US3156635A - Gold plating - Google Patents
Gold plating Download PDFInfo
- Publication number
- US3156635A US3156635A US133301A US13330161A US3156635A US 3156635 A US3156635 A US 3156635A US 133301 A US133301 A US 133301A US 13330161 A US13330161 A US 13330161A US 3156635 A US3156635 A US 3156635A
- Authority
- US
- United States
- Prior art keywords
- gold
- hydrazine
- bath
- cyanide
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- This invention is based on the discovery that it is possible to obtain 24-carat gold deposits essentially free of organic inclusions by employing a gold bath containing potassium gold cyanide and conducting salts consisting of phosphates or phosphites adjusted to a pH of 36. Gold deposition from such solutions proceeds at an efficiency of less than 100 percent resulting in some loss of hydrogen with the result that the phosphorous acidphosphite solution is somewhat more suitable from a buffer standpoint. Polyphosphoric acids may also be used although they gradually convert to orthophosphate.
- the deposits obtained from this solution are not bright, being yellow matte to semi-bright, but they are smooth and of high purity.
- An object of this invention is to provide an acid gold plating bath which is low in organic material so that there is little tendency to codeposit organic compounds with gold.
- a second object of this invention is to provide a gold plating bath which is low in cyanide, thereby minimizing the tendency to build up a concentration of cyanide break-down products in the bath. Obviously, some alkali cyanide will develop in the bath over a period of time, but at a pH of 36 the concentration is maintained at a low value. However, I have found that the introduction of hydrazine or substituted hydrazines tends to prevent this cyanide build-up and to provide improved electrodeposits.
- the hydrazine compounds which may be employed are comprised of the water soluble hydrazine salts which is the sulfate, N H .H SO the hydrochloride, N H .2HCl, etc., the water soluble organic hydrazine, hydrazono, and hydrazo compounds, etc. Approximately /2 to 20 g./l. of the hydrazine or hydrazine compound are satisfactory in preventing the build-up of cyanide products.
- the gold content of the bath is not very critical but very satisfactory deposits are obtained with from 4 to 36 g./l. of soluble gold salt.
- the phosphate or phosphite anions are present in the bath in the proportion of about 5 to 200 g./l.
- the phosphate and phosphate anions may be added to the bath as acids in which case, the pH is adjusted to the range of 36 by the addition of alkali.
- Example 1 A bath of the following composition was prepared:
- Example 2 A bath was made up as follows:
- Brass panels plated in this bath were similar in appearance to those obtained from the phosphoric acid phosphate bath.
- the addition of methyl hydrazine in one case and dimethyl hydrazine in another case gave brighter deposits.
- Potassium phosphite could be substituted for the equivalent amount of KOH and phosphorous acid to make this bath.
- Example 3 A bath was made up according to Example 1, except that only 2 g./l. of gold (as sodium gold cyanide) were added. Satisfactory deposits were obtained up to 0.6 amp/dm. Increasing the phosphate content to 200 g./l. had no observable effect on the deposit, but the voltage drop across the cell was lowered.
- gold sodium gold cyanide
- Example 4 A bath was prepared as follows:
- a plating solution for plating approximately 24k 15 selected from the group consisting of phosphoric, phosphorous and polyphosphoric acid anions,
- a plating solution as claimed in claim 4 comprising 1 to 10 g./l. of hydrazine sulfate.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE620596D BE620596A (en, 2012) | 1961-08-23 | ||
US133301A US3156635A (en) | 1961-08-23 | 1961-08-23 | Gold plating |
GB2261/62A GB928087A (en) | 1961-08-23 | 1962-01-22 | Gold plating |
DES77933A DE1215467B (de) | 1961-08-23 | 1962-02-07 | Bad zum galvanischen Abscheiden 24karaetiger Goldueberzuege |
CH872662A CH399863A (fr) | 1961-08-23 | 1962-07-19 | Procédé pour le dépôt électrolytique d'or et électrolyte pour la mise en oeuvre de ce procédé |
FR906617A FR1331064A (fr) | 1961-08-23 | 1962-08-09 | Procédé pour le dépôt électrolytique d'or et électrolyte pour la mise en oeuvre de ce procédé |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US133301A US3156635A (en) | 1961-08-23 | 1961-08-23 | Gold plating |
Publications (1)
Publication Number | Publication Date |
---|---|
US3156635A true US3156635A (en) | 1964-11-10 |
Family
ID=22457931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US133301A Expired - Lifetime US3156635A (en) | 1961-08-23 | 1961-08-23 | Gold plating |
Country Status (5)
Country | Link |
---|---|
US (1) | US3156635A (en, 2012) |
BE (1) | BE620596A (en, 2012) |
CH (1) | CH399863A (en, 2012) |
DE (1) | DE1215467B (en, 2012) |
GB (1) | GB928087A (en, 2012) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3445352A (en) * | 1966-09-23 | 1969-05-20 | Western Electric Co | Gold electroplating process and solution |
DE2001497B2 (de) | 1969-01-15 | 1973-01-04 | Pmd Chemicals Ltd., Coventry, Warwickshire (Grossbritannien) | Verfahren zur Herstellung eines wäßrigen, galvanischen Goldbades |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4207149A (en) * | 1974-12-04 | 1980-06-10 | Engelhard Minerals & Chemicals Corporation | Gold electroplating solutions and processes |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2176668A (en) * | 1938-02-10 | 1939-10-17 | Int Silver Co | Silver plating process |
US2654702A (en) * | 1948-09-03 | 1953-10-06 | Dow Chemical Co | Electrodepostion of metal from alkaline cyanide bath |
US2812299A (en) * | 1949-05-05 | 1957-11-05 | Birle & Co K G | Electrolytic deposition of gold and gold alloys |
US2978390A (en) * | 1957-07-22 | 1961-04-04 | Bell Telephone Labor Inc | Gold plating solutions |
-
0
- BE BE620596D patent/BE620596A/xx unknown
-
1961
- 1961-08-23 US US133301A patent/US3156635A/en not_active Expired - Lifetime
-
1962
- 1962-01-22 GB GB2261/62A patent/GB928087A/en not_active Expired
- 1962-02-07 DE DES77933A patent/DE1215467B/de active Pending
- 1962-07-19 CH CH872662A patent/CH399863A/fr unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2176668A (en) * | 1938-02-10 | 1939-10-17 | Int Silver Co | Silver plating process |
US2654702A (en) * | 1948-09-03 | 1953-10-06 | Dow Chemical Co | Electrodepostion of metal from alkaline cyanide bath |
US2812299A (en) * | 1949-05-05 | 1957-11-05 | Birle & Co K G | Electrolytic deposition of gold and gold alloys |
US2978390A (en) * | 1957-07-22 | 1961-04-04 | Bell Telephone Labor Inc | Gold plating solutions |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3445352A (en) * | 1966-09-23 | 1969-05-20 | Western Electric Co | Gold electroplating process and solution |
DE2001497B2 (de) | 1969-01-15 | 1973-01-04 | Pmd Chemicals Ltd., Coventry, Warwickshire (Grossbritannien) | Verfahren zur Herstellung eines wäßrigen, galvanischen Goldbades |
Also Published As
Publication number | Publication date |
---|---|
DE1215467B (de) | 1966-04-28 |
BE620596A (en, 2012) | |
CH399863A (fr) | 1965-09-30 |
GB928087A (en) | 1963-06-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |