US3663378A - Electroplating of nickel - Google Patents
Electroplating of nickel Download PDFInfo
- Publication number
- US3663378A US3663378A US124941A US3663378DA US3663378A US 3663378 A US3663378 A US 3663378A US 124941 A US124941 A US 124941A US 3663378D A US3663378D A US 3663378DA US 3663378 A US3663378 A US 3663378A
- Authority
- US
- United States
- Prior art keywords
- nickel
- compound
- electroplating
- baths
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/77—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems
- C07D307/78—Benzo [b] furans; Hydrogenated benzo [b] furans
- C07D307/82—Benzo [b] furans; Hydrogenated benzo [b] furans with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to carbon atoms of the hetero ring
- C07D307/83—Oxygen atoms
Definitions
- This invention relates to the electrodeposition of semibright, or bright, sulfur-free, high leveling nickel plate from aqueous acidic nickel plating baths and more particularly, it relates to the use of an addition agent as an improved brightener in acidic nickel plating baths.
- Another object of the present invention is to provide an improved process for electroplating a ductile, lustrous nickel late. p
- the present invention includes a bath for electroplating ductile, lustrous nickel plate which comprises an aqueous acidic nickel plating solution containing at least one soluble nickel plating salt and a brightening amount of a compound having the formula:
- R and R are H, CH C l-I F, Cl, Br, Ch O, C H O Ch3CO, C2H5CO, CI-hCONl-I- C2H CONH, (Cl-I2)" -SO3 or O(CH2),1 SO3H.
- R is H,F,Clorphenyl, and n is a number from 1 to 6 inclusive.
- the plating bath is an aqueous acidic nickel plating solution which contains at least one soluble nickel plating salt, desirably selected from nickel sulfate, nickel chloride, nickel bromide, nickel sulfamate and nickel fluoroborate, and a brightening amount of a compound falling within the formula (A) given above.
- the compound used has the following structure:
- these compounds are present in amounts which will provide brightening and leveling of the nickel plate produced, amounts within the range of about 0.03 to l gram/liter being desired, with amounts within the range of about 0.1 to 0.3 grams/liter being preferred.
- the brightening additives of the present invention may be prepared, generally, by condensing the lactone of an 0- hydroxy phenyl acetic acid with an aldehyde. Such preparation is illustrated specifically with regard to the preparation of compound (B) above. In this preparation, the lactone of 0- hydroxy phenyl acetic acid is condensed with formaldehyde,
- Similar reactions may be carried out using 0- hydroxy phenyl acetic acid lactones having substituting groups on the benzene ring such as fluoro, chloro, bromo, methyl, methoxy, ethyl, ethoxy, acetyl, acetylamino, propionyl, propionylamino, and sulfoalkyl, or sulfoalkylether groups where the alkyl group is not more than six carbons. It is preferred, however, that not more than two such groups be present on the benzene ring.
- the halogenated materials may be used such as the fluoro, chloro, abromo.
- the alkyl (methyl and ethyl), alkoxy (methoxy and ethoxy) and ketones (methyl and ethyl ketone) are used in place of (D) in the reaction sodium ethoxide.
- the -Nl-ICOCI-I and -NI-ICOC,I-I substituted materials that are to be used in place of (D) in the reaction with sodium ethoxide are prepared by reacting the amine precursor with CH COCI or C H COCl as follows:
- the fluorinated materials (where R is F) are prepared by substituting chlorine with fluorine in the presence of SbF according to the Swartz reaction.
- the aqueous acidic nickel plating baths may be of various types, including the Watts type or modifications thereof.
- the nickel salts used in formulating the baths are desirably nickel sulfate, nickel chloride, nickel bromide, nickel sulfamate, nickel fluoborate, as well as mixtures of any two or more of these.
- the nickel salts are preferably used in conjunction with buffer materials,
- boric acid such as boric acid.
- Other acidic type buffers which may be used include formic acid, fluoboric acid, and the like, and these may be used either in place of or in conjunction with boric acid. It has generally been found that optimum results are obtained when the concentration of the boric acid, or its equivalent, is at least about 30 grams/liter.
- Compound (A) may be used in concentrations of 0.05 to 1 gram per liter, preferably 0.1 to 0.3 g/l, when used alone in the baths, especially Watts nickel baths, or dilute all chloride (about 100 g/l NiCI .6H,O) nickel baths. When used alone in such baths it allows the production of ductile, high leveling sulfur-free nickel plate.
- lf o-benzoyl sulfamide and/or other class 1 nickel brighteners are used in conjunction with (A) in acidic nickel baths (sulfate, chloride, bromide, fluoborate, sulfamate), full bright nickel plate is obtained. It is preferred, however, to use compound (A) in the deposition of semi-bright high leveling, sulfur-free nickel plate.
- the presence of the low foaming wetting agent 2-ethyl hexyl sulfate (sodium salt) is desirable, in concentrations of 0.1 to 0.5 g/l.
- sulfur containing anodes S D nickel
- S D nickel sulfur containing anodes
- sodium lauryl sulfate is a preferred wetting agent in concentrations of0.05 to 0.3 g/l.
- EXAMPLE 2 To the bath of Example 1, 2-10 mg/l of the l to 1 mole 1,3- dioxolane adduct of propargyl alcohol or the 1 to 2 mole propylene oxide adduct of propargyl alcohol are added, thus making it possible to use slightly lower optimum concentrations of compound (3) in the bath, that is 0.1 to 0.2 g/l instead of 0.2 to 0.6 g/l.
- Example 4 An example of fully bright plating nickel bath is shown in Example 4 below. lnstead of o-benzyl sulfimide, p-toluene sulfonumidc and the other well known class 1 nickel brighteners shown in U.S. Pat. No. 2,781,306 col 6, Table 11 may be used.
- Air agitation 1f mechanical or cathode rod agitation is used, then sodium lauryl sulfate wetting agent, in concentrations of about 0.1 to 0.5 g/l is preferred over the shorter chain similar surfactants.
- the electroplating baths of the preceeding examples may be operated at temperatures from about room temperature to almost boiling, with temperatures within the range of about 40 to 60 C being preferred.
- the pH values of these baths may range from about 2 to 5.5, although pH values within the range of about 3.0 to 4.8 are preferred.
- the cathode current densities used may also vary, values within the range of about 5 to several hundred amperes/square foot being useful. While the preferred range is about 20 to amperes/square foot, the optimum will depend in each instance on the agitation, temperature, and concentration and type of nickel salts used in the bath.
- the compounds having the formula (A) are outstanding nickel brighteners and there is produced an excellent semibright or full bright, sulfur-free high leveling nickel plate. A more passive plate is produced than would coumarin and the compounds (A), do not hydrolyze in the warm acid nickel plating baths, forming harmful products which cause dulling of the plate and decrease leveling, as do the unsaturated esters such as dimethyl itaconate, and the like.
- a bath for electroplating ductile, lustrous nickel plate which comprises an aqueous acidic nickel plating solution containing at least one soluble nickel plating salt and a brightening amount of a brightening compound having the formula R is selected from H, F, C1 or phenyl; and
- n is a number from 1 to 6 inclusive.
- a method for electroplating ductile, lustrous nickel plate which comprises electrodepositing nickel on a base from the aqueous acidic nickel plating solution as claimed in claim 1.
- nickel salts in the plating solution are selected from nickel sulfate, nickel chloride, nickel bromide, nickel sulfamate and nickel fluoborate.
- the electroplating solution as claimed in claim 4 wherein the brightener 8.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims (7)
- 2. A method for electroplating ductile, lustrous nickel plate which comprises electrodepositing nickel on a base from the aqueous acidic nickel plating solution as claimed in claim 1.
- 3. The method as claimed in claim 2 wherein the nickel salts in the plating solution are selected from nickel sulfate, nickel chloride, nickel bromide, nickel sulfamate and nickel fluoborate.
- 4. The method as claimed in claim 3 wherein the brightener compound is present in the plating solution in an amount of from about 0.03 to 1.0 grams/liter.
- 5. The method as claimed in claim 4 wherein the brightener compound in the plating solution has the formula:
- 6. The electroplating solution as claimed in claim 1 wherein the nickel salts are selected from nickel sulfate, nickel chloride, nickel bromide, nickel sulfamate and nickel fluoborate.
- 7. The electroplating solution as claimed in claim 6 wherein the brightening compound is present in an amount of from about 0.03 to 1.0 grams/liter.
- 8. The electroplating solution as claimed in claim 7 wherein the brightening compound has the formula
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12494171A | 1971-03-16 | 1971-03-16 |
Publications (1)
Publication Number | Publication Date |
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US3663378A true US3663378A (en) | 1972-05-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US124941A Expired - Lifetime US3663378A (en) | 1971-03-16 | 1971-03-16 | Electroplating of nickel |
Country Status (1)
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US (1) | US3663378A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930072A (en) * | 1974-06-28 | 1975-12-30 | Universal Oil Prod Co | Stabilization of metal plating baths |
US4333920A (en) * | 1979-02-23 | 1982-06-08 | Van Dyk & Company, Inc. | Benzalphthalides and broad spectrum sun screens |
US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
US20090309060A1 (en) * | 2006-06-30 | 2009-12-17 | Akinori Oka | Additives for Electrolyte Solution and Electrolyte Solution |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2635076A (en) * | 1947-01-29 | 1953-04-14 | Harshaw Chem Corp | Bright nickel plating |
US2748068A (en) * | 1953-07-20 | 1956-05-29 | Rockwell Spring & Axle Co | Composition and process for electroplating bright nickel |
-
1971
- 1971-03-16 US US124941A patent/US3663378A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2635076A (en) * | 1947-01-29 | 1953-04-14 | Harshaw Chem Corp | Bright nickel plating |
US2748068A (en) * | 1953-07-20 | 1956-05-29 | Rockwell Spring & Axle Co | Composition and process for electroplating bright nickel |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930072A (en) * | 1974-06-28 | 1975-12-30 | Universal Oil Prod Co | Stabilization of metal plating baths |
US4333920A (en) * | 1979-02-23 | 1982-06-08 | Van Dyk & Company, Inc. | Benzalphthalides and broad spectrum sun screens |
US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
US20090309060A1 (en) * | 2006-06-30 | 2009-12-17 | Akinori Oka | Additives for Electrolyte Solution and Electrolyte Solution |
US8163195B2 (en) * | 2006-06-30 | 2012-04-24 | Otsuka Chemical Co., Ltd. | Additives for electrolyte solution and electrolyte solution |
US8372300B2 (en) | 2006-06-30 | 2013-02-12 | Otsuka Chemical Co., Ltd. | Additives for electrolyte solution and electrolyte solution |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
|
AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |