1986-07-28 1994-08-02 International Business Machines, Inc. Product formed by method of controlling resistivity of plated metal
US5055144A (en) * 1989-10-02 1991-10-08 Allied-Signal Inc. Methods of monitoring precipitates in metallic materials
US5487014A (en) * 1994-08-26 1996-01-23 The United States Of America As Represented By The Secretary Of The Army Low cost automated system for evaluating the electrical characteristics of ferroelectric materials
US5527377A (en) * 1994-10-05 1996-06-18 Kabushiki Kaisha Kobe Seiko Sho Manufacturing method of metal or alloy
WO2000062310A1 (de) * 1999-04-07 2000-10-19 Robert Bosch Gmbh Temperaturfühler mit wenigstens einer leiterbahn und verfahren zur herstellung eines temperaturfühlers
US6453219B1 (en) 1999-09-23 2002-09-17 Kic Thermal Profiling Method and apparatus for controlling temperature response of a part in a conveyorized thermal processor
US6470239B1 (en) 1999-09-23 2002-10-22 Kic Thermal Profiling Method for maximizing throughput of a part in a conveyorized thermal processor
US6560514B1 (en) 1999-09-23 2003-05-06 Kic Thermal Profiling Method and apparatus for optimizing control of a part temperature in conveyorized thermal processor
US6283379B1 (en) 2000-02-14 2001-09-04 Kic Thermal Profiling Method for correlating processor and part temperatures using an air temperature sensor for a conveyorized thermal processor
US20060134892A1 (en) * 2002-09-11 2006-06-22 Evans Michael J Method of enhancing the photoconductive properities of a semiconductor and method of producing a semiconductor with enhanced photoconductive properties
US7364993B2 (en) * 2002-09-11 2008-04-29 Teraview Limited Method of enhancing the photoconductive properties of a semiconductor
US20060176350A1 (en) * 2005-01-14 2006-08-10 Howarth James J Replacement of passive electrical components
US20060170077A1 (en) * 2005-01-28 2006-08-03 Semiconductor Energy Laboratory Co., Ltd. Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same
US7915058B2 (en) * 2005-01-28 2011-03-29 Semiconductor Energy Laboratory Co., Ltd. Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same

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JPS5316518B1 (OSRAM) 1978-06-01
GB1342973A (en) 1974-01-10
NL7112417A (OSRAM) 1972-10-03
FR2133387A5 (OSRAM) 1972-11-24
CA930481A (en) 1973-07-17
DE2144571A1 (de) 1972-10-05

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