US2998360A - High-level nickel plating - Google Patents

High-level nickel plating Download PDF

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Publication number
US2998360A
US2998360A US796252A US79625259A US2998360A US 2998360 A US2998360 A US 2998360A US 796252 A US796252 A US 796252A US 79625259 A US79625259 A US 79625259A US 2998360 A US2998360 A US 2998360A
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US
United States
Prior art keywords
nickel
liter
grams
sulfate
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US796252A
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English (en)
Inventor
Eugene N Castellano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seymour Manufacturing Co
Original Assignee
Seymour Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seymour Manufacturing Co filed Critical Seymour Manufacturing Co
Priority to US796252A priority Critical patent/US2998360A/en
Priority to GB5751/60A priority patent/GB887692A/en
Priority to DES67373A priority patent/DE1118564B/de
Application granted granted Critical
Publication of US2998360A publication Critical patent/US2998360A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt

Definitions

  • This invention relates to foundation coatings for bright nickel plating processes, and more particularly the preliminary treatment of metallic surfaces by the electrodeposition of basic nickel foundation layers having a high degree of receptability.
  • particular objective of the present invention is to provide I base nickel layers of inherent receptability to the outer bright nickel coating, thereby eliminating the necessity of a special activation step.
  • the base nickel. layers of the invention are electro lytically deposited from conventional plating baths and have the characteristics of ductility and smoothness'to an exceptional, degree. Compared with the available procedures for producing base nickel coatings, the presently described coatings have substantially higher leveling characteristics and are inherently activated during the depcsiticn processto provide high susceptibility for ,the subsequent application of bright nickel platings.
  • the invention involves the use of an additive comprising compounds of the following formula:
  • R is a hydrocarbon radical, preferably an alkyl group
  • X is an alkali or alkaline earth metal.
  • Compounds of the indicated formula may be prepared by conventional procedures and are commercially available.
  • the preferred compounds employed in the process of the invention are those wherein R is a methyl radical and X is magnesium.
  • Other alkali and alkaline earth metal salts including alkoxy phenolic metal sulfates of the characterized formulation are appropriate and suitable in the practice of the present invention.
  • the amount of the additive employed preferably lies within the range of from about 0.2 to 10 grams per liter based upon the composition of the electrolytic plating bath.
  • the major constituents of the plating bath may be the inorganic nickel sulfate and chloride salts.
  • Nickel sulfate will, in practice, range from 180 to 400 grams/liter, and nickel chloride from 8 to 120 grams/liter of bath solution. This corresponds to a total available nickel content of about 40 to 120 grams/liter in solution.
  • An average composition is 280 grams/liter of the nickel sulfate and 60 grams/liter of the nickel chloride, or a total of about 76 grams/ liter of available nickel.
  • Boric acid concentrations of from 8 to 50 grams/liter are desirable as a buffering agent, with a range of 30 to 50 being generally most suitable. Normally about 45 grams/liter of boric acid is considered to give optimum results.
  • An anti-pitter or wetting agent comprising a sulfuric ester of a normal primary aliphatic alcohol having eight to eighteen carbon atoms in the molecule, such as sodium lauryl sulfate, is also desirably included in the 2,998,360 Patented Aug. 29, 1961 ICC 2 bath. Such anti-pitting agents are disclosed in the prior patent to Waite and Martin, No. 2,254,161. A small amount of this agent, on the order of 0.1 gram/liter, is suitable.
  • the pH of the bath may vary from a low of 3.0 to a high of 4.8 determined electrometrically, and the optimum range here is from 3.8 to 4.8.
  • the process of the invention involves operating at bath temperatures ranging from about 35 to 60 C., with 50f to 55 C. being especially suitable in commercial practice. Cathode current densities of 25 to amperes per sq. ft. are practical in most cases and 50 to 55 amperes per sq. ft. is typical of good operating practice.
  • the nickel coating was applied in accordance with the procedures described above, using similar current densitim, and corresponding improvements are observed.
  • Example 4 Nickel sulfate 300 grams/liter.
  • R0 SOlX wherein R is a lower alkyl radical, and X is selected from the class consisting of alkali and alkaline earth metals.
  • a process for producing high-level base nickel coatings on metal which comprises electrodepositing a base nickel coating from an aqueous acidic solution of at least one nickel salt containing in solution from about 0.2 to about 10 grams per liter of an alkali metal lower alkoxy phenol sulfate.
  • a process for producing high-level base nickel coatings on metal which comprises electrodepositing a base nickel coating from an aqueous acidic solution of at least one nickel salt containing in solution from about 0.2 to about 10 grams per liter of an alkaline earth metal lower alkoxy phenol sulfate.
  • a process for producing high-level base nickel coatings on 'metal which comprises electrodepositing a base nickel coating from an aqueous acidic solution of at least one nickelsalt containing in solution from about 0.2 to about 10 grams per liter of an alkali metal methoxy phenol sulfate.
  • a process for producing high-level base nickel coatings on metal which comprises electrodepositing a base nickel coating from an aqueous acidic solution of at least one nickel salt containing in solution from about 0.2 to about 10 grams per liter of a methoxy phenol magnesium sulfate.
  • An aqueous electrolytic solution for producing inherent high adhesion for bright nickel platings comprising at least one nickel salt in an amount of from 8 to 400 grams per liter and from 0.2 to 10 grams per liter of an additive of the formula R0 SOLX References Cited in the file of this patent UNITED STATES PATENTS Flett Apr. 2, 1940 Haas et al. July 7, 1959

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US796252A 1959-03-02 1959-03-02 High-level nickel plating Expired - Lifetime US2998360A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US796252A US2998360A (en) 1959-03-02 1959-03-02 High-level nickel plating
GB5751/60A GB887692A (en) 1959-03-02 1960-02-18 An electrolytic bath and method for depositing a nickel base on metal
DES67373A DE1118564B (de) 1959-03-02 1960-03-01 Saures galvanisches Nickelbad zum Abscheiden einer Grundschicht auf Metalloberflaechen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US796252A US2998360A (en) 1959-03-02 1959-03-02 High-level nickel plating

Publications (1)

Publication Number Publication Date
US2998360A true US2998360A (en) 1961-08-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
US796252A Expired - Lifetime US2998360A (en) 1959-03-02 1959-03-02 High-level nickel plating

Country Status (3)

Country Link
US (1) US2998360A (de)
DE (1) DE1118564B (de)
GB (1) GB887692A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3089888A (en) * 1961-05-05 1963-05-14 Gen Aniline & Film Corp Sulfates of alkenoxylated butynediol
CN103898565A (zh) * 2013-06-04 2014-07-02 无锡市锡山区鹅湖镇荡口青荡金属制品厂 一种在镁合金笔记本电脑外壳表面电镀镍镀液

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195409A (en) * 1936-07-31 1940-04-02 Nat Aniline & Chem Co Inc Electrodeposition
US2893932A (en) * 1953-08-13 1959-07-07 Dehydag Gmbh Production of metal electrodeposits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195409A (en) * 1936-07-31 1940-04-02 Nat Aniline & Chem Co Inc Electrodeposition
US2893932A (en) * 1953-08-13 1959-07-07 Dehydag Gmbh Production of metal electrodeposits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3089888A (en) * 1961-05-05 1963-05-14 Gen Aniline & Film Corp Sulfates of alkenoxylated butynediol
CN103898565A (zh) * 2013-06-04 2014-07-02 无锡市锡山区鹅湖镇荡口青荡金属制品厂 一种在镁合金笔记本电脑外壳表面电镀镍镀液

Also Published As

Publication number Publication date
DE1118564B (de) 1961-11-30
GB887692A (en) 1962-01-24

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