US3613774A - Unilateral heat transfer apparatus - Google Patents

Unilateral heat transfer apparatus Download PDF

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Publication number
US3613774A
US3613774A US864777A US3613774DA US3613774A US 3613774 A US3613774 A US 3613774A US 864777 A US864777 A US 864777A US 3613774D A US3613774D A US 3613774DA US 3613774 A US3613774 A US 3613774A
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US
United States
Prior art keywords
heat
chamber
heat transfer
evaporator
wick
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Expired - Lifetime
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US864777A
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English (en)
Inventor
Frank E Bliss Jr
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Lockheed Martin Corp
Original Assignee
Sanders Associates Inc
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Filing date
Publication date
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Publication of US3613774A publication Critical patent/US3613774A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2200/00—Prediction; Simulation; Testing
    • F28F2200/005—Testing heat pipes

Definitions

  • FIG. 1 A first figure.
  • the present invention relates generally to the field of heat transfer systems and more particularly to a directional heat PIPC.
  • the heat pipe is a bilateral heat transfer device, relatively independent of gravity, which is capable of transferring large quantities of heat with a very small temperature difference between the heat source and heat sink.
  • the heat pipe comprises a closed, evacuated chamber having its inside walls lined with a capillary structure, generally a wick, saturated with a volatile fluid. The fluid is evaporated from the wick in an evaporator section at one end of the heat pipe and condenses back to the liquid state in the condenser section at the opposite end. Capillary action is the force which causes the condensed working fluid to return to the evaporator section to complete the transfer cycle.
  • a heat pipe is generally connected between a source of given heat flux and an infinite heat sink at a given temperature.
  • an evacuated tube having its interior surfaces with the exception of the heat output or condenser section covered with a wicking material.
  • Heat added to the evaporator produces vaporization of a volatile liquid from the wick and the vapors travel from the evaporator to a condenser under a slight pressure gradient.
  • the removal of the latent heat of vaporization at the condenser causes the vapor to condense and the condensate returns by gravity to the region of the wick whereby it is returned to the evaporator to complete the cycle. Since there is no wicking material disposed adjacent the heat output end of the device, a heat source near the output does not reverse the operation of the invention and flow of heat back into the object to be cooled is inhibited.
  • FIG. 1 is a schematic crosssectional illustration of a unilateral heat pipe in accordance with the present invention.
  • FIG. 2 is a graph illustrating the relative forward and reverse heat conductivity of the apparatus of FIG. 1.
  • FIG. 3 is a three-dimensional cross section view of an embodiment of the present invention adapted to cooling avionics equipment.
  • FIG. I the present invention is schematically illustrated in its fundamental form.
  • a closed evacuated container 10 has a capillary structure in the form of a wick I2 disposed on the inside surface of the evaporator or heat input end.
  • a perforated metal plate 14 operates to hold the wick 12 in place yet allow evaporation of a volatile liquid.
  • the remainder of the apparatus may be covered with a layer 20 of insulating material to confine the transfer of heat to these areas. In the majority of applications this insulation is not required and is not necessary for proper operation.
  • FIG. 2 The marked difference in the forward and reverse heat transfer characteristics of the present invention is graphically illustrated in FIG. 2. These data were taken by the applicant during the testing of the actual ap paratus of the invention as shown in FIG. I.
  • the solid lines shown in FIG. 2 represents the surface temperatures of the heat input and output surfaces 16 and 18 as a function of time for operation of the invention in the forward direction. The temperature difference between the heat input and output surfaces was found to be approximately 60.
  • the heat output surface was at saturation temperature while the input is relatively higher, since to boil the working fluid temperatures higher than saturation are required. A large portion of the temperature difference, however, may be eliminated by providing improved contact between the capillary structure and container such as by using grooves cut in the interior container walls as the capillary structure.
  • the dashed lines shown in FIG. 2 illustrate the high resistance provided by the present invention to reverse heat flow.
  • the heat output surface I8 was heated to slightly under the melting point of the solder bonding a test thermocouple (not shown) to the surface and the heat input surface I6 exhibited a negligible temperature rise.
  • FIG. 3 is a three-dimensional view with portions cut away of an embodiment of the present invention which is particularly well adapted to provide cooling of avionics apparatus on highspeed aircraft.
  • This embodiment may comprise two compound heat transfer systems.
  • the first system two of which, 30 and 32, are illustrated, includes a closed rigid evaporator container 34 having its inside surfaces covered with a wick 36.
  • a plurality of flexible wick sections 38 are connected to wicklined heat sink channels 40 which are disposed longitudinally in but isolated by a vapor space 58 from the surface of a double-walled container 42 or aircraft skin in which the elec' tronics 44 to be cooled are carried.
  • the heat transfer systems 30 and 32 are mounted between plates 46 and 48 which are in turn secured to the inner wall 50 of the double-wall container 42 by a series of brackets 52.
  • the outer surface of the inner wall 50 is covered with a suitable wicking material 54 and separated from the outer wall 56 of container 42 by a vapor space 58 and thus comprises the second or outer heat transfer system.
  • This vapor moves across the vapor space 58 and condenses on the inner surface of the outer wall 56 of the double-walled container 42. Heat is thus liberated to the exterior environment, the condensate flows by gravity to the bottom of the vapor space 58 and is returned to the evaporation area through wick 54 by capillary action.
  • the flexible wicking sections may simply be contiguous with the wick 54. in such an arrangement the vapors would pass through the flexible sections 38 into the vapor space 58 and condense on the inner surface of the outer wall 56.
  • the outer heat transfer system acts as a thermal diode. Since very little liquid is available at the inner surface of the outer wall 56 any heat in order to reach the inside wall 50 of the container 42 must be transferred through the vapor space by conduction and convection. As discussed above with reference to FIGS. 1 and 2 this results in a much slower rise in the temperature of the internal electronics.
  • the solid portions 60 and 62 of the container 42 are obviously necessary to the structural integrity of the apparatus in an airborne environment, however, their heat transfer properties are negligible when compared to the efficient unilateral cooling provided by the double-walled thermal diode construction of the remainder of the container.
  • Unilateral heat transfer apparatus comprising a closed evaporative heat transfer chamber having an evaporator portion and a condenser portion,
  • a capillary structure disposed on the interior surfaces of said chamber exclusive of said condenser portion thereof and extending from said evaporator portion to a point beneath said condenser portion,
  • Apparatus as recited in claim I further including means for mounting electronic components in heat transfer relation with the evaporator portion of said chamber.
  • Apparatus as recited in claim 4 wherein said evaporator portion of said chamber comprises a wicklined rigid chamber and a flexible wick-lined segment forming a continuous chamber therewith,
  • said condenser portion comprises a double-walled container having a vapor space between said walls, having a wick disposed on the outer surface of the inner wall, and having the outer surface of the outer wall thereof in heat transfer relation with a heat sink, and
  • said components are mounted on the exterior of said rigid chamber.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US864777A 1969-10-08 1969-10-08 Unilateral heat transfer apparatus Expired - Lifetime US3613774A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86477769A 1969-10-08 1969-10-08

Publications (1)

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US3613774A true US3613774A (en) 1971-10-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
US864777A Expired - Lifetime US3613774A (en) 1969-10-08 1969-10-08 Unilateral heat transfer apparatus

Country Status (5)

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US (1) US3613774A (enrdf_load_stackoverflow)
JP (1) JPS4923929B1 (enrdf_load_stackoverflow)
DE (1) DE2028651A1 (enrdf_load_stackoverflow)
FR (1) FR2101166B1 (enrdf_load_stackoverflow)
GB (1) GB1315198A (enrdf_load_stackoverflow)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700028A (en) * 1970-12-10 1972-10-24 Noren Products Inc Heat pipes
US3714981A (en) * 1971-02-03 1973-02-06 Noren Prod Inc Heat shield assembly
US3735806A (en) * 1970-12-07 1973-05-29 Trw Inc Unidirectional thermal transfer means
US3738421A (en) * 1971-06-11 1973-06-12 R Moore Heatronic capacitor
JPS4882445A (enrdf_load_stackoverflow) * 1972-02-02 1973-11-05
JPS4966057U (enrdf_load_stackoverflow) * 1972-09-19 1974-06-10
US3837394A (en) * 1973-11-09 1974-09-24 Bell Telephone Labor Inc Thermal transfer apparatus providing transfer control
US3854524A (en) * 1972-09-07 1974-12-17 Atomic Energy Commission Thermal switch-heat pipe
US3947244A (en) * 1971-10-05 1976-03-30 Thermo Electron Corporation Heap pipe vacuum furnace
US4377198A (en) * 1980-10-14 1983-03-22 Motorola Inc. Passive, recyclable cooling system for missile electronics
US4673030A (en) * 1980-10-20 1987-06-16 Hughes Aircraft Company Rechargeable thermal control system
US4674565A (en) * 1985-07-03 1987-06-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe wick
US4683940A (en) * 1986-07-16 1987-08-04 Thermacore, Inc. Unidirectional heat pipe
US4964457A (en) * 1988-10-24 1990-10-23 The United States Of America As Represented By The Secretary Of The Air Force Unidirectional heat pipe and wick
GB2286229A (en) * 1977-10-04 1995-08-09 Rolls Royce Turbine aerofoil blades
US20060090882A1 (en) * 2004-10-28 2006-05-04 Ioan Sauciuc Thin film evaporation heat dissipation device that prevents bubble formation
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2726103C2 (de) * 1977-06-10 1984-11-29 Vdo Adolf Schindling Ag, 6000 Frankfurt Einrichtung zum Anzeigen der Geschwindigkeitsänderung eines Schiffes
JPS58127064A (ja) * 1982-01-22 1983-07-28 橋本　巍洲 磁気冷凍機

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018087A (en) * 1958-04-11 1962-01-23 Hexcel Products Inc Heat transfer panel
US3154139A (en) * 1962-06-11 1964-10-27 Armstrong Cork Co One-way heat flow panel
US3229759A (en) * 1963-12-02 1966-01-18 George M Grover Evaporation-condensation heat transfer device
US3402767A (en) * 1964-11-23 1968-09-24 Euratom Heat pipes
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018087A (en) * 1958-04-11 1962-01-23 Hexcel Products Inc Heat transfer panel
US3154139A (en) * 1962-06-11 1964-10-27 Armstrong Cork Co One-way heat flow panel
US3229759A (en) * 1963-12-02 1966-01-18 George M Grover Evaporation-condensation heat transfer device
US3402767A (en) * 1964-11-23 1968-09-24 Euratom Heat pipes
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3735806A (en) * 1970-12-07 1973-05-29 Trw Inc Unidirectional thermal transfer means
US3700028A (en) * 1970-12-10 1972-10-24 Noren Products Inc Heat pipes
US3714981A (en) * 1971-02-03 1973-02-06 Noren Prod Inc Heat shield assembly
US3738421A (en) * 1971-06-11 1973-06-12 R Moore Heatronic capacitor
US3947244A (en) * 1971-10-05 1976-03-30 Thermo Electron Corporation Heap pipe vacuum furnace
JPS4882445A (enrdf_load_stackoverflow) * 1972-02-02 1973-11-05
US3854524A (en) * 1972-09-07 1974-12-17 Atomic Energy Commission Thermal switch-heat pipe
JPS4966057U (enrdf_load_stackoverflow) * 1972-09-19 1974-06-10
US3837394A (en) * 1973-11-09 1974-09-24 Bell Telephone Labor Inc Thermal transfer apparatus providing transfer control
GB2286229A (en) * 1977-10-04 1995-08-09 Rolls Royce Turbine aerofoil blades
GB2286229B (en) * 1977-10-04 1995-12-20 Rolls Royce Turbine aerofoil blade provided with a heat insulating coating
US4377198A (en) * 1980-10-14 1983-03-22 Motorola Inc. Passive, recyclable cooling system for missile electronics
US4673030A (en) * 1980-10-20 1987-06-16 Hughes Aircraft Company Rechargeable thermal control system
US4674565A (en) * 1985-07-03 1987-06-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe wick
US4683940A (en) * 1986-07-16 1987-08-04 Thermacore, Inc. Unidirectional heat pipe
US4964457A (en) * 1988-10-24 1990-10-23 The United States Of America As Represented By The Secretary Of The Air Force Unidirectional heat pipe and wick
US20060090882A1 (en) * 2004-10-28 2006-05-04 Ioan Sauciuc Thin film evaporation heat dissipation device that prevents bubble formation
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure

Also Published As

Publication number Publication date
GB1315198A (en) 1973-04-26
JPS4923929B1 (enrdf_load_stackoverflow) 1974-06-19
DE2028651A1 (enrdf_load_stackoverflow) 1971-04-15
FR2101166B1 (enrdf_load_stackoverflow) 1974-07-12
FR2101166A1 (enrdf_load_stackoverflow) 1972-03-31

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