US2979868A - Lapping device for semiconductor wafers - Google Patents

Lapping device for semiconductor wafers Download PDF

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Publication number
US2979868A
US2979868A US773902A US77390258A US2979868A US 2979868 A US2979868 A US 2979868A US 773902 A US773902 A US 773902A US 77390258 A US77390258 A US 77390258A US 2979868 A US2979868 A US 2979868A
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US
United States
Prior art keywords
lapping
guide
disc
workpieces
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US773902A
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English (en)
Inventor
Emeis Reimer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
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Siemens Corp
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Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
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Publication of US2979868A publication Critical patent/US2979868A/en
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Definitions

  • My invention relates to rotating lapping tables for reducing electric semiconductor elements to a desired small and uniform thickness.
  • the semiconductor element in electric devices such as rectifiers, transistors or photodiodes consist in most cases of a monocrystalline pellet, disc or plate of wafer thickness, for example in the order of tenths of millimeters.
  • Semiconductor wafers of silicon must be particularly thin as compared with germanium, because of the small lifetime of the electric charge carriers.
  • the conventional method of producing semiconductor wafers of the prescribed slight thickness and best possible uniformity is to grind the raw wafers on a twodisc lapping table which has a number of guide discs located between the two lapping discs and provided with gear teeth in meshing engagement with an inner sun gear and an outer orbit gear whose rotation relative to one another causes the guide discs to travel in planetarygear fashion.
  • Such machines leave much to be desired because the guide discs must be just as thin as the semiconductor wafers to be processed and hence are subjected to grinding together with the wafers. This reduces the strength of the gear teeth and renders the guidance progressively unreliable.
  • Each new batch of wafers to be lapped requires the insertion of new planetary guide discs.
  • my invention is based upon the design of a single-disc lapping machine of known type in which several eccentrically mounted guide rings slide under their own weight on the rotating lapping table 'so that the rotary motion of the table imparts rotation to the rings.
  • the material to be processed is distributed within the guide rings as uniformly as possible and is loaded by an elastic intermediate layer, for example a disc of felt.
  • an elastic intermediate layer for example a disc of felt.
  • the entire inserted assembly rotates continuously together with the guide ring about its own axis.
  • the guide rings may have any desired thickness.
  • the lappingtable has a recess in its center so as to form an annular disc, and the guide rings have such a diametric size that they project beyond the inner and outer edge of "the lapping disc; This secures uniform wear of all grinding planes, and any occurringirregularities in the plane or grinding surface are automatically eliminated by the preferred wear of the protruding spots.
  • Each individual guide ring and the workpieces placed therein are guided at the proper location by means of a central shaft. Such guidance however, may also be effective by laterally mounted rollers.
  • a guide body whose bottom side consists mainly of a surface plane on which the workpieces are to be fastened.
  • the guide body also carries several spacer pieces consisting preferably of hard metal such as used for the carbide tips of cutting tools, one of these materials being available under the trade name Widia. The use of such materials prevents excessive wear of the spacer pieces.
  • the guide body is preferably given a circular shape and the same size as the guide ring. The guidance of the body at the proper location can be effected in the same manner as in the known single-disc lapping table described above.
  • a further advantage is achieved by subdividing the guide body into two portions, namely an inner portion which carries the workpieces, and an outer portion which carries the spacer pieces and is displaceable relative tothe inner portion as to axial position or height.
  • the two portions of the guide body are resiliently pressed against each other in the vertical direction and are displaceable relative to each other by means of screw bolts;
  • Fig. 1 is a partial sectional View of the above-mentioned known single-disc lapping machine.
  • Fig. 2 shows a corresponding sectional view of a ma chine according to the invention.
  • Fig. 2a represents in cross section a portion of Fig. 2 on an enlarged scale
  • Fig. 3 is a plan view of a similar but somewhat modified machine.
  • a guide ring 2 glides on a lapping table 3 which rotates about a vertical axis schematically indicated at 4.
  • the wafer workpieces 5 to be grounded are located within the guide ring 2 in uniform distribution and are pressed against the lapping table by a weight 6 placed upon an intermediate disc 7 of felt.
  • the guide ring 2 is kept in proper position by a pivot pin 8 mounted on the stationary machine frame structure.
  • the rotating motion of the lapping table 3 causes the guide ring 2 to rotate about the pivot pin 8.
  • the guide ring 2 projects beyond the outer and inner peripheries of the plane annular top surface of the lapping table 3 and thus affords uniform wear of the planar grinding surfaces.
  • the machine according to the invention shown in Fig. 2 is likewise provided with a single lapping disc 3 rotating about the vertical axis 4 when inoperation.
  • the guiding body for the wafer workpieces'5 comprises an inner portion 11 and an outer portion 12.
  • the waters 5, which preferably are previously lapped on one side thereof, are fastened at their machined side to the planar bottom surface of the inner portion 11, for example by means of an adhesive.
  • the unfinished side of the workpieces 5 rests upon the planar grinding surface of the lapping disc 3.
  • the inner portion 11 and the outer portion 12 of the guiding structure are connected with each other by spring sleeves 13, which press the two portions vertically against each other while centrally located guide pins 14 provide some guidance.
  • the outer ring-shaped portion 12 has an annular planar surface to which a number of spacer pieces 15 are fastened. These pieces consist preferably of hard metal such as mentioned above. 7
  • the adjustment in height between the two portions 11 and 12 of the guide body is effected by means of micrometer screws 16 whose nut portions are fastened, for example by set screws 17, in bores of a shoulder flange on the inner guide portion 11.
  • the counter bearings for the micrometers are formed by respective steel balls 18 mounted in cavities of the outer ring portion 12.
  • three spring sleeves 13 which are likewise uniformly distributed along the periphery of the guide structure as is apparent from Fig. 3.
  • the portions of the guide structure are preferably circular and occupy, in totality, the same place as the guide ring 2 described above with reference to Fig. l.
  • the composite guide body according to Fig. 2 is centrally guided for rotation on a pivot pin 8.
  • the spring sleeve 13 consists of an elongated inner portion 13a which forms the sleeve proper and is fastened in the inner portion 11 of the guide body by means of a screw thread. 7
  • the sleeve further comprises a cap 13b.
  • the spring 13c within the sleeve pushes a washer 13d against a nut 132 on the upper end of the guide pin 14.
  • the guide pin 14 is pressed upwardly and hence also the outer portion 12 of the guide body into which the guide pin 14 is screwed.
  • the top view shown in Fig. 3, illustrating most of the features described above with reference to Fig. 2, represents a modified machine in which the guide structures are not journalled by means of a central pivot but by rollers 20 which engage the outer periphery of the annular portion 11 and keep the guide body in proper rotational position with respect to the lapping table 3.
  • the use of such rollers facilitates mounting the guide structures onto the table or disassembling them therefrom.
  • the rollers 29 are journalled on holder plates 21 which can be adjusted by means of a set screw that passes through an elongated slot 22 and engages a part (not illustrated) firmly joined with the stationary frame-structure of the lapping machine.
  • the planar front face of the inner portion 11 and the free planar sides of the spacer pieces 15 are located in one and the same radial plane.
  • This starting position can be produced with great accuracy by an initial, idle grinding operation.
  • the workpieces consisting of semiconductor wafers that are plane on one side, are fastened at their planar side to the underside of the portion 11, preferably by means of an adhesive.
  • the outer portion 12 is then displaced downwardly by means of V the micrometer screws 16 an amount'corresponding to the prescribed wafer thickness.
  • the micrometer screws 16 are preferably such that they require considerable force for adjustment so that inadvertent displacements are. avoided.
  • the spacer pieces 15 While the semiconductor wafers are ground down to smaller thickness, the spacer pieces 15 ultimately abut against the table surface. When this occurs the prescribed wafer thickness is obtained. Since the spacer pieces are extremely hard, any further reduction in thickness of the workpieces is impeded to such an extent that no excessive reduction need be feared.
  • the engagement of the spacer pieces with the table surface can readily be observed optically. After the occurrence of engagement is observed the lapping operation is preferably continuedfor a short interval of time in order to make certain that all workpieces are machined down to prescribed thickness.
  • the accurately planar shape of the table surface can be preserved by providing the machine at least at one location with a guiding ring 2 with which such machines were originally equipped and of which one is shownin Fig. 1.
  • This guiding ring 2 may run idle or may also be used in the known manner for 'lapping purposes.
  • the lapping table can also be kept in planar condition by inserting between active runs of the machine an idle run in which the original guiding ringsare inserted. in a similar manner, the original planar condi-v tion of the surfaces on portion 11 of the guide body can be reconditioned from time to time by an idle grinding run in which the micrometer screws are set to zero position.
  • Single-disc lapping machine for producing semiconductor wafers of predetermined slight thickness, comprising a lapping disc having a lapping surface and mounted for rotation about a vertical axis, guide ring means disposed eccentrically to said lapping disc surface,
  • said guide ring means comprising a guide body having a planar surface on the underside thereof for receiving said workpieces to be removably fastened thereto, and a plurality of spacer pieces carried by said guide body for spacing said guide body from said lapping disc surface to determine the final lapping thickness of said workpieces, said guide body comprising an inner portion for carrying the workpieces to be lapped and an outer portion for carrying said spacer pieces, biasing means resiliently pressing said inner portion and said outer portion toward each other, and screw means for displacing said outer portion in vheightrelative to said inner portion and relative to said lapping disc surface.
  • said screw 'means comprising 'a micrometer device for measuring and adjusting the relative displacement in height between said inner and outer portions of said guide body and for moving said outer portion relative to said lapping disc surface.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US773902A 1957-11-29 1958-11-14 Lapping device for semiconductor wafers Expired - Lifetime US2979868A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES56076A DE1110544B (de) 1957-11-29 1957-11-29 Einscheiben-Laeppmaschine fuer Halbleiterscheiben

Publications (1)

Publication Number Publication Date
US2979868A true US2979868A (en) 1961-04-18

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ID=7490856

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US773902A Expired - Lifetime US2979868A (en) 1957-11-29 1958-11-14 Lapping device for semiconductor wafers

Country Status (3)

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CH (1) CH366208A (de)
DE (1) DE1110544B (de)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3090169A (en) * 1961-05-11 1963-05-21 Stephen A Boettcher Lapping machine fixture
US3093937A (en) * 1962-11-30 1963-06-18 Cavitron Ultrasonics Inc Ultrasonic lapping machines
US3233370A (en) * 1963-07-19 1966-02-08 Falk Production of parallel lapped surfaces
US3374582A (en) * 1964-12-08 1968-03-26 Speedfam Corp Lapping machine
US3375614A (en) * 1964-12-09 1968-04-02 Speedfam Corp Lapping machine truing ring and fixture
US3388506A (en) * 1964-11-16 1968-06-18 Speedlap Corp Lap limiting fixture means
US3505766A (en) * 1964-12-09 1970-04-14 Speedfam Corp Lapping machine truing ring
US3699722A (en) * 1970-11-23 1972-10-24 Radiation Inc Precision polishing of semiconductor crystal wafers
FR2521895A1 (fr) * 1982-02-23 1983-08-26 Ansermoz Raymond Tasseau multiple pour le rodage, au lapidaire, de pieces en forme de lames minces
US4707948A (en) * 1981-11-27 1987-11-24 Unisys Corp. Float lapping fixture
EP0403287A3 (de) * 1989-06-16 1991-10-23 Shin-Etsu Handotai Company Limited Verfahren zum Polieren von Halbleiterplättchen
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5649849A (en) * 1995-03-24 1997-07-22 Eastman Kodak Company Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface
US5649855A (en) * 1995-01-25 1997-07-22 Nec Corporation Wafer polishing device
US5749771A (en) * 1994-02-22 1998-05-12 Nec Corporation Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost
US5957763A (en) * 1997-09-19 1999-09-28 Speedfam Corporation Polishing apparatus with support columns supporting multiple platform members
US7399217B1 (en) 2007-02-05 2008-07-15 P.R. Hoffman Machine Products Lapping machine
FR2939061A1 (fr) * 2008-12-03 2010-06-04 Lam Plan Systeme de traitement de surface, par effet d'abrasion, de pieces mecaniques, notamment de rodage
US20110223835A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Three-point spindle-supported floating abrasive platen
US20110223838A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Fixed-spindle and floating-platen abrasive system using spherical mounts
US20110223836A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Three-point fixed-spindle floating-platen abrasive system
US20110223837A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Fixed-spindle floating-platen workpiece loader apparatus
CN103962934A (zh) * 2013-01-25 2014-08-06 上海浦东汉威阀门有限公司 一种阀门密封面研磨机
CN107932309A (zh) * 2017-11-20 2018-04-20 西安航天动力测控技术研究所 一种保证安全机构零件装配面精度的自动研磨系统
CN112676947A (zh) * 2020-12-28 2021-04-20 王兆举 一种用于智能平面精磨机中的工件轴自动对接定位机构
US20230182256A1 (en) * 2020-05-15 2023-06-15 Atm Qness Gmbh Laboratory Disk Grinder, Replacement Grinding Disk and Use of a Grinding Disk

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3020805C2 (de) * 1980-06-02 1984-12-13 Buehler Ltd., Evanston, Ill. Einrichtung zum Schleifen eines Körpers mit zwei mit sehr geringem Abstand zueinander verlaufenden ebenen Oberflächen
DE3127182C2 (de) * 1981-07-09 1987-03-19 Michael Grässner KG, 7031 Steinenbronn Einscheibenflachfläppmaschine
DE9015026U1 (de) * 1990-10-31 1991-02-07 Spinner GmbH Elektrotechnische Fabrik, 8000 München Poliervorrichtung für LWL-Steckerstifte

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2722089A (en) * 1952-04-18 1955-11-01 Crane Packing Co Method of and apparatus for lapping articles
US2842906A (en) * 1955-10-26 1958-07-15 Lyle E Carter Work holder for lapping machine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2412306A (en) * 1944-08-25 1946-12-10 Western Electric Co Lapping apparatus
US2779139A (en) * 1952-11-24 1957-01-29 Crane Packing Co Lapping machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2722089A (en) * 1952-04-18 1955-11-01 Crane Packing Co Method of and apparatus for lapping articles
US2842906A (en) * 1955-10-26 1958-07-15 Lyle E Carter Work holder for lapping machine

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3090169A (en) * 1961-05-11 1963-05-21 Stephen A Boettcher Lapping machine fixture
US3093937A (en) * 1962-11-30 1963-06-18 Cavitron Ultrasonics Inc Ultrasonic lapping machines
US3233370A (en) * 1963-07-19 1966-02-08 Falk Production of parallel lapped surfaces
US3388506A (en) * 1964-11-16 1968-06-18 Speedlap Corp Lap limiting fixture means
US3374582A (en) * 1964-12-08 1968-03-26 Speedfam Corp Lapping machine
US3375614A (en) * 1964-12-09 1968-04-02 Speedfam Corp Lapping machine truing ring and fixture
US3505766A (en) * 1964-12-09 1970-04-14 Speedfam Corp Lapping machine truing ring
US3699722A (en) * 1970-11-23 1972-10-24 Radiation Inc Precision polishing of semiconductor crystal wafers
US4707948A (en) * 1981-11-27 1987-11-24 Unisys Corp. Float lapping fixture
FR2521895A1 (fr) * 1982-02-23 1983-08-26 Ansermoz Raymond Tasseau multiple pour le rodage, au lapidaire, de pieces en forme de lames minces
EP0403287A3 (de) * 1989-06-16 1991-10-23 Shin-Etsu Handotai Company Limited Verfahren zum Polieren von Halbleiterplättchen
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5749771A (en) * 1994-02-22 1998-05-12 Nec Corporation Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5649855A (en) * 1995-01-25 1997-07-22 Nec Corporation Wafer polishing device
US5649849A (en) * 1995-03-24 1997-07-22 Eastman Kodak Company Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface
US5957763A (en) * 1997-09-19 1999-09-28 Speedfam Corporation Polishing apparatus with support columns supporting multiple platform members
US6001005A (en) * 1997-09-19 1999-12-14 Speedfam Corporation Polishing apparatus
US7399217B1 (en) 2007-02-05 2008-07-15 P.R. Hoffman Machine Products Lapping machine
US20080188166A1 (en) * 2007-02-05 2008-08-07 Godshall Mark A Lapping machine
FR2939061A1 (fr) * 2008-12-03 2010-06-04 Lam Plan Systeme de traitement de surface, par effet d'abrasion, de pieces mecaniques, notamment de rodage
US8328600B2 (en) 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
US20110223838A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Fixed-spindle and floating-platen abrasive system using spherical mounts
US20110223836A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Three-point fixed-spindle floating-platen abrasive system
US20110223837A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Fixed-spindle floating-platen workpiece loader apparatus
US20110223835A1 (en) * 2010-03-12 2011-09-15 Duescher Wayne O Three-point spindle-supported floating abrasive platen
US8500515B2 (en) 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8602842B2 (en) 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8647171B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
US8740668B2 (en) 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
CN103962934A (zh) * 2013-01-25 2014-08-06 上海浦东汉威阀门有限公司 一种阀门密封面研磨机
CN107932309A (zh) * 2017-11-20 2018-04-20 西安航天动力测控技术研究所 一种保证安全机构零件装配面精度的自动研磨系统
US20230182256A1 (en) * 2020-05-15 2023-06-15 Atm Qness Gmbh Laboratory Disk Grinder, Replacement Grinding Disk and Use of a Grinding Disk
CN112676947A (zh) * 2020-12-28 2021-04-20 王兆举 一种用于智能平面精磨机中的工件轴自动对接定位机构

Also Published As

Publication number Publication date
CH366208A (de) 1962-12-15
DE1110544B (de) 1961-07-06

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