US3373113A - Process for etching copper printed circuits - Google Patents

Process for etching copper printed circuits Download PDF

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Publication number
US3373113A
US3373113A US480750A US48075065A US3373113A US 3373113 A US3373113 A US 3373113A US 480750 A US480750 A US 480750A US 48075065 A US48075065 A US 48075065A US 3373113 A US3373113 A US 3373113A
Authority
US
United States
Prior art keywords
etching
printed circuits
copper
printed
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US480750A
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English (en)
Inventor
Achenbach Karl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FMC Corp
Original Assignee
FMC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FMC Corp filed Critical FMC Corp
Application granted granted Critical
Publication of US3373113A publication Critical patent/US3373113A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Definitions

  • the present invention concerns a process for etching the portions of the copper printed circuits which are not protected by printing ink.
  • an insulating backing is first provided with a copper coating 35 or 70 m. thick which is then printed with an etch resistant printing ink on the portions which should be retained as conductor lines after the etching.
  • the etching is effected by spraying the printed plates with an etching liquid or by dipping such printed plates in an etching bath in order to dissolve the copper which is not protected by the printed resist.
  • Usual etching liquids are strong mineral acids such as H 80, and HNO;,, as well as chromic acid, iron chloride or ammonium persulfate solutions.
  • H 80, and HNO mineral acids
  • chromic acid iron chloride or ammonium persulfate solutions.
  • the use of such solutions entail certain disadvantages.
  • ammonium persulfate While several disadvantages could be avoided by the use of ammonium persulfate, its use still has several drawbacks. As ammonium persulfate only attacks the copper slowly, it is necessary to add activators or the solution is activated with heat. In spite of this the etching periods necessary, even though not very great, are still longer than those required for iron chloride. Ammonium persulfate solutions can only effectively be used in a concentration range of 150 to 250 g./liter of water.
  • H O activated mineral acid baths
  • the essence of the process according to the invention resides in the use of aqueous H O, containing mineral acid solutions which in addition contain phosphoric acid, as stabilizer, for the etching of printed circuits.
  • a process for etching printed copper circuits which comprises contacting the printed copper circuit with an aqueous etching solution of a mineral acid selected from the group consisting of sulfuric acid and nitric acid containing H O, as an activator for the mineral acid, the step of incorporating an effective stabilizing amount of H PO, as a stabilizer for the H 0 in said aqueous etching solution.
US480750A 1964-08-22 1965-08-18 Process for etching copper printed circuits Expired - Lifetime US3373113A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED45263A DE1253008B (de) 1964-08-22 1964-08-22 Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten Schaltungen

Publications (1)

Publication Number Publication Date
US3373113A true US3373113A (en) 1968-03-12

Family

ID=7048878

Family Applications (1)

Application Number Title Priority Date Filing Date
US480750A Expired - Lifetime US3373113A (en) 1964-08-22 1965-08-18 Process for etching copper printed circuits

Country Status (6)

Country Link
US (1) US3373113A (de)
BE (1) BE668423A (de)
DE (1) DE1253008B (de)
FR (1) FR1442848A (de)
GB (1) GB1063007A (de)
NL (1) NL6510928A (de)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864271A (en) * 1972-12-04 1975-02-04 Du Pont Stabilized acidic hydrogen peroxide solutions
US3869401A (en) * 1972-12-04 1975-03-04 Du Pont Stabilized acidic hydrogen peroxide solutions
US3892833A (en) * 1972-11-10 1975-07-01 Matsushita Electric Ind Co Ltd Method of making an ion-selective electrode
US3905907A (en) * 1972-12-22 1975-09-16 Furukawa Electric Co Ltd Solutions for chemical dissolution treatment of metal materials
US3953263A (en) * 1973-11-26 1976-04-27 Hitachi, Ltd. Process for preventing the formation of nitrogen monoxide in treatment of metals with nitric acid or mixed acid
US4051001A (en) * 1974-08-26 1977-09-27 Hitachi, Ltd. Process for regenerating etching solution
US4356069A (en) * 1981-03-09 1982-10-26 Ross Cunningham Stripping composition and method for preparing and using same
US4401509A (en) * 1982-09-07 1983-08-30 Fmc Corporation Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide
US4491500A (en) * 1984-02-17 1985-01-01 Rem Chemicals, Inc. Method for refinement of metal surfaces
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
EP0079505B1 (de) * 1981-10-29 1987-02-04 LeaRonal, Inc. Verfahren zur Wiedergewinnung von Kupfer aus den verbrauchten Ätzlösungen
EP0387057A1 (de) * 1989-03-08 1990-09-12 Tokai Denka Kogyo Kabushiki Kaisha Mittel zur Oberflächenbehandlung von Kupfer oder Kupferlegierungen
US5362712A (en) * 1990-08-17 1994-11-08 Hoechst Aktiengesellschaft Process for removing a copper mold from a molded body
US5364549A (en) * 1989-10-05 1994-11-15 Interox Chemicals Limited Hydrogen peroxide solutions

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2923608A (en) * 1956-04-13 1960-02-02 Fmc Corp Method of improving the bonding properties of steel surfaces
US2978301A (en) * 1957-01-11 1961-04-04 Fmc Corp Process and composition for the dissolution of copper
US2982625A (en) * 1957-03-22 1961-05-02 Sylvania Electric Prod Etchant and method
GB955000A (en) * 1961-04-13 1964-04-08 Marconi Co Ltd Improvements in or relating to copper etching solutions

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2211400A (en) * 1938-08-10 1940-08-13 Chase Brass & Copper Co Pickling solution for copper-base alloys
US2428804A (en) * 1945-09-07 1947-10-14 Esther M Terry Copper cleaning composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2923608A (en) * 1956-04-13 1960-02-02 Fmc Corp Method of improving the bonding properties of steel surfaces
US2978301A (en) * 1957-01-11 1961-04-04 Fmc Corp Process and composition for the dissolution of copper
US2982625A (en) * 1957-03-22 1961-05-02 Sylvania Electric Prod Etchant and method
GB955000A (en) * 1961-04-13 1964-04-08 Marconi Co Ltd Improvements in or relating to copper etching solutions

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3892833A (en) * 1972-11-10 1975-07-01 Matsushita Electric Ind Co Ltd Method of making an ion-selective electrode
US3864271A (en) * 1972-12-04 1975-02-04 Du Pont Stabilized acidic hydrogen peroxide solutions
US3869401A (en) * 1972-12-04 1975-03-04 Du Pont Stabilized acidic hydrogen peroxide solutions
US3905907A (en) * 1972-12-22 1975-09-16 Furukawa Electric Co Ltd Solutions for chemical dissolution treatment of metal materials
US3953263A (en) * 1973-11-26 1976-04-27 Hitachi, Ltd. Process for preventing the formation of nitrogen monoxide in treatment of metals with nitric acid or mixed acid
US4051001A (en) * 1974-08-26 1977-09-27 Hitachi, Ltd. Process for regenerating etching solution
US4356069A (en) * 1981-03-09 1982-10-26 Ross Cunningham Stripping composition and method for preparing and using same
EP0079505B1 (de) * 1981-10-29 1987-02-04 LeaRonal, Inc. Verfahren zur Wiedergewinnung von Kupfer aus den verbrauchten Ätzlösungen
US4401509A (en) * 1982-09-07 1983-08-30 Fmc Corporation Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
US4491500A (en) * 1984-02-17 1985-01-01 Rem Chemicals, Inc. Method for refinement of metal surfaces
EP0387057A1 (de) * 1989-03-08 1990-09-12 Tokai Denka Kogyo Kabushiki Kaisha Mittel zur Oberflächenbehandlung von Kupfer oder Kupferlegierungen
US5364549A (en) * 1989-10-05 1994-11-15 Interox Chemicals Limited Hydrogen peroxide solutions
US5362712A (en) * 1990-08-17 1994-11-08 Hoechst Aktiengesellschaft Process for removing a copper mold from a molded body

Also Published As

Publication number Publication date
NL6510928A (de) 1966-02-23
DE1253008B (de) 1967-10-26
GB1063007A (en) 1967-03-22
BE668423A (de) 1965-12-16
FR1442848A (fr) 1966-06-17

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