US20230230866A1 - Transfer conveyor system for semiconductor inspecting apparatus using moving magnet - Google Patents

Transfer conveyor system for semiconductor inspecting apparatus using moving magnet Download PDF

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Publication number
US20230230866A1
US20230230866A1 US17/592,536 US202217592536A US2023230866A1 US 20230230866 A1 US20230230866 A1 US 20230230866A1 US 202217592536 A US202217592536 A US 202217592536A US 2023230866 A1 US2023230866 A1 US 2023230866A1
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carrier
armature
conveyor system
transfer conveyor
sensor
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English (en)
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Hong Youn KIM
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Zeus Tech Co Ltd
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Zeus Tech Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/08—Electromagnets; Actuators including electromagnets with armatures
    • H01F7/16—Rectilinearly-movable armatures
    • H01F7/1638—Armatures not entering the winding
    • H01F7/1646—Armatures or stationary parts of magnetic circuit having permanent magnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0266—Control or detection relating to the load carrier(s)
    • B65G2203/0283—Position of the load carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B65G2203/042—Sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/08—Electromagnets; Actuators including electromagnets with armatures
    • H01F7/16—Rectilinearly-movable armatures
    • H01F2007/1684—Armature position measurement using coils

Definitions

  • the present invention relates to a transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet, and more specifically, to a transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet which allows an abrasion degree, a damage state, or an alignment/misalignment of a carrier to be rapidly and easily detected so that a replacement time and rebalancing of the carrier are predictable and diagnosable.
  • LDM linear direct-current motor
  • LSM linear synchronous motor
  • a transfer system using a permanent magnet as a stator and a coil as a mover carrier including the stator and the mover
  • the transfer system may be applied to transport and logistics fields in which high-precision and high-speed characteristics can be utilized, in particular, transfer/transport systems for semiconductor inspecting apparatuses.
  • a commutation Hall sensor and an optical or magnetic linear scale are mounted on an armature mover to acquire speed and position information of the mover, or a position sensor such as an encoder or resolver is used for the mover to estimate a speed using an M-type measurement method, a T-type measurement method, or an M/T-type measurement method.
  • the present invention is directed to providing a transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet, in which an armature including a moving magnet and a stator including a motor coil are provided to reduce a load of a carrier and thus implement a high-precision and high-speed transfer, an existing encoder and an existing resolver are removed to reduce costs and improve installation difficulties, and a degree of vibration of the carrier and precise transfer position information are detected in real time to facilitate a predictive diagnosis, thereby increasing inspection yield and reducing product unit costs.
  • a transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet including a carrier in which a semiconductor wafer or a substrate is transferred by being mounted and accommodated, an armature which is provided to be accommodated in a permanent magnet plate under the carrier and includes a plurality of permanent magnets disposed in a longitudinal direction of the carrier, a stator which is disposed to be spaced apart from the armature, is fixedly installed on a guide rail, and includes a plurality of motor coils configured to interact with a magnetic field generated by the permanent magnet, a sensor unit which is installed at each of two ends of each motor coil, detects whether the armature approaches, senses a variation of the magnetic field, and measures a position of the armature from speed information of the armature, and a carrier monitoring unit which is provided on the carrier and monitors the carrier to detect an abrasion degree, a damage state, or an alignment/misalignment of the carrier in real time.
  • two Hall sensors may be disposed in a multi-layered stack structure.
  • the Hall sensors may be disposed at intervals of 90° to generate sine waves, a rising and falling period of a signal of the Hall sensor may be set as a speed measurement period to calculate a rotational speed of a motor, and the calculated rotational speed may be integrated to measure the position of the armature.
  • the carrier monitoring unit may include a speed sensor configured to measure a speed and acceleration, a pressure sensor configured to measure pressure, a temperature/humidity sensor configured to detect temperature/humidity of an outer surface of the carrier and temperature/humidity of the carrier, an inclination angle sensor configured to measure inclination, and a frequency detection sensor configured to detect revolutions per minute and a degree of vibration of the carrier from a measurement frequency measured in the carrier.
  • the carrier monitoring unit may be packaged in a single body, and long coupling holes may be formed in both end portions of the single body.
  • the carrier monitoring unit may further include an impact sensor configured to detect an impact transmitted to the carrier, and a noise sensor configured to detect noise from a natural frequency.
  • a parameter value of the measurement frequency may be any one of a root mean square (RMS) value, a peak value, and a fast Fourier transform (FFT) conversion value.
  • RMS root mean square
  • FFT fast Fourier transform
  • the frequency detection sensor may output a warning alarm.
  • the frequency detection sensor may stop an operation of the carrier.
  • FIG. 1 is a block diagram of a transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 2 is an image of the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 3 shows diagrams illustrating a magnetic flux density of an armature being sensed through a Hall sensor in the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 4 shows diagrams illustrating an example of an operation method of the armature and a sensor signal in the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 5 is a front view of a carrier monitoring unit in the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 6 is a diagram illustrating an example of a configuration for monitoring position information through the carrier monitoring unit of the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 7 shows diagrams illustrating an example of a configuration for detecting a measurement frequency through the carrier monitoring unit of the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 1 is a block diagram of a transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 2 is an image of the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 3 shows diagrams illustrating a magnetic flux density of an armature being sensed through a Hall sensor in the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 4 shows diagrams illustrating an example of an operation method of the armature and a sensor signal in the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 5 is a front view of a carrier monitoring unit in the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet may include a carrier 15 in which a semiconductor wafer or a substrate is seated and accommodated and which is transferred, an armature 10 which is provided to be accommodated in a permanent magnet plate 11 under the carrier 15 and includes a plurality of permanent magnets disposed in a longitudinal direction of the carrier 15 , a stator 20 which is disposed to be spaced apart from the armature 10 , is fixedly installed on a guide rail 40 , and includes a plurality of motor coils configured to interact with a magnetic field generated by the permanent magnet, a sensor unit which is installed at each of two ends of each motor coil, detects whether the armature 10 approaches, senses a variation of the magnetic field, and measures a position of the armature 10 from speed information of the armature, and a carrier monitoring unit 410 which is provided on the carrier 15 and monitors the carrier 15 to detect an abrasion degree, a damage state
  • the carrier 15 is a part in which the semiconductor wafer or the substrate is seated and accommodated and which is transferred.
  • the carrier 15 may be applied in transferring substrates of a liquid crystal display (LCD), a flat panel display (FPD), and the like which are not semiconductor objects to be inspected.
  • LCD liquid crystal display
  • FPD flat panel display
  • the permanent magnet plate 11 may be coupled to a lower portion of the carrier 15 .
  • the carrier 15 may be transferred by being guided by the guide rail 40 .
  • the armature 10 may include the plurality of permanent magnets disposed in the longitudinal direction of the carrier 15 .
  • the armature 10 may be provided to be accommodated in the permanent magnet plate 11 .
  • the stator 20 may be disposed to be spaced apart from the armature 10 .
  • the stator 20 may be disposed to be spaced apart from the armature 10 , may be fixedly installed on the guide rail 40 , and may include the plurality of motor coils interacting with the magnetic field generated by the permanent magnet.
  • the transfer conveyor system may include a node controller, a sensor signal distributor (SSD) connected to the motor coil, and an upper controller connected to the node controller and the SSD.
  • SSD sensor signal distributor
  • the armature 10 including a moving magnet and the stator 20 including the motor coil are provided, as compared with an existing linear synchronous motor (LSM)-type linear motor structure in which an armature including a coil is selected as a mover, it is possible to relatively reduce a weight, remove a power supply component including a drive connected to the motor coil, and remove a position sensor, a communication Hall sensor, and the like from the armature, thereby reducing a motor load. Accordingly, a load of the carrier 15 can be reduced to thus implement a high-precision and high-speed transfer.
  • LSM linear synchronous motor
  • an existing LSM structure is operated by being mounted with a position sensor, a communication Hall sensor, and the like, which has caused an increase in motor load.
  • the sensor unit 30 may be installed at each of the two ends of each motor coil, may detect whether the armature 10 approaches, and may sense the variation of the magnetic field, and may measure the position of the armature 10 from the speed information of the armature.
  • the sensor unit 30 may include two Hall sensors at one of two ends of a coil.
  • the Hall sensors 30 may be disposed in a vertical stacking method. Such two Hall sensors 30 may be disposed at intervals of 90° to generate sine waves. A rising and falling period of a signal of each Hall sensor may be set as a speed measurement period to calculate a speed of the armature 10 , and the calculated speed may be integrated to measure a position of the armature 10 .
  • one Hall sensor may function as a proximity sensor (configured to detect whether the armature 10 approaches), and as shown in FIG. 3 , the Hall sensor at a lower side may be used to sense a vector magnetic flux density of the permanent magnet. Then, when the armature 10 passes through the stator 20 , sensor signals are added to detect a position of the armature 10 .
  • each armature may be informed of a position using a proximity sensor, and thus, a position signal and a U, V, W commutation signal may be generated.
  • linear motor unit 300 having such a configuration, it is possible to reduce a defect rate due to dust in a clean environment and suppress vibration in a processing process as compared with a conventional ball screw transfer system and a conventional belt conveyor transfer system.
  • the carrier monitoring unit 410 may be provided.
  • the carrier monitoring unit 410 may include a speed sensor 413 which measures a speed and acceleration, a pressure sensor 415 which measures pressure, a temperature/humidity sensor 411 which detects temperature/humidity of the carrier 15 , an inclination angle sensor 416 which measures inclination, and a frequency detection sensor 412 which detects a degree of vibration of the carrier 15 from a measurement frequency measured in the carrier 15 .
  • the carrier monitoring unit 410 may further include an impact sensor (not shown) which detects an impact transmitted to the carrier 15 and a noise sensor 414 which detects noise from a natural frequency.
  • the carrier monitoring unit 410 is packaged in a single body 401 as mainly shown in FIG. 5 , and long coupling holes 402 may be formed in both end portions of the single body 401 .
  • the carrier monitoring unit 410 may be detachably attached to the carrier 15 using the long coupling holes 402 .
  • the speed sensor 413 may provide notification of a minute displacement behavior of the carrier 15 .
  • the pressure sensor 415 may monitor an intensity or the like of an external force applied to the carrier 15 .
  • the temperature/humidity sensor 411 may provide temperature/humidity information about a transfer environment.
  • the inclination angle sensor 416 may measure inclination of the carrier 15 .
  • An abnormal behavior and a fault diagnosis of the carrier 15 may be predicted in advance.
  • the frequency detection sensor 412 serves to detect the degree of vibration of the carrier 15 from the measurement frequency measured by the carrier 15 .
  • a parameter value of the measurement frequency may be any one of a root mean square (RMS) value, a peak value, and a fast Fourier transform (FFT) conversion value.
  • RMS root mean square
  • FFT fast Fourier transform
  • the frequency detection sensor 412 may output a warning alarm signal.
  • the frequency detection sensor 412 may output a signal for stopping an operation of the carrier 15 .
  • a degree of vibration and precise transfer position information of the carrier 15 can be detected in real time to facilitate a predictive diagnosis.
  • FIG. 6 is a diagram illustrating an example of a configuration for monitoring position information through the carrier monitoring unit of the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • FIG. 7 shows diagrams illustrating an example of a configuration for detecting a measurement frequency through the carrier monitoring unit of the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet according to one embodiment of the present invention.
  • a monitoring user interface (UI) of the transfer conveyor system for a semiconductor inspecting apparatus using a moving magnet may be built. Temperature and humidity information of a system, driving revolutions per minute (RPM) of a linear motor, displacement, and the like may be detected on a screen in real time. For example, when a displacement amount deviates from a small circle, it indicates a warning alarm stage, and when a displacement amount deviates from a large circle, an operation stop signal may be output.
  • RPM revolutions per minute
  • the frequency detection sensor 412 may sense vibration information of X-, Y-, and Z-axes according to a time.
  • a natural frequency of the carrier 15 may be measured through the frequency detection sensor 412 to detect an RMS value of a measurement frequency of the carrier 15 .
  • a peak value of the measurement frequency may be used to monitor whether the carrier 15 is at a dangerous level or an immediate stop state.
  • an FFT conversion value of the measurement frequency may be used. As shown in FIG. 7 , FFT may be performed on the measurement frequency to obtain an FFT conversion value, and the FFT conversion value may be monitored and compared with first and second thresholds preset for each specific band in real time to monitor an abnormal transfer state, thereby immediately stopping an operation.
  • the carrier monitoring unit 410 may be connected to a monitoring program through a separate gateway (not shown) provided for transmitting/receiving. Through the monitoring program, after an error is diagnosed from the sensed measurement frequency, a replacement time of the carrier 15 may be predicted and diagnosed, or the carrier 15 may be overhauled.
  • the armature 10 including a moving magnet and the stator 20 including the motor coil can be provided to reduce a load of the carrier 15 and thus implement a high-precision and high-speed transfer, an existing encoder and an existing resolver can be removed to reduce costs and improve installation difficulties, and a degree of vibration of the carrier 15 and precise transfer position information can be detected in real time to facilitate a predictive diagnosis, thereby increasing inspection yield and reducing product unit costs.
  • the carrier 15 is driven through a linear motor instead of a conventional rotary type drive actuator, thereby implementing higher precision and suppressing vibration during processing.
  • an armature including a moving magnet and a stator including a motor coil can be provided to reduce a load of a carrier and thus implement a high-precision and high-speed transfer, an existing encoder and an existing resolver can be removed to reduce costs and improve installation difficulties, and a degree of vibration of the carrier and precise transfer position information can be detected in real time to facilitate a predictive diagnosis, thereby increasing inspection yield and reducing product unit costs.
  • armature 11 permanent magnet plate 15 : carrier 20 : stator 30 : sensor unit 40 : guide rail 400 : carrier monitoring unit 401 : single body 402 : long coupling hole 410 : carrier monitoring unit 411 : temperature/humidity sensor 412 : frequency detection sensor 413 : speed sensor 414 : noise sensor 415 : pressure sensor 416 : inclination angle sensor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Linear Motors (AREA)
  • Non-Mechanical Conveyors (AREA)
US17/592,536 2022-01-06 2022-02-04 Transfer conveyor system for semiconductor inspecting apparatus using moving magnet Pending US20230230866A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0002372 2022-01-06
KR1020220002372A KR20230106460A (ko) 2022-01-06 2022-01-06 무빙마그넷을 이용한 반도체 검사장비용 이송컨베이어 시스템

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