US3607507A - Novel splicing method - Google Patents
Novel splicing method Download PDFInfo
- Publication number
- US3607507A US3607507A US694791A US3607507DA US3607507A US 3607507 A US3607507 A US 3607507A US 694791 A US694791 A US 694791A US 3607507D A US3607507D A US 3607507DA US 3607507 A US3607507 A US 3607507A
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- US
- United States
- Prior art keywords
- imide
- forming polymer
- splice
- spliced
- reaction product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 229920000642 polymer Polymers 0.000 claims abstract description 71
- 239000004642 Polyimide Substances 0.000 claims abstract description 10
- 229920001721 polyimide Polymers 0.000 claims abstract description 10
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 239000007795 chemical reaction product Substances 0.000 claims description 14
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 13
- 229910052796 boron Inorganic materials 0.000 claims description 13
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 12
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 10
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 claims description 6
- 150000004820 halides Chemical class 0.000 claims description 6
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 4
- 239000000835 fiber Substances 0.000 abstract description 13
- 239000000463 material Substances 0.000 description 9
- 239000004952 Polyamide Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229920002647 polyamide Polymers 0.000 description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- HROJZVFWLRONHN-UHFFFAOYSA-N acetic acid;propane Chemical compound CCC.CC(O)=O.CC(O)=O HROJZVFWLRONHN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- -1 diphenol diester Chemical class 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- OETHQSJEHLVLGH-UHFFFAOYSA-N metformin hydrochloride Chemical compound Cl.CN(C)C(=N)N=C(N)N OETHQSJEHLVLGH-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
- D06M23/16—Processes for the non-uniform application of treating agents, e.g. one-sided treatment; Differential treatment
- D06M23/18—Processes for the non-uniform application of treating agents, e.g. one-sided treatment; Differential treatment for the chemical treatment of borders of fabrics or knittings; for the thermal or chemical fixation of cuttings, seams or fibre ends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H69/00—Methods of, or devices for, interconnecting successive lengths of material; Knot-tying devices ;Control of the correct working of the interconnecting device
- B65H69/02—Methods of, or devices for, interconnecting successive lengths of material; Knot-tying devices ;Control of the correct working of the interconnecting device by means of adhesives
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F11/00—Chemical after-treatment of artificial filaments or the like during manufacture
- D01F11/10—Chemical after-treatment of artificial filaments or the like during manufacture of carbon
- D01F11/14—Chemical after-treatment of artificial filaments or the like during manufacture of carbon with organic compounds, e.g. macromolecular compounds
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
- D04H1/587—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives characterised by the bonding agents used
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
- D04H1/64—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives the bonding agent being applied in wet state, e.g. chemical agents in dispersions or solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/31—Textiles threads or artificial strands of filaments
- B65H2701/312—Fibreglass strands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/31—Textiles threads or artificial strands of filaments
- B65H2701/314—Carbon fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
Definitions
- Roberts ABSTRACT Disclosed herein is a method for splicing the ends of thermally stable fibers, filaments, strands, wires, etc., which comprises applying a thermally stable imide-forming polymer to the ends to be spliced and then converting the imide-forming polymer to a polyimide.
- This invention relates to a method for splicing thermally stable fibers, filaments, strands, wires, etc. More particularly, this invention relates to a method for splicing thermally stable fibers, filaments, strands, wires, etc., which comprises 1. bringing the ends to be spliced into a proximate position with respect to each other, 2. applying an imide-forming polymer to the ends to be spliced,
- thermoplastic and epoxy-type adhesives require long setting times in order to cure the adhesive.
- adhesive materials are thermally unstable.
- the present invention solves the above mentioned splicing problems by providing a convenient method for obtaining a rapidly made, high-temperature resistant splice, without resorting to the use of undesirable tapes or clamps or impractical twisting or knotting operations, or to time-consuming gluing operations.
- the advantages of the present invention is that it provides a process for the rapid splicing of thermally resistant fibers, filaments and other related materials, wherein the splice maintains its strength even upon exposure to high temperatures.
- the present invention solves'problems widely encountered in the splicing of high-temperature-resistant fibers such as the long setting times required by conventional adhesives and thermally unstable adhesive bonds which fail at elevated temperatures. Moreover, the present invention eliminates the need for tapes and clamps and provides a splicing technique for materials which are not readily adaptable to being twisted, braided, tied or knotted.
- filament will be used to include fibers, threads, filaments, wires, slender rods, strands, etc.
- the present invention is applicable to the splicing of high temperature-resistant filaments such as those filaments prepared from boron, carbon, graphite, quartz, refrasil, glass, asbestos, nichrome, copper, tungsten, aluminum, and other related materials.
- the imide-forming polymers used to prepare the thermally stable splice include polyamide acids prepared from aromatic tetracarboxylic acid dianhydrides and derivatives thereof and polyamino compounds containing at least two primary amino groups per molecule.
- polyamide acids prepared from aromatic tetracarboxylic acid dianhydrides and derivatives thereof and polyamino compounds containing at least two primary amino groups per molecule.
- equimolar amounts of compounds such as benzophenone tetracarboxylic acid dianhydride and 4,4'-oxydianiline are reacted in N-methyl pyrrolidone at temperatures of under 60 C. to form an imide-forming polymer.
- the polyamide acid is converted into a thermally stable polyimide.
- imide-forming polymer component of the present invention are those polymers prepared by the reaction of a monoacid halide of a tricarboxylic acid monoanhydride and a polyamino component containing at least two primary amino groups per molecule.
- a monoacid halide of a tricarboxylic acid monoanhydride and a polyamino component containing at least two primary amino groups per molecule.
- equimolar amounts of the monoacid chloride of trimellitic anhydride and methylene dianiline are reacted in N-methyl pyrrolidone at temperatures below C. to form an imide-forming polymer. Upon further heating at temperatures above C. this polymer undergoes imide formation.
- These polymers prepared from monoacid halides of tricarboxylic acid anhydrides are described in detail in U.S. Pat. No. 3,260,691 which is incorporated herein by reference.
- imide-forming polymer component of the present invention are those polymers prepared by the reaction of a tricarboxylic anhydride with a diphenol diester type compound as is described in detail in British Pat. No. 1,070,364, which is incorporated herein by reference.
- imide-forming polymer component of the present invention are those polymers which are capable of being converted to thermally stable polyimide-type structures which are generally well known to those skilled in the art.
- EXAMPLE 1 This example is set forth to illustrate the use of an imideforming polymer to splice the ends of a boron filament having a diameter of 4 mils, which filament broke while being coated in a wire-tower-coating operation.
- the ends of the boron filament are brought into overlapping contact with each other and a small amount of an imide-forming polymer solution is applied to the overlapping ends.
- the solvent for the polymer is ignited and then the flames are quickly quenched in order to accelerate the drying of the polymer, i.e. the evaporation of the solvent and the conversion of the polyamide to a polyimide.
- a strong splice results within 1 minute and the spliced filament is immediately conducted through the elevated temperature zones of the wire tower where the temperature reaches 400 C. under moderate tension.
- the splice withstands the elevated temperatures without softening or parting. Approximately 2 minutes elapses between the time when the broken ends are first overlapped and coated with the imide-forming resin and when the splice enters the elevated temperature zone of the wire tower.
- the polyamide acid solution used in this example is prepared by dissolving 16.1 parts of benzophenone tetracarboxylic acid dianhydride in 74 ml. of N-methyl pyrrolidone in a three-neck, round bottom flask fitted with a thermometer, a stirrer and an air condenser protected by a calcium chloride tube. To the flask was added a solution of 13.4 parts of oxydianiline in 74 ml. of dimethylacetamide. The reaction mixture was held at 50 C. with stirring for 16 hours. The resulting polyamide solution which is applied to the splice has a Brookfield viscosity of 150 centipoises at 25 C.
- Example 1 is repeated here except that the imide-forming polymer is the polymeric reaction product of pyromellitic di anhydride and methylene dianiline in N-methylpyrrolidone.
- the broken ends of the boron filament are brought into overlapping contact, coated, and dried according to the procedures described in example 1. A strong, heat resistant splice is obtained in less than 2 minutes.
- EXAMPLE 3 This example is set forth here to illustrate the drawbacks encountered when using an epoxy resin system to splice the ends of a 4 mil diameter boron filament.
- the epoxy resin system is prepared by mixing a small quantity of a commercial epoxy resin and an activator for the resin. This mixture is applied to the ends of the boron filament which are in overlapping contact. Heat is applied to the coated ends using an infrared heat lamp, for about 20 minutes in order to cure the epoxy and set the bond. After this time, the splice is advanced into the elevated temperature zone of the wire tower. While in the 400 C. zone, the splice fails.
- the commercial method described in example 3 has a further drawback in that the epoxy/activator system must be prepared in small quantities just prior to use wherein the imide-forming polymers used in the present invention have excellent shelf life at room temperature or below. Furthermore, the epoxy polymer is flammable and cannot be ignited so as to form a rapid bond as is the case with the imide-forming polymer solutions used in examples 1 and 2.
- Example 1 is repeated here except that AWG 018 copper wire is spliced using the imide-forming solution and the procedures described in example 1 An excellent heat resistant splice is obtained in about 1 minute.
- EXAMPLE 5 This example is set forth to illustrate the splicing of a 4 mil diameter boron filament using an imide-forming polymer solution which is prepared from a tricarboxylic component and a diamin'e component;
- This imide-forming polymer is prepared by thoroughly mixing trimellitic anhydride monoacid chloride (90.0 g., 0.43 mol) and methylene dianiline (86.4 g., 0.43 mol) in a reaction flask.
- trimellitic anhydride monoacid chloride 90.0 g., 0.43 mol
- methylene dianiline 86.4 g., 0.43 mol
- a mixture of N-methyl pyrrolidone (210 g.) and triethylamine (43.2 g., 0.43 mol) is added with vigorous stirring. The solids dissolve rapidly and the temperature rises to about C.
- Example 6 is repeated here except that the imide-forming polymer is prepared by first reacting 2.1 moles of trimellitic acid anhydride with 1.0 mole ofp,p'-dihydroxyphenyl propane diacetate which reaction product is further reacted with diaminodiphenyl methane. The resulting polymer solution is then used to splice 4 mil diameter boron filament according to the procedure of example 1. A strong, thermally stable splice is obtained within 1 minute.
- Example 1 is repeated here except that the imide-forming polymer solution is used to splice uncoated 4 mil diameter boron filaments that snapped while being wound on a takeup spool.
- the splicing procedure of example 1 is followed except that the splice is not subjected to the elevated temperatures of the wire-coating tower.
- the splice which was made within 1 minute is examined after 24 hours and compared to the heat cured splice of example 1. The respective splices are found to be comparable.
- Example 9 Example 1 is repeated here except that a heat gun is applied to the splice in order to evaporate the solvent and cure the polymer. A strong thermally stable splice is obtained in less than 4 minutes.
- Example 1 is repeated here except that the infrared lamp of example 3 is used in order to evaporate the solvent and cure the polymer. A strong thermally stable splice is obtained in less than 5 minutes. This splice does not part when exposed to elevated temperatures of about 400 C in a wire tower.
- Example 1 is repeated here except that a 10 mil diameter carbon fiber is spliced. A strong thermally resistant splice is obtained within 2 minutes.
- Example 1 is repeated here except that a 10 mil graphite fiber is spliced. A strong thermally resistant splice is obtained within 2 minutes.
- Example 1 is repeated here except that a refrasil fiber is spliced. A strong thermally resistant splice is obtained within 2 minutes.
- the preferred thermally stable imide-forming polymers used to splice filaments in the practice of this invention are those prepared from aromatic tricarboxylic and tetracarboxylic components and aromatic polyamino compounds containing at least two amino groups per molecule.
- aromatic tricarboxylic and tetracarboxylic components and aromatic polyamino compounds containing at least two amino groups per molecule are especially preferred.
- polymers prepared using benzophenone tetracarboxylic components and an aromatic primary diamine as are described in detail in U.S. Pat. Nos. 3,190,856 and 3,277,043.
- heat sources other than the open flame, heat gun and infrared lamp used in the foregoing examples may be used to evaporate the solvent in the polymer solution and accelerate the cure of the imide-forrning resin. These would include ovens, hot plates, and other means which will become apparent to those skilled in the art.
- the ends to be spliced may be held in proximate position with respect to each other using holding means such as tape, clamps, jigs, etc., while the joint is coated with the imide-forming polymer and then while the polymer is cured. The holding means is then removed.
- a narrow shallow trough shape jig is especially useful for applying and curing the imide-forming polymer while maintaining the ends to be spliced in an overlapping position.
- the splice can be made as long as the ends are proximately positioned in respect to each other without the need for actual physical contact.
- any space between the ends to be spliced should be kept to a minimum in order to provide a stronger bond and minimize the thickness of the splice.
- the present invention is not limited to overlapping-type slices. It is equally applicable to butt and other type splices and can also be used to further bond or overcoat those splices made by twisting, tying, knotting, etc., the ends of the material to be joined wherever the nature of the materials to be spliced allow such physical manipulation.
- a method of splicing thermally resistant filaments, fibers, threads, wires, strands and other related materials which comprises:
- the imide-forming polymer is the polymeric reaction product of benzophenone tetracarboxylic acid dianhydride and an aromatic primary diamine.
- the imide-forming polymer is the polymeric reaction product of pyromellitic dianhydride and an aromatic primary diamine.
- the imide-forming polymer is the polymeric reaction product of monoacid halide trimellitic dianhydride and an aromatic primary diamine.
- a method for splicing boron filaments which comprises:
- the imide-forming polymer is the polymeric reaction product of benzophenone tetracarboxylic acid dianhydride and an aromatic primary diamine.
- the imide-forming polymer is the polymeric reaction product of pyromellitic dianhydride and an aromatic primary diamine.
- the imide-forming polymer is the polymeric reaction product of monoacid halide trimellitic dianhydride and an aromatic primary diamine.
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- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Disclosed herein is a method for splicing the ends of thermally stable fibers, filaments, strands, wires, etc., which comprises applying a thermally stable imide-forming polymer to the ends to be spliced and then converting the imide-forming polymer to a polyimide.
Description
United States Patent [72] Inventor Raymond J. Enos Springfield, Mass. [21] Appl. No. 694,791 [22] Filed Jan. 2, 1968 [45] Patented Sept. 21, 1971 [73] Assignee Monsanto Company St. Louis, Mo.
[54] NOVEL SPLlClNG METHOD 8 Claims, No Drawings [52] U.S. Cl 156/158, 156/157, 156/331 151 Int. Cl B65h 69/02 [50] Field 01' Search 156/157, 331, 158
[56] References Cited UNITED STATES PATENTS 3.179,633 4/1965 Endrey 156/331 UX Primary Examiner-Carl D. Quarforth Assistant Examiner-Brooks H. Hunt A!l0rney.r-William J. Farrington, Arthur E. Hoffman and H.
B. Roberts ABSTRACT: Disclosed herein is a method for splicing the ends of thermally stable fibers, filaments, strands, wires, etc., which comprises applying a thermally stable imide-forming polymer to the ends to be spliced and then converting the imide-forming polymer to a polyimide.
NOVEL SPLICING METHOD The invention herein described was made in the course of or under a contract or subcontract thereunder with the Departmeng of the Air Force.
BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method for splicing thermally stable fibers, filaments, strands, wires, etc. More particularly, this invention relates to a method for splicing thermally stable fibers, filaments, strands, wires, etc., which comprises 1. bringing the ends to be spliced into a proximate position with respect to each other, 2. applying an imide-forming polymer to the ends to be spliced,
3. curing the imide-forming polymer to a thermally stable polyimide.
2. Description of the Prior Art The splicing of fibers, filaments, wires, strands, etc. is well known in the art, dating back in some instances to ancient times. However, modern technology has provided novel fiber and filaments such as boron, carbon, graphite, refrasil, quartz, etc. which present a special splicing problem. Thin filaments of these materials are susceptible to breaking during their manufacture, during wind up operations, during coating operations in conventional coating and/or sizing operations, or during their use or applications. The breaks in the abovementioned filaments cause excessive delays involved in splicing the broken ends. Conventional splicing means such as tapes, clamps, etc. are unsuitable for obvious reasons of thermal instability, added bulkiness and cost. Moreover, the fragile nature of some of the above-mentioned fibers and filaments makes it impossible to knot or twist the broken ends together.
Attempts have been made to splice broken ends of the filaments described above using thermoplastic and epoxy-type adhesives. However, these materials require long setting times in order to cure the adhesive. In addition, such adhesive materials are thermally unstable.
If the break occurs during a coating operation involving high-temperature cure, such as a wire tower-coating operation where the elevated temperature zones reach temperatures as high as 400 C., a special problem arises. When a conventional adhesive bonded splice is subjected to these high temperatures, the adhesive used to make the splice usually fails while the wire is in the high-temperature zone of the tower causing added problems such as extended down time, cooling problems, etc.
A definite need exists in the art for a splicing method which will provide rapid splicing and a spliced joint which will withstand high temperature without the need for prolonged aging of the spliced joint.
The present invention solves the above mentioned splicing problems by providing a convenient method for obtaining a rapidly made, high-temperature resistant splice, without resorting to the use of undesirable tapes or clamps or impractical twisting or knotting operations, or to time-consuming gluing operations.
SUMMARY OF THE INVENTION 3. curing the imide-forming polymer to a thermally stablepolyimide.
The advantages of the present invention is that it provides a process for the rapid splicing of thermally resistant fibers, filaments and other related materials, wherein the splice maintains its strength even upon exposure to high temperatures.
The present invention solves'problems widely encountered in the splicing of high-temperature-resistant fibers such as the long setting times required by conventional adhesives and thermally unstable adhesive bonds which fail at elevated temperatures. Moreover, the present invention eliminates the need for tapes and clamps and provides a splicing technique for materials which are not readily adaptable to being twisted, braided, tied or knotted.
For purposes of this application the term filament will be used to include fibers, threads, filaments, wires, slender rods, strands, etc.
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is applicable to the splicing of high temperature-resistant filaments such as those filaments prepared from boron, carbon, graphite, quartz, refrasil, glass, asbestos, nichrome, copper, tungsten, aluminum, and other related materials.
The imide-forming polymers used to prepare the thermally stable splice include polyamide acids prepared from aromatic tetracarboxylic acid dianhydrides and derivatives thereof and polyamino compounds containing at least two primary amino groups per molecule. In a typical example of the preparation of these polyamide acids, equimolar amounts of compounds such as benzophenone tetracarboxylic acid dianhydride and 4,4'-oxydianiline are reacted in N-methyl pyrrolidone at temperatures of under 60 C. to form an imide-forming polymer. Upon further heating of this polymer at elevated temperatures the polyamide acid is converted into a thermally stable polyimide. These polyamide acids which are based on tetracarboxylic and polyamino components and which are used in the present invention as the imide-forming polymer are described in detail in U.S. Pat. Nos. 3,179,614, 3,179,633, 3,179,634, 3,179,635, 3,190,856, and 3,277,043 which are incorporated herein by reference.
Also suitable as the imide-forming polymer component of the present invention are those polymers prepared by the reaction of a monoacid halide of a tricarboxylic acid monoanhydride and a polyamino component containing at least two primary amino groups per molecule. In a typical example of the preparation of these types of compounds, equimolar amounts of the monoacid chloride of trimellitic anhydride and methylene dianiline are reacted in N-methyl pyrrolidone at temperatures below C. to form an imide-forming polymer. Upon further heating at temperatures above C. this polymer undergoes imide formation. These polymers prepared from monoacid halides of tricarboxylic acid anhydrides are described in detail in U.S. Pat. No. 3,260,691 which is incorporated herein by reference.
Also suitable as the imide-forming polymer component of the present invention are those polymers prepared by the reaction of a tricarboxylic anhydride with a diphenol diester type compound as is described in detail in British Pat. No. 1,070,364, which is incorporated herein by reference.
Also included as the imide-forming polymer component of the present invention are those polymers which are capable of being converted to thermally stable polyimide-type structures which are generally well known to those skilled in the art.
The following examples are set forth in illustration of the present invention and are not to be construed as limitations thereof. All parts and percentages given are by weight unless otherwise indicated.
EXAMPLE 1 This example is set forth to illustrate the use of an imideforming polymer to splice the ends of a boron filament having a diameter of 4 mils, which filament broke while being coated in a wire-tower-coating operation. The ends of the boron filament are brought into overlapping contact with each other and a small amount of an imide-forming polymer solution is applied to the overlapping ends. The solvent for the polymer is ignited and then the flames are quickly quenched in order to accelerate the drying of the polymer, i.e. the evaporation of the solvent and the conversion of the polyamide to a polyimide. A strong splice results within 1 minute and the spliced filament is immediately conducted through the elevated temperature zones of the wire tower where the temperature reaches 400 C. under moderate tension. The splice withstands the elevated temperatures without softening or parting. Approximately 2 minutes elapses between the time when the broken ends are first overlapped and coated with the imide-forming resin and when the splice enters the elevated temperature zone of the wire tower.
The polyamide acid solution used in this example is prepared by dissolving 16.1 parts of benzophenone tetracarboxylic acid dianhydride in 74 ml. of N-methyl pyrrolidone in a three-neck, round bottom flask fitted with a thermometer, a stirrer and an air condenser protected by a calcium chloride tube. To the flask was added a solution of 13.4 parts of oxydianiline in 74 ml. of dimethylacetamide. The reaction mixture was held at 50 C. with stirring for 16 hours. The resulting polyamide solution which is applied to the splice has a Brookfield viscosity of 150 centipoises at 25 C.
EXAMPLE 2 Example 1 is repeated here except that the imide-forming polymer is the polymeric reaction product of pyromellitic di anhydride and methylene dianiline in N-methylpyrrolidone. The broken ends of the boron filament are brought into overlapping contact, coated, and dried according to the procedures described in example 1. A strong, heat resistant splice is obtained in less than 2 minutes.
EXAMPLE 3 This example is set forth here to illustrate the drawbacks encountered when using an epoxy resin system to splice the ends of a 4 mil diameter boron filament.
The epoxy resin system is prepared by mixing a small quantity of a commercial epoxy resin and an activator for the resin. This mixture is applied to the ends of the boron filament which are in overlapping contact. Heat is applied to the coated ends using an infrared heat lamp, for about 20 minutes in order to cure the epoxy and set the bond. After this time, the splice is advanced into the elevated temperature zone of the wire tower. While in the 400 C. zone, the splice fails.
Note that the commercial method described in example 3 has a further drawback in that the epoxy/activator system must be prepared in small quantities just prior to use wherein the imide-forming polymers used in the present invention have excellent shelf life at room temperature or below. Furthermore, the epoxy polymer is flammable and cannot be ignited so as to form a rapid bond as is the case with the imide-forming polymer solutions used in examples 1 and 2.
EXAMPLE 4 Example 1 is repeated here except that AWG 018 copper wire is spliced using the imide-forming solution and the procedures described in example 1 An excellent heat resistant splice is obtained in about 1 minute.
EXAMPLE 5 EXAMPLE 6 This example is set forth to illustrate the splicing of a 4 mil diameter boron filament using an imide-forming polymer solution which is prepared from a tricarboxylic component and a diamin'e component; This imide-forming polymer is prepared by thoroughly mixing trimellitic anhydride monoacid chloride (90.0 g., 0.43 mol) and methylene dianiline (86.4 g., 0.43 mol) in a reaction flask. A mixture of N-methyl pyrrolidone (210 g.) and triethylamine (43.2 g., 0.43 mol) is added with vigorous stirring. The solids dissolve rapidly and the temperature rises to about C. Stirring is continued for about 1 hour while the solution cools to about 50 C. At this point, the polymer solution is diluted with a mixture of N-methy] pyrrolidone (37 g.) and xylene 124 g). After standing overnight, the solution is filtered to remove the triethylamine hydrochloride and is diluted to about 20 percent solids with N methyl pyrrolidone.
This solution is then applied to overlapping ends of the boron filament and the solvent in the polymer solution is ignited and quenched as in example 1. A strong, thermally re sistant splice is obtained within 1 minute which withstands the elevated temperature of the wire tower (about 400 C.) within 2 minutes after the splice is made.
EXAMPLE 7 Example 6 is repeated here except that the imide-forming polymer is prepared by first reacting 2.1 moles of trimellitic acid anhydride with 1.0 mole ofp,p'-dihydroxyphenyl propane diacetate which reaction product is further reacted with diaminodiphenyl methane. The resulting polymer solution is then used to splice 4 mil diameter boron filament according to the procedure of example 1. A strong, thermally stable splice is obtained within 1 minute.
EXAMPLE 8 Example 1 is repeated here except that the imide-forming polymer solution is used to splice uncoated 4 mil diameter boron filaments that snapped while being wound on a takeup spool. The splicing procedure of example 1 is followed except that the splice is not subjected to the elevated temperatures of the wire-coating tower. The splice which was made within 1 minute is examined after 24 hours and compared to the heat cured splice of example 1. The respective splices are found to be comparable.
EXAMPLE 9 Example 1 is repeated here except that a heat gun is applied to the splice in order to evaporate the solvent and cure the polymer. A strong thermally stable splice is obtained in less than 4 minutes.
EXAMPLE 10 Example 1 is repeated here except that the infrared lamp of example 3 is used in order to evaporate the solvent and cure the polymer. A strong thermally stable splice is obtained in less than 5 minutes. This splice does not part when exposed to elevated temperatures of about 400 C in a wire tower.
EXAMPLE 11 Example 1 is repeated here except that a 10 mil diameter carbon fiber is spliced. A strong thermally resistant splice is obtained within 2 minutes.
EXAMPLE 12 Example 1 is repeated here except that a 10 mil graphite fiber is spliced. A strong thermally resistant splice is obtained within 2 minutes.
EXAMPLE 13 Example 1 is repeated here except that a refrasil fiber is spliced. A strong thermally resistant splice is obtained within 2 minutes.
The preferred thermally stable imide-forming polymers used to splice filaments in the practice of this invention are those prepared from aromatic tricarboxylic and tetracarboxylic components and aromatic polyamino compounds containing at least two amino groups per molecule. Especially preferred are those polymers prepared using benzophenone tetracarboxylic components and an aromatic primary diamine as are described in detail in U.S. Pat. Nos. 3,190,856 and 3,277,043.
By varying the type and amount of solvent in the polyimide solution the amounts of heat required to evaporate the solvent and effect a cure can be controlled as should be obvious to those skilled in the art.
Other heat sources other than the open flame, heat gun and infrared lamp used in the foregoing examples may be used to evaporate the solvent in the polymer solution and accelerate the cure of the imide-forrning resin. These would include ovens, hot plates, and other means which will become apparent to those skilled in the art.
If necessary, the ends to be spliced may be held in proximate position with respect to each other using holding means such as tape, clamps, jigs, etc., while the joint is coated with the imide-forming polymer and then while the polymer is cured. The holding means is then removed. A narrow shallow trough shape jig is especially useful for applying and curing the imide-forming polymer while maintaining the ends to be spliced in an overlapping position.
It should be noted that it is not necessary to keep the ends to be spliced in actual physical contact with each other unless the filament is to be used as an electrical or thermal conductor. For nonconductive applications the splice can be made as long as the ends are proximately positioned in respect to each other without the need for actual physical contact. However, those skilled in the art will readily realize that any space between the ends to be spliced should be kept to a minimum in order to provide a stronger bond and minimize the thickness of the splice.
The present invention is not limited to overlapping-type slices. It is equally applicable to butt and other type splices and can also be used to further bond or overcoat those splices made by twisting, tying, knotting, etc., the ends of the material to be joined wherever the nature of the materials to be spliced allow such physical manipulation.
From the foregoing, it will be realized that many variations may be made in the practice of the present invention without departing from the spirit and scope thereof.
What is claimed is:
l. A method of splicing thermally resistant filaments, fibers, threads, wires, strands and other related materials which comprises:
l. bringing the ends to be spliced into a proximate position with respect to each other,
2. applying an imide-forming polymer solution to the ends to be spliced,
3. curing the imide-forming polymer to a thermally stable polyimide wherein the curing of the imide-forming polymer is initiated by igniting the solvent in the imideforrning polymer solution.
2. The method of claim 1 wherein the imide-forming polymer is the polymeric reaction product of benzophenone tetracarboxylic acid dianhydride and an aromatic primary diamine.
3. The method of claim 1 wherein the imide-forming polymer is the polymeric reaction product of pyromellitic dianhydride and an aromatic primary diamine.
4. The method of claim 1 wherein the imide-forming polymer is the polymeric reaction product of monoacid halide trimellitic dianhydride and an aromatic primary diamine.
5. A method for splicing boron filaments which comprises:
1. bringing the ends to be spliced into a proximate position with respect to each other,
2. applying an imide-forming polymer solution to the ends to be spliced, and 2. curing the imlde-forming polymer to a thermally stable polyimide, wherein the curing of the imide-forming polymer is initiated by igniting the solvent in the imide forming polymer solution.
6. The method of claim 5 wherein the imide-forming polymer is the polymeric reaction product of benzophenone tetracarboxylic acid dianhydride and an aromatic primary diamine.
7. The method of claim 5 wherein the imide-forming polymer is the polymeric reaction product of pyromellitic dianhydride and an aromatic primary diamine.
8. The method of claim 5 wherein the imide-forming polymer is the polymeric reaction product of monoacid halide trimellitic dianhydride and an aromatic primary diamine.
Claims (11)
- 2. applying an imide-forming polymer solution to the ends to be spliced,
- 2. The method of claim 1 wherein the imide-forming polymer is the polymeric reaction product of benzophenone tetracarboxylic acid dianhydride and an aromatic primary diamine.
- 2. applying an imide-forming polymer solution to the ends to be spliced, and
- 2. curing the imide-forming polymer to a thermally stable polyimide, wherein the curing of the imide-forming polymer is initiated by igniting the solvent in the imide-forming polymer solution.
- 3. The method of claim 1 wherein the imide-forming polymer is the polymeric reaction product of pyromellitic dianhydride and an aromatic primary diamine.
- 3. curing the imide-forming polymer to a thermally stable polyimide wherein the curing of the imide-forming polymer is initiated by igniting the solvent in the imide-forming polymer solution.
- 4. The method of claim 1 wherein the imide-forming polymer is the polymeric reaction product of monoacid halide trimellitic dianhydride and an aromatic primary diamine.
- 5. A method for splicing boron filaments which comprises:
- 6. The method of claim 5 wherein the imide-forming polymer is the polymeric reaction product of benzophenone tetracarboxylic acid dianhydride and an aromatic primary diamine.
- 7. The method of claim 5 wherein the imide-forming polymer is the polymeric reaction product of pyromellitic dianhydride and an aromatic primary diamine.
- 8. The method of claim 5 wherein the imide-forming polymer is the polymeric reaction product of monoacid halide trimellitic dianhydride and an aromatic primary diamine.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US69479168A | 1968-01-02 | 1968-01-02 |
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US3607507A true US3607507A (en) | 1971-09-21 |
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ID=24790294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US694791A Expired - Lifetime US3607507A (en) | 1968-01-02 | 1968-01-02 | Novel splicing method |
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US (1) | US3607507A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3716396A (en) * | 1970-04-21 | 1973-02-13 | K Shirano | Process for producing polyesters of improved rubber adhesion and product |
US4428992A (en) | 1981-11-21 | 1984-01-31 | Hitco | Method of splicing reinforcement fiber |
US4814028A (en) * | 1986-11-12 | 1989-03-21 | Yazaki Corporation | Method of forming filled protective sheath on coupled wire conductors |
US4822434A (en) * | 1986-07-10 | 1989-04-18 | Yazaki Corporation | Method for forming cover layer over wire joint |
US5610785A (en) * | 1993-07-16 | 1997-03-11 | International Business Machines Corporation | Head suspension assembly and its manufacturing method |
US6262555B1 (en) | 1998-10-02 | 2001-07-17 | Robicon Corporation | Apparatus and method to generate braking torque in an AC drive |
FR2959443A1 (en) * | 2010-04-29 | 2011-11-04 | Messier Dowty Sa | Method for splicing strands of fibers e.g. glass fibers, utilized in fabrication of braided/woven preforms, involves pressing and heating thermoactivable binder so as to form sectioned sleeves that completely cover free ends around strands |
US20160033199A1 (en) * | 2014-07-29 | 2016-02-04 | Hitachi Metals, Ltd. | Method and apparatus for manufacturing enameled wire |
EP3747810A1 (en) * | 2019-06-06 | 2020-12-09 | Georg Sahm GmbH & Co. KG | Method for joining strips, strip joining device, processing system and use of same |
RU2807195C2 (en) * | 2019-06-06 | 2023-11-10 | Георг Зам Гмбх Унд Ко. Кг | Method of connecting tape, device for connecting tape, processing system and use |
-
1968
- 1968-01-02 US US694791A patent/US3607507A/en not_active Expired - Lifetime
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3716396A (en) * | 1970-04-21 | 1973-02-13 | K Shirano | Process for producing polyesters of improved rubber adhesion and product |
US4428992A (en) | 1981-11-21 | 1984-01-31 | Hitco | Method of splicing reinforcement fiber |
US4822434A (en) * | 1986-07-10 | 1989-04-18 | Yazaki Corporation | Method for forming cover layer over wire joint |
US4814028A (en) * | 1986-11-12 | 1989-03-21 | Yazaki Corporation | Method of forming filled protective sheath on coupled wire conductors |
US5610785A (en) * | 1993-07-16 | 1997-03-11 | International Business Machines Corporation | Head suspension assembly and its manufacturing method |
US5809635A (en) * | 1993-07-16 | 1998-09-22 | International Business Machines Corporation | Method for fixedly attaching covered wires to a head suspension load beam |
US6262555B1 (en) | 1998-10-02 | 2001-07-17 | Robicon Corporation | Apparatus and method to generate braking torque in an AC drive |
FR2959443A1 (en) * | 2010-04-29 | 2011-11-04 | Messier Dowty Sa | Method for splicing strands of fibers e.g. glass fibers, utilized in fabrication of braided/woven preforms, involves pressing and heating thermoactivable binder so as to form sectioned sleeves that completely cover free ends around strands |
US20160033199A1 (en) * | 2014-07-29 | 2016-02-04 | Hitachi Metals, Ltd. | Method and apparatus for manufacturing enameled wire |
US10670335B2 (en) * | 2014-07-29 | 2020-06-02 | Hitachi Metals, Ltd. | Method and apparatus for manufacturing enameled wire |
EP3747810A1 (en) * | 2019-06-06 | 2020-12-09 | Georg Sahm GmbH & Co. KG | Method for joining strips, strip joining device, processing system and use of same |
WO2020245119A2 (en) | 2019-06-06 | 2020-12-10 | Georg Sahm Gmbh & Co. Kg | Method for connecting strips, strip connecting device, processing system and use |
WO2020245119A3 (en) * | 2019-06-06 | 2021-02-18 | Georg Sahm Gmbh & Co. Kg | Method for connecting strips, strip connecting device, processing system and use |
RU2807195C2 (en) * | 2019-06-06 | 2023-11-10 | Георг Зам Гмбх Унд Ко. Кг | Method of connecting tape, device for connecting tape, processing system and use |
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