US2401220A - Method of forming sprayed layers - Google Patents

Method of forming sprayed layers Download PDF

Info

Publication number
US2401220A
US2401220A US444721A US44472142A US2401220A US 2401220 A US2401220 A US 2401220A US 444721 A US444721 A US 444721A US 44472142 A US44472142 A US 44472142A US 2401220 A US2401220 A US 2401220A
Authority
US
United States
Prior art keywords
template
rectifiers
counter
small
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US444721A
Inventor
Walter F Bonner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Federal Telephone and Radio Corp
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE460122D priority Critical patent/BE460122A/xx
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to US444721A priority patent/US2401220A/en
Priority to GB3164/43A priority patent/GB560564A/en
Priority to FR916093D priority patent/FR916093A/en
Application granted granted Critical
Publication of US2401220A publication Critical patent/US2401220A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/12—Application of an electrode to the exposed surface of the selenium or tellurium after the selenium or tellurium has been applied to the foundation plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
    • B05C17/06—Stencils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

Definitions

  • This invention relates to means for assuring deposit of matter on a predetermined area and more particularly to means fordepositing a counter-electrode over a small. areafor productionof small rectifiers.
  • I provide a template with an opening or openings through which matter to be deposited on a plate supported therebelow may be applied over the dea flare -toward the lower'side of the template so that sired area.
  • the openings are made with matter deposited through the holes will not contact the template and will therefore not be disturbed upon removal of the template from the base plate.
  • my invention applies to production of selenium rectifiers and deposit of the counter-electrode is made by spraying moltenmetal from above the upper surface of the template through the openings.
  • this thin Z counter-electrode layer may be easily stripped flaring out the hole 15 below point metal coated with selenium.
  • metal forming the counter-electrode l3 may be applied by means of a metal spray gun indicated at B1 by the nozzle.
  • a metal spray gun indicated at B1 by the nozzle When this molten metal is sprayed over the upper surface of template I so as to feed through the hole IE, it will then deposit a thin layer 13 over a small area of the selenium coated surface.
  • the difllculty caused by metal of the thin layer sticking to the template is avoided by cated at E8, So that the sprayed metal deposited on the selenium layer I2 is at no point in contact with the template. As a consequence when template It is removed, the deposited metal is not disturbed.
  • a plurality of holes l5 may be provided in ternplate It so that the counter-electrode for many rectifiers may beapplied to a strip or plate of After deposit of the counter-electrode the strip may be cut up to form the individual rectifier units.
  • a uniformity of the rectifier product is achieved. This is of rectifiers, for example, in instrument rectifier ts. While I have described my invention as particularly applied to the production of small rectifier units, it should be distinctly understood that this method may be applied in any case where it is necessary to deposit matter over a predetermined area. Whenever the problem of preventing the deposited matter sticking to the template or stencil sheet arises, my invention will be found useful. It is, therefore, clear that the principles of my invention may be appliedgenerdiameter'of the hole is l6, as indiextreme importance in small ally to the deposit of thin layers of fixed area and need not be limited to th specific purpose outlined above.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Rectifiers (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

May 28, 1946. w. F. BONNER I 2,401,220
METHOD OF FORMING SPRAYED LAYERS Filed May 27, 1942 I 16 I v VENTOR.
/ BONNER Patented May 28, 1946 UNlTED SAT E METHOD OF FORMING SPRAYED LAYERS Walter F. Bonner, Glen Itldge. N.
Federal Telephone and Radio corporation of Delaware J., asslgnor to- Corporation, a
Application May 27, 1942, Serial No. 444,721
1 Claim.
This invention relates to means for assuring deposit of matter on a predetermined area and more particularly to means fordepositing a counter-electrode over a small. areafor productionof small rectifiers.
It sometimes occurs that it is desirable to deposit a thin layer of matter over a small area of a base plate, the area of deposit to be substantially constant. Such a problem is encountered in the application of counter-electrodes to small rectiflers, such as instrument rectifiers.
It has been proposed to assure that the desired area be covered by use of a template serving as a stencil with openings of the desired size. and shape. However, this is not found satisfactory in the making of small rectifiers such as instrument rectifiers since the metal forming the counter-electrode tends to adhere to the template so that when it is removed the metal deposit may be disturbed or lifted entirely oil the rectifier layer. This leads to lack of uiformity in the rectifiers produced and to generally unsatisfactory results.
It is an object of my invention to avoid the dificulties which arise from matter deposited through atemplate sticking thereto.
It is a further object of my invention to provide apparatus for the production of rectiilers of small size so that the individual re'ctifiers will be substantially uniform.
According to a feature of my invention I provide a template with an opening or openings through which matter to be deposited on a plate supported therebelow may be applied over the dea flare -toward the lower'side of the template so that sired area. The openings are made with matter deposited through the holes will not contact the template and will therefore not be disturbed upon removal of the template from the base plate.
Preferably my invention applies to production of selenium rectifiers and deposit of the counter-electrode is made by spraying moltenmetal from above the upper surface of the template through the openings.
A better understanding of my invention and the objects and feature thereof may be had from the particular description thereof made with reference to the accompanying drawing the singlev figure of which illustrates an enlarged scale apparatus for practicing my invention. The figure of the drawing shows by way of example in exaggerated scalean arrangement for practicing my invention. In this figure a supporting plate or table It is shown on which is to the selenium layer.
placed a. strip or plate ll" forming the base plate of rectifier units. On'this plate II is a further layer I! which may be a thin layer of selenium or in the case of other rectifiers, a suitable semiconducting oxide. In order to complete a rec tifier unit counter-electrodes I3 must be applied In the case of instrument rectifiers which are very small in size, this thin Z counter-electrode layer may be easily stripped flaring out the hole 15 below point metal coated with selenium.
from the selenium if it is permitted to stick to any portion of the template through which it is deposited. To'avold this difficulty I provide a template I of special form, which is arranged over the coated strip H so that holes or open- IS in the template'are directly above seleni-' ings um layer l2. Each hole is reduced in diameter so that at point It the substantially ofa size to correspond to the desired area of counter-electrode layer l3. The
metal forming the counter-electrode l3 may be applied by means of a metal spray gun indicated at B1 by the nozzle. When this molten metal is sprayed over the upper surface of template I so as to feed through the hole IE, it will then deposit a thin layer 13 over a small area of the selenium coated surface. In accordance with my invention the difllculty caused by metal of the thin layer sticking to the template is avoided by cated at E8, So that the sprayed metal deposited on the selenium layer I2 is at no point in contact with the template. As a consequence when template It is removed, the deposited metal is not disturbed.
A plurality of holes l5 may be provided in ternplate It so that the counter-electrode for many rectifiers may beapplied to a strip or plate of After deposit of the counter-electrode the strip may be cut up to form the individual rectifier units. By using apparatus as outlined in accordance with my invention, a uniformity of the rectifier product is achieved. This is of rectifiers, for example, in instrument rectifier ts. While I have described my invention as particularly applied to the production of small rectifier units, it should be distinctly understood that this method may be applied in any case where it is necessary to deposit matter over a predetermined area. Whenever the problem of preventing the deposited matter sticking to the template or stencil sheet arises, my invention will be found useful. It is, therefore, clear that the principles of my invention may be appliedgenerdiameter'of the hole is l6, as indiextreme importance in small ally to the deposit of thin layers of fixed area and need not be limited to th specific purpose outlined above.
What is claimed is: In a method of spraying a thin layer of ma terial on a predetermined area of a flat surface by means of a template having holes therethrougb, said holes being divided into two continuous zones, said zones having a relatively small common cross-section and each zone increasing in cross-section to its outer end at the surface and the said two zonesforming a sharp template.
angle at their meeting point in an axial section through the said hole, comprising the steps of applying said template to said flat surface around the area of the latter to be sprayed, spraying said material through the holes of said template on I an area smaller than the end of said hole adjacent to said flat surface, and removing said template from said fiat surface, thereby preventing that a part of said layer is removed with said WALTER F. BONNER.
US444721A 1942-05-27 1942-05-27 Method of forming sprayed layers Expired - Lifetime US2401220A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BE460122D BE460122A (en) 1942-05-27
US444721A US2401220A (en) 1942-05-27 1942-05-27 Method of forming sprayed layers
GB3164/43A GB560564A (en) 1942-05-27 1943-02-26 Means for forming deposited layers
FR916093D FR916093A (en) 1942-05-27 1945-10-20 Device for depositing material, in particular for the manufacture of small straighteners

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US444721A US2401220A (en) 1942-05-27 1942-05-27 Method of forming sprayed layers

Publications (1)

Publication Number Publication Date
US2401220A true US2401220A (en) 1946-05-28

Family

ID=23766065

Family Applications (1)

Application Number Title Priority Date Filing Date
US444721A Expired - Lifetime US2401220A (en) 1942-05-27 1942-05-27 Method of forming sprayed layers

Country Status (4)

Country Link
US (1) US2401220A (en)
BE (1) BE460122A (en)
FR (1) FR916093A (en)
GB (1) GB560564A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2507958A (en) * 1946-02-21 1950-05-16 Emi Ltd Mosaic screen for cathode-ray tubes
US3260196A (en) * 1961-11-21 1966-07-12 Vitramon Inc Method and apparatus for making electrical unit
US3777661A (en) * 1970-06-29 1973-12-11 Shinko Electric Co Ltd Method and device for marking sheets through stencils
US4526098A (en) * 1977-02-22 1985-07-02 Dl Process Co. Laser formed rotary print plate with internal sintered titanium ink reservoir

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE628600A (en) * 1962-03-06 1900-01-01

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2507958A (en) * 1946-02-21 1950-05-16 Emi Ltd Mosaic screen for cathode-ray tubes
US3260196A (en) * 1961-11-21 1966-07-12 Vitramon Inc Method and apparatus for making electrical unit
US3777661A (en) * 1970-06-29 1973-12-11 Shinko Electric Co Ltd Method and device for marking sheets through stencils
US4526098A (en) * 1977-02-22 1985-07-02 Dl Process Co. Laser formed rotary print plate with internal sintered titanium ink reservoir

Also Published As

Publication number Publication date
GB560564A (en) 1944-04-07
BE460122A (en)
FR916093A (en) 1946-11-26

Similar Documents

Publication Publication Date Title
DE2855426C2 (en) Process for coating gemstones with a hot melt adhesive layer
US3357856A (en) Method for metallizing openings in miniature printed circuit wafers
DE102019206887B4 (en) WAFER PROCESSING PROCESS
US2401220A (en) Method of forming sprayed layers
US2783193A (en) Electroplating method
DE102020201866A1 (en) Wafer processing method
US2784479A (en) Method of manufacturing rectifier plates in multiple
US4024835A (en) Spinner chuck for non-circular substrates
DE102020201864B4 (en) Wafer processing methods
US2359377A (en) Method of making selenium elements
US3392440A (en) Scribing method for semiconductor wafers
US2994624A (en) Wire coating apparatus and method
DE102019215998B4 (en) WAFER PROCESSING PROCESS
US2428043A (en) Method of manufacturing metal electric rectifiers
DE102020208555A1 (en) WAFER PROCESSING PROCESS
US2862837A (en) Method of producing a metal coating of uniform thickness by spraying
US2543678A (en) Method of producing rectifier elements
JPS57200564A (en) Manufacture of enameled substrate
US2879582A (en) Method of making copper oxide rectifiers
DE102020213738B4 (en) WAFER PROCESSING METHODS
US2697188A (en) Selenium rectifier
DE844464C (en) Condenser microphone with a very small air gap between the membrane and the counter surface
US2356588A (en) Dry rectifier device
EP4446455A1 (en) Metal mask
US2330351A (en) Method of making rubber articles