US3787106A - Monolithically structured gas discharge device and method of fabrication - Google Patents

Monolithically structured gas discharge device and method of fabrication Download PDF

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Publication number
US3787106A
US3787106A US00197003A US3787106DA US3787106A US 3787106 A US3787106 A US 3787106A US 00197003 A US00197003 A US 00197003A US 3787106D A US3787106D A US 3787106DA US 3787106 A US3787106 A US 3787106A
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cavities
conductor array
dielectric
conductor
thin
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J Schermerhorn
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Techneglas LLC
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Owens Illinois Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel

Definitions

  • the device comprises a monolithic panel structure in which the conductor arrays are created on a single substrate and wherein two or more arrays are separated from each other and from the gaseous medium by at least one insulating member.
  • the gas discharge takes place not between two opposing members, but between two contiguous or adjacent members on the same substrate.
  • This invention relates to multiple gas discharge devices, especially multiple gas discharge display/memory panels or units which have an electrical memory and which are capable of producing a visual display or representation of data such as numerals, letters, radar displays, aircraft displays, binary-words, educational displays, television, etc. 7
  • this invention relates to a monolithically structured multiple gaseous discharge display/memory panel wherein the conductors or electrodes (for carrying gaseous discharge condition manipulating potentials) are non-conductively coupled to the operative gaseous medium.
  • Such a gas discharge display/memory panel is characterized by an ionizable gaseous medium, usually a mixture of at least two gases at an appropriate gas pressure, in a thin gas chamber or space between a pair of opposed dielectric charge storage members which are backed by conductor (electrode) members, the conductor members backing each dielectric member typically being appropriately oriented so as to define a plurality of discrete discharge volumes, each constituting a discharge unit.
  • an ionizable gaseous medium usually a mixture of at least two gases at an appropriate gas pressure
  • the discharge units are additionally defined by surrounding or confining physical structure such as by cells or apertures in perforated glass plates and the like so as to be physically isolated relative to other units.
  • charges produced upon ionization of the gas of a selected discharge unit, when proper alternating operating potentials are applied to selected conductors thereof, are collected upon the surfaces of the dielectric at specifically defined locations and constitute an electrical field opposing the electrical field which created them so as to terminate the discharge for the remainder of the half cycle and aid in the initiation of a discharge on a succeeding opposite half cycle of applied voltage, such charges as are stored constituting an electrical memory.
  • the dielectric layers prevent the passage of substantial conductive current from the conductor members to the gaseous medium and also serve as collecting surfaces for ionized gaseous medium charges (electrons, ions) during the alternate half cycles of the AC. operating potentials, such charges collecting first on one elemental or discrete dielectric surface area and then on an opposing elemental or discrete dielectric surface area on alternate half cycles to constitute an electrical memory.
  • a continuous volume of ionizable gas is confined between a pair of dielectric surfaces backed by conductor arrays typically forming matrix elements.
  • the cross conductor arrays may be orthogonally related (but any other configuration of conductor arrays may be used) to define a plurality of opposed pairs of charge storage areas on the surfaces of the dielectric bounding or confining the gas.
  • the number of elemental discharge volumes will be the product H X C and the number of elemental or discrete areas will be twice the number of elemental discharge volumes.
  • the conductor arrays may be shaped otherwise. Accordingly, while the preferred conductor arrangement is of the crossed grid type as discussed herein, it is likewise apparent that where a maximal variety of two dimensional display patterns is not necessary, as where specific standardized visual shapes (e.g., numerals, letters, words, etc.) are to be formed and image resolution is not critical, the conductors may be shaped accordingly.
  • One such method comprises the use of external radiation, such as flooding part or all of the gaseous medium of the panel with ultraviolet radiation.
  • This external conditioning method has the obvious disadvantage that it is not always convenient or possible to provide external radiation to a panel, especially if the panel is in a remote position.
  • an external UV source requires auxiliary equipment. Accordingly, the use of internal conditioning is generally preferred.
  • One internal conditioning means comprises using internal radiation, such as by the inclusion of a radioactive material and/or by the use of one or more so-called pilot discharge unit for the generation of photons.
  • the space between the dielectric surfaces occupied by the gas is such as to permit photons generated on discharge in a selected discrete or elemental volume of gas (discharge unit) to pass freely through the panel gas space so as to condition other and more remote elemental volumes of other discharge units.
  • the gas is one which produces visible light or invisible radiation which stimulates a phosphor (if visual display is an objective) and copious supply of charges (ions and electrons) during discharge.
  • the gas pressure and the electric field are sufficient to laterally confine charges generated on discharge within elemental or discrete dielectric areas within the perimeter of such areas, especially in a panel containing non-isolated units.
  • the space between the dielectric surfaces occupied by the gas is such as to permit photons generated on discharge in a selected discrete or elemental volume of gas to pass freely through the gas space and strike surface areas of dielectric remote from the selected discrete volumes, such remote, photon struck dielectric surface areas thereby emitting electrons so as to condition other and more remote elemental volumes for discharges at a uniform applied potential.
  • the allowable distance or spacing between the dielectric surfaces depends, inter alia, on the frequency of the alternating current supply, the distance typically being greater for lower frequencies.
  • V is the half amplitude of the smallest sustaining voltage signal which results in a discharge every half cycle, but at which the cell is not bi-stable and V is the half amplitude of the minimum applied voltage sufficient to sustain discharges once initiated.
  • the basic electrical phenomenon utilized in this invention is the generation of charges (ions and electrons) alternately storable at discrete points or pairs of opposed or facing discrete points or areas on a dielectric surface or a pair of dielectric surfaces backed by conductors connected to a source of operating potential.
  • Such stored charges result in an electrical field opposing the field produced by the applied potential that created them and hence operate to terminate ionization in the elemental gas volume between opposed or facing discrete points or areas of dielectric surface.
  • sustain a discharge means producing a sequence of momentary discharges, at least one discharge for each half cycle of applied alternating sustaining voltage, once the elemental gas volume has been discharged, to maintain alternate storing of charges at discrete areas or pairs of opposed discrete areas on the dielectric surfaces.
  • the conductor arrays are applied to supporting substrates, typically of a ceramic or glass material.
  • a Bitzer et al device there is fabricated a panel structure wherein the respective row-column conductor arrays are formed, on thin glass plates and a perforated center plate is then sandwiched between the nonconductor surfaces of the thin glass plates with the individual perforations of the center plate positioned at the conductor cross points so as to define discrete discharges.
  • a multiple gaseous discharge display/memory panel of a monolithic structure in which the conductor arrays are created on a single substrate and wherein two or more arrays are created on a single substrate and wherein two or more arrays are separated from each other and from the gaseous medium by at least one insulating member.
  • the gas discharge takes place between two contiguous or adjacent surfaces members formed and carried on the same substrate.
  • the respective cooperating conductor arrays are formed on and carried by a single common support member, such as a relatively thick non-conductive support substrate.
  • a single common support member such as a relatively thick non-conductive support substrate.
  • One of the conductor arrays is formed on the surface of the support substrate and then a thin dielectric layer is formed directly on that conductor array.
  • the second conductor array is formed directly on the exposed surface of this dielectric layer to define a plurality of matrix cross points.
  • a plurality of discrete gas cavities, one for each matrix cross point, is formed in the dielectric layer, each cavity in electrically operative adjacency to its corresponding matrix cross point.
  • a further dielectric or non-conductive layer or coating is then applied on the structure thus formed so as to assure that the second conductor array as well as any conductors in the first conductor array are dielectrically isolated from or non-conductively coupled to the operative gas medium with which the cavities are to be filled.
  • all of the electrically operative elements are formed monolithically in permanently fixed positional relationship on a common support substrate.
  • Such structure may be mounted in an envelope filled with an operating gas or a viewing plate may be joined to the structure by a spacer sealant element.
  • FIG. 1 is an isometric view of a monolithically structured gas discharge device incorporating the invention
  • FIG. 2 is a partially enlarged sectional view of the support substrate illustrating the monolithicity of the panel
  • FIG. 3 is a diagrammatic illustration of an offset location of the discharge cavities with respect to the cross points of the matrix
  • FIG. 4 is a diagrammatic illustration of the position of the discharge cavities overlying the bottom or first applied conductor array as shown in FIG. 2;
  • FIG. 5 is an enlarged cross-sectioned view of a discharge cavity illustrating a modification of the invention.
  • FIG. 6 is an enlarged cross-sectioned view of a cavity shown in FIG. 2 with typical dimensional measurements for a device which has 33 electrodes per inch linear density. Higher densities are contemplated.
  • a support substrate 10 which may be flat or planar as shown or bowed or curved if desired, has a first or bottom conductor array 11 formed thereon.
  • Such conductor arrays may be gold, silver, copper etc., as described in Baker et al. US. Pat. No. 3,499,167 and are applied by any suitable conductor printing processes to thicknesses of from about 5,000 to about 10,000 angstrom units. It will be appreciated that such conductors may be small gauge wires which are placed in the desired pattern on the surface of plate 10 and adhered thereto by an adhesive until the later elements of the monolithic structure have been applied.
  • a dielectric layer or coating 12 is applied over the conductors 11 and has a thickness of from about 0.5 mils to about 6 mils and in an operating example was about 1.2 mils thick.
  • a top cooperating conductor array 13 is applied to the upper surface of the dielectric coating or layer 12 and can be applied in the same manner as the bottom conductor array 11 (it will be appreciated that the terms top" and bottom are relative and could just as well be called row and column conductor arrays, respectively).
  • Conductor array 13 is applied at transverse angles with respect to conductor array II to thereby define a plurality of matrix cross points.
  • a plurality of discrete discharge cavities 15 are formed in dielectric coating or layer 12.
  • cavities 15 are located over the bottom conductors ll and adjacent the top conductors 13.
  • Each cavity may be formed by well known photoetching technique and/or chemical etching through a mask or screen having a pattern of holes in registry with the desired cavity location on the dielectric surface.
  • the use of a laser beam, sonic source of like-energy is contemplated for drilling or forming the cavities.
  • the cavities may comprise any suitable geometric shape such as a rounded hole, a groove, etc.
  • the mask had openings or apertures having a diameter of about 8 mils and the resulting cavities had exemplary dimensions of about 12 mils diameter at the top and about 6 mils at the bottom with a dielectric layer thickness of about l.2 mils.
  • the etching process in this example was terminated so that a thin layer of about 0.1 to 0.2 mils of dielectric remained on the bottom conductor 11.
  • the cavities need not be located over the bottom conductors or in alignment with any of the conductors but may, in their adjacency to the matrix cross points, only need to be positioned such that the electric field between thecross points is capable of manipulating the discharge condition of any gas in the cavities 15.
  • the cavities may be located in any of the other sectors adjacent the matrix cross points such as indicated by dotted lines in the upper left corner of FIG. 3. In some cases, it may be desirable to place cavities 15 in all of these positions. It will also be appreciated that cavities 15 may be formed in dielectric layer I2 before or after the application of conductor array 13.
  • the monolithic portion of the structure is completed by applying, as by vacuum deposition techniques, an overcoat or layer 16 on the top conductor array 13 as well as in the cavities l5 and on the exposed surfaces of dielectric layer 12.
  • the overcoat is typically nonconductive; however, the utilization of conductive overcoats is contemplated.
  • the term overcoat is intended to include any film, layer, deposit, etc., applied continuously or discontinuously to the dielectric or conducting surfaces.
  • the overcoat in addition to providing a coating on conductor array 13 is also preferably a good photoemitter and capable of lowering and stabilizing the operating voltage of the device.
  • the overcoat typi' cally comprises one or more layers of an oxide of lead, silicon, aluminum, titanium, zirconium, hafnium, magnesium, beryllium, calcium, strontium, or barium.
  • oxides of rare earths may be utilized, both of the Lanthanide and Actinide Series, especially scandium, yttrium, thorium, and cerium.
  • pure metals such as zinc, lead, gold, copper, silver, etc. may be used.
  • all of the electrically operative structural elements are monolithically formed as an integral assembly.
  • the electrically operative elements may, if desired, be formed on substrate 10 in such a way as to be removable from the substrate after forming and mounted in a gas filled envelope.
  • a spacer-sealant member [8, such as any well known glass frit sealant is silk screened on the surface of the monolithic assembly, but short of the lateral edges of plate 10 so as to permit the conductors in the arrays to extend to the edges of the plate to permit connection to external circuits.
  • a viewing cover plate 19, is mounted on the monolithic assembly in spaced relation by means of spacer sealant rib 18.
  • overcoat 16 be limited to the area of the panel where good photoemissivity is desired and not under spacer-sealant 18.
  • the spacing between cover plate 19 and the monolithic assembly is not critical, and forms a gas reservoir or chamber for the assembly.
  • a gas filling tubulation, not shown, may be applied to substrate 10 (outside the viewing area of the device) or to viewing plate 19.
  • gases and gas mixtures have been utilized as the gaseous medium in a gas discharge device.
  • gases include C0; C0 halogens; nitrogen; NI-I oxygen; water vapor; hydrogen; hydrocarbons; P 0 boron fluoride; acid fumes; TiCh; Group VIII gases; air; H 0 vapors of sodium, mercury, thallium, cadmium, rubidium, and cesium; carbon disulfide; laughing gas; H 8; deoxygenated air; phosphorus vapors; C 11 CH naphthalene vapor; enthracene; freon; ethyl alcohol; methylene bromide; heavy hydrogen; electron attaching gases; electron free gases; sulfur hexafluoride; tritium; radio active gases; and the rare or inert gases.
  • two or more rare gases selected from neon, argon, xenon, krypton, and radon in the presence or absence of effective amounts of other gaseous components such as mercury and/or helium.
  • FIG. 5 A modification in the monolithic structure and manner of forming the cavities is shown in FIG. 5.
  • the bottom conductor array 11 has applied thereto barrier coating which is resistant to the etchant used to form the cavities.
  • the etchant removes the dielectric 12 to barrier 20. This avoids any variation in the thickness of dielectric over bottom conductor 11 when the cavities are to be located thereover.
  • a barrier 20 may be non-conductive material such as alumina, chrome nitride, etc., deposited by vacuum deposition tecniques to a thickness of about 5,000 to about 10,000 angstrom units.
  • a photo-emissive ovcrcoat may be employed exclusively over each discharge site or cell, so as to isolate the discharge cell from adjacent or other neighboring cells.
  • the overcoat is omitted from the top electrode array such that the electrodes are in direct contact with the gaseous medium.
  • the discharge takes place between the top bare or exposed electrode and the bottom of the cavity.
  • top and/or bottom electrodes may be split with the cavity positioned in between or within the two halves of the split electrode.
  • the two halves could also be electrically manipulated separately for purposes of addressing (such as with capacitively coupled multiplexing techniques).
  • overcoat or barrier layers may be employed, especially luminescent phosphors.
  • phosphors may be positioned within the device as dots, etc. so as to be excited by a gas discharge or other means.
  • the discharges take place between the bottom of a depression, under or adjacent to which is a back or bottom conductor and a top conductor covered with a thin film dielectric.
  • the distance between these two points once established, can be held thru heat treatments and sealing processes even if the entire plate is warped.
  • Prior art construction must hold the distance between the front and back plate accurately, since the discharge occurs between the two plates.
  • the front plate 19 Since the discharge takes place on a single side of a plate, as opposed to between two plates, the front plate 19 is free for other use. The most obvious use is to simply leave it clear for maximum use of light generated in the discharge. This is possible because there are no electrodes or films to block it. Another use is for the application of phosphors.
  • Electrostatic field focusing is caused by the depression similar to the Bitzer et al sandwich structure.
  • the fields should also be better focused around the front electrodes since they are covered only by a thin dielectric overcoat possibly leading to slightly higher densities.
  • a method of making gas discharge display device comprising:
  • dielectric layer has a thickness of from about 0.5 mils to about 6 mils.
  • a non-conductive support substrate has applied thereto a first conductor array, applying a barrier coating on said first conductor array to form a barrier layer, and then applying a thin dielectric coating on said barrier layer to form a thin dielectric layer applying a second conductor array on said support substrate and said thin dielectric layer in transverse relation with respect to said first conductor array and on the opposite sides of said barrier layer;
  • a method of making gas discharge display device comprising:
  • a non-conductive support substrate constituting: forming a first conductor array on said substrate; applying a thin insulative layer on said first conductor array; forming a transverse conductor array on said thin insulative layer in transverse relation with respect to said first conductor array and on the opposite side of said thin insulative layer; forming a plurality of gas cavities in said thin insulative layer offset from but proximate to the crossing points of said conductor arrays on the side of said insulative layer opposite said first conductor array;
  • said gaseous medium is constituted by two or more rare gases selected from the group neon, argon, xenon, krypton and radon.
  • gaseous medium includes effective amounts of other gaseous components selected from mercury and helium.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Gas-Filled Discharge Tubes (AREA)
US00197003A 1971-11-09 1971-11-09 Monolithically structured gas discharge device and method of fabrication Expired - Lifetime US3787106A (en)

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US (1) US3787106A (enrdf_load_stackoverflow)
JP (1) JPS4856059A (enrdf_load_stackoverflow)
CA (1) CA965137A (enrdf_load_stackoverflow)
DE (1) DE2249682A1 (enrdf_load_stackoverflow)
FR (1) FR2159387B1 (enrdf_load_stackoverflow)
GB (1) GB1415673A (enrdf_load_stackoverflow)
IT (1) IT966368B (enrdf_load_stackoverflow)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904906A (en) * 1971-12-29 1975-09-09 Fujitsu Ltd Plasma display panel including an opaque, reinforcing film
US3904905A (en) * 1972-02-28 1975-09-09 Matsushita Electric Ind Co Inc Luminous radiation panel apparatus
US3935494A (en) * 1974-02-21 1976-01-27 Bell Telephone Laboratories, Incorporated Single substrate plasma discharge cell
US3993379A (en) * 1975-12-22 1976-11-23 The Perkin-Elmer Corporation Mercury electrodeless discharge lamp and method of its fabrication
US4009407A (en) * 1974-07-30 1977-02-22 Panel Technology, Inc. Segmented electrode type gas discharge display panel with mercury giver means
US4028578A (en) * 1973-02-16 1977-06-07 Owens-Illinois, Inc. Gas discharge dielectric containing a source of boron, gallium, indium, or thallium
US4109176A (en) * 1972-09-25 1978-08-22 Owen-Illinois, Inc. Insulating dielectric for gas discharge device
US4160311A (en) * 1976-01-16 1979-07-10 U.S. Philips Corporation Method of manufacturing a cathode ray tube for displaying colored pictures
US4164059A (en) * 1976-01-16 1979-08-14 U.S. Philips Corporation Method of manufacturing a color display tube and color display tube manufactured by said method
US4235001A (en) * 1975-09-17 1980-11-25 Haruhiro Matino Gas display panel fabrication method
EP0081359A1 (en) * 1981-12-04 1983-06-15 BURROUGHS CORPORATION (a Delaware corporation) Method of making an assembly of electrodes
EP0081360A1 (en) * 1981-12-04 1983-06-15 BURROUGHS CORPORATION (a Michigan corporation) Method of making an electrode assembly
US4494038A (en) * 1975-03-10 1985-01-15 Owens-Illinois, Inc. Gas discharge device
WO1998001884A3 (en) * 1996-07-08 1998-02-12 Univ California Microgap flat panel display
US20020167265A1 (en) * 2001-05-09 2002-11-14 Kenji Miyata Display device
US20030160738A1 (en) * 2002-02-22 2003-08-28 Yoshiyuki Kaneko Display device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164678A (en) * 1978-06-12 1979-08-14 Bell Telephone Laboratories, Incorporated Planar AC plasma panel
JPS5979938A (ja) * 1982-10-28 1984-05-09 Fujitsu Ltd ガス放電パネル
JPS6081735A (ja) * 1983-10-13 1985-05-09 Fujitsu Ltd ガス放電パネルとその駆動方法
TW503425B (en) * 2000-03-27 2002-09-21 Technology Trade & Transfer A single substrate-type discharge display device and its drive method as well as a color Single substrate-type discharge display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3479237A (en) * 1966-04-08 1969-11-18 Bell Telephone Labor Inc Etch masks on semiconductor surfaces
US3559190A (en) * 1966-01-18 1971-01-26 Univ Illinois Gaseous display and memory apparatus
US3614509A (en) * 1969-05-07 1971-10-19 Westinghouse Electric Corp Large area plasma panel display device
US3646384A (en) * 1970-06-09 1972-02-29 Ibm One-sided plasma display panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559190A (en) * 1966-01-18 1971-01-26 Univ Illinois Gaseous display and memory apparatus
US3479237A (en) * 1966-04-08 1969-11-18 Bell Telephone Labor Inc Etch masks on semiconductor surfaces
US3614509A (en) * 1969-05-07 1971-10-19 Westinghouse Electric Corp Large area plasma panel display device
US3646384A (en) * 1970-06-09 1972-02-29 Ibm One-sided plasma display panel

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904906A (en) * 1971-12-29 1975-09-09 Fujitsu Ltd Plasma display panel including an opaque, reinforcing film
US3904905A (en) * 1972-02-28 1975-09-09 Matsushita Electric Ind Co Inc Luminous radiation panel apparatus
US4109176A (en) * 1972-09-25 1978-08-22 Owen-Illinois, Inc. Insulating dielectric for gas discharge device
US4028578A (en) * 1973-02-16 1977-06-07 Owens-Illinois, Inc. Gas discharge dielectric containing a source of boron, gallium, indium, or thallium
US3935494A (en) * 1974-02-21 1976-01-27 Bell Telephone Laboratories, Incorporated Single substrate plasma discharge cell
US4009407A (en) * 1974-07-30 1977-02-22 Panel Technology, Inc. Segmented electrode type gas discharge display panel with mercury giver means
US4494038A (en) * 1975-03-10 1985-01-15 Owens-Illinois, Inc. Gas discharge device
US4235001A (en) * 1975-09-17 1980-11-25 Haruhiro Matino Gas display panel fabrication method
US3993379A (en) * 1975-12-22 1976-11-23 The Perkin-Elmer Corporation Mercury electrodeless discharge lamp and method of its fabrication
US4164059A (en) * 1976-01-16 1979-08-14 U.S. Philips Corporation Method of manufacturing a color display tube and color display tube manufactured by said method
US4160311A (en) * 1976-01-16 1979-07-10 U.S. Philips Corporation Method of manufacturing a cathode ray tube for displaying colored pictures
EP0081359A1 (en) * 1981-12-04 1983-06-15 BURROUGHS CORPORATION (a Delaware corporation) Method of making an assembly of electrodes
EP0081360A1 (en) * 1981-12-04 1983-06-15 BURROUGHS CORPORATION (a Michigan corporation) Method of making an electrode assembly
US4407934A (en) * 1981-12-04 1983-10-04 Burroughs Corporation Method of making an assembly of electrodes
WO1998001884A3 (en) * 1996-07-08 1998-02-12 Univ California Microgap flat panel display
US5847509A (en) * 1996-07-08 1998-12-08 The Regents Of The University Of California Microgap flat panel display
US20020167265A1 (en) * 2001-05-09 2002-11-14 Kenji Miyata Display device
US6936958B2 (en) * 2001-05-09 2005-08-30 Hitachi, Ltd. Display device
US20030160738A1 (en) * 2002-02-22 2003-08-28 Yoshiyuki Kaneko Display device

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Publication number Publication date
CA965137A (en) 1975-03-25
DE2249682A1 (de) 1973-05-17
FR2159387B1 (enrdf_load_stackoverflow) 1978-11-03
JPS4856059A (enrdf_load_stackoverflow) 1973-08-07
GB1415673A (en) 1975-11-26
FR2159387A1 (enrdf_load_stackoverflow) 1973-06-22
IT966368B (it) 1974-02-11

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