US3622470A - Continuous plating method - Google Patents

Continuous plating method Download PDF

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Publication number
US3622470A
US3622470A US826381A US3622470DA US3622470A US 3622470 A US3622470 A US 3622470A US 826381 A US826381 A US 826381A US 3622470D A US3622470D A US 3622470DA US 3622470 A US3622470 A US 3622470A
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Prior art keywords
stock
plating
bath
tin
passing
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US826381A
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English (en)
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Lawrence P Gowman
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Wire and Strip Platers Inc
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Wire and Strip Platers Inc
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Definitions

  • the stock passes through an alkaline etch bath, an acid oxidizing bath, a conditioner bath containing tin, and a bronze-plating bath in which bronze is plated on the aluminum.
  • the conditions of concentration, temperature, and solution movement are all controlled so as to achieve continuous plating of bronze while feeding the stock at a relatively high speed. Following the bronze plating, further plating and/or drawing steps may be carried out.
  • plating only one strand of eight gauge aluminum wire at 100 feet per minute produces 60 pounds of wire per hour; plating one strand of 14 gauge aluminum wire at 100 feet per minute produces 22.5 pounds per hour; and plating one strand of gauge aluminum wire at 100 feet per minute produces 5.6 pounds per hour.
  • the length and width of the plating line may be fixed, the width being selected so as to accommodate the number of wires to be plated.
  • the number of baths to be used is selected, and the length of each bath is selected to allow the wire or strip to remain in each bath long enough to accomplish the required chemical action at the feeding speeds to be used.
  • concentration, temperature, and solution movement in the bath are the factors or parameters which can be controlled to control reaction kinetics. Current density may also be controlled where relevant.
  • concentration, temperature, and solution movement in the bath are the factors or parameters which can be controlled to control reaction kinetics. Current density may also be controlled where relevant.
  • the parameters of batch aluminum plating processes would not apply to a high-speed process such as is needed for economical continuous plating of aluminum wire and strip.
  • Another object of the invention is to provide an aluminumplating process in which parameters such as temperature, concentrations, and solution movement are selected and controlled to permit plating of aluminum wire and strip moving at a relatively high speed.
  • a further object of the invention is to provide a method of continuously plating aluminum wire and strip stock in which etching, oxidizing, conditioning, and bronze-plating steps are carried out by passing the stock through successive baths, with any given portion of the stock remaining in each bath only a short time.
  • Another object of the invention is to condition the aluminum wire or strip, plate bronze thereon to provide a metallurgical bond between the bronze and the aluminum, and then plate a selected metal on the bronze to provide a desired coating, suitable metals being tin, copper, lead, lead-tin alloy, or nickel.
  • Still another object of the invention is to plate metals on aluminum wire as just described in the last preceding paragraph, and then draw the wire to reduce its size.
  • a further object is to continuously plate layers of bronze, then nickel, and then tin, lead or lead-tin alloy on aluminum wire or strip to provide plated material which is solderable and will withstand prescribed solderability tests.
  • FIGS. 1 and 2 illustrate a processing line for continuously plating wire or strip stock in accordance with one embodiment of the invention. These figures are schematic and are not intended to show the details of processing equipment since such equipment does not form a part of the present invention.
  • the stock to be plated is represented in FIGS. 1 and 2 by the line 10 which may be wire or strip stock.
  • the stock 10 passes through a series of tanks designated 12, l4, l6, 18, 20, 22, and 24. Contact is made to the stock as by means of rollers or other suitable contact means where the stock is to be electroplated.
  • At least one tray for holding a bath is provided in each of these tanks, there being two trays 26 and 28 in tank 12, two trays 30 and 32 in tank 14, two trays 34 and 36 in tank 16, one tray 38 in tank 18, one tray 40 in tank 20, one tray 42 in tank 22, and three trays 44, 46, and 48 in tank 24.
  • the stock also passes through rinse tanks 50, 52, 54, and 56 as shown, and it may be noted that there is no rinse tank between tanks 16 and 18 nor between tanks 18 and 20.
  • Anodes are used in the electroplating trays, the anode being of the metal being plated.
  • the stock is the cathode in these trays.
  • the first tank 12 contains an alkaline etching liquid. Some of this liquid is continuously moved through the trays 26 and 28 by means of a pump P, and the liquid overflows from the trays through suitable outlets back to the tank 12. Thus, each of the trays 26 and 28 comprises an alkaline etching bath.
  • a suitable composition for the etching liquid is:
  • Sodium or potassium 3-8 ounces per gallon of hydroxide solution Sodium or potassium l-4 ounces per gallon of gluconate solution Any suitable wetting agent may also be added to the etching bath, if desired.
  • the balance of the bath is water.
  • the temperature of the etching baths 26 and 28 is preferably in the range from to F. For high speed plating, the stock remains in each of the baths 26 and 28 a time no greater than 10 seconds for each bath, a suitable range being 3 to 10 seconds.
  • the etching baths 26 and 28 serve to remove oxide from the aluminum stock to expose the metal.
  • aluminum as used herein is intended to include pure aluminum, commercial grades of aluminum containing normal amounts of impurities, and alloys of aluminum in which aluminum is a major ingredient.
  • the aluminum stock 10 passes through rinsing bath 50 to remove excess etching liquid and passes from there into baths 30 and 32 in tank 14.
  • Tank 14 contains an oxidizing liquid which is preferably aqueous hydrochloric or nitric acid containing a fluoride compound. Some of the oxidizing liquid is continuously moved through trays 30 and 32 by means of a pump P and liquid overflows from trays 30 and 32 through suitable outlets back to the tank 14. Thus, the trays 30 and 32 contain the oxidizing baths through which the stock 10 passes.
  • the composition of the bath may be 50 percent nitric acid or 50 percent hydrochloric acid plus a fluoride salt such as ammonium bifluoride. Hydrofluoric acid can be used in place of the fluoride salt. Where ammonium bifluoride is used, the concentration is preferably in the range from 4-8 ounces per gallon of solution.
  • the temperature of each of the baths 30 and 32 is maintained in the range from 70-90 F.
  • the stock 10 remains in each of the baths 30 and 32 for a time no greater than 10 seconds where high production rates are required.
  • a suitable range for this immersion time is 3 to 10 seconds.
  • the baths 30 and 32 serve to reoxidize the aluminum somewhat for the subsequent treating steps.
  • the stock then passes through the rinsing bath 52 which removes excess oxidizing liquid, and from there passes to trays or baths 34 and 36 in tank 16.
  • Tank 16 contains a conditioning liquid which conditions the stock for a bronze plating step which is to take place in tank 18. Some of this conditioning liquid is continuously moved through trays 34 and 36 by means of a pump P, and the liquid overflows from trays 34 and 36 through suitable outlets back to the tank 16.
  • the conditioning ingredient of the baths 34 and 36 is a stannate compound which is preferably sodium stannate or potassium stannate.
  • the baths 34 and 36 also preferably contain sodium or potassium gluconate and sodium or potassium hydroxide.
  • a suitable composition for the baths 34 and 36 is:
  • the baths 34 and 36 should contain at least 5 ounces of tin in the form of a stannate compound per gallon.
  • the tin does not plate out to any substantial extent on the aluminum surface, but merely conditions that surface to make it receptive to the bronze plating which is carried out in tanks 18 and 20.
  • the sodium or potassium gluconate ingredient of the baths 34 and 36 is not believed to be essential, but is helpful to keep the aluminum surface clean by chelating alloying constituents.
  • the temperature of the baths 34 and 36 is preferably maintained in the range from 80 to 100 F.
  • the stock 10 remains in the baths 34 and 36 a time no greater than l seconds for high production rates, and a suitable range for this immersion time is l to 10 seconds.
  • Tanks l8 and 20 each contain a bronze-plating solution.
  • This is an aqueous solution comprising in ounces per gallon of solution (a) at least ounces of tin contained in a stannate compound, (b) at least 2.5 ounces of copper contained in a cyanide compound, and (c) at least 1 ounce of alkali hydroxide.
  • the solution is moved through trays 38 and 40 by means of pumps P and the solution is allowed to overflow from the trays 38 and 40 through suitable outlets back to the tanks 18 and 20.
  • a suitable composition for the bronze plating solution is:
  • the solution is preferably maintained in a temperature range from 90 to l20 F.
  • a cathode current density of 100-600 amperes per square foot is maintained.
  • the stock remains in each of the baths 38 and 40 for a time no greater than seconds for high production rates, and a suitable range for this immersion time is 3 to 10 seconds.
  • a suitable thickness is 0.000030 inch.
  • the bronze plate should have good adherence to the aluminum, and good adherent platings of bronze have been achieved with the processing conditions outlined above.
  • the bronze plate provides a metallurgical bond to the aluminum, and makes it possible to plate other metals on the stock in subsequent processing steps.
  • An example of such processing steps is illustrated by the tank 24 in the drawing.
  • One of the most desirable materials to plate on the wire in the tank 24 would be a solderable metal or alloy such as tin or lead-tin alloy.
  • the processing line illustrated in the drawing also includes a nickel plating tank 22 having a tray 42 therein. It is to be understood that for some applications it would not be essential to use the nickel plating tank 22.
  • a metal such as tin, copper, lead-tin, lead or nickel on the bronze-plated wire without any intervening barrier if there is no need to pass a solderability test such as the solder pot test.
  • a nickel barrier layer it serves to prevent the bronze from dissolving in the metal or alloy plated in tank 24 and thus impairing the metallurgical bond.
  • the solution is preferably an aqueous solution of nickel fluoborate.
  • a suitable composition for this bath is two parts of nickel fluoborate to one part of water.
  • the pH of the solution is preferably maintained at about 3 to 4%.
  • the stock is the cathode, and a cathode current density of to 500 amperes per square foot is maintained.
  • the temperature of the nickel-plating bath is preferably maintained in the range from about 100 to F. The stock passes through the nickel-plating bath in a time no greater than 10 seconds for high volume production.
  • the stock passes through a rinsing bath 56 to the baths 44, 46, and 48 provided in the plating tank 24.
  • a rinsing bath 56 As previously mentioned, any of several metals or alloys may be plated on the stock in the tank 24, and no attempt will be made to illustrate all of the plating solutions which are possible.
  • the selected metal should be plated from a fluoboric solution of the metal.
  • the stock passes through each of the baths in a time of 10 seconds or less.
  • the parameters of the process are selected such that successful plating cannot be achieved at extremely slow speeds of the stock.
  • EXAMPLE 1 The stock in this example was 0.040 inch thick by 2 inches wide aluminum strip of the type known as alloy No. 1100-0. The speed of the stock was 50 ft./min. The stock passed through trays 26 and 28 containing the etching liquid in a time of IO seconds, and the temperature of these baths was maintained at F. The composition of these baths was in accordance with the previous description. The stock passed through each of the oxidizing baths 30 and 32 in a time of 10 seconds for each bath, and the temperature of these baths was maintained at about 75 F. The composition of the oxidizing bath 30 and 32 and other processing conditions were in accordance with the previous description.
  • the temperature of the baths 38 and 40 was maintained at about 100 F.
  • the baths 38 and 40 contained about 3 oz./gal. of copper in the form of copper cyanide, about 4 oz./gal. of free cyanide, about 5.5 oz./gal. of tin in the form of potassium stannate, and about 1.5 oz./gal. of free caustic in the form of potassium hydroxide.
  • a nickel plating bath 22 was not used in this example, but rather the material was passed directly into tank 24 where tin was plated on the stock.
  • a tin metal concentration of about 1 l oz.lgal. was used at a temperature of 90 F. and a cathode current density of a./square foot.
  • EXAMPLE 2 In this example, eight gauge aluminum wire was passed through the processing line at a speed of 100 ft./min. The wire passed through the etching baths 26 and 28 in a time of 10 seconds for each bath. The temperature of the etching baths was maintained at about 155 F. The composition of the etching baths was the same as in example 1.
  • the wire passed through the oxidizing baths 30 and 32 in about seconds for each bath, and the temperature of these baths was maintained at about 75 F.
  • the oxidizing baths contained 50 percent by volume nitric acid and 4 oz./gal. of ammonium bifluoride. The balance of the solution was water.
  • the stock passed through the conditioner baths 34 and 36 in a time of 5 seconds for each bath, and the temperature of these baths was maintained at 90 F.
  • These baths contained about 6.5 oz./gal. of solution of tin metal in the form of potassium stannate.
  • the wire passed through the bronze plating baths 38 and 40 in a time of 10 seconds for each bath, and the baths were maintained at a temperature of 95 F.
  • a cathode current density of 540 a.lsquare foot was used.
  • the composition of the baths was the same as in example 1.
  • the nickel-plating bath 42 was not used.
  • the wire passed through baths 44, 46, and 48 in a time of 5 seconds each (total immersion time seconds), and the temperature of the plating solution was 85 F. A cathode current density of 200 a./square foot was used.
  • the material plated on the wire was tin-lead alloy, and this alloy was plated from a fluoboric solution of standard composition.
  • the resulting product had an adherent plating, and good solderable coatings were obtained.
  • gauge aluminum wire alloy identified as alloy No. 1245 was passed through the processing line at a speed of 200 ft./min.
  • the stock passed through the etching baths 26 and 28 in a time of 5 seconds for each bath.
  • the temperature of the baths was maintained at about 170 F.
  • the compositions of the baths were in accordance with the previous description.
  • the wire passed through the conditioning baths 34 and 36 in a time of 5 seconds for each bath, the temperature of these baths was maintained at 100 F.
  • the other processing conditions were the same as for example 1.
  • a cathode current density of 1,080 a./square foot was used.
  • the composition of the baths was about 3.5 oz./gal. of copper metal, about 6.5 oz./gal. of tin metal, about 4.5 oz./gal. of free cyanide in the form of potassium cyanide and about 1.7 oz./gal. of free caustic in the form of potassium hydroxide.
  • the balance of the solution was water.
  • the wire passed through the tin-plating baths 44, 46, and 48 in a time of 7.5 seconds, and the temperature of these baths was about 100 F.
  • the cathode current density was 200 a.lsq. foot.
  • the metal plated on the wire in the baths 44, 46, and 48 was tin, and a standard tin fluoborate plating solution was used.
  • the resulting product had highly adherent coatings, and coatings were obtained which were easily solderable by normal soft soldering techniques. These coatings also withstood a solder pot test which is more rigid than normal soft soldering techniques.
  • solderability can be checked by soldering a joint between two pieces of stock using a solder such as 6040 lead-tin alloy at a temperature of 240350 F. The joint is then stressed to the breaking point, and if a break occurs in the solder rather than between solder and aluminum, the solder joint was sound and the coatings are satisfactory.
  • solder pot test is used. This test is described in U.S. military specification MIHTD 202 C dated Sept. 12, 1963. In general, soldering is carried out at a temperature in the range from 350 to 500 F. (say 450 F.) for 10 seconds, and the results are satisfactory if good wetting of the solder on the stock is achieved.
  • a method of continuously plating the surfaces of aluminum wire or strip stock comprising the steps of:
  • the plating method as claimed in claim 1 including the further step of passing said stock as cathode through a nickelplating bath comprised of an aqueous solution of nickel fluoborate while maintaining in said nickel-plating bath a cathode current density sufficient to plate nickel and less than 500 amperes per square foot.
  • the plating method as claimed in claim 2 including the further step of passing said stock as cathode through a further plating bath comprised of a fluoboric solution of a material selected from the group consisting of tin, copper, lead-tin, lead, and nickel to plate the selected material on said stock.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
US826381A 1969-05-21 1969-05-21 Continuous plating method Expired - Lifetime US3622470A (en)

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AU (1) AU1491770A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA949493A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2025670A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2043585B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1270902A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NO (1) NO128284B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4039398A (en) * 1975-08-15 1977-08-02 Daiichi Denshi Kogyo Kabushiki Kaisha Method and apparatus for electrolytic treatment
US4157290A (en) * 1977-08-29 1979-06-05 Maschinenfabrik Augsburg-Nurnberg Aktiengesellschaft Coating arrangement
US4169770A (en) * 1978-02-21 1979-10-02 Alcan Research And Development Limited Electroplating aluminum articles
US5450784A (en) * 1993-09-28 1995-09-19 Detroit Diesel Corporation Electroplated piston skirt for improved scuff resistance
US5601695A (en) * 1995-06-07 1997-02-11 Atotech U.S.A., Inc. Etchant for aluminum alloys
US20020028538A1 (en) * 2000-01-20 2002-03-07 Chris Parfeniuk Physical Vapor Deposition Target Constructions
US20030102359A1 (en) * 2000-03-30 2003-06-05 Solvay Fluor Und Derivate Gmbh Fluorostannate-containing brazing or soldering fluxes and use thereof in brazing or soldering aluminum or aluminum alloys
US6840431B1 (en) * 2000-03-10 2005-01-11 Honeywell International Inc. Methods of bonding two aluminum-comprising masses to one another
US7195053B2 (en) 2002-02-06 2007-03-27 Andersen Corporation Reduced visibility insect screen
EP3093376A1 (en) * 2015-05-11 2016-11-16 Bticino S.P.A. Process for continuous electrochemical tinning of an aluminium wire
US20220148756A1 (en) * 2019-04-26 2022-05-12 Sumitomo Electric Industries, Ltd. Aluminum base wire, stranded wire, and method for manufacturing aluminum base wire

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1974441A (en) * 1929-10-09 1934-09-25 Celluloid Corp Process and apparatus for electroplating
US2523161A (en) * 1947-11-28 1950-09-19 Allied Chem & Dye Corp Electrodeposition of nickel
US2586099A (en) * 1951-08-11 1952-02-19 Gen Motors Corp Bearing
US2650875A (en) * 1950-12-09 1953-09-01 Diversey Corp Method of etching aluminum and aluminum base alloys
US2891309A (en) * 1956-12-17 1959-06-23 American Leonic Mfg Company Electroplating on aluminum wire
US3108006A (en) * 1959-07-13 1963-10-22 M & T Chemicals Inc Plating on aluminum

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1410518A (fr) * 1964-01-20 1965-09-10 M & T Chemicals Inc Procédé pour déposer un revêtement métallique sur un métal actif et produits obtenus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1974441A (en) * 1929-10-09 1934-09-25 Celluloid Corp Process and apparatus for electroplating
US2523161A (en) * 1947-11-28 1950-09-19 Allied Chem & Dye Corp Electrodeposition of nickel
US2650875A (en) * 1950-12-09 1953-09-01 Diversey Corp Method of etching aluminum and aluminum base alloys
US2586099A (en) * 1951-08-11 1952-02-19 Gen Motors Corp Bearing
US2891309A (en) * 1956-12-17 1959-06-23 American Leonic Mfg Company Electroplating on aluminum wire
US3108006A (en) * 1959-07-13 1963-10-22 M & T Chemicals Inc Plating on aluminum

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4039398A (en) * 1975-08-15 1977-08-02 Daiichi Denshi Kogyo Kabushiki Kaisha Method and apparatus for electrolytic treatment
US4157290A (en) * 1977-08-29 1979-06-05 Maschinenfabrik Augsburg-Nurnberg Aktiengesellschaft Coating arrangement
US4169770A (en) * 1978-02-21 1979-10-02 Alcan Research And Development Limited Electroplating aluminum articles
US5450784A (en) * 1993-09-28 1995-09-19 Detroit Diesel Corporation Electroplated piston skirt for improved scuff resistance
US5601695A (en) * 1995-06-07 1997-02-11 Atotech U.S.A., Inc. Etchant for aluminum alloys
US6797362B2 (en) 2000-01-20 2004-09-28 Honeywell International Inc. Physical vapor deposition target constructions
US6780794B2 (en) 2000-01-20 2004-08-24 Honeywell International Inc. Methods of bonding physical vapor deposition target materials to backing plate materials
US20020028538A1 (en) * 2000-01-20 2002-03-07 Chris Parfeniuk Physical Vapor Deposition Target Constructions
US6840431B1 (en) * 2000-03-10 2005-01-11 Honeywell International Inc. Methods of bonding two aluminum-comprising masses to one another
US20030102359A1 (en) * 2000-03-30 2003-06-05 Solvay Fluor Und Derivate Gmbh Fluorostannate-containing brazing or soldering fluxes and use thereof in brazing or soldering aluminum or aluminum alloys
US6880746B2 (en) * 2000-03-30 2005-04-19 Solvay Fluor Und Derivate Gmbh Fluorostannate-containing brazing or soldering fluxes and use thereof in brazing or soldering aluminum or aluminum alloys
US7195053B2 (en) 2002-02-06 2007-03-27 Andersen Corporation Reduced visibility insect screen
US8042598B2 (en) 2002-02-06 2011-10-25 Andersen Corporation Reduced visibility insect screen
EP3093376A1 (en) * 2015-05-11 2016-11-16 Bticino S.P.A. Process for continuous electrochemical tinning of an aluminium wire
US20220148756A1 (en) * 2019-04-26 2022-05-12 Sumitomo Electric Industries, Ltd. Aluminum base wire, stranded wire, and method for manufacturing aluminum base wire
US11664134B2 (en) * 2019-04-26 2023-05-30 Sumitomo Electric Industries, Ltd. Aluminum base wire, stranded wire, and method for manufacturing aluminum base wire

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Publication number Publication date
GB1270902A (en) 1972-04-19
AU1491770A (en) 1971-11-18
DE2025670A1 (de) 1970-11-26
FR2043585B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-07-12
NO128284B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-10-22
FR2043585A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1971-02-19
SE366775B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-05-06
CA949493A (en) 1974-06-18

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