US3255813A - Cooling system for electron discharge devices - Google Patents

Cooling system for electron discharge devices Download PDF

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Publication number
US3255813A
US3255813A US162547A US16254761A US3255813A US 3255813 A US3255813 A US 3255813A US 162547 A US162547 A US 162547A US 16254761 A US16254761 A US 16254761A US 3255813 A US3255813 A US 3255813A
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United States
Prior art keywords
liquid
cooling
anode
space
channel
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Expired - Lifetime
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US162547A
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English (en)
Inventor
Besson Andre
Charles Daniel
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Thales SA
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CSF Compagnie Generale de Telegraphie sans Fil SA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
    • H01J7/24—Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
    • H01J19/74—Cooling arrangements

Definitions

  • the present invention relates to a cooling system for electron discharge devices and, more particularly, to cooling systems with a cooling medium for the anodes of highpower electron tubes which is permit-ted to boil over as it performs its cooling function.
  • a cooling system having a boiling cooling medium for anodes of electron tubes of high power in which a relatively thick or massive anode, pierced by channels parallel to the axis thereof and open at the top and at the bottom, is placed within a tank in such a manner that the water which is admitted toward the bottom of the anode no only enters into the channels but also bathes the external wall of the anode up to a cert-ain level corresponding to a partial occupation of the channels by the liquid.
  • the vapor bubbles which form at the contact surface between the anode and the water rise within the portions of the channels left free by the liquid and produce a movement or circulation resulting in-very effective cooling. After the ejection thereof through the top of the channels, the vapor bubbles condense within a vapor chamber and return toward the source of supply of water.
  • the object of the present invention is a cooling device with boiling action that avoids the afore-mentioned inconveniences and shortcomings.
  • a further object of the present invention resides in the provision of a cooling system for an electron discharge device utilizing boiling of the cooling medium which avoids any increase of the capacity of the anode with respect to ground caused by the presence of the cooling system.
  • FIGURE 1 is a longitudinal cross-sectional view of an electron discharge device cooled by a cooling system in accordance with the present invention.
  • FIGURE 2 is a longitudinal cross-secti0nal view through an electron discharge device cooled by a modified embodiment of a cooling system in accordance with the present invention.
  • FIGURE 3 is a schematic showing of a cooling system in accordance with the present invention.
  • FIGURE 4 is a schematic showing of a modified embodiment of a cooling system in accordance with the present invention.
  • the cooling device according to the present invention comprises, in combination, the following features:
  • reference numeral 1 designates therein a highpower electron tube of which the anode 2 is either constituted itself or formed integral with a thick or massive body made of one or several pieces according to any known manufacturing technique, this body being pierced by channels 3 parallel to the axis of the tube and being open at the top and at the bottom whereby these channels constitute the feature (a) of the present invention.
  • these channels are provided with a trans verse cross section which increases in the direction of the circulation of the vapor bubbles, that is, present a flaring in the direction from the input at the bottom to the output at the top.
  • This form offers the advantage of considerably reducing the shocks and violent vibrations which occur when the vapor bubbles formed have the tendency of rapidly disappearing. Additionally, it improves the heat exchange by permitting the bubbles to remain in good'contact with the liquid from which they originate.
  • a vapor chamber 5 constituting the feature (b) of the present invention.
  • the vapor chamber 5 is provided with a vapor evacuation pipe 6.
  • the tightening of the water-tight enclosure delimited by the joint 9 may be effected by a clamping ring 10 and bolts 11.
  • this receptacle or tank as shown in FIGURE 2, is not incompatible with the characteristic of the present invention, for after re-installation of the tube with the tight joint 9, the water intended for the cooling arrives only at the bottom of the anode within the enclosure delimited by this joint 9, whereas the water which remains between the anode 2 and the wall 13 represents only stagnant water without pressure in very small quantity which ends up by evaporating during the operation of the tube.
  • the water supplied to the tube may be: (I) either without pressure, with a level maintained by the tank with constant level such that the water occupies a portion of the length of the channels, the remaining portion thereof being occupied by the vapor or by the emulsion of the liquid entrained by the bubbles; (2) or under pressure, maintained-by a pump of which the output is regulated in such a manner that the water fills entirely the channels but does not fill entirely the vapor chamber above the channels nor the evacuation piping in such a manner that there exists space for the vapor within this chamber and this piping.
  • FIGURES 3 and 4 represent two embodiments of installations corresponding, respectively, to each of these two modes of operation.
  • the rectangle 4 designates schematically a tube according to any one of FIGURES 1 and 2, with water inlet at 8 and vapor evacuation at 6.
  • the pipe 6 is engaged with a sulficient tightness within the piping 14 which conducts the vapor into the cooling condenser 15 from which the water is returned to the cycle through the channel 16.
  • the channel 17 recuperates the condensate which might have formed within the piping 14.
  • the constant level 12 is maintained by a tank 18 with constant level owing to a floating closure member 19 and a feed tank 20.
  • FIGURE 4 in which the same reference numerals designate analogous elements to FIGURE 3, the difference with FIGURE 3 resides in the fact that between the tank 18 and the channel 8 there are arranged a pump 23 and a cooling heat exchanger 22.
  • This pump 23 forces the water across the cooler 22 in such a manner that the water occupies entirely the channels, as shown in FIG- URES l or 2, but does not occupy the entire cross section of the channel 6 to leave space to the vapor.
  • the separation between the water and vapor takes place within the chamber 21, the water returning to the cooling cycle through tank 18 and the heat exchanger 22, whereas the vapor follows the condensation cycle within the condenser 15 and is returned to the cooling cycle through the channel 16.
  • This device which is a cooling system by circulation with boiling notwithstanding, rendered possible by the combination of the tight joint together with channels and vapor chamber according to the present invention, offers the advantage of permitting the flow of water through the channels maintained at very low temperature, for example, lower than 10 C.
  • the circulation of this water with a relatively little significant rate of flow, is necessary in order that the temperature of the liquid within the channels of the anode rises only slightly.
  • the tight joint permits this circulation, and the vapor chamber permits collecting the bubbles which form at the contact between the metal and the water.
  • the use of a liquid at very low temperature for cooling together with boiling permits a considerable increase in the power dissipated per surface unit. For example, if the temperature is lower than 10 C., the dissipation may amount to 1 kilowatt per cm.
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • channel means in said body having open inlet means at the bottom thereof and open outlet means at the top thereof; vapor chamber means in communication with said outlet means; means for feeding cooling liquid to said inlet means to fill the space including said channel means and said chamber means with said liquid up to a predetermined height with the remaining part of said space being normally occupied by vapor produced by boiling on the part of said liquid during operation of said tube; tank means disposed about said body; and liquid-tight seal means disposed about said inlet means to prevent the escape of said liquid to the space surrounding said massive body thereby maintaining said liquid exclusively beneath said massive body whence it can escape normally only through said channel means, said seal means being provided between the inside of said tank means and the liquidfilled space supplied with cooling liquid by said feed means.
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • channel means in said body having open inlet means at the bottom thereof and open outlet means at the top thereof;
  • liquid-tight seal means disposed around said inlet means to prevent the escape of said liquid to the space surrounding said massive body, thereby maintaining said liquid exclusively beneath said massive body;
  • said massive body and said vapor chamber means forming a unitary structure.
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • channel means in said body having open inlet means at the bottom thereof and open outlet means at the top thereof; vapor chamber means in communication with said outlet means; means for feeding cooling liquid to said inlet means to fill the space including said channel means and said chamber means with said liquid up to a predetermined height with the remaining part of said space being normally occupied by vapor produced by boilingof said liquid during operation of said tube including static pressure means for maintaining said liquid substantially at the constant level of said predetermined height within said channel means in the absence of additional pressure means;
  • liquid-tight seal means disposed around said inlet means to prevent the escape of said liquid to the space surrounding said body, thereby maintaining said liquid exclusively beneath said body in a space which, in the direction of normal flow, communicates only with said channel means.
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • channel means in said body having open inlet means at the bottom thereof and open outlet means at the top thereof;
  • a cooling arrangement for electron tube having a massive body as anode comprising in combination:
  • a cooling arrangement for electron tubes having a body as anode comprising in combination:
  • channel means within said body having inlet means at the bottom thereof and outlet means at the top thereof; vapor chamber means in communication with said outlet means; means for feeding cooling liquid to said inlet means to fill the space comprised of said channel means and said chamber means with said liquid up to a predetermined height with the remaining part of said space being normally occupied by vapor produced by boiling of said liquid during operation of said tube;
  • a cooling arrangement for electron tubes having a massive body as anode comprising in combination:
  • channel means in said body having open inlet means at the bottom thereof and open outlet means at the top thereof, said channel means having a progressively increasing cross section in the direction from said inlet means to said outlet means;
  • tank means disposed about said body
  • liquid-tight seal means disposed about said inlet means to prevent the escape of said liquid to the space surrounding said massive body, thereby maintaining said liquid exclusively beneath said massive body away from the lateral surfaces of said massive body, said seal means being provided between the inside of said tank means and the liquid-filled space supplied with cooling liquid by said feed means;
  • said massive body and said vapor chamber means forming a unitary structure.
  • a cooling arrangement for high power electron tubes comprising in combination:
  • a massive elongated anode body having top, bottom and side surfaces;
  • channel means extending longitudinally in said anode body having open inlet means at the bottom surface thereof and open outlet means at the top surface thereof;
  • vapor chamber means in communication with the outlet means of said channel means for collecting vaporized cooling liquid present in said channel means
  • seal means disposed in liquid-tight contact with the bottom surface of said anode body around said inlet means for preventing contact between said cooling liquid and the side surface of said anode body.
  • a cooling arrangement for high power electron tubes comprising in combination:
  • a massive elongated anode body having top, bottom and side surfaces;
  • channel means extending longitudinally in said anode body having open inlet means at the bottom surface thereof and open outlet means at the top surface thereof;
  • vapor chamber means in communication with the outlet means of said channel means for collecting vaporized cooling liquid present in said channel means
  • seal means disposed in liquid-tight contact with the bottom surface of said anode body around said inlet means for preventing contact between said cooling liquid and the side surface of said anode body, the side surface of said anode body being at all times during normal operation in direct contact with the outer atmosphere.

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  • X-Ray Techniques (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
US162547A 1961-01-09 1961-12-27 Cooling system for electron discharge devices Expired - Lifetime US3255813A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR849149A FR1285937A (fr) 1961-01-09 1961-01-09 Perfectionnements aux systèmes de refroidissement avec ébullition des anodes de lampes électroniques de grande puissance

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US3255813A true US3255813A (en) 1966-06-14

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US162547A Expired - Lifetime US3255813A (en) 1961-01-09 1961-12-27 Cooling system for electron discharge devices

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US (1) US3255813A (enrdf_load_stackoverflow)
FR (1) FR1285937A (enrdf_load_stackoverflow)
GB (1) GB950139A (enrdf_load_stackoverflow)
NL (1) NL273314A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375868A (en) * 1965-08-24 1968-04-02 Thomson Houston Comp Francaise Vaporization system having improved feed liquid recirculating means
US3912001A (en) * 1974-03-11 1975-10-14 Gen Electric Water cooled heat sink assembly
US4163471A (en) * 1976-09-30 1979-08-07 Frederic Leder Forced convection heat exchanger for warming articles
US5195577A (en) * 1989-10-26 1993-03-23 Mitsubishi Denki Kabushiki Kaisha Cooling device for power semiconductor switching elements
US5977714A (en) * 1997-04-16 1999-11-02 Adamovski; Victor Isaevich Magnetron anodes having refractory material and cooled by fluid boiling
US20040011506A1 (en) * 2002-04-05 2004-01-22 Michel Langlois Cooling device for an electron tube
US20120012282A1 (en) * 2007-05-15 2012-01-19 Asetek A/S Direct air contact liquid cooling system heat exchanger assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2922608C2 (de) * 1979-06-02 1982-02-25 Kernforschungsanlage Jülich GmbH, 5170 Jülich Spallationsquellentargets, Verfahren zu deren Kühlung und Verwendung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2018163A (en) * 1934-07-14 1935-10-22 Technicraft Engineering Corp Heat exchange apparatus
US2440245A (en) * 1944-03-13 1948-04-27 Standard Telephones Cables Ltd Cooling of high-temperature bodies
US2671658A (en) * 1951-02-14 1954-03-09 Meehanite Metal Corp Metal lined cupola
US2873954A (en) * 1954-06-05 1959-02-17 Telefunken Gmbh Heat exchanger for electric discharge tube
US2935306A (en) * 1951-03-02 1960-05-03 Gen Electric Vapor cooling apparatus for electric discharge devices
US2969957A (en) * 1956-01-10 1961-01-31 Thomson Houston Comp Francaise Electric discharge device cooling systems

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2018163A (en) * 1934-07-14 1935-10-22 Technicraft Engineering Corp Heat exchange apparatus
US2440245A (en) * 1944-03-13 1948-04-27 Standard Telephones Cables Ltd Cooling of high-temperature bodies
US2671658A (en) * 1951-02-14 1954-03-09 Meehanite Metal Corp Metal lined cupola
US2935306A (en) * 1951-03-02 1960-05-03 Gen Electric Vapor cooling apparatus for electric discharge devices
US2873954A (en) * 1954-06-05 1959-02-17 Telefunken Gmbh Heat exchanger for electric discharge tube
US2969957A (en) * 1956-01-10 1961-01-31 Thomson Houston Comp Francaise Electric discharge device cooling systems

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375868A (en) * 1965-08-24 1968-04-02 Thomson Houston Comp Francaise Vaporization system having improved feed liquid recirculating means
US3912001A (en) * 1974-03-11 1975-10-14 Gen Electric Water cooled heat sink assembly
US4163471A (en) * 1976-09-30 1979-08-07 Frederic Leder Forced convection heat exchanger for warming articles
US5195577A (en) * 1989-10-26 1993-03-23 Mitsubishi Denki Kabushiki Kaisha Cooling device for power semiconductor switching elements
US5977714A (en) * 1997-04-16 1999-11-02 Adamovski; Victor Isaevich Magnetron anodes having refractory material and cooled by fluid boiling
US20040011506A1 (en) * 2002-04-05 2004-01-22 Michel Langlois Cooling device for an electron tube
US6979939B2 (en) * 2002-04-05 2005-12-27 Thales Cooling device for an electron tube
US20120012282A1 (en) * 2007-05-15 2012-01-19 Asetek A/S Direct air contact liquid cooling system heat exchanger assembly

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Publication number Publication date
FR1285937A (fr) 1962-03-02
GB950139A (en) 1964-02-19
NL273314A (enrdf_load_stackoverflow)

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