US3725065A - Method for making a kinescope comprising a color selection mask with temporary corridors - Google Patents

Method for making a kinescope comprising a color selection mask with temporary corridors Download PDF

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US3725065A
US3725065A US00076907A US3725065DA US3725065A US 3725065 A US3725065 A US 3725065A US 00076907 A US00076907 A US 00076907A US 3725065D A US3725065D A US 3725065DA US 3725065 A US3725065 A US 3725065A
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mask
substrate
color
apertures
layer
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G Fadner
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RCA Licensing Corp
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RCA Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H01J9/142—Manufacture of electrodes or electrode systems of non-emitting electrodes of shadow-masks for colour television tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H01J9/142—Manufacture of electrodes or electrode systems of non-emitting electrodes of shadow-masks for colour television tubes
    • H01J9/144—Mask treatment related to the process of dot deposition during manufacture of luminescent screen

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  • the present invention relates to color kinescopes and particularly to a novel method for making a maskedtarget color kinescope wherein the image screen is produced with the use of a temporary mask having temporary apertures of given size which temporary mask is subsequentialy converted to a permanent color-selection mask having larger apertures of a second size.
  • the prior art discloses color kinescopes having an image screen, which includes a mosaic comprising a multiplicity of groups of closely spaced elemental phosphor deposits, the elemental deposits of each of such groups emitting light of a particular color when struck by an electron beam, and a color-selection mask disposed between the image screen and the electron source of the kinescope.
  • Such masks including focusing and non-focusing masks
  • Such masks and their mode of operation are well-known and may be of a planar, or spherical, or some other nonplanar contour, the contour of a particular mask generally being similar to that of the image screen with which it is used.
  • the size of the apertures in the color-selection mask is graded from a maximum at the center to a minimum at the edge of the mask.
  • the mask apertures and also the beam spots on the screen are somewhat smaller than the phosphor areas.
  • commercial screen printing procedures involve using a color-selection mask having apertures of a desired Iinal size as a master for photographically printing the phosphor areas thereof.
  • the mask, with the size of its apertures unchanged, is then used in a color kinescope for color-selection.
  • the prior art discloses masks having apertures that are individually larger than those in a conventional shadow mask kinescope, and that may be larger than the respective elemental phosphor areas of the image screens associated therewith. If no focusing action is involved, such larger aper- 3,725,065 Patented Apr. 3, 1973 ICC tures provide electron beam spots of greater size as measured at the screen, so that a larger proportion (or, in many cases, all) of each phosphor area is impinged than in conventional color kinescopes.
  • the beam spot size at the screen generally is reduced to approximately the phosphor area size by focusing the beamlets in the space between the mask and the screen.
  • masks with such larger apertures are not satisfactory for direct screen printing (for both focusing and non-focusing-type tubes) because they generally lead to oversize (and, therefore, overlapping) phosphor areas and associated problems with color purity and white uniformity.
  • a mask In order to allow the use of a mask, first, as a photographic master for screen printing and, then, as a color-selection mask (either focusing or non-focusing type) exhibiting increased electron transmissivity, the prior art has -sought ways to provide, and use for screen printing, a temporary mask having temporary apertures of a lirst size and, after screen printing, to convert the temporary mask to a permanent, or final, colorselection mask having the desired larger, final-size apertures, this with substantial maintenance of the desired kinescope operating tolerances.
  • a colorselection mask is not a preliminary mask since the apertures of the former are larger in size and the former is used only for the color-selection function (including focusing), not for screen printing.
  • each aperture of inal size is larger than the associated perforation in the resist coating, so that portions of the resist coating overhang the final-size apertures in the conductive sheet and form printing apertures of smaller size than the apertures. Then the partially coated sheet is used as a master in the well-known image screenprinting operation, the light rays utilized for printing passing through and being defined by the small perforations in the resist coating. The resist coatings are subsequently removed so that the apertured conductive sheet can be used as a color-selection mask.
  • this method is not completely satisfactory from a commercial standpoint, especially in those cases where the color-selection mask is desired to have a non-planar final configuration.
  • the bichromated glue or shellac, as well as comparable other organic resist materials disclosed in the prior art deteriorate at the annealing temperatures (e.g., about 900 C.) generally employed in producing non-planar masks by continuous mask-making processes practiced in the art. More specifically, in these continuous mask-makin processes, a tiat band of a suitable conductive material (e.g., cold-rolled steel), which is in a comparatively hard condition, is passed through the mask-making equipment where the band is, inter alia, provided with suitable apertures.
  • the conductive material is used in a relatively hard condition to impart strength thereto and thereby minimize tearing and/or deformation of the band while it is being passed through the mask-making equipment.
  • a non-planar (e.g., spherical) mask When a non-planar (e.g., spherical) mask is required, it is generally desirable to shape the mask to the desired configuration after the mask-making operation is completed but before the screen-printing operation. For such a shaping operation, it is desirable, first, to anneal (at about 900 C. for 10 minutes, for example) the mask, which is still in a comparatively hard condition, in order to reduce the hardness, and thereby facilitate the shaping thereof. After the mask is annealed and shaped, it is generally mounted on a frame and used as a master for printing the phosphor areas of the image screen in a manner known in the art (see U.S. Pat. No. 3,406,068).
  • the perforated resist coating is required to remain on the preliminary mask during the screen-printing operation, which necessitates the resist coatings remaining on the preliminary mask throughout the preceding annealing operation.
  • the aforementioned resist materials i.e., shellac or glue
  • other organic resists known in the art are not capable of withstanding these annealing temperatures.
  • color-selection masks may be either of the above methods must be made from a sheet of comparatively soft material in order to avoid annealing of the preliminary masks and yet allow the shaping thereof with relative ease.
  • the above method is not completely commercialy satisfactory for the reason that the resist materials, such as shellac or glue, as well as other resists known in the art, used therein are not completely opaque.
  • opaquing materials are required to be added to the resist material to minimize the amount of light passing therethrough during the screen printing operation. This addition of opaquing materials involves additional steps in the manufacture of the kinescope.
  • portions of the resist coating overhang the final size apertures in the preliminary mask and because the prior art resist materials used therein are comparatively fragile, considerable care must be exercised in handling the preliminary mask to avoid damage to these overhanging portions during the mask forming operation.
  • an apertured metal layer is provided directly on a substrate of a second metal that is t be processed ultimately into a color-selection mask.
  • the apertured metal layer is produced in one embodiment therein by producing a suitable photosensitive resist pattern on the substrate area and thereafter depositing the second metal directly on accessible areas of the same surface, but substantially not on the resist pattern, and then removing the resist pattern.
  • the apertures in the metal layer serve as the temporary apertures for screen printing, the aperture size and shape being adjusted for this purpose by regulating the resist patterns dimensions and configuration.
  • the substrate-metal layer workpiece is then etched with a suitable material so that portions of the substrate that are accessible through the apertures of the metal layer are removed, thereby producing the colorselection mask with final size apertures. Because the apertured metal layer is on the substrate during the etching of the substrate, it is necessary that the second metal comprising this layer be resistant to the etchants that are used. Where the second metal is not completely so resistant, it, too, is attached by the etchant so that the size of the temporary apertures in the metal layer'might vary significantly from the proper dimensions, thus leading to improperly sized phosphor areas. Therefore, the range of materials from which the second metal can be selected is limited by the material comprising the substrate.
  • the invention comprises a method for producing a color kinescope containing a color-selection (final) mask having apertures of given dimension at each location on the mask (which apertures in a conventional graded mask, will vary from the center to the edge thereof) and an image screen, which screen is produced with a temporary mask having light-permeable corridors aligned with the apertures and having respective maximum dimensions smaller than the respective minimum dimensions of the associated apertures.
  • the method includes the steps of providing a perforated layer of etch resistant material on at least one surface of a suitable substrate and producing apertures that extend through the Substrate, the apertures being larger than and in substantial register with the openings of the perforated etch resistant layer.
  • an opaque layer of heat-resistant material e.g., a metal, preferably one having a melting point that significantly exceeds the thermal treatment temperatures intended for the temporary mask previous to the printing of the screen
  • the heat-resistant layer includes corridors that extend therethrough and that equal substantially the size of the openings of the etch-resistant layer.
  • the heat-resistant layer is removed, along with any remaining portions of the etch-resistant layer, from the substrate and the apertured substrate, which constitutes the color-selection mask, is then incorporated in the kinescope along with the screen.
  • the present method provides a number of improvements over the prior art, such as, for example, a temporary mask that can withstand the thermal treatments (e.g., annealing) generally conducted in kinescope manufacture, and a comparatively broad range of materials that can be used for the heat-resistant layer of the temporary mask.
  • a temporary mask that can withstand the thermal treatments (e.g., annealing) generally conducted in kinescope manufacture, and a comparatively broad range of materials that can be used for the heat-resistant layer of the temporary mask.
  • FIG. 1 is a side view, partly in axial section, of a mask-type color kinescope including an image screen prepared with the use of a temporary mask made by the present invention, which temporary mask is later converted to the color-selection mask of the kinescope.
  • FIG. 2 is a fragmentary, transverse sectional view of a resist-coated substrate prior to the conversion thereof to a temporary mask according to the present invention.
  • FIG. 3 is a fragmentary transverse sectional view of the structure shown in FIG. 2 at a subsequent processing step of the present invention, wherein perforations are provided in the resist layers.
  • FIG. 4 is a fragmentary transverse sectional view of the structure shown in FIG. 3, there being produced in the substrate apertures extending therethrough, and
  • FIG. is a sectional perspective view of the structure in FIG. 4, there being, additionally, an opaque layer of heat-resistant material disposed on and substantially coextensive with the resist layer.
  • FIG. 6 is a fragmentary transverse sectional view of the temporary mask produced by the steps including those shown in FIGS. 2 through 5.
  • FIG. 7 is a fragmentary perspective view of the temporary mask shown in FIG. 6, in position for use as a photographic master in preparing an image screen for a color kinescope.
  • FIG. 8 is a fragmentary sectional perspective view of a structure comprising a grille-type color-selection mask during processing into a temporary mask according to this invention, the structure further comprising a perforated etch-resistant layer and an opaque heat-resistant layer.
  • FIG. 9 is a fragmentary sectional transverse view of a structure comprising a substrate wherein the apertures extending therethrough have been produced by etching through the openings of only one of the perforated etchresistant layers thereon.
  • FIG l illustrates a mark-type color kinescope 1.0 ⁇ produced by the novel method and temporary mask structure disclosed herein, which kinescope 10 includes a glass envelope 12 comprising a funnel portion 14 and a panel or cap 16, which cap 16 includes a transparent faceplate 18.
  • a particular color e.g., red, blue, or green
  • the faceplate 18 (or other transparent substrate), the phosphor areas 20 and, optionally, a light absorbing matrix 26 (discussed below), are collectively referred to herein as an image screen 28.
  • an image screen 28 there is included on the image screen a light-reflective, electron-permeable, conductive layer (not shown) of aluminum, for example, which covers the phosphor areas and also serves as an electrode.
  • the phosphor areas 20, are, for illustration purposes, exaggerated in size and proportion (as are other parts of FIG. 1 and the other figures) and4 shown as having a dot configuration, which dots may, be arranged in the well-known hexagonal dot pattern (FIG. 7).
  • each phosphor area may have a wellknown stripe configuration (not shown), these stripes being arranged in an array of parallel lines of dierent color phosphors to provide a line color screen.
  • the kinescope 10 further includes a number of electron guns equal to the number of different colors in the screen and either electrostatic or magnetic deflection and convergence means, none of which are shown for simplicity.
  • a color-selection mask (or mask electrode )30 which may be, for example, of the focusing or non-focusing variety, both of which are known in the art.
  • a suitable frame 32 or other means can be used to support the color-selection (final) mask 30 in the cap 16.
  • the colorselection mask 30 is understood to be of the non-focusing mask variety, which is operated at substantially the same potential as the screen 28 to form a field-free region therebetween.
  • rIhe mask 30 ⁇ is made from a sheet or wide band of electrically conducting material (e.g., cold-rolled steel) and has a plurality of apertures 34 of desired final size therein.
  • the size of the apertures 34 may be graded from a maximum at the center to a minimum at the edge of the mask, as is well-known in the art. While the apertures 34 are, for simplicity, shown in FIG. 1 to be substantially circular in shape, apertures having other shapes may be used; for example, the mask may be of the grille type (FIG.
  • each aperture 34 is of such size as to be capable of passing an electron beam 22 whose spot dimensions, as measured at the screen 28 (i.e., the spot size of the beam), are at least substantially equal to, or preferably larger than, the size of the individual phosphor area 20 upon which the electron beam spot impinges.
  • the electron beam spot size is preferably sufliciently large to provide a negative leaving tolerance (beam spot larger than corresponding phosphor area) but not so great that the electron beam spot impinges any ones other than the intended phosphor areas.
  • the effective size of the light spots produced during screen printing generally exceeds by a significant amount the size of the electron beam spots produced in the operation of the kinescope. This results in the size of the individual phosphor areas being considerably greater than the spot size of their associated electron beam so that the beam spot impinges only a portion of each phosphor area.
  • Such differences in size between the printing light spots and the electron beam spots are familiar to the art, the difference therebetween being attributable to the more extensive penumbra-umbra effect taking place in the screen printing process.
  • the apertures 34 exceed in size their associated phosphor areas 20.
  • the apertures of a focusing-type mask are much greater in size than their respective individual phosphor areas whether the color tube is of the positive leaving tolerance type (beam spot smaller than a corresponding phosphor area) or the negative leaving tolerance type.
  • there is a single aperture in the color selection barrier for each trio of phosphor areas 20 i.e., one area each of red, green and blue phosphors); however, for purposes of simplicity, each aperture 34 is shown in FIG. 1 to correspond in position with only one phosphor area 20.
  • the kinescope 1G In the operation of the kinescope 1G, electrons are emitted by the respective electron guns (not shown) and thereafter directed, by means known in the art, as respective electron beams (only one beam 22 is shown for simplicity), through the apertures 34 to impinge upon the trios of phosphor areas 20. Because a larger electron beam spot is produced, which spot impinges upon substantially an entire individual phosphor area, the kinescope 10 exhibits improved characteristics, such as increased image brightness and contrast, over positive tolerance kinescopes.
  • a color kinescope (e.g., 10 of FIG. 1) is manufactured by steps including the production of a temporary mask 50- (FIG. 6) for screen printing.
  • the rst step in making the temporary mask 50 is the provision of a continuous rst layer 52.
  • a photosensitive resist material e.g., bichromated sh glue
  • a suitable, relatively hard material e.g., cold-rolled steel having a thickness of about 7 mils
  • a continuous second layer '58 of a photosensitive resist material on the other major surface 60 of the substrate 56 (the second layer 58 is not shown in the drawings in FIGS. 5 to 7 for simplicity).
  • the layers 52 and 58 of resist material are converted into perforated layers 62 and 64, respectively, by methods known in the art; for example, by light exposure through a suitable stencil and subsequent selective removal of the unexposed, unhardened areas by washing, to produce patterns of openings 66 and 68 therein.
  • the openings 66 and 68 are disposed at and substantially concentric with the sites where the color-selection apertures (78 in FIG. 4) are intended, the openings 66 or 68 of each respective perforated layer 62 or 64 being in register with those of the other layer.
  • the openings (e.g., 66) of one of the layers (62) are of a predetermined size, at each location, suitable for screen printing, the size of each opening being significantly smaller than the minimum size of the subsequently produced apertures (78 in FIG. 4).
  • the other openings (i.e., 68) preferably are significantly larger at each location than the corresponding openings (66) of predetermined size such that the apertures (78 in FIG. 4) that are later produced are generally tapered from one surface 54 toward the other surface 60, according to general practice in the art.
  • Such tapered apertures generally are preferred to minimize interference of the color-selection mask with the electron beams during operation of the kinescope; for example, to minimize impingement of electrons on the side walls of the apertures.
  • Those portions of the substrate 56 (FIG. 3) located generally between the openings 66 and 68 of the perforated resist layers 62 and 64, respectively, are removed, as by etching with ferrie chloride, from both surfaces 52 and 60 of the substrate 56, so as to produce apertures 78 (FIG. 4) thereat.
  • Such removal of material from the substrate 56 is carried out so that there are also removed portions thereof located beneath that layer (i.e., 62) surrounding the openings (i.e., 66) of the predetermined size necessary for screen printing, and consequently, areas 69 (FIG. 4) of this layer 62 extend partially across the apertures 78 so produced.
  • these areas 69 of the layer 62 overhang the apertures 78 so that substantially all of these respective areas 69 are located above the apertures 78.
  • certain substrate portions located beneath the second resist layer y64 also have been removed so that areas of this layer 64 also extend partially across the apertures 78, to produce a relatively larger ta'per angle, although it is not necessary for purposes of this invention that this be so.
  • etching of the substrate to produce apertures 78 can be done through only the openings 68 of one perforated etch-resistant layer 58' on the substrate, these openings 68 being significantly larger than the other openings (66') that are of predetermined size suitable for screen printing and that are located in the second etch-resistant layer 62'.
  • the heatresistant layer 72 is provided, and the perforated etchresistant layer 64' (or 64 of FIG. 4) can be removed from the substrate S6 where it is desired to eliminate any interference by that layer (64') with the subsequent screen printing operation.
  • the exposed surface 70 of the resist layer 62 which includes the openings 66 of the predetermined size for screen printing, is covered with a heat-resistant layer 72 (FIG. 5) of a material capable of withstanding the annealing temperatures (i.e., the melting point of such material exceeds the annealing temperature of the substrate) to which the temporary mask is subjected (as discussed below), an exemplary annealing temperature being about 900 C.
  • the heat resistant layer 72 includes light-permeable corridors 73 that are in substantial register with and substantially co-extensive with the openings 66.
  • the term heat-resistant is defined herein to include material capable of withstanding thermal treatments (e.g., annealing) to which the temporary mask might be subjected.
  • Such a heat-resistant material can be metal, such as copper or nickel, for example; and the layer 72 should be sufficiently thick so that the parts 75 thereof over the apertures 78 can be self supporting (e.g., about one-half mil in thickness).
  • the material of the layer 72 preferably is substantially opaque and, where the mask is to be formed to a non-planar contour, is of relatively ductile material.
  • This layer of heat-resistant material can be produced by, for example, painting directly on the resist layer; evaporation; electroless chemical depositio-n, electrolytic deposition; or electrophoresis, according to known practices.
  • the workpiece 71 (shown in FIG. 5 and comprising the apertured substrate 56, perforated resist layer 62, and heat-resistant layer 72) is annealed (e.g., at about 900 C.), thereby relieving any stresses that may be present in the substrate 56 and facilitating the mask forming operation (discussed below).
  • the resulting assembly including the substrate 56 and the heat-resistant layer 72 (FIG. 6) is formed (shaped) according to known practices in the art to produce a temporary mask 50 of non-planar contour where a non-planar color-selection mask is desired.
  • substantially all of the resist layers (62 and 64) have been removed (due to the annealing), as shown in FIG. 6, and the heat-resistant layer 72 is located on the apertured substrate 56.
  • the temporary mask 50 (FIG. 6) thus produced is then positioned (FIG. 7) in spaced relation with a suitable transparent substrate (e.g., a faceplate) and used as a photographic master to print the Various elemental phosphor areas 82, 84, and 86 of the respective phosphor groups (e.g., red, blue, and green) on the substrate 80.
  • a suitable transparent substrate e.g., a faceplate
  • the printing process is known in the art (see, for example, U.S. Pat. 3,406,068 to H. B. Law).
  • the shaping of the temporary mask to this configuration is done, as mentioned above, as the final step in temporary mask-making, and before screen printing.
  • one surface 88 of the transparent substrate 80 may be coated with a mixture (not shown) comprising a first one of the desired phosphors and a suitable photosensitive material and then exposed to a suitable light which is passed through the corridors 73 of the temporary mask S0.
  • a mixture (not shown) comprising a first one of the desired phosphors and a suitable photosensitive material and then exposed to a suitable light which is passed through the corridors 73 of the temporary mask S0.
  • Those portions of the photosensitive phosphor coating (not shown) struck by the light rays are hardened and then the unhardened portions of the coating are removed, by washing, for example, to leave a pattern (not shown) of areas (dots) of a phosphor of a first color mixed with the hardened resist material. This sequence of steps is repeated for the other phosphors.
  • the hardened resist material is subsequently removed from the phosphor dots by baking or by chemical dissolution methods known in the art.
  • a light sourcel (not shown) intended for a particular phosphor group is located at a point (90, 92, or 94) so as to be in substantially the same spatial relation with the image screen (e.g., 28 of FIG. l) as the center of deflection or apparent source of the electron beam (not shown) used for exciting that particular phosphor group.
  • the paths followed by the light rays during printing and by the electrons during operation of the kinescope are indicated, for purposes of illustration, by the lines 96, 98, and 100.
  • the screen printing operation may include providing, by using the temporary mask 50 disclosed herein, a lightabsorbing matrix (e.g., 26 of FIG. 1) of an opaque, nonlight-reflective material on the image screen (e.g., 28 of FIG. 1).
  • a lightabsorbing matrix e.g., 26 of FIG. 1
  • an opaque, nonlight-reflective material on the image screen (e.g., 28 of FIG. 1).
  • This matrix can be produced, for example, in the manner described in the abovementioned application of Law et al.
  • the phosphor areas may, if desired, be somewhat larger than the openings of the matrix so that portions of the respective phosphor areas overlap the matrix.
  • the effective size of such phosphor areas is, however, equal to the size of their respective matrix openings.
  • the term size is deiined to be the effective size thereof.
  • the temporary mask 50 (FIG. 6) is converted to a color-selection mask (not shown) that corresponds to mask 30 in FIG. 1, by removing the layer 72 of heat-resistant material.
  • Such removal is carried out, for example, where the heat-resistant material is metal, by a second etching operation utilizing a suitable etching material. It is preferred that the second etching material be selected so as substantially not to attack the substrate 56.
  • the quantity and thickness of the heat-resistant layer is comparaively small with respect to the apertured substrate, a relatively insignificant dimensional change might result in the apertured substrate due to etching, in the relatively short time needed to remove the heat-resistant layer.
  • the material comprising the heat-resistant layer can be chosen so as to be more readily attacked by etching agents than the substrate so as to facilitate removal thereof from the substrate.
  • Such materials include those having oxidation-reduction potentials significantly higher than the material comprising the substrate 56.
  • an assembly 110 comprising a substrate 112 that has been processed (generally in the manner outlined above) into a grille-type color-selection mask of desired dimensions, an etch-resistant perforated layer 114 on the substrate 112, which layer 114 serves the same purposes as and is comparable to layer 62 in FIGS. 3 to 5; and an opaque layer 116 of heat-resistant material co-extensive with the perforated layer 114, which opaque layer 116 is comparable to and serves the same purpose as the layer 72 in FIGS. 3 to 5.
  • a method for producing a color kinescope comprising a non-planar color-selection mask making apertures of given minimum dimension at each location thereon and an image screen, said screen being produced with a non-planar temporary mask having light-permeable corridors registered with said apertures and saving a dimension at each location substantially smaller than said given minimum dimension, comprising the steps of:

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US00076907A 1970-09-30 1970-09-30 Method for making a kinescope comprising a color selection mask with temporary corridors Expired - Lifetime US3725065A (en)

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Cited By (9)

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US3841876A (en) * 1972-06-30 1974-10-15 Hitachi Ltd Method for making a phosphor screen of a cathode-ray tube
US3931442A (en) * 1973-03-02 1976-01-06 Gte Sylvania Incorporated Temporary modification of a pattern mask for use in forming a color CRT screen and a process for modifying the same
US3955980A (en) * 1974-11-04 1976-05-11 Zenith Radio Corporation Method for making a color selection mask for a color cathode ray tube
US3993516A (en) * 1974-10-07 1976-11-23 Zenith Radio Corporation Method of controlled etching in the manufacture of a color selection mask for a color cathode ray tube
US4094678A (en) * 1976-12-07 1978-06-13 Zenith Radio Corporation Method of making curved color cathode ray tube shadow masks having interregistrable electron beam-passing aperture patterns
US4318026A (en) * 1980-04-30 1982-03-02 Rca Corporation Method of making a grid for a cathode-ray tube electron gun
US4651051A (en) * 1985-07-05 1987-03-17 Rca Corporation Cathode-ray tube having a focusing color-selection structure and a viewing screen formed therefrom
US5302504A (en) * 1990-09-16 1994-04-12 Konica Corporation Silver halide color photographic light sensitive material containing a pyrazolotriazole type magenta coupler
EP0704758A1 (en) 1994-09-12 1996-04-03 Fuji Photo Film Co., Ltd. Silver halide color photographic material

Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
FR2218642B1 (xx) * 1973-02-21 1976-11-26 Hitachi Ltd
JPS49130670A (xx) * 1973-04-13 1974-12-14
US4303466A (en) * 1980-06-19 1981-12-01 Buckbee-Mears Company Process of forming graded aperture masks
JPS5897243A (ja) * 1981-12-03 1983-06-09 Toshiba Corp カラ−受像管用マスクの製作法
US4534744A (en) * 1983-05-02 1985-08-13 Burroughs Corporation Display panel and method of making it
US4632726A (en) * 1984-07-13 1986-12-30 Bmc Industries, Inc. Multi-graded aperture mask method

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US2663821A (en) * 1951-06-16 1953-12-22 Rca Corp Masked target kinescope

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841876A (en) * 1972-06-30 1974-10-15 Hitachi Ltd Method for making a phosphor screen of a cathode-ray tube
US3931442A (en) * 1973-03-02 1976-01-06 Gte Sylvania Incorporated Temporary modification of a pattern mask for use in forming a color CRT screen and a process for modifying the same
US3993516A (en) * 1974-10-07 1976-11-23 Zenith Radio Corporation Method of controlled etching in the manufacture of a color selection mask for a color cathode ray tube
US3955980A (en) * 1974-11-04 1976-05-11 Zenith Radio Corporation Method for making a color selection mask for a color cathode ray tube
US4094678A (en) * 1976-12-07 1978-06-13 Zenith Radio Corporation Method of making curved color cathode ray tube shadow masks having interregistrable electron beam-passing aperture patterns
US4318026A (en) * 1980-04-30 1982-03-02 Rca Corporation Method of making a grid for a cathode-ray tube electron gun
US4651051A (en) * 1985-07-05 1987-03-17 Rca Corporation Cathode-ray tube having a focusing color-selection structure and a viewing screen formed therefrom
US5302504A (en) * 1990-09-16 1994-04-12 Konica Corporation Silver halide color photographic light sensitive material containing a pyrazolotriazole type magenta coupler
EP0704758A1 (en) 1994-09-12 1996-04-03 Fuji Photo Film Co., Ltd. Silver halide color photographic material

Also Published As

Publication number Publication date
FR2108104B1 (xx) 1973-06-29
AU466629B2 (en) 1975-11-06
IT939783B (it) 1973-02-10
AU3362071A (en) 1973-03-22
NL7113359A (xx) 1972-04-05
CA950963A (en) 1974-07-09
BE773288A (fr) 1972-01-17
GB1346657A (en) 1974-02-13
DE2148705A1 (de) 1972-04-06
FR2108104A1 (xx) 1972-05-12
CA950962A (en) 1974-07-09
US3663997A (en) 1972-05-23

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