US2873234A - Electrodeposition of copper - Google Patents

Electrodeposition of copper Download PDF

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Publication number
US2873234A
US2873234A US666766A US66676657A US2873234A US 2873234 A US2873234 A US 2873234A US 666766 A US666766 A US 666766A US 66676657 A US66676657 A US 66676657A US 2873234 A US2873234 A US 2873234A
Authority
US
United States
Prior art keywords
copper
selenium
cyanide
baths
bright
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US666766A
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English (en)
Inventor
Passal Frank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Primerica Inc
Original Assignee
Metal and Thermit Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DENDAT1072449D priority Critical patent/DE1072449B/de
Application filed by Metal and Thermit Corp filed Critical Metal and Thermit Corp
Priority to US666784A priority patent/US2873235A/en
Priority to US666766A priority patent/US2873234A/en
Priority to GB18210/58A priority patent/GB836977A/en
Priority to FR1198260D priority patent/FR1198260A/fr
Application granted granted Critical
Publication of US2873234A publication Critical patent/US2873234A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • C25D3/40Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Definitions

  • This invention relates to electroplating of copper and more particularly to the electrodeposition of bright copper plates.
  • Electrodeposited copper is widely used as a decorative finish and also as an undercoat for subsequent electrodeposits such as nickel baths acceptacle to industry are desirably economic, stable, easy to maintain, and should have good plating characteristics.
  • Alkaline-cyanide type baths are widely used because of their relatively high plating speeds, excellent throwing power, and ease of maintenance. Alkaline-cyanide electroplating baths, and processes are described in Modern Electroplating, edited by A. G. Gray, pages 194-225 (1953).
  • Another object of the invention is to provide bath compositions of the alkaline-cyanide type from which bright copper plate is electrodeposited.
  • Still another object of the invention is to provide compositions of matter which, when dissolved in water, yield alkaline-cyanide electrolytes suitable for the electrodeposition of bright copper electrodeposits.
  • the invention contemplates-elem trodepositing copper from an alkaline-cyanide copper plating bath containing a small but effective amount of a compound having the general formula (herein referred to as a selenium bisdithiocarbamate), wherein R and R may be the same or different and are selected from the class consisting of hydrogen and alkyl hydrocarbon groups having up to 6 carbon atoms in the group.
  • R and R within the scope of the invention include hydrogen and alkyl groups such as methyl, ethyl, propyl, butyl, amyl and hexyl, and the branched as well as the straight chain groups.
  • the R and R groups may be replaced with a single alkyl cyclic compound, which may be viewed as a joinder of the R and R groups and include compounds having a total of to 7 carbon atoms in the ring.
  • Selenium bisdiethyldithiocarbamate is the preferred additive.
  • Electroplatingt 2 Conventional alkaline-cyanide baths and process conditions for electrodeposition are utilized in the present invention. Typical baths and process are illustrated in the table below: a
  • potassium salts noted in the table which are preferred, may be partially or completely replaced by sodium salts.
  • the copper electrodeposits obtained from baths utilizing selenium bisdithiocarbamate additions are substantially mirror bright.
  • the electrodeposits prepared from the selenium bisdithiocarbamate-containing baths may be obtained in an even brighter condition by utilizing auxiliary or cooperating brightening additives in conjunction with the primary selenium bisdithiocarbamate.
  • auxiliary additives include relatively small amounts of salts of lead, bismuth, antimony, or zinc, e. g., lead acetate, bismuth citrate, potassium antimony tartrate, zinc chloride, zinc sulfate, etc.
  • the alkaline-cyanide baths utilized should preferably contain a compound selected from the class consisting of the alkali metal tartrates, citrates, gluconates, and saccharates to improve current efiiciencies.
  • wetting agents of the kind generally used in alkaline-cyanide copper electroplating baths are preferably incorporated in the baths. These include quaternary amine wetting agents such as C-decylbetaine and the ammonium hydroxide derivatives such as trimethylbenzylammonium chloride.
  • the above compounds, marketed under the trade name Deriphats are used-in concentrations of 0.01 to 0.1 gram per liter. They are stable in the electrolyte and even impart some brightening action.
  • a compound of this class which has been successfully used is the sodium salt of a coconut alcohol derivative of fl-amino propionate, designated as Deriphat 151.
  • the selenium acts as a non-metal, the compounds being analogues of sulphur and/or oxygen-containing compounds, i. e., the selenium atoms were essentially non-metallic in nature.
  • An alkyline-cyanide bath for bright copper plating comprising copper cyanide and, as a brightening agent more than 0.001 g./1. of at least one selenium bisdithiocarbarnate having the general formula:
  • a bath solution according to claim 1 which also contains an alkali metal gluconate.
  • a bath solution according to claim 1 which also contains an alkali metal saccharate.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US666766A 1957-06-19 1957-06-19 Electrodeposition of copper Expired - Lifetime US2873234A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DENDAT1072449D DE1072449B (de) 1957-06-19 Cyanidisches Bad zum galvanischen Abscheiden von g'änzenden Kupferüberzügen
US666784A US2873235A (en) 1957-06-19 1957-06-19 Electrodeposition of copper
US666766A US2873234A (en) 1957-06-19 1957-06-19 Electrodeposition of copper
GB18210/58A GB836977A (en) 1957-06-19 1958-06-06 Improvements in or relating to baths for the electrodeposition of copper
FR1198260D FR1198260A (fr) 1957-06-19 1958-06-16 Procédé de cuivrage électrolytique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US666766A US2873234A (en) 1957-06-19 1957-06-19 Electrodeposition of copper

Publications (1)

Publication Number Publication Date
US2873234A true US2873234A (en) 1959-02-10

Family

ID=24675380

Family Applications (1)

Application Number Title Priority Date Filing Date
US666766A Expired - Lifetime US2873234A (en) 1957-06-19 1957-06-19 Electrodeposition of copper

Country Status (4)

Country Link
US (1) US2873234A (fr)
DE (1) DE1072449B (fr)
FR (1) FR1198260A (fr)
GB (1) GB836977A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3309293A (en) * 1964-11-16 1967-03-14 Elechem Corp Copper cyanide electroplating bath
US3360338A (en) * 1964-12-24 1967-12-26 Johnson & Johnson Indicator tape
US3480524A (en) * 1967-09-21 1969-11-25 Kewanee Oil Co Selenium compound and its use as a brightener in a copper plating bath
US3532610A (en) * 1967-10-27 1970-10-06 Kewanee Oil Co Selenium compounds as brighteners in copper plating baths

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732336A (en) * 1956-01-24 Electroplating composition for copper
US2737485A (en) * 1952-09-22 1956-03-06 Gen Motors Corp Electrodeposition of copper
US2770587A (en) * 1956-06-04 1956-11-13 Elechem Corp Bath for plating bright copper
US2773022A (en) * 1953-08-17 1956-12-04 Westinghouse Electric Corp Electrodeposition from copper electrolytes containing dithiocarbamate addition agents

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732336A (en) * 1956-01-24 Electroplating composition for copper
US2737485A (en) * 1952-09-22 1956-03-06 Gen Motors Corp Electrodeposition of copper
US2773022A (en) * 1953-08-17 1956-12-04 Westinghouse Electric Corp Electrodeposition from copper electrolytes containing dithiocarbamate addition agents
US2770587A (en) * 1956-06-04 1956-11-13 Elechem Corp Bath for plating bright copper

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3309293A (en) * 1964-11-16 1967-03-14 Elechem Corp Copper cyanide electroplating bath
US3360338A (en) * 1964-12-24 1967-12-26 Johnson & Johnson Indicator tape
US3480524A (en) * 1967-09-21 1969-11-25 Kewanee Oil Co Selenium compound and its use as a brightener in a copper plating bath
US3532610A (en) * 1967-10-27 1970-10-06 Kewanee Oil Co Selenium compounds as brighteners in copper plating baths

Also Published As

Publication number Publication date
FR1198260A (fr) 1959-12-07
DE1072449B (de) 1959-12-31
GB836977A (en) 1960-06-09

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