US3781764A

US3781764A - Moisture seal for electrical connector

Info

Publication number: US3781764A
Application number: US00198920A
Authority: US
Inventors: F Johnson
Original assignee: Collins Radio Co
Current assignee: Collins Radio Co
Priority date: 1971-11-15
Filing date: 1971-11-15
Publication date: 1973-12-25
Anticipated expiration: 1990-12-25
Also published as: US3836935A

Abstract

Disclosed is a printed circuit board interconnect system having moisture seal means for precluding the formation of a moisture film between electrical contacts. The seal means comprises a resilient seal strip having one or more integral hollow seals disposed on either side thereof, each hollow seal surrounding a male connecting pin of the system and being compressed between printed circuit boards that are electrically connected.

Description

United States Patent [191 Johnson Dec. 25, 1973 MOISTURE SEAL FOR ELECTRICAL CONNECTOR I [75] Inventor: Frederick W. Johnson, Cedar Rapids, Iowa [73] Assignee: Collins Radio Company, Dallas,

Tex.

22 Filed: Nov. 15,1971 21 Appl.No.:198,92(l

[52] US. Cl 339/94, 174/153, 339/17 [51] Int. Cl H011) 17/26, HOlr 7/02 [58] Field of Search 317/101 CC; 174/138,

[56] References Cited UNITED STATES PATENTS 3,457,441 7/1969 Phillips et al. 174/153 R 3,272,952 9/1966 McKeon 174/138 D X 3,086,074 4/1963 Just et al 339/94 A 3,439,316 4/1969 Evans 339/258 R 3,136,591 6/1964 Just et a1 339/17 LM 2,619,515 11/1952 Doane 339/94 M FOREIGN PATENTS OR APPLICATIONS 1,415,920 4/1969 Germany 174/153 G 1,202,435 1/1960 France 339/94 M 587,643 5/1947 Great Britain 339/94 M Primary Examiner-Marvin A. Champion Assistant Examiner-Terrell P. Lewis AztorneyRobert .1. Crawford [57] ABSTRACT Disclosed is a printed circuit board interconnect system having moisture seal means for precluding the formation of a moisture film between electrical contacts. The seal means comprises a resilient seal strip having one or more integral hollow seals disposed on either side thereof, each hollow seal surrounding a male connecting pin of the system and being compressed between printed circuit boards that are electrically connected.

10 Claims, 10 Drawing Figures PATENIEDMMS 1915 3,781. 764

sum 3 BF 5 SHEET 5 OF 5 PMENTHJBEC2 I975 FIG. 4(0) FlG. 4(b) MOISTURE SEAL FOR ELECTRICAL CONNECTOR This invention relates in general to electrical interconnect systems and in particular to systems for electri cally interconnecting printed circuit boards in modular fashion so that each of the boards may be readily connected and disconnected.

In the past decade, numerous pin and socket electrical interconnect systems have been developed for facilitating interchangeability of electrical component box units. In the printed circuit board field, the boxes consist of multiple side or interconnect boards and associated printed circuit component boards or cards, usually all of the multilayer circuit variety and detachably plugged together. Such interconnect systems are well known as exemplified by U.S. Pat. Application No. 92,772, filed Nov. 25, 1970, and assigned to the assignee of this invention, and by U. S. Pat. No. 3,270,251.

Because of the high density and corresponding close proximity of electrical contacts, the application of these interconnect systems in environments subject to high humidity and temperature variations may not be satisfactory due to the formation of a moisture film between contacts which lowers the insulation resistance and jeopardizes complex circuit operations. No known means has been available for solving this problem.

It is therefore an object of this invention to provide an interconnect system of the type described with a moisture sealing arrangement which will prevent moisture condensate from bridging adjacent contacts.

I It is another object to provide new and unique moisture seals for use in a wide variety of interconnect systerns.

In one preferred embodiment of the invention, a printed circuit interconnect board is disclosed having a plurality of electrical male connecting pins perpendicularly extending therefrom. A low spring-rate resilient seal of dielectric material surrounds each of the connecting pins of the interconnect board. A printed circuit component board has mounted thereon one or more conductors each of which is comprised of an elongated dielectric contact housing containing a plurality of spaced electrical female sockets. Each of the sockets includes spring biased electrical contact means which form an opening for frictionally receiving one of the male connecting pins of the interconnect board such that the interconnect board and the printed circuit component boards are held in spaced relationship and separated by the resilient seals, the seals being compressed between the board and the connector to form a moisture seal between contacts.

This and other preferred embodiments of the invention are described in more detail in the following specification with reference to the accompanying drawings in which:

FIG. 1 (a) is a pictorial view of the preferred integral seal of this invention;

FIG. 1(b) is a cross sectional view of the novel moisture seal of the invention taken along the section line l--l of FIG. 1(a);

FIG. 2(a) is a pictorial view of one embodiment of the invention showing a printed circuit board'with a single connectortherein in spaced relationship to an interconnect board having perpendicular connecting pins extending therefrom and through the integral moisture seal;

FIG. 2(b) pictorially illustrates the components of FIG. 2(a) in assembled relation;

FIG. 2(c) is a cross section taken along line 22 of FIG. 2(b);

FIG. 3(a) is an exploded pictorial view of a plurality of printed circuit component boards to be parallel mounted with an interconnect board;

FIG. 3(b) illustrates the interconnect system of FIG. 3(a) in assembled condition; y

FIG. 3(c) is a cross section taken along lines 3-3 of FIG. 3(b);

FIG. 4(a) is a pictorial-view of an alternative moisture seal; and

FIG. 4(b) is a sectional view taken along line 4-4 of FIG. 4(a).

In FIGS. 1(a) and 1(b), a preferred moisture seal of this invention is comprised of a carrier strip 2 having a plurality of hollow and generally cylindrical or O ring shaped seals 6 extending from the bottom side of the strip, and a plurality of bellow type hollow seals 4 extending from the top side of the strip. These bellowslike seals embody the principle of controlled collapse providing relatively uniform axial sealing force over an extended range of travel. The axes of the oppositely located hollow seals are in alignment and of predetermined spacing. Obviously the strip.2 could be severed into segments comprised of any desired number of opposed hollow seals. The seal may be constructed of any suitable resilient dielectric material which will not be adversely affected by temperatures varying between 55 C to C, the particular resiliency and temperature characteristics being determined by the type connectors with which the seal is used and by the environment to which the seal will be subjected. One suitable material is the Class III, Grade 50, silicone rubber defined by Federal Specification ZZR-765.

With particular reference to FIG. 1(b), the bellows type seal 4 is in the shape of two inverted

frustums

8 and 9; i.e., two frustums adjoining each other at their maximum cross sectional dimensions. The bellows type seal and the opposed O ring type seal ring surround a diaphragm portion 10 of the carrier strip 2. The diaphragm 19 has a hole 12 which joins the cavities formed by the O ring and bellows type seals, the common axes of the opposed seals passing through the center of the holes. It should be noted that the holes 12 are smaller in cross section than the male connecting pins to be inserted through the holes, thereby forming a moisture resistant seal between the pins and the diaphragms.

Referring to FIG. 2(a), illustrated is a printed circuit component board 16 having connector 18 mounted thereon in conventional manner (not disclosed). While it is not illustrated, as well known in the art a printed circuit component board 16 traditionally carries a plurality of semiconductor and/or other. discrete components, the board usually being of laminated structure having varied interconnect circuitry within the multilayer circuit planes. Also shown in simplified fashion is a printed circuit interconnect board 20 having a plurality of pins 22 extending perpendicularly therefrom. Again in known fashion the pins 22 are soldered to plated through holes in the interconnect board and are in predetermined electrical contact with circuitry carried by the board. While the board is'referred to herein asan interconnectboard as it carries the male connecting pins, it should be noted that it also may carry com- The moisture seal strip 2 is illustrated having the connecting pins 22 extending through the O ring seal 6, hole 12 and bellows seal 4 of the carrier strip.

FIG. 2(b) illustrates the printed circuit component board and the printed circuit interconnect board plugged together in the intended manner, and FIG. 2(c) is a cross sectional view taken along line 22 of FIG. 2(b) to illustrate the interrelationship of parts in more detail. As shown in FIG. 2(c), the connector housing 18 has a plurality of cavities 28 each containing a female electrical socket 24, each socket having opposed spring arms 26 in frictional engagement with connecting pins 22. Cavities 28v have an enlarged leadin cavity 30 for guiding the male pins and receiving the conjugate frustum 8 of the bellows 4. It will be noted that when the printed circuit component board and the printed circuit interconnect boards are pressed together the seal is compressed to form a moistureproof junction between the lead in cavities 30 of the connector and the frustums 8 of the seals 4, between the pins 22 and the diaphragm l and between 0 ring seal 6 and the surface 17 surrounding the plated through holes of the interconnect board I6. By constructing the bellows seal 4 with the frustum 8, a long creepage path is provided along the entire length of frustums 8 and the walls of cavities 30. Therefore while a single frustum or cylindrical type seal could be used in place of bellows seal 4 as shown, the preferred seal shape provides a low spring rate seal with the highest moisture resistance between contacts. The frictional force between spring arm 26 and connecting pins 22 is sufficient to hold the boards together against the forces of this seal, and it is readily apparent that each contact has its own moistureproof seal from the adjacent contact. Therefore each contact is isolated from all other contacts by two insulation elements; i.e., its own surround seal and the surround seal of the other circuit.

Rather than mounting printed circuit'boards perpendicular to one another as shown in FIGS. 2(a), 2(b) and 2(0), it is often desirable to mount the boards in parallel. Such an arrangement is shown in FIGS. 3(a), 3(b) and 3(c). Shown in an exploded pictorial view in FIG. 3(a) is a printed circuit interconnect board 32 having connecting pins 34 and an associated carrier strip 36. Illustrated in spaced relationship are two printed

circuits component boards

38 and 39 each having

connectors

40 and 41, respectively, the connecting pins 34 passing through the connectors 40 and board 38. Additional carrier strips 37 are mounted on the pins 34 between

boards

38 and 39. FIG. 3(b) shows the boards in assembled form, and FIG. 3(0) is a cross sectional view taken along line 3-3 of FIG. 3(b) illustrating in detail the arrangement of parts. The

connector housings

40 and 41, connector cavities 44, sockets 46 and opposed spring arms 48 are as illustrated in FIGS. 2(a), 2(b) and 2(c). It will be observed, however, that connecting pins 34 are of sufficient length to extend completely through the lower printed circuit component board to engage the spring arms 48 of

connectors

40 and 41. The seals cooperate with the printed circuit boards and connector housings in the same precise fashion as described with respect to FIGS. 2(a), 2(b) and 2(0).

While not described in detail it should be realized that the moisture seals of this invention could be utilized with the integral pin and socket connector arrangement as described in detail in the aforementioned U.S. Fat. application Ser. No. 92,772 filed Nov. 25, I970.

FIGS. 4(a) and 4(b) illustrate an alternative moisture seal which is particularly useful with highly dense contact arrangements, such as, for example where the connecting pins of FIGS. 2 and 3 are on one tenth inch centers. Carrier strip 50 has ribs 52 extending from the bottom side defining hollow seats having cavities 54. Extending from the top of the carrier strip are bellows type seals 56 each comprised of

inverted frustums

58 and 60 which form cavities 62. It will be noted that the cross section of

frustums

58 and 60 are rectangular in shape and particularly adapted for contacting the rectangular lead in

cavities

30 and 62 of the

connectors

18 and 20 of FIGS. 2 and 3. The cavities formed by bellows seals 56 are each opposite a rectangularly shaped cavity 54 formed by the ribs 52, opposed cavities being joined by holes 66 through diaphragms 64. The axes of

opposed cavities

54 and 62 and holes 64 are in alignment.

While certain preferred cross sectional shapes for the lower and top seals of the carrier strip have been illustrated for use with particular interconnect systems, it is contemplated that different cross sectional shapes may be used with the disclosed and other similar systems without departure from the teachings herein.

I claim:

1. A resilient seal strip for use in printed circuit board interconnect systems comprising: a resilient carrier strip; a plurality of protrusions integral with said strip extending from the first side of said strip and defining a first plurality of hollow seals of predetermined spacing; and a plurality of protrusions integral with said strip extending from the second side of said strip and defining a second plurality of resilient collapsible low spring rate hollow seals, each one of the seals of said first plurality having a common axis with one of the seals of said second plurality, each said common axis passing through a hole in said strip, the maximum diameter of each hole being substantially less than the interior diameter of each of the hollow seals of said second plurality at the junction of the seals and said carrier strip.

2. The seal strip of claim 1 in which the hollow seals of said first plurality are rectangular in shape.

3. The seal strip of claim 1 in which the hollow seals of said first plurality are cylindrical in shape.

4. The seal strip of claim I in which the hollow seals of said second plurality are cylindrical in shape.

5. The seal strip of claim 1 in which the hollow seals of said second plurality are in the shape of a frustum.

6. The seal strip of claim 1 in which the hollow seals of said second plurality of seals are in the shape of two inverted frustums.

7. The seal strip'of claim 1 in which the interior diameter of each seal of said second plurality of seals at the junction with the carrier strip and the point farthest removed from the carrier strip is in each instance substantially less than the maximum interior diameter thereof.

8. The seal strip of claim 1 wherein the interior diameter of each seal of said second plurality of seals at the junction of said carrier strip is substantially less than the interior diameter of each seal of said first plurality of seals at said junction.

9. A resilient seal strip for use in printed circuit interconnect systems comprising: a resilient carrier strip; a

first plurality of resilient hollow and generally cylindrical seals of predetermined spacing integral with said 1 strip and extending from a first side of said strip; and a second plurality of resilient integral hollow seals in the shape of two inverted frustums extending from and integral with the second side of said strip, each one of the hollow seals of said first plurality having a common axis with one of the hollow seals of said second plurality, each said common axis passing through the center of a hole in said strip, the minimum interior diameter of each hollow seal of said second plurality being substantiallylarger than the maximum diameter of each hole in said strip.

maximum diameter of said hole.

UNITED STATES PATENT OFFICE I CERTIFICATE OF CORRECTION Patent No. 3,781,764 Dated Dec. 25, 1973 Inventor(S) Frederick w. Johnson It is certified that error appears in the above-identified patent and that said Letters Patent are hereby corrected as shown below:

Column 1 line 42 change "conductors" to --connectors-;

l Co1umn 2, hne 43 change "19" to --10--; I

change "circuit" to --contact--;

Column 3, line 38" Claim 10, h'ne 7 change the semicolon (g) to a comma Signed and seeledthis 9th day of Jul 1974.

(SEAL) Attest:

MCCQY M. GIBSON, JR.v C. MARSHALL- DANN Attesting Officer Commissioner of Patents FORM PO-1050HO-69) USCOMM-DC 6037 8-F'69 US GOVERNMENT PRINTING OFFICE: I969 O-366-334 UNITED STATES PATENT. OFFICE I CERTIFICATE OF CORRECTION Pateht No. 331,764 Dated Dec. '25, 1973 Inventor(s) Frederick w. Johnson It is certified that error appears in the above-identified patent and that said Letters Patent are hereby corrected as shown below:

A Column l line 42 change "conductors" to --connectors-';

change "l9" to --l0--; Y

Y Column 2, line 43 Column 3, line 38 v Claim 10, line 7 change the semicolon to a comma Signed and seal ec l this 9th day of Jhly"l97 (SEAL) Attest:

McCOY M. GIBSON, JR. C. MARSHALL DANN At testing Officer v Commissioner of Patents FORM PO-1050 (10-69) .USCOMM-DC 60376-P69 U.$. GOVERNMENT PRINTING OFFICE Ill! 0-366-334

Claims

4. The seal strip of claim 1 in which the hollow seals of said second plurality are cylindrical in shape.

7. The seal strip of claim 1 in which the interior diameter of each seal of said second plurality of seals at the junction with the carrier strip and the point farthest removed from the carrier strip is in each instance substantially less than the maximum interior diameter thereof.

9. A resilient seal strip for use in printed circuit interconnect systems comprising: a resilient carrier strip; a first plurality of resilient hollow and generally cylindrical seals of predetermined spacing integral with said strip and extending from a first side of said strip; and a second plurality of resilient integral hollow seals in the shape of two inverted frustums extending from and integral with the second side of said strip, each one of the hollow seals of said first plurality having a common axis with one of the hollow seals of said second plurality, each said common axis passing through the center of a hole in said strip, the minimum interior diameter of each hollow seal of said second plurality being substantially larger than the maximum diameter of each hole in said strip.

10. A low spring rate resilient seal comprising; a resilient carrier strip; a first hollow and generally cylindrical resilient seal integral with and exTending from a first side of said strip; a second hollow and generally cylindrical resilient seal integral with and extending from a second side of said strip; and a hole extending through said strip between said first and second seals; the axes of said first and second seals and said hole being in alignment, the minimum interior diameter of at least one of said seals being substantially larger than the maximum diameter of said hole.