US3529130A - Coated configuration and method for prevention of vaporization splattering of thin film surfaces - Google Patents

Coated configuration and method for prevention of vaporization splattering of thin film surfaces Download PDF

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Publication number
US3529130A
US3529130A US732269A US73226968A US3529130A US 3529130 A US3529130 A US 3529130A US 732269 A US732269 A US 732269A US 73226968 A US73226968 A US 73226968A US 3529130 A US3529130 A US 3529130A
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US
United States
Prior art keywords
tungsten
filaments
splattering
thin film
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US732269A
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English (en)
Inventor
Rudolph A Cola
Johannes F Gerber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Priority to US732269A priority Critical patent/US3529130A/en
Priority to FR1603911D priority patent/FR1603911A/fr
Priority to GB1230956D priority patent/GB1230956A/en
Priority to DE1926927A priority patent/DE1926927C3/de
Application granted granted Critical
Publication of US3529130A publication Critical patent/US3529130A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y10T428/2958—Metal or metal compound in coating

Definitions

  • One of the well-known techniques for applying such thin films to substrates is through evaporation of certain metals which are used for printed circuitry, for example.
  • a technique for the evaporation of such metals involves conductive heating of the metal through resistance heat ing of tungsten wires. These tungsten wires or filaments may be helically wrapped around a central core of the metal or alloy to be evaporated.
  • One of the problems in this technique is the tendency of the metal evaporated by the tungsten wire to splatter globules of the metal onto the substrate. If the metal being evaporated is a nickel-iron alloy, for example, these globules may range in size and diameter from .2 to mils.
  • Such globules may even cause a glass substrate to crack, but in any event they reduce the quality of the product both mechanically and electronically. Mechanically they often make it diflicult to maintain the stringent spacing requirements between laminants of a printed circuit assembly. It is, of course, apparent that if the thin film surface is to be used for the application of magnetic information that such globules, or sputter balls, as they are called, interfere with the high packing density of magnetic information.
  • the tungsten wire contains very small quantities of graphite entrapped in the grain boundaries or pockets immediately under the surface of the wire. Nickel in its liquid phase tends to attack the tungsten along its grain boundaries. As the nickel gets access to the pockets of graphite by grain-boundary penetration bubbles of gasses form which sometimes rupture to produce sputter balls.
  • FIG. 1 shows a schematic cross section of a core wire to be evaporated surrounded by six spirally wrapped tungsten filaments having on the outer surfaces thereof a refractory coating;
  • FIG. 2 shows a schematic cross section of the assembly of FIG. 1 wherein the core is molten through resistive heating of the tungsten filaments.
  • tungsten wires (.025" OD) are helically wrapped in tangential relationship around a central core wire .025 OD) composed of 83% nickel and 17% iron, commonly referred to under the trade name of Permalloy.
  • a non-wetting agent can be applied to the external surfaces of the tungsten wire baflle and thereby prevent such creeping of the molten alloy around the surfaces of the tungsten filaments.
  • Such a non-wetting agent must be insoluble in the molten metal or alloy and remain stable in the temperatures to which the surfaces of the tungsten wires rise during such evaporation operations.
  • the surfaces of the tungsten filaments reach temperatures of 2000 C. for relatively short periods, for instance, less than one minute.
  • the evaporant is nickel-iron
  • aluminum oxide has been found to exhibit excellent non-wetting properties when in contact with molten nickel-iron.
  • the external surfaces of the tungsten filaments are lightly sprayed with high purity aluminum oxide utilizing methyl alcohol as a carrier.
  • aluminum oxide is sold by the Linde Division of Union Carbide Corporaation under the trade designation of Linde type .058.
  • Plasma spray a technique for spraying the aluminum oxide coating onto the surface of the tungsten without oxidizing the metal.
  • One such excellent technique is called plasma spray.
  • nickel-iron evaporant Although aluminum oxide was found to give excellent results with a nickel-iron evaporant, other oxides such as beryllium oxide and zirconium oxide may be used. Other metal evaporants such as aluminum and nickel also exhibit tendencies to splatter and their vaporization can be similarly controlled by applicants discovery.
  • a method for preventing the splattering of globules of the metal of said wire on the substrate comprising the steps of spirally wrapping a plurality of resistively heatable filaments in tangential relationship about the surface of such metallic Wire to be evaporated to form an assembly, and coating the outer surfaces of such assembly with an agent, said agent being insoluble and non-Wetting with respect to the metal of the wire in its molten state and thermally stable in the range of temperature of the filament under heat.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
US732269A 1968-05-27 1968-05-27 Coated configuration and method for prevention of vaporization splattering of thin film surfaces Expired - Lifetime US3529130A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US732269A US3529130A (en) 1968-05-27 1968-05-27 Coated configuration and method for prevention of vaporization splattering of thin film surfaces
FR1603911D FR1603911A (https=) 1968-05-27 1968-12-24
GB1230956D GB1230956A (https=) 1968-05-27 1969-05-21
DE1926927A DE1926927C3 (de) 1968-05-27 1969-05-27 Vorrichtung und Verfahren zum Verhindern des Verspratzens von Metall beim Aufdampfen dünner Metallschichten, sowie Verfahren zur Herstellung dieser Vorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US732269A US3529130A (en) 1968-05-27 1968-05-27 Coated configuration and method for prevention of vaporization splattering of thin film surfaces

Publications (1)

Publication Number Publication Date
US3529130A true US3529130A (en) 1970-09-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
US732269A Expired - Lifetime US3529130A (en) 1968-05-27 1968-05-27 Coated configuration and method for prevention of vaporization splattering of thin film surfaces

Country Status (4)

Country Link
US (1) US3529130A (https=)
DE (1) DE1926927C3 (https=)
FR (1) FR1603911A (https=)
GB (1) GB1230956A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113249688A (zh) * 2021-04-16 2021-08-13 杭州电子科技大学 一种适用于真空环境下的金属纳米材料蒸着装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3068337A (en) * 1958-12-05 1962-12-11 Gen Electric Vaporizer and method for making the same
US3231715A (en) * 1963-03-18 1966-01-25 Ultek Corp Filament for evaporating reactive metal in high vacuum apparatus
US3330938A (en) * 1966-03-14 1967-07-11 Charles G Fossati Metallizing apparatus
US3344768A (en) * 1965-08-30 1967-10-03 Burroughs Corp Powder evaporation apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3068337A (en) * 1958-12-05 1962-12-11 Gen Electric Vaporizer and method for making the same
US3231715A (en) * 1963-03-18 1966-01-25 Ultek Corp Filament for evaporating reactive metal in high vacuum apparatus
US3344768A (en) * 1965-08-30 1967-10-03 Burroughs Corp Powder evaporation apparatus
US3330938A (en) * 1966-03-14 1967-07-11 Charles G Fossati Metallizing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113249688A (zh) * 2021-04-16 2021-08-13 杭州电子科技大学 一种适用于真空环境下的金属纳米材料蒸着装置及方法
CN113249688B (zh) * 2021-04-16 2024-03-22 杭州电子科技大学 一种适用于真空环境下的金属纳米材料蒸着装置及方法

Also Published As

Publication number Publication date
DE1926927A1 (de) 1969-12-04
DE1926927B2 (de) 1974-12-05
FR1603911A (https=) 1971-06-14
DE1926927C3 (de) 1975-07-10
GB1230956A (https=) 1971-05-05

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Owner name: BURROUGHS CORPORATION

Free format text: MERGER;ASSIGNORS:BURROUGHS CORPORATION A CORP OF MI (MERGED INTO);BURROUGHS DELAWARE INCORPORATEDA DE CORP. (CHANGED TO);REEL/FRAME:004312/0324

Effective date: 19840530