US2123628A - Copper base alloys - Google Patents
Copper base alloys Download PDFInfo
- Publication number
- US2123628A US2123628A US84838A US8483836A US2123628A US 2123628 A US2123628 A US 2123628A US 84838 A US84838 A US 84838A US 8483836 A US8483836 A US 8483836A US 2123628 A US2123628 A US 2123628A
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- US
- United States
- Prior art keywords
- manganese
- copper
- alloy
- phosphorus
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 title description 27
- 239000000956 alloy Substances 0.000 title description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 17
- 229910052802 copper Inorganic materials 0.000 title description 17
- 239000010949 copper Substances 0.000 title description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 20
- 229910052698 phosphorus Inorganic materials 0.000 description 18
- 239000011574 phosphorus Substances 0.000 description 18
- 229910052748 manganese Inorganic materials 0.000 description 15
- 239000011572 manganese Substances 0.000 description 15
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 14
- 230000032683 aging Effects 0.000 description 10
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 8
- 238000003466 welding Methods 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 238000010791 quenching Methods 0.000 description 4
- 230000000171 quenching effect Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003483 aging Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
Definitions
- This invention relates to alloys and more particularly to copper base alloys of improved characteristics.
- An object of the invention is to provide a high quality copper base alloy of inexpensive ingredients.
- a further object is to provide an alloy, the physical properties of which can be improved by heat treatment.
- An additional object is to provide an alloy which can be easily cast.
- the present invention comprises the combination of elements, methods o'f manufacture, and the product thereof brought out and exemplied in the disclosure hereinafter set forth, the scope of the invention being indicated in the appended 2o claims.
- Figure l is a graph illustrating the improvement in hardness of the alloy disclosed herein with heat treatment.
- Figure 2 is a graph illustrating the improvev ment in electrical conductivity of said alloy with 35. h eat treatment.
- the ingredients used are very economical and have been found to introduce no serious diillculties in manufacture.
- the alloy can'be produced by any of the standard manufacturing methods. For example, it is possible to add the manganese 50 .in the form of cupro-manganese.
- the phosphorus may be introduced in a standard manner such. as a. 15% phosphor-copper hardener alloy.
- the proportions of manganese and phosphorus 55 may each be varied over a considerable range of values and there may be an excess of either in some instances without deleterious effects on the alloy.
- a suitable ratio of phosphorus to manganese is 1 to 4.
- considerable age hardening is obtained with a ratio of 1 to 2 and 5 also with a ratio as high as 1 to 20.
- manganese phosphide is suitable as a hardening ingredientl for copper or the alpha alloys of copper. Additional ingredients may likewise be added in some instances 15 to produce certain beneficial effects.
- the ingredients may be present in'the following ranges of proportions:l
- Manganese 0.05% to 10% Phosphorus 0.05% to 5% Copper balance The most suitable proportions, however, will fall within the following Manganese 0.4 to 5.0% Phosphorus 0.1 to 0.75% Copper balance Where alpha alloys of copper are used or where the other additions are included, the proportions of manganese and phosphorus may preferably be substantially the same as given above.
- the alloy After the alloy has been produced it may be heated to a relatively high temperature, preferably in the order of 800 C. to 1000* C. and then 40 rapidly cooled from that temperature to room temperature or below, preferably by quenching in water. After the quenching operation the alloy, in such form as may be desired, may be given an aging treatment by baking at a temperature below '700 C. and preferably at a temperature in the order of 350 C. to 550 C. The aging may proceed for a considerable length of time according to the temperature used. The greatest improvement in hardness and electrical conductivity will be obtained during the flrst two or three hours if 450 C. is used as aging temperature but further improvement may be noted upon continuing the aging for 8 to 16 hours or more.
- the alloy of the present invention is very economical to produce and results in a material of high strength, high hardness, good electrical and heat conductivity and high resistancefto 'corrosion.
- the material can be easily forged. It can also be extruded and drawn to high hardness and in this respect it is superior to the silicon bronzes 40 used at present.
- the alloy is superior to the present phosphor bronzes because it can be heat treated. It likewise has a higher creep strength than phosphor bronzes and will not be so readily softened by exposure to elevated temperatures.. This makes it possible for the alloy to be soldered without losing its strength.
- the alloy Because of its high strength, good conductivity and high resistance to heat softening the alloy is well suited for use as resistance welding electrodes and dies, soldering iron tips, springs and electric current carrying parts.' There are many init well suited for gas welding and arc welding rods.
- An electric contacting member composed of about .05 to 10% manganese, 05 to 5% phosphorus and the remainder copper.
- An electric contacting member composed of about .05 to 10% manganese, .05 to 5% phosphorus and the remainder substantially all copper characterized by high strength and hardness, good electrical and heat conductivity and high resistance to softening at elevated temperatures.
- An electric contacting member composed of about 0.4 to 5% manganese, 0.1 to 0.75% phosphorus and the balance copper.
- a resistance welding electrode composed of about .05 to 10% manganese, .05 to 5% phosphorus and the remainder copper.
- a resistance welding electrode composed of about .05 to 10% manganese, .05 to 5% phosphorus and the remainder substantially all copper characterized by high strength and hardness, good electric and heat conductivity and high resistance to softening at elevated temperatures.
- a resistance welding electrode composed lof about 0.4 to 5.0% manganese, 0.1 to 0.75% phosphorous and the balance copper.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Description
July 12, 193s.`
GOPPR BAs ALLoYs Filed June 12, 1.936
F. n ggNsEL ET AL Hman/55s -Hoc/rwm A10 'zo .so 4a,
TOTAL HOURS 174555Z)4 A auf/ym@ fwn mfc-,mko /lr 45m:
. 31@ z 'FormV Hou/Ps -flEa vlNvlEN-roi'es .751111Z 7?. Hensel r' aviar] 'Z me,
A ORN Patented July 12, 1938 UNITED STATES PATENT or-FlcE corri-:a misa ALLoYs Application June 12, 1936,'seria1 No. s4,sss
6 Claims.
This invention relates to alloys and more particularly to copper base alloys of improved characteristics.
An object of the invention is to provide a high quality copper base alloy of inexpensive ingredients.
A further object is to provide an alloy, the physical properties of which can be improved by heat treatment.
An additional object is to provide an alloy which can be easily cast.
Other objects of the invention will be apparent from the following description taken in connection with the appended claims.
The present invention comprises the combination of elements, methods o'f manufacture, and the product thereof brought out and exemplied in the disclosure hereinafter set forth, the scope of the invention being indicated in the appended 2o claims.
lWhile a preferred embodiment of the invention is described herein, it is contemplated that considerable variation may be made in the method of procedure and the combination of elements 25 without departing from the spirit of the invention.
The invention may be better understood from the following description when read in conJunction with the accompanying drawing in which:
Figure l is a graph illustrating the improvement in hardness of the alloy disclosed herein with heat treatment; and
Figure 2 is a graph illustrating the improvev ment in electrical conductivity of said alloy with 35. h eat treatment.
vWe have found that by adding manganese and phosphorus to copper or to alpha alloys of copper an intermetallic compound of manganese phosphide can be formed which has a variable 40 solid solubility in the copper matrix. We have,
` therefore, been able to produce copper alloys containing these ingredients which may be greatly improved in hardness and electrical conductivity by a suitable age-hardening process.
The ingredients used are very economical and have been found to introduce no serious diillculties in manufacture. The alloy can'be produced by any of the standard manufacturing methods. For example, it is possible to add the manganese 50 .in the form of cupro-manganese. The phosphorus may be introduced in a standard manner such. as a. 15% phosphor-copper hardener alloy.
The proportions of manganese and phosphorus 55 may each be varied over a considerable range of values and there may be an excess of either in some instances without deleterious effects on the alloy. A suitable ratio of phosphorus to manganese is 1 to 4. However, considerable age hardening is obtained with a ratio of 1 to 2 and 5 also with a ratio as high as 1 to 20.
A slight excess of phosphorus above the amount required to form the intermetallic compound of manganese phosphide with the manganese will ordinarily serve as a deoxidizing agent during the 10 production of the alloy.
As previously stated the manganese phosphide is suitable as a hardening ingredientl for copper or the alpha alloys of copper. Additional ingredients may likewise be added in some instances 15 to produce certain beneficial effects.
Where the manganese and phosphorus are added to substantially'pure copper the ingredients may be present in'the following ranges of proportions:l
Manganese 0.05% to 10% Phosphorus 0.05% to 5% Copper balance The most suitable proportions, however, will fall within the following Manganese 0.4 to 5.0% Phosphorus 0.1 to 0.75% Copper balance Where alpha alloys of copper are used or where the other additions are included, the proportions of manganese and phosphorus may preferably be substantially the same as given above.
In the production of the alloy and the subsequent treatment thereof to improve the electrical, mechanical and thermal characteristics the following procedure may suitably be followed:
After the alloy has been produced it may be heated to a relatively high temperature, preferably in the order of 800 C. to 1000* C. and then 40 rapidly cooled from that temperature to room temperature or below, preferably by quenching in water. After the quenching operation the alloy, in such form as may be desired, may be given an aging treatment by baking at a temperature below '700 C. and preferably at a temperature in the order of 350 C. to 550 C. The aging may proceed for a considerable length of time according to the temperature used. The greatest improvement in hardness and electrical conductivity will be obtained during the flrst two or three hours if 450 C. is used as aging temperature but further improvement may be noted upon continuing the aging for 8 to 16 hours or more.
The improvement in hardness and electricalv conductivity during aging is shown in the graphs (Figures 1 and 2) for certain alloys made according to the present invention. Curves Il, Il, I2
5 and I3 represent the improvement in characteristics of an alloy containing 0.5% manganese, 0.28% phosphorus and the balance copper. It will be noted that this alloy has a ratio of phosphorus to manganese of approximately 1 to 2.
In Figure l the curves I0, H and I2 represent the increase ln Rockwell B hardness of specimens quenched from 900 C., 950 C. and 1000 C. respectively. It will be noted that in all cases the hardness was increased from between 30 and 40 Rockwell B immediately after quenching to between 70 and B0 Rockwell B after aging for 5 to 10 hours at 450 C. y
Further aging at this temperature did not materially affect the hardness of the alloy, but as will be noted from curve I3 of Figure 2, the electrical conductivity steadily increased during aging for 16 hours or more.
It will be noted that the-conductivity increases from about 23% immediately after quenching 25 from 950 C. to 38% after I16 hours aging at Curve Il in Figure 1 represents the increase in hardness obtained during aging in specimens of an alloy containing 3.65% manganese, 0.18%
phosphorus and the balance copper. 'I'his alloy has a ratio of phosphorus to manganese of 1 to 20.
The alloy of the present invention is very economical to produce and results in a material of high strength, high hardness, good electrical and heat conductivity and high resistancefto 'corrosion. Y
The material can be easily forged. It can also be extruded and drawn to high hardness and in this respect it is superior to the silicon bronzes 40 used at present.
The alloy is superior to the present phosphor bronzes because it can be heat treated. It likewise has a higher creep strength than phosphor bronzes and will not be so readily softened by exposure to elevated temperatures.. This makes it possible for the alloy to be soldered without losing its strength.
Because of its high strength, good conductivity and high resistance to heat softening the alloy is well suited for use as resistance welding electrodes and dies, soldering iron tips, springs and electric current carrying parts.' There are many init well suited for gas welding and arc welding rods.
Because of its high resistance to atmospheric attack and also to salt water corrosiom'it is suggested as suitable for many marine applications.
While the present invention, as to its objects and advantages, has been described herein as carried out in specific embodiments thereof, it is not desired to be limited thereby butit is intended to cover the invention broadly within the spirit and scope of the appended claims.
' What is claimed is:
1. An electric contacting member composed of about .05 to 10% manganese, 05 to 5% phosphorus and the remainder copper.
2. An electric contacting member composed of about .05 to 10% manganese, .05 to 5% phosphorus and the remainder substantially all copper characterized by high strength and hardness, good electrical and heat conductivity and high resistance to softening at elevated temperatures.
3. An electric contacting member composed of about 0.4 to 5% manganese, 0.1 to 0.75% phosphorus and the balance copper. Y
' 4. A resistance welding electrode composed of about .05 to 10% manganese, .05 to 5% phosphorus and the remainder copper.
5. A resistance welding electrode composed of about .05 to 10% manganese, .05 to 5% phosphorus and the remainder substantially all copper characterized by high strength and hardness, good electric and heat conductivity and high resistance to softening at elevated temperatures.
6. A resistance welding electrode composed lof about 0.4 to 5.0% manganese, 0.1 to 0.75% phosphorous and the balance copper.
FRANZ R. HENSEL. EARL I. LARsEN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84838A US2123628A (en) | 1936-06-12 | 1936-06-12 | Copper base alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84838A US2123628A (en) | 1936-06-12 | 1936-06-12 | Copper base alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2123628A true US2123628A (en) | 1938-07-12 |
Family
ID=22187532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US84838A Expired - Lifetime US2123628A (en) | 1936-06-12 | 1936-06-12 | Copper base alloys |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2123628A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2712992A (en) * | 1953-11-16 | 1955-07-12 | Olin Mathiason Chemical Corp | Copper-base alloy |
| DE1758122A1 (en) * | 1967-06-26 | 1971-01-14 | Olin Mathieson | Copper alloy and process for its manufacture |
| US3928028A (en) * | 1974-04-05 | 1975-12-23 | Olin Corp | Grain refinement of copper alloys by phosphide inoculation |
| US3976477A (en) * | 1974-12-23 | 1976-08-24 | Olin Corporation | High conductivity high temperature copper alloy |
| US4605532A (en) * | 1984-08-31 | 1986-08-12 | Olin Corporation | Copper alloys having an improved combination of strength and conductivity |
| US5390722A (en) * | 1993-01-29 | 1995-02-21 | Olin Corporation | Spray cast copper composites |
| US5489417A (en) * | 1992-09-02 | 1996-02-06 | Olin Corporation | Spray cast copper-manganese-zirconium alloys having reduced porosity |
| US6202703B1 (en) * | 1993-05-27 | 2001-03-20 | Kabushiki Kaisha Kobe Seiko Sho | Corrosion resistant copper alloy tube and fin-tube heat exchanger |
-
1936
- 1936-06-12 US US84838A patent/US2123628A/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2712992A (en) * | 1953-11-16 | 1955-07-12 | Olin Mathiason Chemical Corp | Copper-base alloy |
| DE1758122A1 (en) * | 1967-06-26 | 1971-01-14 | Olin Mathieson | Copper alloy and process for its manufacture |
| US3928028A (en) * | 1974-04-05 | 1975-12-23 | Olin Corp | Grain refinement of copper alloys by phosphide inoculation |
| US3976477A (en) * | 1974-12-23 | 1976-08-24 | Olin Corporation | High conductivity high temperature copper alloy |
| US4605532A (en) * | 1984-08-31 | 1986-08-12 | Olin Corporation | Copper alloys having an improved combination of strength and conductivity |
| US5489417A (en) * | 1992-09-02 | 1996-02-06 | Olin Corporation | Spray cast copper-manganese-zirconium alloys having reduced porosity |
| US5390722A (en) * | 1993-01-29 | 1995-02-21 | Olin Corporation | Spray cast copper composites |
| US6202703B1 (en) * | 1993-05-27 | 2001-03-20 | Kabushiki Kaisha Kobe Seiko Sho | Corrosion resistant copper alloy tube and fin-tube heat exchanger |
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