US3707766A - Method of manufacturing a plurality of bridge rectifiers - Google Patents
Method of manufacturing a plurality of bridge rectifiers Download PDFInfo
- Publication number
- US3707766A US3707766A US00140770A US3707766DA US3707766A US 3707766 A US3707766 A US 3707766A US 00140770 A US00140770 A US 00140770A US 3707766D A US3707766D A US 3707766DA US 3707766 A US3707766 A US 3707766A
- Authority
- US
- United States
- Prior art keywords
- rungs
- support section
- ribbon
- metal parts
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Definitions
- a method of manufacturing a bridge rectifier having four rectifying elements arranged between four lead-in wires comprising the steps of attaching one end of the longitudinal portion of each of a pair of T- shaped metal parts to the support section of a metal ribbon, said ribbon having at least one pair of metal rungs extending from the support section of said ribbon, each of said T-shaped parts having a metal cross beam connected to the other end of the longitudinal portion, the end of each rung extending between each of the ends of the cross beams of said pair of T-shaped metal parts; placing each element between a corresponding rung and cross beam; electrically connecting each of two electrodes of said each element to said corresponding rung and cross beam, respectively, in accordance with the polarization scheme of said bridgerectifier; encapsulating said bridge rectifier; and severing said rungs and longitudinal portions from the support section of said ribbon.
- the bridge rectifier there may be used a ribbon having the shape of a comb with rungs extending on one side of a supporting portion, as well as a ribbon with rungs extending on both sides of a supporting portion, in a double-comb form. Furthermore, it is possible to use a ribbon having the shape of a ladder comprising two supporting portions.
- T-shaped metal parts 4, shown in FIGS. 1 and 3 to 5 are attached, for example, by way of spot welding on either side of the supporting portion 1 of the ribbon according to FIG. 1, in
- the semiconductor elements 7 are preferably fiat monocrystalline semiconductor bodies each having a pn-junction extending parallel in relation to the two surface sides. These rectifying elements 7, for effecting the contacting, are preferably joined to the rungs and T-shaped metal parts by way of soldering using one of the known solders. Soldering of the rectifying elements is most favorably carried out by dipping into a bath kept at soldering temperature.
- the rungs 3 and the T-shaped metal parts 4 are already gilt, silver-coated or tinned prior to the soldering. Clamping of the rectifying elements is effected, of course, in accordance with a polarity scheme of the bridge rectifier to be manufactured.
- the dot-and-dash line 10 in FIGS. 1 to 4 indicates the line where the bridge rectifiers, after soldering and the subsequently following etching of the rectifying elements for the purpose of improving the reverse breakdown characteristics, are separated from the supporting portion 1 of the ribbon.
- the individual bridge rectifiers are still embedded in a plastics material in the known way prior thereto.
- the dashline 11 in FIG. 2 shows the outline of the plastics envelope. Since the T-shaped parts 4, owing to their shape, are already firmly retained in the plastics material, the rungs 3 require a special shape or design for being anchored in the plastics envelope. To this end, the rungs 3 according to FIG. 2 are provided with cut-out portions 8. For serving the same purpose, there may also be provided projecting, throughgoing, or widened portions on the rungs.
- FIGS. 3 to 5 show one type of embodiment of a T- shaped metal part 4 which has proved to be particularly favorable.
- the T-shaped metal part is twice bent off so that the surface of the T-shaped part contacts the surface of the semiconductor elements 7 in a flat plane, and without any stress from bending moments.
- the preferred type of embodiment of a T-shaped metal part 4 still comprises a compensating loop 9 intended to compensate for tensions in the direction of the cross beams 6 between pairs of adjacent rectifying elements 7.
- both the ribbon and the T-shaped metal parts 4 may be manufactured by way of punching.
- the T- shaped metal parts 4 may be attached to the supporting portion 1 of the ribbon automatically by way of spot welding, as is indicated by the welding points 12 in FIG. 1.
- the described method according to the invention offers the particular advantage that metal parts of only two different shapes can be used; namely the ribbon with the rungs 3 and T-shaped parts 4 of identical shape which are attached to the two flat sides of the supporting portion 1 of the ribbon. Accordingly, there are only required two different punching tools.
- a method of manufacturing a bridge rectifier having four rectifying elements arranged between four lead-in wires comprising the steps of:
- each of a pair of T-shaped metal parts attaching one end of the longitudinal portion of each of a pair of T-shaped metal parts to the support section of a metal ribbon, said ribbon having at least one pair of metal rungs extending from the support section of said ribbon, each of said T- shaped parts having a metal cross beam connected .to the other end of the longitudinal portion, the end of each rung extending between each of the ends of the cross beams of said pair of T-shaped metal parts;
- T- shaped metalparts are attached to said support section between each pair of rungs, said rungs extending from one side of said support section in a comb-like fashion.
- each of said two T-shaped metal parts are respectively attached to opposite sides of said support section of said ribbon.
- each of said T-shaped metal parts are provided with a compensating loop.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Electrotherapy Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702023288 DE2023288C (de) | 1970-05-13 | Verfahren zum Herstellen einer Mehr zahl von Bruckengleichnchtern |
Publications (1)
Publication Number | Publication Date |
---|---|
US3707766A true US3707766A (en) | 1973-01-02 |
Family
ID=5770936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00140770A Expired - Lifetime US3707766A (en) | 1970-05-13 | 1971-05-06 | Method of manufacturing a plurality of bridge rectifiers |
Country Status (6)
Country | Link |
---|---|
US (1) | US3707766A (enrdf_load_stackoverflow) |
JP (1) | JPS5212891B1 (enrdf_load_stackoverflow) |
AU (1) | AU2788671A (enrdf_load_stackoverflow) |
FR (1) | FR2088551B3 (enrdf_load_stackoverflow) |
GB (1) | GB1288526A (enrdf_load_stackoverflow) |
NL (1) | NL7106555A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3781976A (en) * | 1971-05-26 | 1974-01-01 | Matsuo Electric Co | Method of manufacturing chip-shaped solid state electrolytic capacitors |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3076253A (en) * | 1955-03-10 | 1963-02-05 | Texas Instruments Inc | Materials for and methods of manufacturing semiconductor devices |
US3356914A (en) * | 1963-05-03 | 1967-12-05 | Westinghouse Electric Corp | Integrated semiconductor rectifier assembly |
US3391456A (en) * | 1965-04-30 | 1968-07-09 | Sylvania Electric Prod | Multiple segment array making |
US3494022A (en) * | 1966-06-30 | 1970-02-10 | Telefunken Patent | Method of manufacturing semiconductor devices |
-
1971
- 1971-04-20 AU AU27886/71A patent/AU2788671A/en not_active Expired
- 1971-05-06 US US00140770A patent/US3707766A/en not_active Expired - Lifetime
- 1971-05-06 GB GB1288526D patent/GB1288526A/en not_active Expired
- 1971-05-13 JP JP46031658A patent/JPS5212891B1/ja active Pending
- 1971-05-13 NL NL7106555A patent/NL7106555A/xx unknown
- 1971-05-13 FR FR7117314A patent/FR2088551B3/fr not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3076253A (en) * | 1955-03-10 | 1963-02-05 | Texas Instruments Inc | Materials for and methods of manufacturing semiconductor devices |
US3356914A (en) * | 1963-05-03 | 1967-12-05 | Westinghouse Electric Corp | Integrated semiconductor rectifier assembly |
US3391456A (en) * | 1965-04-30 | 1968-07-09 | Sylvania Electric Prod | Multiple segment array making |
US3494022A (en) * | 1966-06-30 | 1970-02-10 | Telefunken Patent | Method of manufacturing semiconductor devices |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3781976A (en) * | 1971-05-26 | 1974-01-01 | Matsuo Electric Co | Method of manufacturing chip-shaped solid state electrolytic capacitors |
Also Published As
Publication number | Publication date |
---|---|
DE2023288B2 (de) | 1972-05-18 |
FR2088551B3 (enrdf_load_stackoverflow) | 1974-03-08 |
FR2088551A3 (enrdf_load_stackoverflow) | 1972-01-07 |
AU2788671A (en) | 1972-10-26 |
JPS5212891B1 (enrdf_load_stackoverflow) | 1977-04-11 |
GB1288526A (enrdf_load_stackoverflow) | 1972-09-13 |
NL7106555A (enrdf_load_stackoverflow) | 1971-11-16 |
DE2023288A1 (enrdf_load_stackoverflow) | 1971-12-02 |
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