US2726970A - Deoxidizing copper base metal parts - Google Patents
Deoxidizing copper base metal parts Download PDFInfo
- Publication number
- US2726970A US2726970A US433813A US43381354A US2726970A US 2726970 A US2726970 A US 2726970A US 433813 A US433813 A US 433813A US 43381354 A US43381354 A US 43381354A US 2726970 A US2726970 A US 2726970A
- Authority
- US
- United States
- Prior art keywords
- copper base
- base metal
- treating
- metal parts
- deoxidizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 8
- 239000010949 copper Substances 0.000 title claims description 8
- 229910052802 copper Inorganic materials 0.000 title claims description 8
- 239000010953 base metal Substances 0.000 title claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 7
- -1 65 TO 85 PER CENT Chemical compound 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
- 239000004133 Sodium thiosulphate Substances 0.000 claims description 5
- 229910021538 borax Inorganic materials 0.000 claims description 5
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 claims description 5
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 5
- 239000004328 sodium tetraborate Substances 0.000 claims description 5
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 5
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 2
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 claims 1
- 239000000243 solution Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002253 acid Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000010405 reoxidation reaction Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical class [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
Definitions
- This invention deals with metallurgy of the copper base alloys and more specifically with a method for deoxidizing the surfaces of such metals prior to soldering and in maintaining the surfaces so deoxidized.
- This invention was developed to facilitate the manufacture of vehicular radiators, the working portions of which are copper and brass. However, this invention is not so limited but may be applied wherever the problem of deoxidizing the surface of copper base alloys exists.
- the manufacture of vehicular radiators is troublesome from a deoxidation standpoint, in that deep drawing operations are involved which necessitate a thermal stress relief operation which is normally carried out in an ordinary air atmosphere. At these elevated temperatures, an adherent oxide film is formed on the metal which must be removed prior to subsequent soldering operations. In the automotive industry this is conventionally done by immersing the parts in an acid solution containing about one third sulphuric acid, one third nitric acid, and one third water by volume.
- chromic acid is also added to this solution as a reoxidation inhibiter.
- An acid solution of this type readily dissolves the metal oxides as well as the base metal, and hence leaves a metal surface free of oxides.
- this solution is followed by a water rinse which inevitably becomes contaminated with acids carried over sufficient to render the wash solution oxidizing to the alloys.
- this acid is too weak to dissolve the oxides formed and hence the metal surface is again contaminated by oxides.
- a chemical compound selected from the group of thio-compounds, especially one containing a divalent sulphur atom, capable of replacing oxygen.
- This mixture is employed at a concentration between /2 and 16 ounces per gallon of water,
- the optjmum ran e is 4 to 8 ounces per gallon of water.
- This solution may be tspjegi ed at any temperature belgw 112.. F. but for most applications the ordinary room temperature solutions are quite effective.
- the time of immersion is not critical and can vary from V2 min'uTE' to 5 minutes.
- Parts to be treated by this material are first cleansed in an alkaline solution, then rinsed in cold water, then deoxidized in the strong sulphuric, nitric acid solution described above, then quickly rinsed twice in cold running water.
- the surface is now clean and free from oxide contamination and is immersed in the solution described in this specification.
- This solution removes secondary oxides, neutralizes trace acids, destroys all traces of oxidizing materials and inhibits the surface of the metal against room temperature atmospheric reoxidation.
- the parts are now rinsed in hot water and permitted to air dry. Parts so treated may be stored any reasonable length of time without deleterious oxidation and when assembled for soldering the solder will penetrate perfectly between the faying surfaces indicating chemically clean metal.
- the process of preparing copper base metal parts for subsequent soldering operations comprising treating said parts first within an alkaline cleaning medium, then deoxidizing the surface by treating with a mixtureof sulphuric and nitric acids, and then treating the deoxidized surface with a solution of /2 to 16 ounces of a mixture comprising sodium thiosulphate, to 85 per cent, sodium tetraborate, 12 to 24 per cent and an alkyl aryl sulphonate, 5 to 10 per cent in one gallon of water.
- the process of preparing copper base metal parts for subsequent soldering operations comprising treating said parts first with an alkaline cleaning medium, then deoxidizing the surface by treating with a mixture of sulphuric and nitric acids, and then treating the deoxidized surface with a solution of 4 to 8 ounces of a mixture consisting substantially of per cent sodium thiosulphate, 18 per cent sodium tetraborate and 7 per cent of an alkyl aryl sulphonate in one gallon of water.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Chemical Treatment Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
United States Patent DEOXIDIZING COPPER BASE METAL PARTS John Toth, Dearborn, Mich., assignor to Ford Motor Company, Dearborn, Mich., a corporation of Delaware No Drawing. Application June 1, 1954, Serial No. 433,813
2 Claims. (Cl. 134-3) This invention deals with metallurgy of the copper base alloys and more specifically with a method for deoxidizing the surfaces of such metals prior to soldering and in maintaining the surfaces so deoxidized.
This invention was developed to facilitate the manufacture of vehicular radiators, the working portions of which are copper and brass. However, this invention is not so limited but may be applied wherever the problem of deoxidizing the surface of copper base alloys exists. The manufacture of vehicular radiators is troublesome from a deoxidation standpoint, in that deep drawing operations are involved which necessitate a thermal stress relief operation which is normally carried out in an ordinary air atmosphere. At these elevated temperatures, an adherent oxide film is formed on the metal which must be removed prior to subsequent soldering operations. In the automotive industry this is conventionally done by immersing the parts in an acid solution containing about one third sulphuric acid, one third nitric acid, and one third water by volume. Occasionally, chromic acid is also added to this solution as a reoxidation inhibiter. An acid solution of this type readily dissolves the metal oxides as well as the base metal, and hence leaves a metal surface free of oxides. However, this solution is followed by a water rinse which inevitably becomes contaminated with acids carried over sufficient to render the wash solution oxidizing to the alloys. However, this acid is too weak to dissolve the oxides formed and hence the metal surface is again contaminated by oxides.
The art has had recourse to the use of both chromates and cyanides to inhibit respectively reoxidation during washing and reoxidation due to exposure to the atmosphere prior to soldering. However, both of these expedients leave an objectionable film on the surface of the metal.
To avoid these disadvantages of the prior art, I have developed a mixture comprising three essential ingredicuts:
1. A chemical compound selected from the group of thio-compounds, especially one containing a divalent sulphur atom, capable of replacing oxygen.
2. An oxyboron compound.
3. A chemical compound selected from'the group of anionic surface active agents known as sulphonates.
An example of such a formulation is:
Percent Sodium thiosulphate 65 to 85 Sodium tetra borate 12 to 24 An alkyl aryl sulphonate 5 to l b I 2,726,970 Patented Dec. 13, 1955 The above ingredients are mixed dry until a homogeneous mixture is obtained. Optimpm results have been obtained withliper cent sodium thio sulphate, 1 8 mgent sodium tetra borate and 7 per cent of an alkyl aryl sulphonate. To accomplish a homogeneous mixture, the dry compounds should have a reasonable screen analy- SIS.
This mixture is employed at a concentration between /2 and 16 ounces per gallon of water, The optjmum ran e is 4 to 8 ounces per gallon of water. This solution may be tspjegi ed at any temperature belgw 112.. F. but for most applications the ordinary room temperature solutions are quite effective. The time of immersion is not critical and can vary from V2 min'uTE' to 5 minutes.
Parts to be treated by this material are first cleansed in an alkaline solution, then rinsed in cold water, then deoxidized in the strong sulphuric, nitric acid solution described above, then quickly rinsed twice in cold running water. The surface is now clean and free from oxide contamination and is immersed in the solution described in this specification. This solution removes secondary oxides, neutralizes trace acids, destroys all traces of oxidizing materials and inhibits the surface of the metal against room temperature atmospheric reoxidation. The parts are now rinsed in hot water and permitted to air dry. Parts so treated may be stored any reasonable length of time without deleterious oxidation and when assembled for soldering the solder will penetrate perfectly between the faying surfaces indicating chemically clean metal.
I claim as my invention:
1. The process of preparing copper base metal parts for subsequent soldering operations comprising treating said parts first within an alkaline cleaning medium, then deoxidizing the surface by treating with a mixtureof sulphuric and nitric acids, and then treating the deoxidized surface with a solution of /2 to 16 ounces of a mixture comprising sodium thiosulphate, to 85 per cent, sodium tetraborate, 12 to 24 per cent and an alkyl aryl sulphonate, 5 to 10 per cent in one gallon of water.
2. The process of preparing copper base metal parts for subsequent soldering operations comprising treating said parts first with an alkaline cleaning medium, then deoxidizing the surface by treating with a mixture of sulphuric and nitric acids, and then treating the deoxidized surface with a solution of 4 to 8 ounces of a mixture consisting substantially of per cent sodium thiosulphate, 18 per cent sodium tetraborate and 7 per cent of an alkyl aryl sulphonate in one gallon of water.
References Cited in the file of this patent UNITED STATES PATENTS 1,049,054 Coombs --'Dec. 21, 1912 2,093,824 Woronoff Sept. 21, 1937 2,244,526 MacKay June 3, 1941 2,395,694 Spence Feb. 26, 1946 2,472,684 Rossi June 7, 1949 2,479,628 Kuentzel Aug. 23, 1949 FOREIGN PATENTS 878,043 France I an. 8, 1943
Claims (1)
1. THE PROCESS OF PREPARING COPPER BASE METAL PARTS FOR SUBSEQUENT SOLDERING OPERATIONS COMPRISING TREATING SAID PARTS FIRST WITHIN AN ALKALINE CLEANING MEDIUM, THEN DEOXIDIZING THE SURFACE BY TREATING WITH A MIXTURE OF SULPHURIC AND NITRIC ACID, AND THEN TREATING THE DEOXIDIZED SURFACE WITH A SOLUTION OF 1/2 TO 16 OUNCES OF A MIXTURE COMPRISING SODIUM THIOSULPHATE, 65 TO 85 PER CENT, SODIUM TETRABORATE, 12 TO 24 PER CENT AND AN ALKYL ARYL SULPHONATE, 5 TO 10 CENT IN ONE GALLON OF WATER.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US433813A US2726970A (en) | 1954-06-01 | 1954-06-01 | Deoxidizing copper base metal parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US433813A US2726970A (en) | 1954-06-01 | 1954-06-01 | Deoxidizing copper base metal parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2726970A true US2726970A (en) | 1955-12-13 |
Family
ID=23721618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US433813A Expired - Lifetime US2726970A (en) | 1954-06-01 | 1954-06-01 | Deoxidizing copper base metal parts |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2726970A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3345295A (en) * | 1963-02-13 | 1967-10-03 | Shulton Inc | Copper cleaning compositions |
| US3646946A (en) * | 1969-01-06 | 1972-03-07 | Olin Mathieson | Copper alloy cleaning process |
| US3728155A (en) * | 1969-01-06 | 1973-04-17 | Olin Corp | Copper alloy cleaning process |
| US4600443A (en) * | 1984-10-01 | 1986-07-15 | Kennecott Corporation | Process for removing surface oxides from a copper-base alloy |
| WO2009048865A1 (en) * | 2007-10-08 | 2009-04-16 | American Trim, L.L.C. | Method of forming metal |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1049054A (en) * | 1911-07-08 | 1912-12-31 | Frank E Coombs | Process of removing scale. |
| US2093824A (en) * | 1935-08-15 | 1937-09-21 | Paul A Woronoff | Detergent cloth |
| US2244526A (en) * | 1934-11-01 | 1941-06-03 | Rust Proofing Company Of Canad | Process of treating metal surfaces |
| FR878043A (en) * | 1940-12-30 | 1943-01-08 | Process for preparing a lye containing bisulfite | |
| US2395694A (en) * | 1944-06-02 | 1946-02-26 | Hooker Electrochemical Co | Processes for removing oxide from the surface of metals |
| US2472684A (en) * | 1946-02-08 | 1949-06-07 | Ciba Ltd | Process for removing corrosion products from surfaces containing heavy metals |
| US2479628A (en) * | 1946-01-25 | 1949-08-23 | Wyandotte Chemicals Corp | Alkali-organic solvent paint remover |
-
1954
- 1954-06-01 US US433813A patent/US2726970A/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1049054A (en) * | 1911-07-08 | 1912-12-31 | Frank E Coombs | Process of removing scale. |
| US2244526A (en) * | 1934-11-01 | 1941-06-03 | Rust Proofing Company Of Canad | Process of treating metal surfaces |
| US2093824A (en) * | 1935-08-15 | 1937-09-21 | Paul A Woronoff | Detergent cloth |
| FR878043A (en) * | 1940-12-30 | 1943-01-08 | Process for preparing a lye containing bisulfite | |
| US2395694A (en) * | 1944-06-02 | 1946-02-26 | Hooker Electrochemical Co | Processes for removing oxide from the surface of metals |
| US2479628A (en) * | 1946-01-25 | 1949-08-23 | Wyandotte Chemicals Corp | Alkali-organic solvent paint remover |
| US2472684A (en) * | 1946-02-08 | 1949-06-07 | Ciba Ltd | Process for removing corrosion products from surfaces containing heavy metals |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3345295A (en) * | 1963-02-13 | 1967-10-03 | Shulton Inc | Copper cleaning compositions |
| US3646946A (en) * | 1969-01-06 | 1972-03-07 | Olin Mathieson | Copper alloy cleaning process |
| US3728155A (en) * | 1969-01-06 | 1973-04-17 | Olin Corp | Copper alloy cleaning process |
| US4600443A (en) * | 1984-10-01 | 1986-07-15 | Kennecott Corporation | Process for removing surface oxides from a copper-base alloy |
| WO2009048865A1 (en) * | 2007-10-08 | 2009-04-16 | American Trim, L.L.C. | Method of forming metal |
| US20100175446A1 (en) * | 2007-10-08 | 2010-07-15 | American Trim. L.L.C. | Method Of Forming Metal |
| US8015849B2 (en) | 2007-10-08 | 2011-09-13 | American Trim, Llc | Method of forming metal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4728456A (en) | Aluminum surface cleaning agent | |
| US3448055A (en) | Aluminum alloy deoxidizing-desmutting composition and method | |
| JPS5821028B2 (en) | Dou Oyobi Dougokin no Kagakutsuyadashiyouki | |
| USRE24596E (en) | Cleaning aluminium | |
| US5320737A (en) | Treatment to reduce solder plating whisker formation | |
| US2726970A (en) | Deoxidizing copper base metal parts | |
| US3425947A (en) | Method of treating metal surfaces | |
| US2380284A (en) | Method of cleaning ferrous metal articles | |
| US3634262A (en) | Process and compositions for treating aluminum and aluminum alloys | |
| US2650156A (en) | Surface finishing of aluminum and its alloys | |
| US3510430A (en) | Compositions for treating aluminum surfaces | |
| US3899367A (en) | Compositions and methods for blackening hardened steel | |
| US2967136A (en) | Chemical brightening and electrolytic polishing of aluminum | |
| US3030238A (en) | Method of treating metal surfaces | |
| US2430435A (en) | Prewelding cleaning of aluminum | |
| JPS626744B2 (en) | ||
| US2960420A (en) | Method and composition for blackening metal articles | |
| US3197340A (en) | Composition and method for cleaning aluminum castings | |
| US2271375A (en) | Process of coating metal surfaces | |
| US3345225A (en) | Method of chemically polishing copper and copper alloys | |
| US2431728A (en) | Treatment of ferrous metals to improve resistance to rusting | |
| US2878189A (en) | Method of de-oxidizing metal surfaces | |
| US1211218A (en) | Process for plating metals. | |
| US2895862A (en) | Solder fluxes | |
| US2567456A (en) | Metal cleaning composition and process |