US3677745A - Copper base composition - Google Patents

Copper base composition Download PDF

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US3677745A
US3677745A US802330A US3677745DA US3677745A US 3677745 A US3677745 A US 3677745A US 802330 A US802330 A US 802330A US 3677745D A US3677745D A US 3677745DA US 3677745 A US3677745 A US 3677745A
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copper
phosphorus
alloys
magnesium
alloy
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Walter L Finlay
Henry J Fisher
Donald A Hay
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Cooper Range Co
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Cooper Range Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys

Definitions

  • a copper-magnesium-phosphorus alloy (optionally containing silver and/or cadmium) wherein the magnesium is present in amounts from 0.01 to 5.0 weight percent, the phosphorus from 0.002 to 4.25 weight percent with copper making up the remainder.
  • silver or cadmium are employed, they are employed in amounts of from 0.02 to 0.2 weight percent and from 0.01 to 2.0 weight percent, respectively.
  • the present invention relates to copper-base alloys and more particularly to the copper-magnesium family of alloys.
  • each of the other alloys is advantageously prepared from the copper which is substantially devoid of oxygen, e.g., oxygen free copper or copper prepared in an inert atmosphere or a vacuum. Alloys prepared from such high purity coppers are relatively expensive which seriously inhibits their use for many applications, particularly in high volume industries such as the automotive industry or electrical conductor industry where cost per unit is very important.
  • the alloys disclosed in U.S. Pat. No. 2,847,303 are similarly disadvantageous.
  • the copper-zirconium alloys containing phosphorus described therein do not consistently exhibit good conductivity characteristics when produced in accordance with the usual commercial methods since the amount of phosphorus added to the melt must be stoichiometrically related to the amount of oxygen present in order to prevent an excess of phosphorus in the alloy. If too much is used, the strength of the alloy may be reduced. If too little is used, complete deoxidation is not achieved. Consequently, industry, when melting phosphorus containing copper-zirconium alloys, has been faced with the difficult problem of carefully controlling the oxygen content of the charge. These controls are clearly objectionable from a practical or economic standpoint.
  • the high strength and conductivity properties of the alloys of the present invention make them, in addition to radiator fins, particularly useful for the production of electrical components such as bus bars or resistance welding electrodes such as welding tips or welding wheels, and the like.
  • the alloys of the present invention provide inexpensive copper-magnesium-phosphorus alloys having good mechanical properties and/or characteristics and heat resistance together With good conductivities over a wide range of temperatures.
  • the alloys of the present invention advantageously also contain silver and/or cadmium and such alloys are considered to be part of this invention and the expression "copper-magnesium-phosphorus alloy when used generically is meant to include alloys containing silver and/or cadmium.
  • These new copper-magnesium-phosphorus alloys comprised of a unique combination of ingredients, in special proportions, when properly thermo-mechanically processed, are characterized by being resistant to softening after being exposed for normal soldering cycles to temperatures in the range of from 700 to 800 F.
  • the alloys of the present invention are especially useful in fabricating heat-transfer apparatus where the components must retain their strength and conductivity after being sub jected to an elevated temperature joining operation.
  • the unexpected properties exhibited by the present invention are believed to result from the formation of intermetallic compounds within the copper matrix.
  • the phosphorus and magnesium combine to form an intermetallic compound approximating the formula Mg P or a complex mixture of compounds formed between copper, magnesium and phosphorus, such as Cu Mg and C11 1.
  • the existence of a chemical interaction between the magnesium and the phosphorus is indicated by the fact that when phosphorus is added in an amount equal or close to the stoichiometric ratio of about 0.85 to 1, which exists between the relative weights of the phosphorus and the magnesium in the compound Mg 'P then the electrical conductivity reaches a peak value with the more simple thermo-rnechanical treatments such as those outlined in the subsequent Example 1.
  • the electrical conductivity is also less than the 95-99% IACS peak value attainable using the aforementioned simple thermo-mechanical treatment. It is postulated that this decrease in conductivity is caused by the free phosphorus or magnesium which is in excess of the amount utilized in the formation of the intermetallic compound(s) and the free magnesium or phosphorus behaves as if it were alone in the copper and reduces the electrical conductivity accordingly.
  • Cu-Mg-P alloys which also contain silver as an alloying element seem capable of producing a desirable combination of high conductivity and high tensile strength over a wider range of phosphorus-to-magnesium-ratios than in the absence of the silver.
  • the increased properties are believed to be due to a combination of strength- '4 ening mechanisms including the coherency and the dispersion strengthening caused by the fine dispersion of intermetallic compound or compounds resulting from age-hardening (or precipitation-hardening), and cold work strengthening.
  • alloys containing silver e.g., .02 to .09% by weight can achieve high conductivity and mechanical strengths with the phosphorus-to-magnesium-ratio ranging from 0.3 to as high as 1.4.
  • thermo-mechanical processing in some cases and this is usually more diflicult in the absence of silver.
  • thermo-mechanical processing variations can be used to give this alloy system a wide range of electrical conductivity and mechanical strength combinations and this versatility is one of the outstanding attributes of this Cu-Mg-P-base alloy.
  • thermomechanical treatments include warm-rolling (pseudo-ausforming), zerolling, shock-loading, cryogenic cooling, stress aging, pseudo-maraging (quenching directly to the aging temperature from the solution-treatment temperature), multiple-aging treatments in succession at the same or various diiferent temperatures (with or without inter posing warm or cold-rolling in between the aging treatments), and various amounts of cold or warm-working prior to the aging treatment.
  • the unifying feature of all these thermomechanical treatments is believed to be the efiect they have in establishing the size, shape, interparticle spacing, distribution, degree of coherency and other controlling characteristics of the precipitate particles. A majority of these precipitate particles (say in excess of 50%) are characterized by diameter less than 1 micron in extent.
  • thermomechanical processing such as the amount of cold-work
  • two dilferent amounts of cold work 69%, and 91%, were introduced into pre viously hot-rolled material, prior to receiving the precipitation-aging treatment.
  • the results shown below indicate how higher electrical conductivity can be attained by increasing the amount of cold-work prior to the precipitation treatment for an alloy containing copper, .041% silver, .09% magnesium and .09% phosphorus.
  • the present invention contemplates the production of unique low cost copper-magnesium-phosphorus alloys.
  • Each of the alloys of this invention after being subjected to appropriate thermo-mechanical processing has good electrical and thermal conductivity together with high mechanical strength, e.g., an ultimate tensile strength (UTS) in excess of 60,000 pounds per square inch (p.s.i.) despite elevation to temperatures of 700 F. or higher for about 3 minutes.
  • UTS ultimate tensile strength
  • Alloys within the contemplated scope of the present invention having the foregoing desirable properties and/or characteristics contain, in weight percentages, .002 to 4.25 phosphorus, 0.01 to 5.0 percent magneisum with the balance, apart from the usual impurities and residual elements, copper.
  • the phosphorus and magnesium are employed in amounts sufiicient to establish a ratio by weight in the range of 0.3 to 1.3, preferably in the neighborhood of 0.85.
  • the alloys of the present invention can also contain from 0.02 to 0.2 weight percent silver and from 0.01 to 2.0 weight percent cadmium.
  • the copper-base alloys of this invention can be produced from coppers containing by weight as much as 600 parts per million (p.p.m.), i.e., 0.06% of oxygen without materially and detrimentally altering the advantageous properties and/ or characteristics of these alloys.
  • This is a very desirable economic advantage since it permits the use of the less expensive grades of copper in the manufacture of these alloys.
  • tough pitch copper which is a copper containing 0.02% to 0.05% oxygen and which is obtained by melting electrolytically obtained cathode copper or by fire refining, can be successfully used in producing the alloys of the present invention.
  • cathode copper is suitable starting material as is copper which has been produced in a reducing atmosphere such as OFHC brand copper (which is 99.99% or more pure), copper prepared in an inert atmosphere, under a charcoal cover or in a vacuum and chemically deoxidized coppers such as lithium-deoxidized copper.
  • pohsphorus deoxidized copper (DLP- deoxidized low phosphorus and DHP-deoxidized high phosphorus) is, of course, acceptable and in some cases preferable because it may eliminate the step of adding phosphorus to the copper if sufiicient phosphorus remains in solution in the copper.
  • alloys of this invention containing the aforementioned ingredients, i.e., copper, phosphorus, magnesium and optionally silver or cadmium, in the aforementioned specially proportioned amounts are characterized by being cold-workable to strengths in excess of 60,000 p.s.i. These alloys are further characterized by having good castability.
  • Phosphorus is employed in an amount corresponding to from 0.002 to 4.25 weight percent of the total weight of the alloy.
  • the phosphorus when employed in such amounts together with magnesium has a number of beneficial effects including alloying as well as deoxidizing effects.
  • the magnesium is employed in amounts sufficient to constitute from 0.01 to 5.0 weight percent of the total weight of the alloy.
  • the inclusion of magnesium has an important effect upon the unexpected tensile strength and electrical and thermal conductivity properties of the alloy.
  • the optimum balance of mechanical and electrical and thermal conductivity properties is obtained when the phosphorus and magnesium are employed with respect to each in a weight ratio of about 0.85 to 1. When employed in proportions substantailly equivalent to this ratio, the phosphorus and magnesium have a synergistic effect on the thermal and electrical conductivity and on the mechanical properties.
  • This cold working does not appear per se to cause precipitation of Cu-Mg and Cu-P compounds but it does condition the copper matrix to precipitate such compounds if thereafter the material is heated; additional cycles of cold working and elevated tempera tures aging further promote the precipitation of such compounds.
  • alloys of this invention are characterized by a relatively controlled rate of precipitation.
  • a first factor resides in the fact that fundamentally, Cu contributes high conductivity and high cold-workstrengthenability.
  • Mg and P optionally with Ag and/or Cd, first contribute an important increase in the coldwork-strengthenability of Cu via solid solution but at some cost in conductivity; then, within the critical limits taught herein, the Mg, P, Ag and/or Cd can be precipitated under excellent control to give a dispersion of precipitate particles throughout the Cu matrix above the softening temperature of the Cu matrix-thus the cold work-strengthening is sacrified while the conductivity is increased by precipitating the Mg, P, Ag and/or Cd out of solid solution.
  • a second factor resides in the discovery that the matrix containing the precipitate can now be cold-worked to regain the cold-work strengthening with only a small loss of electrical conductivity.
  • a third factor resides in the discovery that the precipitate so formed now inhibits the atomic movements which are necessary to dissipate coldwork-strengthening i.e. the precipitate particles block recrystallimtion and softening. The result is that the properly processed alloy can, without serious or complete softening, be heated and used at temperatures and time considerably higher than any hitherto known material with comparable conductivity and strength.
  • silver raises the softening temperatures and increases the strength of the alloy.
  • silver retards recrystallization of wrought copper significantly. T hirdly, it is believed that silver inhibits grain growth.
  • the desirability of the silver in the aforementioned ranges permits the use of the base-copper containing silver such as Copper Range White Pine silver-bean'ng coppers, when making the alloys of the present invention, and these commercially available grades of copper can be used without sacrificing such desirable properties and/or characteristics as electrical or thermal conductivity.
  • the alloys of this invention may contain up to 2.0% cadmium by weight.
  • the addition of cadmium to the copper-magnesium-phosphorus or copper-magnesiurn-phosphorus-silver alloys of the invention results in the retention of strengths higher after exposure to elevated temperatures without detrimentally decreasing the conductivity and/or the mechanical properties for many important commercial applications.
  • the alloys contain approximately in weight percentages, 0.05 to 0.3% magnesium, 0.04 to 0.25% phosphorus, 0.03 to 0.09% silver and 0.02 to 0.10% cadmium, with the balance, apart from the usual impurities and residual elements, copper.
  • Such alloys have a superior combination of physical, mechanical and/or metallurgical properties and/or characteristics in combination with being inexpensively produced.
  • the softening temperature is a function of the amount of cold work, to wit, the lower the amount of cold work, the higher the softening temperature, and conversely.
  • the half-hardness temperature of the cadmium-free alloys of this invention lies between 725 F. to 750 F. When cadmium is present in the amounts heretofore mentioned, the half-hardness temperature for 30 minutes is between about 750 and 800 F.
  • the unique copper-magnesium-phosphorus and copper-magnesium-phosphorus-silver alloys of this invention are prepared in accordance with known procedures.
  • the copper is melted and the alloying ingredients added thereto.
  • the melting of the copper can be carried out in air under a protective cover or in a vacuum.
  • Special refractories such as aluminum oxide, magnesium oxide and the like can be employed in the production of the alloy. It is advantageous, particularly when using tough pitch or other relatively high oxygen containing coppers, to add the phosphorus before or simultaneously with the silver and the magnesium or cadmium to be added after the deoxidation in order to magnesium and cadmium losses.
  • the established melt is then preferably cast in a non-oxidizing atmosphere such as N or argon.
  • the magnesium as a copper-10 to 20% magnesium alloy, phosphorus as 15% phosphorus-copper and cadmium as a copper-5% cadmium alloy.
  • Silver may, on the other hand, be added in the elemental form or as a master alloy.
  • the alloys of the present invention can be worked using a variety of techniques. Good balance between the mechanical and conductivity properties of the alloys containing from about 0.01 to about 1 weight percent magnesium and from about 0.002 to 0.85 weight percent phosphorus (with or without silver and cadmium) is obtained when the alloys are worked as follows. Cast rolling slabs are hot-rolled at temperatures from about 1000 to 1600 F. to a metal thickness of about 0.30 to 0.50 inch. Further reduction in thickness is achieved 'by conventional cold-rolling and annealing procedures. In fact these alloys can be intermediately annealed in the readily available continuous annealing lines.
  • a wrought product is produced by reducing the cast blank or intermediate at a temperature below about 1200 F. in order to avoid rupturing the cast blank.
  • alloys of the present invenhion can be sold in the as-cast state or after any degree of reduction (hot or cold). They can also for some applications he produced and processed by power metallurgical techniques. The fabricator can then age-harden and/or work-harden the material at the desired stage in his fabrication procedure.
  • Example 1 The alloys of the present invention having the composition set forth in Table I were prepared by melting ETP copper, at about 2000 F. Carbon was added to the melt to deoxidize the copper partially. Fifteen percent phosphorus-copper was then added to the melt to complete the deoxidization of the copper; however, enough phosphorus must be added to provide, after the deoxidation is complete, an amount of phosphorus equivalent to the desired phosphorus content of the alloy. Following the addition of the phosphorus-copper, the magnesium was added to the melt in the form of a copper-magnesium alloy containing about 10 percent magnesium. (The silver, if not already present, is added before or after the deoxidizing process. It is, of course, possible and convenient to use a. copper which already contains silver.) The entire melting and compounding process was carried out under an atmosphere of nonoxidizive protective gas such as nitrogen or the like. The
  • FIG. 10 is a perspective view, partially broken, of a typical fin and tube type radiator assembly having a plurality of large surface area fins 22 or heat transfer surfaces and coolant tubes 20 for water passage.
  • the reason for the strength requirements stems from the amount of handling, particularly during assembly and installation, to which the apparatus is subjected coupled with a requirement that the fins be quite thin. Being so thin, they must be strong enough to resist the multiple stresses to which they 'are subjected during fabrication, installation and use. In addition, the strength as well as the conductivity requirements take into effect the temperature at which the soldering operation is conducted.
  • FIG. 2 illustrates a pair of metal sheets 24, 26 being spot welded as at 28 by a pair of welding tips 30, 32, composed of a copper alloy of the present invention.
  • FIG. 3 illustrates a pair of metal sheets 34, 36 being resistance welded along a seam 38 by a pair of Welding wheels 40, 42, composed of a copper alloy of the present invention.
  • FIG. 4 illustrates a coiled compression spring 44, composed of copper alloy of the present invention.
  • Example 2 In further operations, other alloys of the present invention are prepared. These alloys are prepared from ETP copper as described in Example 1. Each alloy thus prepared is hot-rolled at 1450 F. and reduced from 1 inch to /2 inch. The /2 inch material is placed in the annealing furnace for 30 minutes at 1450 F. and then water-quenched. The water-quenched material is coldrolled percent to produce a A inch strip which was cold-rolled further (85%) to obtain a strip 0.024 inch thick. This strip is annealed at 750 F. in molten salt for from 10 to 30 minutes, and then cold-rolled again (SW/2%) to obtain a strip 0.003 inch thick.
  • SW/2 cold-rolled again
  • This strip is made into tensile samples and tested as cold-rolled and after a 3-minute anneal at 710 F. (in molten salt).
  • the composition of these alloys and their properties are melt was poured into cakes while at a temperature of 40 listed in Table II.
  • Annealing tempera- Annealing temperature 1,000 F. for ture, 800 F. for 3h0urs 3hours Composition, weight percent UTS Percent UTS Percent Ag Mg P On (KIPS) IACS (KIPS) IACS 0. 041 0. 1 008 Remainder 61. 5 88 78. 1 87 0. 041 0. 1 024 d 76. 6 90 75. 8 s7 0. 041 0. 1 75. 7 00 77. 0 00 0. 041 0. 1 76. 4 91 76. 0 89 0. 041 o. 1 74. 9 90 81. 9 89 0. 041 0.1 76. 6 93 so 5 92 0050" thick strip (cold-rolled 69%). about 2150 F.
  • Example 4 An alloy having a composition of 0.041% silver, 0.53% magnesium, 0.32% phosphorus. with the remainder being copper was cast into 1-inch thick slabs for hot-rolling in accordance with the method of Example l. The alloy was hot-rolled at 1650 F. from 1 inch to 0.480 inch with reheat after each pass, and water-quenched from 1650 F. Cold-rolling was then carried out to reduce the strip 68% from 0.48 inch to .160 inch. Very good retention of hardness is possessed by this alloy as indicated when the alloy is heated at 700 F. for 200 minutes, and shown by the data below.
  • the additives of the present invention do not appreciably adversely afiect two basic properties of pure copper, viz, high conductivity, both electrical and thermal; and (2) high strengthenability by cold work with very little loss in conductivity, e.g. only a drop from 100% IACS to 97-98% IACS by 60-90% cold reduction, which can increase the yield strength by a factor as high as five and can more than double the ultimate tensile strength.
  • two of the lowest-cost and most abundant elements-phosphorus and magnesiumwithin critical percentage ranges and in critical ratios four important objectives are accomplished at will and under good control:
  • a copper base alloy material consisting essentially of by weight 0.002 to 4.25 percent phosphorus, 0.01 to 5.0 percent magnesium with the remainder being copper, the approximately stoichiometric ratio of phosphorus to magnesium ranging from 0.3 to 1.4 by weight.
  • a copper base alloy material consisting essentially of by weight 0.002 to 4.25 percent phosphorus, 0.01 to 5.0 percent magnesium, 0.02. to 0.2 percent silver with the remainder being copper, the approximately stoichiometric ratio of phosphorus to magnesium ranging from 0.3 to 1.4 by weight.
  • a copper base alloy material consisting essentially of by weight 0.002 to 4.25 percent phosphorus, 0.01 to 5.0 percent magnesium, 0.02 to 0.2 percent silver, up to 2 percent cadmium with the remainder being copper, the approximately stoichiometric ratio of phosphorus to magnesium ranging from 0.3 to 1.4 by weight.
  • a copper base material consisting essentially of from 2 to 5 percent magnesium, from 0.6 to 4.25 percent phosphorus with the remainder being copper, the approximately stoichiometric ratio of phosphorus to magnesium ranging from 0.3 to 1.4 by weight.
  • a copper base material consisting essentially of from 1.0 to 2.0 percent magnesium, from 0.3 to 2.0 percent phosphorus with the remainder being copper, the approximately stoichiometric ratio of phosphorus to magnesium ranging from 0.3 to 1.4 by weight.
  • a radiator fin comprised of the copper material claimed in claim 1.
  • a copper-base material consisting essentially of from 0.01 to 1.0 percent magnesium, from 0.003 to 1.0 percent phosphorus with the remainder being copper, the approximately stoichiometric ratio of phosphorus to magnesium ranging from 0.3 to 1.4 by weight.
  • a copper-base material consisting essentially of from 0.01 to 1.0 percent magnesium, from 0.003 to 1.0 percent phosphorus, 0.02 to 0.2 percent silver with the remainder being copper, the approximately stoichiometric ratio of phosphorus to magnesium ranging from 0.3 to 1.4 by weight.

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US3976477A (en) * 1974-12-23 1976-08-24 Olin Corporation High conductivity high temperature copper alloy
US4202688A (en) * 1975-02-05 1980-05-13 Olin Corporation High conductivity high temperature copper alloy
US4305762A (en) * 1980-05-14 1981-12-15 Olin Corporation Copper base alloy and method for obtaining same
US4337785A (en) * 1974-12-23 1982-07-06 Sumitomo Light Metal Industries, Ltd. Method using copper-copper-alloy tube for water supply
US4400351A (en) * 1980-06-13 1983-08-23 Mitsubishi Kinzoku Kabushiki Kaisha High thermal resistance, high electric conductivity copper base alloy
US4427627A (en) 1977-03-09 1984-01-24 Comptoir Lyon-Alemand Louyot Copper alloy having high electrical conductivity and high mechanical characteristics
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
DE3729509A1 (de) * 1986-09-11 1988-03-24 Lmi Spa Verbesserte metallegierung auf kupferbasis, insbesondere fuer den bau elektronischer bauteile
WO1999005331A1 (en) * 1997-07-22 1999-02-04 Olin Corporation Copper alloy having magnesium addition
US5868877A (en) * 1997-07-22 1999-02-09 Olin Corporation Copper alloy having improved stress relaxation
US5980656A (en) * 1997-07-22 1999-11-09 Olin Corporation Copper alloy with magnesium addition
US6093265A (en) * 1997-07-22 2000-07-25 Olin Corporation Copper alloy having improved stress relaxation
EP1063309A2 (en) * 1999-06-07 2000-12-27 Waterbury Rolling Mills, Inc. Copper alloy
EP1179606A2 (en) * 2000-08-09 2002-02-13 Olin Corporation Silver containing copper alloy
EP1482063A1 (en) * 2003-05-27 2004-12-01 Fisk Alloy Wire, Inc. Processing copper-magnesium alloys and improved copper alloy wire
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US20180187292A1 (en) * 2015-09-09 2018-07-05 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US10453582B2 (en) 2015-09-09 2019-10-22 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
US11104977B2 (en) 2018-03-30 2021-08-31 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
US11203806B2 (en) 2016-03-30 2021-12-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11319615B2 (en) 2016-03-30 2022-05-03 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11655523B2 (en) 2018-03-30 2023-05-23 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar

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GB1561922A (en) * 1976-01-13 1980-03-05 Olin Corp High strength high conductivity copper alloys
JPS61257443A (ja) * 1985-05-08 1986-11-14 Mitsubishi Shindo Kk 半導体装置用Ｃｕ合金リ−ド素材
JP6680042B2 (ja) * 2016-03-30 2020-04-15 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
JP6680041B2 (ja) * 2016-03-30 2020-04-15 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
DE102017218182A1 (de) * 2017-09-26 2019-03-28 Continental Teves Ag & Co. Ohg Elektrisch leitfähiges Kontaktelement

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Also Published As

Publication number Publication date
NL7002516A (sv) 1970-08-26
JPS4910894B1 (sv) 1974-03-13
CA931385A (en) 1973-08-07
DE2007516C2 (de) 1983-11-24
DE2007516A1 (sv) 1970-10-08
FR2032972A5 (sv) 1970-11-27
GB1281971A (en) 1972-07-19
NL171726C (nl) 1983-05-02
BE746431A (fr) 1970-08-24

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