US2873234A - Electrodeposition of copper - Google Patents
Electrodeposition of copper Download PDFInfo
- Publication number
- US2873234A US2873234A US666766A US66676657A US2873234A US 2873234 A US2873234 A US 2873234A US 666766 A US666766 A US 666766A US 66676657 A US66676657 A US 66676657A US 2873234 A US2873234 A US 2873234A
- Authority
- US
- United States
- Prior art keywords
- copper
- selenium
- cyanide
- baths
- bright
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
Definitions
- This invention relates to electroplating of copper and more particularly to the electrodeposition of bright copper plates.
- Electrodeposited copper is widely used as a decorative finish and also as an undercoat for subsequent electrodeposits such as nickel baths acceptacle to industry are desirably economic, stable, easy to maintain, and should have good plating characteristics.
- Alkaline-cyanide type baths are widely used because of their relatively high plating speeds, excellent throwing power, and ease of maintenance. Alkaline-cyanide electroplating baths, and processes are described in Modern Electroplating, edited by A. G. Gray, pages 194-225 (1953).
- Another object of the invention is to provide bath compositions of the alkaline-cyanide type from which bright copper plate is electrodeposited.
- Still another object of the invention is to provide compositions of matter which, when dissolved in water, yield alkaline-cyanide electrolytes suitable for the electrodeposition of bright copper electrodeposits.
- the invention contemplates-elem trodepositing copper from an alkaline-cyanide copper plating bath containing a small but effective amount of a compound having the general formula (herein referred to as a selenium bisdithiocarbamate), wherein R and R may be the same or different and are selected from the class consisting of hydrogen and alkyl hydrocarbon groups having up to 6 carbon atoms in the group.
- R and R within the scope of the invention include hydrogen and alkyl groups such as methyl, ethyl, propyl, butyl, amyl and hexyl, and the branched as well as the straight chain groups.
- the R and R groups may be replaced with a single alkyl cyclic compound, which may be viewed as a joinder of the R and R groups and include compounds having a total of to 7 carbon atoms in the ring.
- Selenium bisdiethyldithiocarbamate is the preferred additive.
- Electroplatingt 2 Conventional alkaline-cyanide baths and process conditions for electrodeposition are utilized in the present invention. Typical baths and process are illustrated in the table below: a
- potassium salts noted in the table which are preferred, may be partially or completely replaced by sodium salts.
- the copper electrodeposits obtained from baths utilizing selenium bisdithiocarbamate additions are substantially mirror bright.
- the electrodeposits prepared from the selenium bisdithiocarbamate-containing baths may be obtained in an even brighter condition by utilizing auxiliary or cooperating brightening additives in conjunction with the primary selenium bisdithiocarbamate.
- auxiliary additives include relatively small amounts of salts of lead, bismuth, antimony, or zinc, e. g., lead acetate, bismuth citrate, potassium antimony tartrate, zinc chloride, zinc sulfate, etc.
- the alkaline-cyanide baths utilized should preferably contain a compound selected from the class consisting of the alkali metal tartrates, citrates, gluconates, and saccharates to improve current efiiciencies.
- wetting agents of the kind generally used in alkaline-cyanide copper electroplating baths are preferably incorporated in the baths. These include quaternary amine wetting agents such as C-decylbetaine and the ammonium hydroxide derivatives such as trimethylbenzylammonium chloride.
- the above compounds, marketed under the trade name Deriphats are used-in concentrations of 0.01 to 0.1 gram per liter. They are stable in the electrolyte and even impart some brightening action.
- a compound of this class which has been successfully used is the sodium salt of a coconut alcohol derivative of fl-amino propionate, designated as Deriphat 151.
- the selenium acts as a non-metal, the compounds being analogues of sulphur and/or oxygen-containing compounds, i. e., the selenium atoms were essentially non-metallic in nature.
- An alkyline-cyanide bath for bright copper plating comprising copper cyanide and, as a brightening agent more than 0.001 g./1. of at least one selenium bisdithiocarbarnate having the general formula:
- a bath solution according to claim 1 which also contains an alkali metal gluconate.
- a bath solution according to claim 1 which also contains an alkali metal saccharate.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DENDAT1072449D DE1072449B (de) | 1957-06-19 | Cyanidisches Bad zum galvanischen Abscheiden von g'änzenden Kupferüberzügen | |
US666784A US2873235A (en) | 1957-06-19 | 1957-06-19 | Electrodeposition of copper |
US666766A US2873234A (en) | 1957-06-19 | 1957-06-19 | Electrodeposition of copper |
GB18210/58A GB836977A (en) | 1957-06-19 | 1958-06-06 | Improvements in or relating to baths for the electrodeposition of copper |
FR1198260D FR1198260A (fr) | 1957-06-19 | 1958-06-16 | Procédé de cuivrage électrolytique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US666766A US2873234A (en) | 1957-06-19 | 1957-06-19 | Electrodeposition of copper |
Publications (1)
Publication Number | Publication Date |
---|---|
US2873234A true US2873234A (en) | 1959-02-10 |
Family
ID=24675380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US666766A Expired - Lifetime US2873234A (en) | 1957-06-19 | 1957-06-19 | Electrodeposition of copper |
Country Status (4)
Country | Link |
---|---|
US (1) | US2873234A (fr) |
DE (1) | DE1072449B (fr) |
FR (1) | FR1198260A (fr) |
GB (1) | GB836977A (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3309293A (en) * | 1964-11-16 | 1967-03-14 | Elechem Corp | Copper cyanide electroplating bath |
US3360338A (en) * | 1964-12-24 | 1967-12-26 | Johnson & Johnson | Indicator tape |
US3480524A (en) * | 1967-09-21 | 1969-11-25 | Kewanee Oil Co | Selenium compound and its use as a brightener in a copper plating bath |
US3532610A (en) * | 1967-10-27 | 1970-10-06 | Kewanee Oil Co | Selenium compounds as brighteners in copper plating baths |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2732336A (en) * | 1956-01-24 | Electroplating composition for copper | ||
US2737485A (en) * | 1952-09-22 | 1956-03-06 | Gen Motors Corp | Electrodeposition of copper |
US2770587A (en) * | 1956-06-04 | 1956-11-13 | Elechem Corp | Bath for plating bright copper |
US2773022A (en) * | 1953-08-17 | 1956-12-04 | Westinghouse Electric Corp | Electrodeposition from copper electrolytes containing dithiocarbamate addition agents |
-
0
- DE DENDAT1072449D patent/DE1072449B/de active Pending
-
1957
- 1957-06-19 US US666766A patent/US2873234A/en not_active Expired - Lifetime
-
1958
- 1958-06-06 GB GB18210/58A patent/GB836977A/en not_active Expired
- 1958-06-16 FR FR1198260D patent/FR1198260A/fr not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2732336A (en) * | 1956-01-24 | Electroplating composition for copper | ||
US2737485A (en) * | 1952-09-22 | 1956-03-06 | Gen Motors Corp | Electrodeposition of copper |
US2773022A (en) * | 1953-08-17 | 1956-12-04 | Westinghouse Electric Corp | Electrodeposition from copper electrolytes containing dithiocarbamate addition agents |
US2770587A (en) * | 1956-06-04 | 1956-11-13 | Elechem Corp | Bath for plating bright copper |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3309293A (en) * | 1964-11-16 | 1967-03-14 | Elechem Corp | Copper cyanide electroplating bath |
US3360338A (en) * | 1964-12-24 | 1967-12-26 | Johnson & Johnson | Indicator tape |
US3480524A (en) * | 1967-09-21 | 1969-11-25 | Kewanee Oil Co | Selenium compound and its use as a brightener in a copper plating bath |
US3532610A (en) * | 1967-10-27 | 1970-10-06 | Kewanee Oil Co | Selenium compounds as brighteners in copper plating baths |
Also Published As
Publication number | Publication date |
---|---|
FR1198260A (fr) | 1959-12-07 |
DE1072449B (de) | 1959-12-31 |
GB836977A (en) | 1960-06-09 |
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