US3219471A - Process of depositing ferromagnetic compositions - Google Patents
Process of depositing ferromagnetic compositions Download PDFInfo
- Publication number
- US3219471A US3219471A US137965A US13796561A US3219471A US 3219471 A US3219471 A US 3219471A US 137965 A US137965 A US 137965A US 13796561 A US13796561 A US 13796561A US 3219471 A US3219471 A US 3219471A
- Authority
- US
- United States
- Prior art keywords
- cobalt
- ions
- substrate
- hypophosphite
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 21
- 230000008569 process Effects 0.000 title claims description 21
- 238000000151 deposition Methods 0.000 title description 9
- 239000000203 mixture Substances 0.000 title description 3
- 230000005294 ferromagnetic effect Effects 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims description 43
- 229910017052 cobalt Inorganic materials 0.000 claims description 35
- 239000010941 cobalt Substances 0.000 claims description 35
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 35
- -1 HYPOPHOSPHITE IONS Chemical class 0.000 claims description 27
- 230000005291 magnetic effect Effects 0.000 claims description 24
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 22
- 229910001429 cobalt ion Inorganic materials 0.000 claims description 21
- 238000006722 reduction reaction Methods 0.000 claims description 16
- 239000003638 chemical reducing agent Substances 0.000 claims description 15
- 238000013500 data storage Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 11
- 150000002500 ions Chemical class 0.000 claims description 10
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 claims description 9
- 229940005631 hypophosphite ion Drugs 0.000 claims description 9
- 239000000470 constituent Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 32
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000007864 aqueous solution Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 8
- 238000007654 immersion Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005234 chemical deposition Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 5
- 239000001119 stannous chloride Substances 0.000 description 5
- 235000011150 stannous chloride Nutrition 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 239000005041 Mylar™ Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000005415 magnetization Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- IPRHNRJRYOAPLY-UHFFFAOYSA-L [Co++].[O-][PH2]=O.[O-][PH2]=O Chemical compound [Co++].[O-][PH2]=O.[O-][PH2]=O IPRHNRJRYOAPLY-UHFFFAOYSA-L 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- GPUADMRJQVPIAS-QCVDVZFFSA-M cerivastatin sodium Chemical compound [Na+].COCC1=C(C(C)C)N=C(C(C)C)C(\C=C\[C@@H](O)C[C@@H](O)CC([O-])=O)=C1C1=CC=C(F)C=C1 GPUADMRJQVPIAS-QCVDVZFFSA-M 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000001455 metallic ions Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49069—Data storage inductor or core
Definitions
- the present invention relates generally to the process of fabricating magnetic data-storage devices, and more specifically relates to a new and improved process for fabricating magnetic devices of the high density storage type which are readily adaptable for use in present-day electronic computers and data processors.
- a more specific object of the present invention is to devise a new and improved chemical deposition process capable of producing magnetic data-storage devices which possess highly desirable characteristics such as: a magnetic coercivity greater than 200 oersteds; a substantially rectangular magnetic hysteresis loop; and having substantially uniform physical and magnetic properties, in addition to high resistance to physical wear.
- a new and improved process for fabricating new and improved magnetic data-storage devices of the high density storage type comprises the steps of first providing a catalytically active substrate capable of receiving a metallic deposit thereon by the process of chemical reduction. Thereafter, the catalytically active substrate is immersed in a complexed aqueous solution having a pH in the alkaline range and including as essential constituents cobalt and hypophosphite ions.
- the combined concentration of cobalt and hypophosphite ions is maintained substantially constant in the range of 2.0 to 8.2 grams/liter, and, additionally, the ratio of cobalt ion concentration to hypophosphite ion concentration is maintained substantially constant in the range of .2 to 1.7.
- the substrate is maintained in the solution for a time sufficient to effect chemical reduction of a cobalt deposit on the surface thereof having a coercive force of at least 200 oersteds.
- the cobalt coated substrate is thereafter rinsed and dried and is then ready to be incorporated in present day electronic computers and data processors as a data storage device.
- the particular substrate onto which the desired cobalt coating is to be chemically deposited may be any of the various shapes and sizes presently being utilized by the computer industry and may either be metallic or nonmetaliic. However, in order to fabricate a storage device in accordance with applicants intended uses, it is preferred that the substrate be a relatively thin sheet or ribbon of polyethylene terephthalate, commonly sold under the trademark Mylar, having a thickness in the order of 0.003 inch.
- the substrate first be rigorously cleaned by immersion in a one molar concentration sodium hydroxide solution, followed by a thorough rinsing in distilled water, a subsequent immersion in a 1/1 dilution of hydrochloric acid solution, again followed by a thorough rinsing in distilled water, and thereafter thoroughly rinsed in acetone.
- a specific cleaning operation is shown and described, it is, of course, to be appreciated that any of the 3,219,47 i Patented Nov. 23, 1965 well known alkaline-acid cleaning procedures may be used with equal success.
- the substrate next be coated with a suitable commercially available adhesive prior to deposition of metallic cobalt thereon.
- a suitable commercially available adhesive any of the various commercially available adhesives may be used with equal success, it is preferred that the adhesive be prepared by mixing one part of Shipleys No. ZOOTF adhesive, currently manufactured by the Shipley Company, Inc., of Wellesley, Massachusetts, United States of America, with three parts of methyl ethyl ketone.
- Shipleys No. ZOOTF adhesive is a well-known Buna-N type adhesive consisting essentially of a thermo plastic base of nitrile-rubber and a small amount of a phenolic thermosetting resin.
- the substrate is then dipped into the adhesive solution and slowly withdrawn at a rate of approximately 0.33 inch/second, then air dried for approximately 30 minutcs, and thereafter cured for approximately 10 hours at a temperature of approximately degrees centigrade.
- the particular manner of applying the adhesive coating to the supporting substrate is not critical; the only restriction is that the adhesive coating be uniformly distributed on the surface thereof.
- chemical reduction of metallic ions is essentially a controlled autocatalytic reduction process of the depositing species on an active metal such as aluminum, iron, nickel, cobalt, palladium, and the like, in the presence of hypophosphite ions; non-active metals such as copper and alloys thereof are normally activated by immersion deposition of palladium onto the depositing surface thereof.
- active metal such as aluminum, iron, nickel, cobalt, palladium, and the like
- non-active metals such as copper and alloys thereof are normally activated by immersion deposition of palladium onto the depositing surface thereof.
- non-conducting materials such as the mentioned Mylar activation is normally accomplished by chemical or vacuum deposition thereon of either a copper or a silver film, followed by immersion deposition of palladium onto the surface of the film.
- the substrate be activated by first being immersed in a stannous chloride solution whereby stannous ions are adsorbed on the surface thereof. Thereafter, the substrate is immersed in a palladium chloride solution whereby the palladium ions in solution are spontaneously reduced by the adsorbed stannous ions, thereby rendering the substrate catalytical- 1y active.
- the adhesive coated Mylar substrate be activated by immersion for a period of ap proximately 5 minutes in a 20 gram/liter aqueous stannous chloride solution containing approximately 10 milliliters/ liter of concentrated hydrochloride acid, with the temperature of the stannous chloride solution being maintained substantially constant at approximately 25 degrees centigrade. Thereafter, the substrate is immersed for a period of approximately 5 minutes in an aqueous palladium chloride solution having a concentration of approximately 0.5 gram/liter and containing approximately 5 milliliters of concentrated hydrochloric acid per liter of solution, with the temperature of the palladium chloride solution being maintained substantially constant at approximately 25 degrees centigrade.
- the final step in the present process is the immersion of the thus activated substrate in an aqueous solution having constituent concentrations in accordance with the teacl1 ings of the present invention.
- GOC12'6H20 NttHgPOa-HgO, 11 0411 0711 0, NHrOl, Co++, H2PO2 C0++lHgPOr C0+++Hg H0, Br, BS,
- citric acid be utilized in an amount sufli-cient to supply citrate ions in a concentration at least equal to the concentration of cobalt ions utilized, whereby soluble cobalt complexes are formed thereby preventing precipitation of the cobalt ions.
- ammonium ions be present in the plating solution of a concentration at least equal to .3 gram/liter of aqueous solution.
- the operating temperature thereof is maintained substantially constant devices of the high density storage type, comprising the steps of:
- a high density magnetic data-storage device fabricated in accordance with the process of claim 1.
- aqueous solution having a pH in the range of 7 to 9 and including as essential constituents cobalt ions and hypophosphite ions, the combined concentration of said cobalt and hypophosphite ions being in the range of 2.0 to 8.2 grams/ liter and the ratio of cobalt ion concentration to hypophosphite ion concentration being in the range of .2 to 1.7, all the metal plating ions consisting essentially of cobalt and said solution further includ ing ammonium ions in a concentration of at least .3 gram/liter and citrate ions in a concentration at least equal to the concentration of said cobalt ions;
- aqueous solution having a pH approximately 8.2, a temperature approximately 80 degrees centigrade, and ineluding as essential constituents cobalt ions and hypophosphite ions, the combined concentration of said cobalt and hypophosphite ions being approximately 4 grams/liter and the ratio of cobalt ionic concentration to hypophosphite ionic concentration being approximately .9, all the metal plating ions consisting essentially of cobalt and said solution further including ammonium ions in a concentration of at least .3 gram/liter and citrate ions in a concentration at least equal to the cobalt ionic concentration;
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL283192D NL283192A (en)) | 1961-09-14 | ||
US137965A US3219471A (en) | 1961-09-14 | 1961-09-14 | Process of depositing ferromagnetic compositions |
GB27354/62A GB953987A (en) | 1961-09-14 | 1962-07-17 | Aqueous bath solution |
CH1056962A CH405521A (fr) | 1961-09-14 | 1962-09-05 | Bain aqueux pour le dépôt d'un revêtement magnétique |
FR909196A FR1342837A (fr) | 1961-09-14 | 1962-09-12 | Bain aqueux pour le dépôt d'un revêtement magnétique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US137965A US3219471A (en) | 1961-09-14 | 1961-09-14 | Process of depositing ferromagnetic compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
US3219471A true US3219471A (en) | 1965-11-23 |
Family
ID=22479828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US137965A Expired - Lifetime US3219471A (en) | 1961-09-14 | 1961-09-14 | Process of depositing ferromagnetic compositions |
Country Status (4)
Country | Link |
---|---|
US (1) | US3219471A (en)) |
CH (1) | CH405521A (en)) |
GB (1) | GB953987A (en)) |
NL (1) | NL283192A (en)) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3306830A (en) * | 1963-06-13 | 1967-02-28 | Bell Telephone Labor Inc | Printed circuit boards and their fabrication |
US3394023A (en) * | 1967-02-09 | 1968-07-23 | Thin Film Inc | Process for converting water-repellent surfaces of plastic into water-attractive surfaces |
US3466156A (en) * | 1966-12-01 | 1969-09-09 | Ncr Co | Magnetic record members |
US3467540A (en) * | 1966-01-25 | 1969-09-16 | Siemag Siegener Masch Bau | Method of increasing the adhesion of metal to a subsurface |
US3501332A (en) * | 1967-04-28 | 1970-03-17 | Shell Oil Co | Metal plating of plastics |
US3525635A (en) * | 1965-07-01 | 1970-08-25 | Minnesota Mining & Mfg | Magnetic recording media |
US3637471A (en) * | 1969-01-29 | 1972-01-25 | Burroughs Corp | Method of electrodepositing ferromagnetic alloys |
US3953658A (en) * | 1971-12-08 | 1976-04-27 | Hoechst Aktiengesellschaft | Copper coatings on shaped plastic supports |
US4128691A (en) * | 1974-02-21 | 1978-12-05 | Fuji Photo Film Co., Ltd. | Process for the production of a magnetic recording medium |
US9476124B2 (en) * | 2015-01-05 | 2016-10-25 | Lam Research Corporation | Selective deposition and co-deposition processes for ferromagnetic thin films |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6607423A (en)) * | 1965-06-11 | 1966-12-12 | ||
ZA902280B (en) * | 1989-03-29 | 1990-12-28 | Merrell Dow Pharma | Selective adenosine receptor agents |
CA2087473C (en) * | 1990-05-17 | 2001-10-16 | Matthias P. Schriever | Non-chromated oxide coating for aluminum substrates |
US5468307A (en) * | 1990-05-17 | 1995-11-21 | Schriever; Matthias P. | Non-chromated oxide coating for aluminum substrates |
US5551994A (en) * | 1990-05-17 | 1996-09-03 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US5298092A (en) * | 1990-05-17 | 1994-03-29 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US5411606A (en) * | 1990-05-17 | 1995-05-02 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US5472524A (en) * | 1990-05-17 | 1995-12-05 | The Boeing Company | Non-chromated cobalt conversion coating method and coated articles |
US5873953A (en) * | 1996-12-26 | 1999-02-23 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
US6432225B1 (en) | 1999-11-02 | 2002-08-13 | The Boeing Company | Non-chromated oxide coating for aluminum substrates |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2430581A (en) * | 1944-11-29 | 1947-11-11 | Rca Corp | Metallizing nonmetallic bodies |
US2532284A (en) * | 1947-05-05 | 1950-12-05 | Brenner Abner | Cobalt plating by chemical reduction |
US2532283A (en) * | 1947-05-05 | 1950-12-05 | Brenner Abner | Nickel plating by chemical reduction |
GB749824A (en) * | 1951-11-24 | 1956-06-06 | Philips Electrical Ind Ltd | Improvements in or relating to methods of metal-plating non-conductors |
US2917439A (en) * | 1957-01-03 | 1959-12-15 | Liu Hsing | Method for metallizing non-conductive material |
US3041198A (en) * | 1960-10-14 | 1962-06-26 | Philco Corp | Electroless plating process |
US3116159A (en) * | 1960-05-19 | 1963-12-31 | Ncr Co | Process of fabricating magnetic data storage devices |
US3138479A (en) * | 1961-12-20 | 1964-06-23 | Burroughs Corp | Method for the electroless deposition of high coercive magnetic film |
-
0
- NL NL283192D patent/NL283192A/xx unknown
-
1961
- 1961-09-14 US US137965A patent/US3219471A/en not_active Expired - Lifetime
-
1962
- 1962-07-17 GB GB27354/62A patent/GB953987A/en not_active Expired
- 1962-09-05 CH CH1056962A patent/CH405521A/fr unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2430581A (en) * | 1944-11-29 | 1947-11-11 | Rca Corp | Metallizing nonmetallic bodies |
US2532284A (en) * | 1947-05-05 | 1950-12-05 | Brenner Abner | Cobalt plating by chemical reduction |
US2532283A (en) * | 1947-05-05 | 1950-12-05 | Brenner Abner | Nickel plating by chemical reduction |
GB749824A (en) * | 1951-11-24 | 1956-06-06 | Philips Electrical Ind Ltd | Improvements in or relating to methods of metal-plating non-conductors |
US2917439A (en) * | 1957-01-03 | 1959-12-15 | Liu Hsing | Method for metallizing non-conductive material |
US3116159A (en) * | 1960-05-19 | 1963-12-31 | Ncr Co | Process of fabricating magnetic data storage devices |
US3041198A (en) * | 1960-10-14 | 1962-06-26 | Philco Corp | Electroless plating process |
US3138479A (en) * | 1961-12-20 | 1964-06-23 | Burroughs Corp | Method for the electroless deposition of high coercive magnetic film |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3306830A (en) * | 1963-06-13 | 1967-02-28 | Bell Telephone Labor Inc | Printed circuit boards and their fabrication |
US3525635A (en) * | 1965-07-01 | 1970-08-25 | Minnesota Mining & Mfg | Magnetic recording media |
US3467540A (en) * | 1966-01-25 | 1969-09-16 | Siemag Siegener Masch Bau | Method of increasing the adhesion of metal to a subsurface |
US3466156A (en) * | 1966-12-01 | 1969-09-09 | Ncr Co | Magnetic record members |
US3394023A (en) * | 1967-02-09 | 1968-07-23 | Thin Film Inc | Process for converting water-repellent surfaces of plastic into water-attractive surfaces |
US3501332A (en) * | 1967-04-28 | 1970-03-17 | Shell Oil Co | Metal plating of plastics |
US3637471A (en) * | 1969-01-29 | 1972-01-25 | Burroughs Corp | Method of electrodepositing ferromagnetic alloys |
US3953658A (en) * | 1971-12-08 | 1976-04-27 | Hoechst Aktiengesellschaft | Copper coatings on shaped plastic supports |
US4128691A (en) * | 1974-02-21 | 1978-12-05 | Fuji Photo Film Co., Ltd. | Process for the production of a magnetic recording medium |
US9476124B2 (en) * | 2015-01-05 | 2016-10-25 | Lam Research Corporation | Selective deposition and co-deposition processes for ferromagnetic thin films |
Also Published As
Publication number | Publication date |
---|---|
CH405521A (fr) | 1966-01-15 |
NL283192A (en)) | |
GB953987A (en) | 1964-04-02 |
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