US2812273A - Method of making titanium-dioxide rectifiers - Google Patents
Method of making titanium-dioxide rectifiers Download PDFInfo
- Publication number
- US2812273A US2812273A US514232A US51423255A US2812273A US 2812273 A US2812273 A US 2812273A US 514232 A US514232 A US 514232A US 51423255 A US51423255 A US 51423255A US 2812273 A US2812273 A US 2812273A
- Authority
- US
- United States
- Prior art keywords
- titanium
- oxidation
- dioxide
- rectifiers
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 title claims description 42
- 239000004408 titanium dioxide Substances 0.000 title claims description 21
- 229960005196 titanium dioxide Drugs 0.000 title description 20
- 235000010215 titanium dioxide Nutrition 0.000 title description 20
- 238000004519 manufacturing process Methods 0.000 title description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 35
- 239000010936 titanium Substances 0.000 claims description 35
- 229910052719 titanium Inorganic materials 0.000 claims description 35
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 230000003647 oxidation Effects 0.000 claims description 19
- 238000007254 oxidation reaction Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 8
- 238000007605 air drying Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002939 deleterious effect Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XWROUVVQGRRRMF-UHFFFAOYSA-N F.O[N+]([O-])=O Chemical compound F.O[N+]([O-])=O XWROUVVQGRRRMF-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- -1 chlorine ions Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Definitions
- This invention relates to asymmetrical electrical conductors containing titanium dioxide.
- this invention relates to the pretreatment of the surface of titanium metal in the production of titanium dioxide rectifiers.
- semiconducting titanium dioxide has been produced by oxidizing titanium metal in either oxygen or steam to produce an oxide film on the surface of the titanium.
- the semiconducting oxide film is commonly referred to as a titanium dioxide film, this film is composed principally of oxygen-deficient titanium dioxide and probably small amounts of the lower oxides of titanium.
- the semiconducting properties of this film have been attributed to the imperfect nature of the oxide crystal lattice. Rectifying contact to the oxygen-deficient titanium dioxide film is obtained by contacting the film with any of several known counterelectrode metals. The base 1 electrical contact for the rectifiers so produced may be made directly to the titanium metal bearing the semiconducting oxide film.
- This improvement in electrical properties is believed to result from chlorine ions that have diffused into the oxide film from the surface of the titanium metal during oxidation.
- the surface of the titanium metal sheet is cleaned to remove all oxide and foreign matter from the surface of the titanium.
- the titanium surface is polished with an abrasive paper and, after polishing, the titanium surface is consecutively rinsed in benzene, acetone, and water, fol lowed by a detergent wash and then rinsed in hot and cold distilled Water.
- the titanium sheet is then pickled in a hydrofluoric acid-nitric acid pickling bath, waterrinsed, and then air-dried.
- the thoroughly cleansed titanium metal is then contacted with hydrochloric acid.
- the surface of the titanium metal wetted with the hydrochloric acid is then dried in air at room temperature.
- the titanium metal is oxidized in any of the known ways to obtain a thin, adherent layer of the oxygen-deficient titanium dioxide film on the titanium metal.
- the preferred oxidation procedure is to oxidize the titanium metal at a temperature ranging from about 700 C. to about 900 C. in an oxygen atmosphere at atmospheric pressure for a period of from about one to 20 minutes. Optimum oxidation is obtained at about 825 C. for a period of about seven minutes. Adherence of the oxide film to the titanium metal decreases as the oxidation temperature increases above about 900 C. At temperatures below about 700 C. oxidation times become excessively long and a higher resistant oxide tends to form.
- the curve of the figure is illustrative of the currentv'oltage characteristics of a typical hydrochloric acid eated titanium dioxide rectifier wherein the counter electrode is bismuth.
- the titanium dioxide rectifier was made in accordance with the above-described procedure. Specifically, after thoroughly clean sing the surface of the titanium metal in the manner described, the titanium was immersed in a 1.2 normal aqueous hydrochloric acid solution for a period of about five minutes and then air dried immediately preceding oxida-' tion. The hydrochloric acid treated titanium was then oxidized in an oxygen atmosphere at a temperature of 900 C. for a period of 10 minutes.
- Rectifying contact was made to the oxide film with a bismuth counterelectrode which was applied by conventional vacuum evaporation techniques.
- Measurements of the current-voltage values of the rectifier shows that the incorporation of the hydrochloric acid treatment in the processing of titanium dioxide rectifiers results in a rectifying device with a significantly lower current in the reverse direction without deleterious effect on the forward current.
- the time of contact with the acid should be only a few minutes although longer periods of time will not deleteriously affect the titanium.
- the rectifying junction may be either an area-type contact between the counterelectrode and the titanium dioxide semiconductor or may be a point contact.
- titanium dioxide rectifiers having a counterelectrode in contacting relationship with a titanium dioxide semiconductor wherein said semiconductor is produced by the oxidation of titanium metal to produce a semiconducting titanium dioxide film on the surface of the titanium, the improvement in combination with said oxidation of contacting the titanium metal with hydrochloric acid prior to oxidation and then air-drying the contacted titanium metal prior to oxidation.
Description
Nov. 5 1957 1-. s. SHILLIDAY ETAL 2,812,273
' METHOD OF MAKING TITANIUM-DIOXIDE RECTIFIERS Filed June 9, 1955 Current Density, cumperes/in 25 2o |5 1o 5 o 2 3 4 Pofential, vblts v INVENTOR.
Theodore S. Shilliday Charles 5. Feet BY rthur E. Middlet Zha4- M A TORNEYS.
United States Patent METHOD OF MAKING TITANIUM-DIOXIDE RECTIFIERS Theodore S. Shilliday and Charles S. Peat, Columbus,
Ohio, and Arthur E. Middleton, Indianapolis, Ind., assignors, by mesne assignments, to the United States of America as represented by the Secretary of the Air *orce Application June 9, 1955, Serial No. 514,232
2 Claims. (Cl. 148-63) This invention relates to asymmetrical electrical conductors containing titanium dioxide. In particular, this invention relates to the pretreatment of the surface of titanium metal in the production of titanium dioxide rectifiers.
semiconducting titanium dioxide has been produced by oxidizing titanium metal in either oxygen or steam to produce an oxide film on the surface of the titanium. Although the semiconducting oxide film is commonly referred to as a titanium dioxide film, this film is composed principally of oxygen-deficient titanium dioxide and probably small amounts of the lower oxides of titanium. The semiconducting properties of this film have been attributed to the imperfect nature of the oxide crystal lattice. Rectifying contact to the oxygen-deficient titanium dioxide film is obtained by contacting the film with any of several known counterelectrode metals. The base 1 electrical contact for the rectifiers so produced may be made directly to the titanium metal bearing the semiconducting oxide film.
It has now been found that pretreating the cleansed titanium metal surface prior to oxidation with hydrochloric acid and permitting the surface to be air dried significantly decreases the reverse current without deleterious change in the forward current. This improvement in electrical properties is believed to result from chlorine ions that have diffused into the oxide film from the surface of the titanium metal during oxidation. In the preparation of the titanium dioxide rectifiers in accordance with this invention, the surface of the titanium metal sheet is cleaned to remove all oxide and foreign matter from the surface of the titanium. As is conventional, the titanium surface is polished with an abrasive paper and, after polishing, the titanium surface is consecutively rinsed in benzene, acetone, and water, fol lowed by a detergent wash and then rinsed in hot and cold distilled Water. The titanium sheet is then pickled in a hydrofluoric acid-nitric acid pickling bath, waterrinsed, and then air-dried. The thoroughly cleansed titanium metal is then contacted with hydrochloric acid. The surface of the titanium metal wetted with the hydrochloric acid is then dried in air at room temperature.
After the surface of the titanium metal has dried, the titanium metal is oxidized in any of the known ways to obtain a thin, adherent layer of the oxygen-deficient titanium dioxide film on the titanium metal. Among the methods of oxidizing the titanium metal to obtain a semiconducting titanium dioxide film the preferred oxidation procedure is to oxidize the titanium metal at a temperature ranging from about 700 C. to about 900 C. in an oxygen atmosphere at atmospheric pressure for a period of from about one to 20 minutes. Optimum oxidation is obtained at about 825 C. for a period of about seven minutes. Adherence of the oxide film to the titanium metal decreases as the oxidation temperature increases above about 900 C. At temperatures below about 700 C. oxidation times become excessively long and a higher resistant oxide tends to form.
The curve of the figure is illustrative of the currentv'oltage characteristics of a typical hydrochloric acid eated titanium dioxide rectifier wherein the counter electrode is bismuth. In this instance, the titanium dioxide rectifier was made in accordance with the above-described procedure. Specifically, after thoroughly clean sing the surface of the titanium metal in the manner described, the titanium was immersed in a 1.2 normal aqueous hydrochloric acid solution for a period of about five minutes and then air dried immediately preceding oxida-' tion. The hydrochloric acid treated titanium was then oxidized in an oxygen atmosphere at a temperature of 900 C. for a period of 10 minutes. Rectifying contact was made to the oxide film with a bismuth counterelectrode which was applied by conventional vacuum evaporation techniques. Measurements of the current-voltage values of the rectifier, as plotted in the curve of the figure, shows that the incorporation of the hydrochloric acid treatment in the processing of titanium dioxide rectifiers results in a rectifying device with a significantly lower current in the reverse direction without deleterious effect on the forward current.
While the particular embodiments of this invention have been shown and described, it will be obvious to those skilled in the art that various changes and modifications may be made without departing from the scope of the invention in its broader aspects. Thus, the particular cleansing procedure disclosed is not critical to the invention. Other cleansing procedures may be used so long as the surface of the titanium is cleansed of all foreign matter and oxides prior to the pretreatment with the hydrochloric acid and subsequent oxidation. The concentration of the hydrochloric acid may be varied without departing from the scope of this invention. The cleansed surface of the titanium need be contacted with the hydrochloric acid only a length of time sufiicient to wet the titanium surface. Preferably the time of contact with the acid should be only a few minutes although longer periods of time will not deleteriously affect the titanium. Further, it is understood that the invention is not limited to the specific forms herein described. The rectifying junction may be either an area-type contact between the counterelectrode and the titanium dioxide semiconductor or may be a point contact.
What is claimed is:
1. In the process of producing semiconducting titanium dioxide by the oxidation of titanium metal, the improvement in combination with said oxidation of contacting the titanium metal with hydrochloric acid prior to oxidation and then airdrying the metal prior to oxidation.
2. In the manufacture of titanium dioxide rectifiers having a counterelectrode in contacting relationship with a titanium dioxide semiconductor wherein said semiconductor is produced by the oxidation of titanium metal to produce a semiconducting titanium dioxide film on the surface of the titanium, the improvement in combination with said oxidation of contacting the titanium metal with hydrochloric acid prior to oxidation and then air-drying the contacted titanium metal prior to oxidation.
References Cited in the file of this patent UNITED STATES PATENTS 1,769,852 Ogden July 1, 1930 2,060,905 Smith Nov. 17, 1936 2,699,522 Breckinridge Ian. 11, 1955
Claims (1)
1. IN THE PROCESS OF PRODUCING SEMICONDUCTING TITANIUM DIOXIDE BY THE OXIDATION OF TITANIUM METAL, THE IMPROVEMENT IN COMBINATION WITH SAID OXIDATION OF CONTACTING THE TITANIUM METAL WITH HYDROCHLORIC ACID PRIOR TO TO OXIDATION AND THEN AIR-DRYING THE METAL PRIOR TO OXIDATION.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US514232A US2812273A (en) | 1955-06-09 | 1955-06-09 | Method of making titanium-dioxide rectifiers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US514232A US2812273A (en) | 1955-06-09 | 1955-06-09 | Method of making titanium-dioxide rectifiers |
Publications (1)
Publication Number | Publication Date |
---|---|
US2812273A true US2812273A (en) | 1957-11-05 |
Family
ID=24046338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US514232A Expired - Lifetime US2812273A (en) | 1955-06-09 | 1955-06-09 | Method of making titanium-dioxide rectifiers |
Country Status (1)
Country | Link |
---|---|
US (1) | US2812273A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3259558A (en) * | 1961-02-15 | 1966-07-05 | Matsushita Electric Ind Co Ltd | Method of producing a metal oxide coating |
US4263060A (en) * | 1973-11-09 | 1981-04-21 | Centre Stephanois De Recherches Mecanique Hydromecanique Et Frottement | Method for treating parts made of titanium or titanium alloy, and parts produced thereby |
US4361951A (en) * | 1981-04-22 | 1982-12-07 | Ford Motor Company | Method of fabricating a titanium dioxide rectifier |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1769852A (en) * | 1927-06-27 | 1930-07-01 | Kodel Radio Corp | Method of producing rectifying units |
US2060905A (en) * | 1935-03-30 | 1936-11-17 | Bell Telephone Labor Inc | Asymmetrical conductor |
US2699522A (en) * | 1952-01-04 | 1955-01-11 | Robert G Breckenridge | Titanium dioxide rectifier |
-
1955
- 1955-06-09 US US514232A patent/US2812273A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1769852A (en) * | 1927-06-27 | 1930-07-01 | Kodel Radio Corp | Method of producing rectifying units |
US2060905A (en) * | 1935-03-30 | 1936-11-17 | Bell Telephone Labor Inc | Asymmetrical conductor |
US2699522A (en) * | 1952-01-04 | 1955-01-11 | Robert G Breckenridge | Titanium dioxide rectifier |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3259558A (en) * | 1961-02-15 | 1966-07-05 | Matsushita Electric Ind Co Ltd | Method of producing a metal oxide coating |
US4263060A (en) * | 1973-11-09 | 1981-04-21 | Centre Stephanois De Recherches Mecanique Hydromecanique Et Frottement | Method for treating parts made of titanium or titanium alloy, and parts produced thereby |
US4361951A (en) * | 1981-04-22 | 1982-12-07 | Ford Motor Company | Method of fabricating a titanium dioxide rectifier |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4050954A (en) | Surface treatment of semiconductor substrates | |
US2899344A (en) | Rinse in | |
US4432846A (en) | Cleaning and treatment of etched cathode aluminum capacitor foil | |
US2812273A (en) | Method of making titanium-dioxide rectifiers | |
JPH04113620A (en) | Cleaning method for semiconductor substrate | |
US2780594A (en) | Electrolytic descaling | |
US2766509A (en) | Titanium dioxide rectifier | |
US2822250A (en) | Material removal from semi-conductive metal telluride | |
US3010885A (en) | Method for electrolytically etching and thereafter anodically oxidizing an essentially monocrystalline semiconductor body having a p-n junction | |
JPS62136030A (en) | Polishing of silicon wafer | |
US3003896A (en) | Process and composition for treating aluminum alloys | |
GB1069168A (en) | Composite coated aluminium articles | |
US3048528A (en) | Descaling titanium and titanium alloy articles | |
US3290180A (en) | Method of treating silicon and devices containing pn junctions | |
US3963528A (en) | Oxidation of chromium surfaces | |
US2465228A (en) | Liquid treatment of contact surfaces for copper oxide rectifiers | |
JPH10183185A (en) | Cleansing liquid, its formulation and production, cleansing, and production of semiconductor substrate | |
US2473456A (en) | Passivation of ferrous metals | |
US2935781A (en) | Manufacture of germanium translators | |
US4049471A (en) | Technique for stabilizing contact resistance of gold plated electrical contacts | |
US2825668A (en) | Process of making a plate oxide rectifier | |
US3378668A (en) | Method of making non-porous weld beads | |
US2062464A (en) | Anodes, method of forming the same, and formation electrolyte therefor | |
US2094642A (en) | Manufacture of electrical rectifiers | |
US2680678A (en) | Method of chemically polishing nickel |