US20230087151A1 - Field plate arrangement for trench gate fet - Google Patents
Field plate arrangement for trench gate fet Download PDFInfo
- Publication number
- US20230087151A1 US20230087151A1 US17/502,692 US202117502692A US2023087151A1 US 20230087151 A1 US20230087151 A1 US 20230087151A1 US 202117502692 A US202117502692 A US 202117502692A US 2023087151 A1 US2023087151 A1 US 2023087151A1
- Authority
- US
- United States
- Prior art keywords
- trench
- gate
- field plate
- dielectric layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 54
- 229920005591 polysilicon Polymers 0.000 claims abstract description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 31
- 210000000746 body region Anatomy 0.000 claims abstract description 30
- 239000002344 surface layer Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000003989 dielectric material Substances 0.000 claims abstract description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 3
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 89
- 238000000034 method Methods 0.000 claims description 57
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 21
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000007792 addition Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 244000208734 Pisonia aculeata Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
Definitions
- This Disclosure relates to semiconductor devices, more particularly to vertical trench gate metal oxide semiconductor field effect transistors (MOSFETs).
- MOSFETs vertical trench gate metal oxide semiconductor field effect transistors
- One type of power MOSFET is a trench gate MOSFET which is designed to handle significant power and to provide a high-power drive capability by vertically conducting current from a top surface to a bottom surface of the semiconductor die.
- the trench gate MOSFET in its active region generally includes a large number of parallel connected active trench gate MOSFET cells each including a trench formed in the semiconductor die, with each active trench having surrounding source regions and oppositely-doped body regions, and where the trenches are deep enough to cross through the body regions to a drift region below the top surface of the semiconductor die.
- Each active trench gate cell has a gate stack buried in the trench comprising a gate electrode generally including doped polysilicon and a gate dielectric.
- the gate electrodes when appropriately biased controls the current conduction in the body region in their vicinity by virtue of the field effect that enables the MOSFET cells to be turned on, thus enabling current to flow between the source and the drain that has a drain contact on a bottom side of the semiconductor die.
- Future generation trench gate MOSFETS may require a 2 ⁇ thicker field plate dielectric layer along the trench (trench wall dielectric) to accommodate a 100 V operating voltage as compared to 45 V technology, the thicker field plate dielectric providing a higher dielectric breakdown voltage.
- a thicker trench wall dielectric layer may result in significant recess in the top portion of the sidewall of the trench wall dielectric layer during a wet etch process that takes place before a bottom dielectric (e.g., silicon oxide) layer is grown to isolate the gate electrode from the field plate.
- This undercut can result in defects in the gate dielectric in which the gate dielectric is significantly thinner in the recess than at the rest of the gate electrode, degrading the electrical isolation between the gate electrode and the field plate. Such defects can cause significant current leakage between the gate and the source, resulting in yield loss.
- a baseline device may have a field plate with two widths (a double-width field plate)
- the addition of the thin trench wall dielectric layer portion results in a field plate with three different widths (a triple-width field plate) a corresponding trench wall dielectric layer with three different thicknesses along the field plate in the height/thickness direction of the trench.
- examples are described herein having three different polysilicon widths for the field plate, it is possible to also have four or more polysilicon widths for the field plate.
- Disclosed aspects include a trench gate MOSFET device that has a substrate with a semiconductor surface layer doped a first conductivity type. At least one trench gate MOSFET cell is located in or over the semiconductor surface layer, and includes a body region in the semiconductor surface layer doped a second conductivity type, and a source region on top of the body region doped the first conductivity type.
- a trench extends down from a top side of the semiconductor surface layer, the trench abutting the body region and being lined with a dielectric material.
- a field plate that includes polysilicon is located in the trench, and a gate electrode is located over the field plate. The field plate has a bottom portion, a middle portion, and a top portion, wherein the bottom portion is narrower than the middle portion, and the middle portion is narrower than the top portion.
- Disclosed aspects further include a method of fabricating a transistor.
- the method includes forming a plurality of trenches in a semiconductor layer over a semiconductor substrate, the plurality of trenches including a first trench and a second trench.
- a gate dielectric layer is formed on first and second sidewalls of the trench, and a gate electrode between the first and second sidewalls.
- a dielectric liner is formed on the first and second sidewalls, the dielectric liner having a first portion at a bottom of the trench with a first thickness, a second portion between the first portion and the gate dielectric layer with a second thickness less than the first thickness, and a third portion between the second portion and the gate dielectric layer with a third thickness less than the second thickness.
- a conductive field plate is formed in the trench, the field plate having a bottom portion with a first width, a middle portion between the bottom portion and the gate electrode with a second width greater than the first width, and a top portion between the middle portion and the gate electrode with a third width greater than the second width.
- FIG. 1 depicts a high-level top view depiction of a disclosed vertical trench gate MOSFET device having a plurality of active trench gate MOSFET cells in an active region of the die along with an outer junction termination trench that provides a junction termination region which surrounds the active region of the device, where the polysilicon gates are shown by example being parallel to one another.
- FIG. 2 is a cross sectional view along the cutline A-A′ shown in FIG. 1 that shows an example trench gate n-channel MOSFET device having a triple width field plate.
- FIGS. 3 A- 3 I show successive cross-sectional views for an in-process disclosed trench gate n-channel MOSFET device having active trench gate cells with a triple width field plate, corresponding to steps in a first example method of forming the trench gate n-channel MOSFET device shown in FIG. 2 .
- FIGS. 4 A- 4 I show successive cross-sectional views for an in-process disclosed trench gate n-channel MOSFET device having active trench gate cells with a triple width field plate, corresponding to steps in a second example method of forming the trench gate n-channel MOSFET device shown in FIG. 2 .
- connection can be through a direct electrical connection where there are only parasitics in the pathway, or through an indirect electrical connection via intervening items including other devices and connections.
- intervening item generally does not modify the information of a signal
- FIG. 1 depicts an enhanced high-level top view depiction of a disclosed vertical trench gate n-channel MOSFET device 100 shown with an optional outer gate junction termination trench 130 which provides a junction termination region that surrounds the active region having the plurality of active trench gate MOSFET cells 105 shown each having a polysilicon gate 105 a .
- NMOS transistors are generally described herein, it should be clear to one having ordinary skill in the art to use this information disclosed in this application to also form PMOS transistors, by n-doped regions being substituted by p-doped regions, and vice versa.
- the active region has a plurality of active trench gate MOSFET cells 105 with their polysilicon gates 105 a shown, with their length direction being oriented parallel to one another.
- the trench gate MOSFET device 100 is shown formed on a substrate 109 , e.g. n+ doped (about 10 19 cm ⁇ 3 to about 10 21 cm ⁇ 3 ), that provides a drain for the device 100 .
- the substrate 109 has having an epitaxial surface layer 108 thereon of the same conductivity type and lightly doped (about 10 14 cm ⁇ 3 to about 10 18 cm ⁇ 3 ).
- there is generally a metal drain contact layer (e.g., Ti/Ni/Ag) on the bottom side of the substrate 109 .
- the junction termination trench 130 provides the junction termination region that surrounds the active region for the MOSFET device 100 that enables the MOSFET device 100 to sustain a higher drain to source breakdown voltage (BV).
- the junction termination trench 130 is generally connected to a field plate 105 b ( FIG. 2 ), e.g., comprising polysilicon, in the active trench gate MOSFET cells and the source.
- the active area as described below in FIG. 2 (shown as 210 ) has body regions 102 and first doped regions 103 , also referred to as source(s) 103 , within the body regions 102 to provide a MOSFET device structure that enables turning on the active trench gate MOSFET cells 105 with a proper gate-to-body region bias to form a conduction channel which enables current to flow between the source regions 103 through the surface layer 108 as a drift region to the substrate 109 (e.g., functioning as a drain).
- the body regions 102 may be p-type with a dopant concentration in a range from about 10 17 cm ⁇ 3 to about 10 19 cm ⁇ 3
- the source regions 103 may be n-type with a dopant concentration in a range from about 10 19 cm ⁇ 3 to about 10 21 cm ⁇ 3 .
- FIG. 2 is a cross sectional view taken along the cut line 2 - 2 shown in FIG. 1 that shows an example trench gate n-channel MOSFET device's (trench gate MOSFET device) 200 in the active area 210 , with a plurality of active trench gate MOSFET cells 105 (shown as two cells for a simplified example) each having a triple width field plate 105 b .
- the trench gate MOSFET device 200 can comprise a discrete device that only includes the plurality of active trench gate MOSFET cells 105 .
- the trench gate MOSFET device can comprise an integrated circuit (IC).
- the IC can include a gate driver with a plurality of trench gate MOSFET cells 105 hooked up in parallel being all driven by the gate driver.
- the field plate 105 b comprises a bottom portion 105 b 1 , a middle portion 105 b 2 , and a top portion 105 b 3 , all in the active area 210 of the trench gate MOSFET device 200 .
- a trench wall dielectric layer 105 c e.g. silicon oxide, comprises a bottom portion 105 c 1 , a middle portion 105 c 2 , and a top portion 105 c 3 .
- the triple width arrangement of the field plate 105 b is distinct from a double width field plate structure without a breakdown voltage degradation.
- the top portion 105 c 3 of the trench dielectric wall dielectric 105 b because it occupies a comparatively small portion of the trench wall dielectric's total height, has a generally minimal impact on the BV between the gate electrode 105 a and the source region 103 , which is typically conductively connected on the semiconductor die to the field plate.
- the height (in a direction normal to the top surface of the surface layer 108 ) of the bottom portion 105 b 1 may be in a range from 3 ⁇ m to 4 ⁇ m
- the height of the middle portion 105 b 2 may be in a range from 0.7 ⁇ m to 1.5 ⁇ m
- the height of the top portion 105 c 3 may be in a range from 1,000 ⁇ to 5,000 ⁇
- the total height of the field plate 105 b may be in a range from 3.8 ⁇ m to 5.6 ⁇ m.
- the thickness (parallel to the top surface of the surface layer 108 ) of the bottom portion 105 b 1 may be in a range from 1,000 ⁇ to 3,000 ⁇
- the thickness of the middle portion 105 b 2 may be in a range from 5,000 ⁇ to 11,000 ⁇
- the thickness of the top portion 105 b 3 may be in a range from 7,000 ⁇ to 13,000 ⁇ .
- the thickness (parallel to the top surface of the surface layer 108 ) of the bottom portion 105 c 1 of the trench wall dielectric layer 105 c may be in a range from 3,000 ⁇ to 8,000 ⁇
- the thickness of the middle portion 105 c 2 may be in a range from 1,500 ⁇ to 2,500 ⁇
- the thickness of the top portion 105 c 3 may be in a range from 700 ⁇ to 1,300 ⁇ .
- the height of the bottom portion 105 b 1 may be about 3.4 ⁇ m
- the height of the middle portion 105 b 2 may be about 1.1 ⁇ m
- the height of the top portion may be about 3,000 ⁇
- the thickness of the bottom portion 105 b 1 may be about 2,000 ⁇
- the thickness of the middle portion 105 b 2 may be about 8,000 ⁇
- the thickness of the top portion 105 b 3 may be about 1 ⁇ m
- the thickness of the bottom portion 105 c 1 may be about 5,000 ⁇
- the thickness of the middle portion 105 c 2 may be about 2,000 ⁇
- the thickness of the top portion 105 c 3 may be about 1,000 ⁇
- the field plates 105 b are formed from doped polysilicon
- the polysilicon can be doped (e.g., n+ or p+), which can comprise in-situ doping during the polysilicon deposition, or ion implantation of undoped polysilicon with one or more dopant ions.
- the field plate 105 b does not conduct any electrical current during trench gate MOSFET device operation, the field plate can also comprise undoped polysilicon.
- the source regions 103 are shown as n+ doped for acting as a source for the active trench gate MOSFET cells 105 formed with the body regions 102 .
- the active trench MOSFET cells 105 generally have a polysilicon gate 105 a with a gate dielectric layer 105 d below the polysilicon gate 105 a and between the sidewalls of the polysilicon gate 105 a and the body region 102 and the source region 103 .
- the total gate dielectric layer 105 d thickness may be in a range from 100 ⁇ to 10,000 ⁇ .
- the triple shield field plate 105 b portions 105 b 1 , 105 b 2 and 105 b 3 are shown below the gate dielectric layer 105 d under the polysilicon gate 105 a .
- the gate 105 a , the source region 103 , and the substrate 109 operates as a 3 -terminal trench gate MOSFET cell 105 , with the source region 103 being tied to the body region 102 .
- the polysilicon gates 105 a are optionally shown having gate recesses (indentations) that have a pre-metal dielectric (PMD) layer 124 above that also fills the gate recesses. Recessed gates may provide more process margin for the source contacts.
- the trench dielectric layer 105 c comprising portions 105 c 1 , 105 c 2 , and 105 c 3 can comprise thermal silicon oxide with a deposited dielectric layer thereon, that may also comprise silicon oxide, or another dielectric material such as silicon nitride or silicon oxynitride, or a material comprising a high-k dielectric (e.g., k>5) such as HfO 2 .
- a high-k dielectric e.g., k>5
- a metal 1 (M1) layer is over and fills contact apertures formed in the PMD layer 124 shown with a metal contact 118 a connecting the source region 103 and body region 102 of the active trench gate MOSFET cells 105 , and a metal contact 118 b providing a common connection to the polysilicon gates 105 a of the active trench gate MOSFET cells 105 .
- FIGS. 3 A- 3 I show successive cross-sectional views of an example in-process disclosed vertical trench gate n-channel MOSFET device with a triple width field plate for the active trench gate MOSFET device 200 shown in FIG. 2 comprising the trench gate MOSFET cells in the active area 210 of the MOSFET device.
- the process flow shown in FIGS. 3 A- 3 I creates a triple width field plate structure from bottom side to the top side by successively filling the trench with polysilicon followed by chemical mechanical polishing (CMP) and etching back.
- CMP chemical mechanical polishing
- FIG. 3 A shows a cross sectional view of the in-process trench gate MOSFET device after silicon trench etching in the surface layer 108 on a substrate 109 providing a drain, generally by Reactive Ion Etching (RIE) to form the trench apertures shown in the surface layer 108 .
- a patterned hard mask (HM) layer shown as HM layer 315 , such as comprising silicon nitride, is generally used in this step.
- HM layer 315 such as comprising silicon nitride
- the trench depth is generally 1 ⁇ m to 10 ⁇ m.
- FIG. 3 B shows a cross sectional view of the in-process trench gate MOSFET device after forming a trench dielectric layer shown as 105 c 1 , followed by a polysilicon deposition for forming a polysilicon layer 320 as an initial filler material of the active trench MOSFET gate cells in the active area 210 .
- the trench dielectric layer 105 c 1 is generally formed by growing a thermal oxide liner 500 ⁇ to 2,000 ⁇ thick followed by a sub-atmospheric chemical vapor deposition (SACVD) of silicon oxide generally 1,000 ⁇ to 5,000 ⁇ thick.
- SACVD sub-atmospheric chemical vapor deposition
- FIG. 3 C shows a cross sectional view of the in-process trench gate MOSFET cell after polysilicon CMP to remove polysilicon layer overburden outside the trenches, then a polysilicon etch-back process that exposes the trench gate MOSFET cells in the active area 210 , with the resulting polysilicon layer in the active area trenches now shown as 105 b 1 .
- FIG. 3 D shows a cross sectional view of the in-process trench gate MOSFET device after oxide pull back of the trench dielectric layer 105 c 1 in the active area 210 to form a thinned trench dielectric layer now shown as 105 c 2 .
- the oxide pull-back process generally comprises a wet etch.
- FIG. 3 E shows a cross sectional view of the in-process trench gate MOSFET device after forming a polysilicon layer 330 as a second filler material of the active trench MOSFET gate cells.
- a CMP process has been performed to remove the polysilicon layer 330 over the top surface of the dielectric layer 105 c .
- FIG. 3 F shows a cross sectional view of the in-process trench gate MOSFET device after a body implant (shown by arrows) that forms the body regions 102 at the surface of the surface layer 108 .
- FIG. 3 G shows the cross-sectional view of the in-process trench gate MOSFET device after ion implanting to form a source region 103 (e.g., a source) in the body regions 102 , then etching a portion of the second polysilicon layer 330 to provide the middle field plate polysilicon portion now shown as 105 b 2 .
- FIG. 3 H shows the cross-sectional view of the in-process trench gate MOSFET device after depositing a third polysilicon layer 340 as a third filler material of the active trench MOSFET gate cells.
- top field plate portion 105 b 3 that can be seen to be the widest of the field plate portions.
- Top field plate portion 105 b 3 completes the triple field plate for the trench gate MOSFET cells.
- FIG. 31 shows the cross-sectional view of the in-process trench gate MOSFET device after a thermal gate oxidation to form the gate dielectric layer 105 d , where as shown in FIG. 31 the gate dielectric layer 105 d will as shown generally grow thicker over the exposed top of the top field plate portion 105 b 3 as compared to the vertical channel region over the silicon mesa comprising the surface layer 108 between the trenches.
- the gate dielectric layer 105 d over the silicon be in a range from about 100 ⁇ (e.g., for 5 V operation) to about 1 , 000 A thick (for higher voltage device operation, e.g. 100 V).
- Gate polysilicon deposition and patterning follows to form the polysilicon gates 105 a shown with optional polysilicon gate recesses, followed by the deposition of the PMD layer 124 which also fills the gate recesses, followed by contact aperture formation through the PMD layer 124 to expose the source region 103 and body region 102 shown recessed into the silicon, and to expose the polysilicon gates 105 a .
- the polysilicon gates are doped.
- Metal 1 formation follows to provide metal contacts including metal contacts 118 a to source region 103 and body region 102 , and another metal contact that is not shown in FIG. 31 (see metal 118 b in FIG. 2 described above) which contacts the polysilicon gates 105 a .
- the metal for the metal contacts can comprise aluminum, or other metal materials such as tungsten or cobalt.
- FIGS. 4 A- 4 I illustrate an alternate method 500 of the disclosure for forming a triple width field plate structure that may be used in a trench gate MOSFET device.
- the method 500 uses a sacrificial layer, such as photoresist, to fill the trench instead of filling the trench with polysilicon as was shown in FIG. 3 B . While the following description of the method 500 uses photoresist as one example, those skilled in the pertinent art will appreciate that other sacrificial materials may be used, such as ARC (anti-reflective coating) or other organic spin-coatable material compatible with semiconductor processing.
- ARC anti-reflective coating
- FIG. 4 A illustrates the MOSFET cells 105 after forming the trench wall dielectric layer 105 c .
- the dielectric layer 105 c e.g. a thermal silicon oxide layer, has been formed on exposed surfaces of the surface layer 108 .
- FIG. 4 B photoresist 505 has been deposited over the substrate 109 and between vertical portions of the dielectric layer 105 c .
- FIG. 4 B illustrates the method 500 after an optional etch-back of the photoresist 505 that exposes the dielectric layer 105 c.
- FIG. 4 C illustrates the method 500 during and after removal of a first portion of the photoresist 505 , e.g. by an anisotropic plasma etch or ash process 510 .
- the removing exposes a top portion of the dielectric layer 105 c at and below a top surface of the surface layer 108 .
- an etch process 515 that is selective to silicon oxide removes a first portion of the dielectric layer 105 c that is not protected by the photoresist 505 .
- the etch process 515 may include, e.g. a buffered HF solution sufficiently diluted to provide process control.
- the etch process 515 thins the dielectric layer 105 c over the surface of the surface layer 108 and over the sidewalls of the trenches.
- FIG. 4 E illustrates the method 500 during and after removal of a second portion of the photoresist 505 , e.g. by an anisotropic plasma etch or ash process 520 .
- the removing exposes a middle portion of the dielectric layer 105 c below the top portion.
- an etch process 525 that is selective to silicon oxide removes a second portion of the dielectric layer 105 c that is not protected by the photoresist 505 .
- the etch process 525 may again include, e.g. a buffered HF solution.
- the etch process 525 further thins the dielectric layer 105 c over the surface of the surface layer 108 and over the sidewalls of the trenches, resulting in a thinner upper portion and a thicker middle portion of the dielectric layer 105 c within the trenches.
- FIG. 4 G illustrates the method 500 during and after removal of a third portion of the photoresist 505 , e.g. by an anisotropic plasma etch or ash process 530 .
- the removing exposes a bottom portion of the dielectric layer 105 c below the middle portion.
- the dielectric layer 105 c now has the bottom portion 105 c 1 , middle portion 105 c 2 and top portion 105 c 3 .
- FIG. 4 H a polysilicon layer 535 has been formed within the trenches and over the top surface of the surface layer 108 , e.g. by conventional means.
- FIG. 41 shows the method 500 after removal of a portion of the polysilicon layer 535 over the top surface of the surface layer 108 .
- the partial removing of the polysilicon layer 535 may include CMP and/or an etch process selective to polysilicon, and separates partially formed triple width field plates 540 , each having a bottom portion 541 , a middle portion 542 and a top portion 543 , respectively corresponding to the bottom portion 105 b 1 , the middle portion 105 b 2 and the top portion 105 b 3 .
- the method 500 may be adapted to provide more than three widths of the partially formed field plates 540 , e.g. by using more than two etch process steps to remove portions of the photoresist 505 .
- the top portion 105 b 3 has no significant effect on the electrical operation of transistors employing this feature. Whereas the double-width field plate is typically used to make more uniform the electrical fields in the drift region of the surface layer 108 , this advantage is not generally applicable at the top of the field plate 105 b , where the electric field is substantially reduced relative to the bottom of the field plate 105 b . While providing little to no electrical benefit, the wider top portion 105 b 3 provides significant processing benefit by reducing the area available for a wet etch, e.g.
- the described implementations include the realization that such a thinner dielectric liner adjacent the gate 105 a can be used to increase the process margin of the transistor while not sacrificing voltage range due to the reduced electric field near the body region 102 . Absent this realization, there is no motivation to add the wider top portion 105 b 3 to the double-width field plate.
- Disclosed aspects can be used to form trench gate MOSFET devices comprising a semiconductor die that may be integrated into a variety of assembly flows to form a variety of different devices and related products.
- the semiconductor die may include various elements therein and/or layers thereon, including barrier layers, dielectric layers, device structures, active elements and passive elements including source regions, drain regions, bit lines, bases, emitters, collectors, conductive lines, conductive vias, etc.
- the semiconductor die can be formed from a variety of processes including bipolar, Insulated Gate Bipolar Transistor (IGBT), CMOS, BiCMOS and MEMS.
- IGBT Insulated Gate Bipolar Transistor
Abstract
A trench gate metal oxide semiconductor (MOSFET) device includes a substrate with a semiconductor surface layer doped a first conductivity type. At least one trench gate MOSFET cell is located in or over the semiconductor surface layer, and includes a body region in the semiconductor surface layer doped a second conductivity type, and a source region on top of the body region doped the first conductivity type. A trench extends down from a top side of the semiconductor surface layer, the trench abutting the body region and being lined with a dielectric material. A field plate that includes polysilicon is located in the trench, and a gate electrode is located over the field plate. The field plate has a bottom portion, a middle portion, and a top portion, wherein the bottom portion is narrower than the middle portion, and the middle portion is narrower than the top portion.
Description
- This Disclosure relates to semiconductor devices, more particularly to vertical trench gate metal oxide semiconductor field effect transistors (MOSFETs).
- One type of power MOSFET is a trench gate MOSFET which is designed to handle significant power and to provide a high-power drive capability by vertically conducting current from a top surface to a bottom surface of the semiconductor die. The trench gate MOSFET in its active region generally includes a large number of parallel connected active trench gate MOSFET cells each including a trench formed in the semiconductor die, with each active trench having surrounding source regions and oppositely-doped body regions, and where the trenches are deep enough to cross through the body regions to a drift region below the top surface of the semiconductor die.
- Each active trench gate cell has a gate stack buried in the trench comprising a gate electrode generally including doped polysilicon and a gate dielectric. The gate electrodes when appropriately biased controls the current conduction in the body region in their vicinity by virtue of the field effect that enables the MOSFET cells to be turned on, thus enabling current to flow between the source and the drain that has a drain contact on a bottom side of the semiconductor die.
- This Summary is provided to introduce a brief selection of disclosed concepts in a simplified form that are further described below in the Detailed Description including the drawings provided. Various disclosed methods and devices of the present disclosure may be beneficially applied to transistors and integrated circuits that include trench field plates. While such embodiments may be expected to reduce defects, e.g. leakage between trench gates a surrounding source region, no particular result is a requirement unless explicitly recited in a particular claim.
- Future generation trench gate MOSFETS may require a 2× thicker field plate dielectric layer along the trench (trench wall dielectric) to accommodate a 100 V operating voltage as compared to 45 V technology, the thicker field plate dielectric providing a higher dielectric breakdown voltage. However, the inventors have discovered that a thicker trench wall dielectric layer may result in significant recess in the top portion of the sidewall of the trench wall dielectric layer during a wet etch process that takes place before a bottom dielectric (e.g., silicon oxide) layer is grown to isolate the gate electrode from the field plate. This undercut can result in defects in the gate dielectric in which the gate dielectric is significantly thinner in the recess than at the rest of the gate electrode, degrading the electrical isolation between the gate electrode and the field plate. Such defects can cause significant current leakage between the gate and the source, resulting in yield loss.
- The inventors have discovered that such defects may be reduced or eliminated by thinning down a small portion of the top trench wall dielectric layer at the top of the trench field plate. Where a baseline device may have a field plate with two widths (a double-width field plate), the addition of the thin trench wall dielectric layer portion results in a field plate with three different widths (a triple-width field plate) a corresponding trench wall dielectric layer with three different thicknesses along the field plate in the height/thickness direction of the trench. Although examples are described herein having three different polysilicon widths for the field plate, it is possible to also have four or more polysilicon widths for the field plate.
- Disclosed aspects include a trench gate MOSFET device that has a substrate with a semiconductor surface layer doped a first conductivity type. At least one trench gate MOSFET cell is located in or over the semiconductor surface layer, and includes a body region in the semiconductor surface layer doped a second conductivity type, and a source region on top of the body region doped the first conductivity type. A trench extends down from a top side of the semiconductor surface layer, the trench abutting the body region and being lined with a dielectric material. A field plate that includes polysilicon is located in the trench, and a gate electrode is located over the field plate. The field plate has a bottom portion, a middle portion, and a top portion, wherein the bottom portion is narrower than the middle portion, and the middle portion is narrower than the top portion.
- Disclosed aspects further include a method of fabricating a transistor. The method includes forming a plurality of trenches in a semiconductor layer over a semiconductor substrate, the plurality of trenches including a first trench and a second trench. A gate dielectric layer is formed on first and second sidewalls of the trench, and a gate electrode between the first and second sidewalls. A dielectric liner is formed on the first and second sidewalls, the dielectric liner having a first portion at a bottom of the trench with a first thickness, a second portion between the first portion and the gate dielectric layer with a second thickness less than the first thickness, and a third portion between the second portion and the gate dielectric layer with a third thickness less than the second thickness. A conductive field plate is formed in the trench, the field plate having a bottom portion with a first width, a middle portion between the bottom portion and the gate electrode with a second width greater than the first width, and a top portion between the middle portion and the gate electrode with a third width greater than the second width.
- Reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, wherein:
-
FIG. 1 depicts a high-level top view depiction of a disclosed vertical trench gate MOSFET device having a plurality of active trench gate MOSFET cells in an active region of the die along with an outer junction termination trench that provides a junction termination region which surrounds the active region of the device, where the polysilicon gates are shown by example being parallel to one another. -
FIG. 2 is a cross sectional view along the cutline A-A′ shown inFIG. 1 that shows an example trench gate n-channel MOSFET device having a triple width field plate. -
FIGS. 3A-3I show successive cross-sectional views for an in-process disclosed trench gate n-channel MOSFET device having active trench gate cells with a triple width field plate, corresponding to steps in a first example method of forming the trench gate n-channel MOSFET device shown inFIG. 2 . -
FIGS. 4A-4I show successive cross-sectional views for an in-process disclosed trench gate n-channel MOSFET device having active trench gate cells with a triple width field plate, corresponding to steps in a second example method of forming the trench gate n-channel MOSFET device shown inFIG. 2 . - Example aspects are described with reference to the drawings, wherein like reference numerals are used to designate similar or equivalent elements. Illustrated ordering of acts or events should not be considered as limiting, as some acts or events may occur in different order and/or concurrently with other acts or events. Furthermore, some illustrated acts or events may not be required to implement a methodology in accordance with this disclosure.
- Also, the terms “connected to” or “connected with” (and the like) as used herein without further qualification are intended to describe either an indirect or direct electrical connection. Thus, if a first device “connects” to a second device, that connection can be through a direct electrical connection where there are only parasitics in the pathway, or through an indirect electrical connection via intervening items including other devices and connections. For indirect connecting, the intervening item generally does not modify the information of a signal
-
FIG. 1 depicts an enhanced high-level top view depiction of a disclosed vertical trench gate n-channel MOSFET device 100 shown with an optional outer gatejunction termination trench 130 which provides a junction termination region that surrounds the active region having the plurality of active trenchgate MOSFET cells 105 shown each having apolysilicon gate 105 a. Although NMOS transistors are generally described herein, it should be clear to one having ordinary skill in the art to use this information disclosed in this application to also form PMOS transistors, by n-doped regions being substituted by p-doped regions, and vice versa. - The active region has a plurality of active trench
gate MOSFET cells 105 with theirpolysilicon gates 105 a shown, with their length direction being oriented parallel to one another. The trenchgate MOSFET device 100 is shown formed on asubstrate 109, e.g. n+ doped (about 1019 cm−3 to about 1021 cm−3), that provides a drain for thedevice 100. Thesubstrate 109 has having anepitaxial surface layer 108 thereon of the same conductivity type and lightly doped (about 1014 cm−3 to about 1018 cm−3). Although not shown, there is generally a metal drain contact layer (e.g., Ti/Ni/Ag) on the bottom side of thesubstrate 109. - The
junction termination trench 130 provides the junction termination region that surrounds the active region for theMOSFET device 100 that enables theMOSFET device 100 to sustain a higher drain to source breakdown voltage (BV). Thejunction termination trench 130 is generally connected to afield plate 105 b (FIG. 2 ), e.g., comprising polysilicon, in the active trench gate MOSFET cells and the source. - The active area as described below in
FIG. 2 (shown as 210) hasbody regions 102 and first dopedregions 103, also referred to as source(s) 103, within thebody regions 102 to provide a MOSFET device structure that enables turning on the active trenchgate MOSFET cells 105 with a proper gate-to-body region bias to form a conduction channel which enables current to flow between thesource regions 103 through thesurface layer 108 as a drift region to the substrate 109 (e.g., functioning as a drain). In one example, thebody regions 102 may be p-type with a dopant concentration in a range from about 1017 cm−3 to about 1019 cm−3, and thesource regions 103 may be n-type with a dopant concentration in a range from about 1019 cm−3 to about 1021 cm−3. -
FIG. 2 is a cross sectional view taken along the cut line 2-2 shown inFIG. 1 that shows an example trench gate n-channel MOSFET device's (trench gate MOSFET device) 200 in theactive area 210, with a plurality of active trench gate MOSFET cells 105 (shown as two cells for a simplified example) each having a triplewidth field plate 105 b. The trench gate MOSFET device 200 can comprise a discrete device that only includes the plurality of active trenchgate MOSFET cells 105. Alternatively, the trench gate MOSFET device can comprise an integrated circuit (IC). For example, the IC can include a gate driver with a plurality of trenchgate MOSFET cells 105 hooked up in parallel being all driven by the gate driver. - The
field plate 105 b comprises abottom portion 105 b 1, amiddle portion 105b 2, and atop portion 105 b 3, all in theactive area 210 of the trench gate MOSFET device 200. A trench walldielectric layer 105 c, e.g. silicon oxide, comprises abottom portion 105 c 1, amiddle portion 105c 2, and atop portion 105 c 3. The triple width arrangement of thefield plate 105 b is distinct from a double width field plate structure without a breakdown voltage degradation. Thetop portion 105 c 3 of the trench dielectric wall dielectric 105 b, because it occupies a comparatively small portion of the trench wall dielectric's total height, has a generally minimal impact on the BV between thegate electrode 105 a and thesource region 103, which is typically conductively connected on the semiconductor die to the field plate. - In some examples, the height (in a direction normal to the top surface of the surface layer 108) of the
bottom portion 105 b 1 may be in a range from 3 μm to 4 μm, the height of themiddle portion 105b 2 may be in a range from 0.7 μm to 1.5 μm, the height of thetop portion 105 c 3 may be in a range from 1,000 Å to 5,000 Å, and the total height of thefield plate 105 b may be in a range from 3.8 μm to 5.6 μm. In some examples, the thickness (parallel to the top surface of the surface layer 108) of thebottom portion 105 b 1 may be in a range from 1,000 Å to 3,000 Å, the thickness of themiddle portion 105b 2 may be in a range from 5,000 Å to 11,000 Å, and the thickness of thetop portion 105 b 3 may be in a range from 7,000 Å to 13,000 Å. In some examples, the thickness (parallel to the top surface of the surface layer 108) of thebottom portion 105 c 1 of the trench walldielectric layer 105 c may be in a range from 3,000 Å to 8,000 Å, the thickness of themiddle portion 105c 2 may be in a range from 1,500 Å to 2,500 Å, and the thickness of thetop portion 105 c 3 may be in a range from 700 Å to 1,300 Å. - In a more specific example, presented without implied limitation, the height of the
bottom portion 105 b 1 may be about 3.4 μm, the height of themiddle portion 105b 2 may be about 1.1 μm, and the height of the top portion may be about 3,000 Å; the thickness of thebottom portion 105 b 1 may be about 2,000 Å, the thickness of themiddle portion 105b 2 may be about 8,000 Å, and the thickness of thetop portion 105 b 3 may be about 1 μm; and the thickness of thebottom portion 105 c 1 may be about 5,000 Å, the thickness of themiddle portion 105c 2 may be about 2,000 Å, and the thickness of thetop portion 105 c 3 may be about 1,000 Å - In the case that the
field plates 105 b are formed from doped polysilicon, the polysilicon can be doped (e.g., n+ or p+), which can comprise in-situ doping during the polysilicon deposition, or ion implantation of undoped polysilicon with one or more dopant ions. Alternatively, because thefield plate 105 b does not conduct any electrical current during trench gate MOSFET device operation, the field plate can also comprise undoped polysilicon. - The
source regions 103 are shown as n+ doped for acting as a source for the active trenchgate MOSFET cells 105 formed with thebody regions 102. The activetrench MOSFET cells 105 generally have apolysilicon gate 105 a with agate dielectric layer 105 d below thepolysilicon gate 105 a and between the sidewalls of thepolysilicon gate 105 a and thebody region 102 and thesource region 103. The totalgate dielectric layer 105 d thickness may be in a range from 100 Å to 10,000 Å. The tripleshield field plate 105 bportions 105b 1, 105 b 2 and 105 b 3 are shown below thegate dielectric layer 105 d under thepolysilicon gate 105 a. Thegate 105 a, thesource region 103, and thesubstrate 109 operates as a 3-terminal trenchgate MOSFET cell 105, with thesource region 103 being tied to thebody region 102. - The
polysilicon gates 105 a are optionally shown having gate recesses (indentations) that have a pre-metal dielectric (PMD)layer 124 above that also fills the gate recesses. Recessed gates may provide more process margin for the source contacts. - The
trench dielectric layer 105c comprising portions 105 c 1, 105c PMD layer 124 shown with ametal contact 118 a connecting thesource region 103 andbody region 102 of the active trenchgate MOSFET cells 105, and ametal contact 118 b providing a common connection to thepolysilicon gates 105 a of the active trenchgate MOSFET cells 105. - A process flow is now described performing a disclosed trench gate MOSFET device including a triple field plate.
FIGS. 3A-3I show successive cross-sectional views of an example in-process disclosed vertical trench gate n-channel MOSFET device with a triple width field plate for the active trench gate MOSFET device 200 shown inFIG. 2 comprising the trench gate MOSFET cells in theactive area 210 of the MOSFET device. The process flow shown inFIGS. 3A-3I creates a triple width field plate structure from bottom side to the top side by successively filling the trench with polysilicon followed by chemical mechanical polishing (CMP) and etching back. -
FIG. 3A shows a cross sectional view of the in-process trench gate MOSFET device after silicon trench etching in thesurface layer 108 on asubstrate 109 providing a drain, generally by Reactive Ion Etching (RIE) to form the trench apertures shown in thesurface layer 108. A patterned hard mask (HM) layer, shown asHM layer 315, such as comprising silicon nitride, is generally used in this step. Although not shown, there is generally a thin silicon pad oxide layer under theHM layer 315. The trench depth is generally 1 μm to 10 μm. -
FIG. 3B shows a cross sectional view of the in-process trench gate MOSFET device after forming a trench dielectric layer shown as 105 c 1, followed by a polysilicon deposition for forming apolysilicon layer 320 as an initial filler material of the active trench MOSFET gate cells in theactive area 210. Thetrench dielectric layer 105 c 1 is generally formed by growing athermal oxide liner 500 Å to 2,000 Å thick followed by a sub-atmospheric chemical vapor deposition (SACVD) of silicon oxide generally 1,000 Å to 5,000 Å thick. -
FIG. 3C shows a cross sectional view of the in-process trench gate MOSFET cell after polysilicon CMP to remove polysilicon layer overburden outside the trenches, then a polysilicon etch-back process that exposes the trench gate MOSFET cells in theactive area 210, with the resulting polysilicon layer in the active area trenches now shown as 105 b 1.FIG. 3D shows a cross sectional view of the in-process trench gate MOSFET device after oxide pull back of thetrench dielectric layer 105 c 1 in theactive area 210 to form a thinned trench dielectric layer now shown as 105c 2. The oxide pull-back process generally comprises a wet etch. -
FIG. 3E shows a cross sectional view of the in-process trench gate MOSFET device after forming apolysilicon layer 330 as a second filler material of the active trench MOSFET gate cells. In the illustrated view, a CMP process has been performed to remove thepolysilicon layer 330 over the top surface of thedielectric layer 105 c.FIG. 3F shows a cross sectional view of the in-process trench gate MOSFET device after a body implant (shown by arrows) that forms thebody regions 102 at the surface of thesurface layer 108. -
FIG. 3G shows the cross-sectional view of the in-process trench gate MOSFET device after ion implanting to form a source region 103 (e.g., a source) in thebody regions 102, then etching a portion of thesecond polysilicon layer 330 to provide the middle field plate polysilicon portion now shown as 105b 2.FIG. 3H shows the cross-sectional view of the in-process trench gate MOSFET device after depositing athird polysilicon layer 340 as a third filler material of the active trench MOSFET gate cells. In the illustrated view, a CMP process has been performed to remove the polysilicon overburden over the top surface of thedielectric layer 105 c, and an etch process has been performed to recess thethird polysilicon layer 340 below the top surface of thesurface layer 108. These operations result in the topfield plate portion 105 b 3 that can be seen to be the widest of the field plate portions. Topfield plate portion 105 b 3 completes the triple field plate for the trench gate MOSFET cells. -
FIG. 31 shows the cross-sectional view of the in-process trench gate MOSFET device after a thermal gate oxidation to form thegate dielectric layer 105 d, where as shown inFIG. 31 thegate dielectric layer 105 d will as shown generally grow thicker over the exposed top of the topfield plate portion 105 b 3 as compared to the vertical channel region over the silicon mesa comprising thesurface layer 108 between the trenches. Thegate dielectric layer 105 d over the silicon be in a range from about 100 Å (e.g., for 5 V operation) to about 1,000 A thick (for higher voltage device operation, e.g. 100 V). - Gate polysilicon deposition and patterning follows to form the
polysilicon gates 105 a shown with optional polysilicon gate recesses, followed by the deposition of thePMD layer 124 which also fills the gate recesses, followed by contact aperture formation through thePMD layer 124 to expose thesource region 103 andbody region 102 shown recessed into the silicon, and to expose thepolysilicon gates 105 a. As described above the polysilicon gates are doped. Metal 1 formation follows to provide metal contacts includingmetal contacts 118 a to sourceregion 103 andbody region 102, and another metal contact that is not shown inFIG. 31 (seemetal 118 b inFIG. 2 described above) which contacts thepolysilicon gates 105 a. The metal for the metal contacts can comprise aluminum, or other metal materials such as tungsten or cobalt. -
FIGS. 4A-4I illustrate analternate method 500 of the disclosure for forming a triple width field plate structure that may be used in a trench gate MOSFET device. Themethod 500 uses a sacrificial layer, such as photoresist, to fill the trench instead of filling the trench with polysilicon as was shown inFIG. 3B . While the following description of themethod 500 uses photoresist as one example, those skilled in the pertinent art will appreciate that other sacrificial materials may be used, such as ARC (anti-reflective coating) or other organic spin-coatable material compatible with semiconductor processing. -
FIG. 4A illustrates theMOSFET cells 105 after forming the trenchwall dielectric layer 105 c. Thedielectric layer 105 c, e.g. a thermal silicon oxide layer, has been formed on exposed surfaces of thesurface layer 108. - In
FIG. 4 B photoresist 505 has been deposited over thesubstrate 109 and between vertical portions of thedielectric layer 105 c.FIG. 4B illustrates themethod 500 after an optional etch-back of thephotoresist 505 that exposes thedielectric layer 105 c. -
FIG. 4C illustrates themethod 500 during and after removal of a first portion of thephotoresist 505, e.g. by an anisotropic plasma etch orash process 510. The removing exposes a top portion of thedielectric layer 105 c at and below a top surface of thesurface layer 108. - In
FIG. 4D anetch process 515 that is selective to silicon oxide removes a first portion of thedielectric layer 105 c that is not protected by thephotoresist 505. Theetch process 515 may include, e.g. a buffered HF solution sufficiently diluted to provide process control. Theetch process 515 thins thedielectric layer 105 c over the surface of thesurface layer 108 and over the sidewalls of the trenches. -
FIG. 4E illustrates themethod 500 during and after removal of a second portion of thephotoresist 505, e.g. by an anisotropic plasma etch orash process 520. The removing exposes a middle portion of thedielectric layer 105 c below the top portion. - In
FIG. 4F anetch process 525 that is selective to silicon oxide removes a second portion of thedielectric layer 105 c that is not protected by thephotoresist 505. Theetch process 525 may again include, e.g. a buffered HF solution. Theetch process 525 further thins thedielectric layer 105 c over the surface of thesurface layer 108 and over the sidewalls of the trenches, resulting in a thinner upper portion and a thicker middle portion of thedielectric layer 105 c within the trenches. -
FIG. 4G illustrates themethod 500 during and after removal of a third portion of thephotoresist 505, e.g. by an anisotropic plasma etch orash process 530. The removing exposes a bottom portion of thedielectric layer 105 c below the middle portion. Thedielectric layer 105 c now has thebottom portion 105 c 1,middle portion 105 c 2 andtop portion 105 c 3. - In
FIG. 4H apolysilicon layer 535 has been formed within the trenches and over the top surface of thesurface layer 108, e.g. by conventional means. Finally,FIG. 41 shows themethod 500 after removal of a portion of thepolysilicon layer 535 over the top surface of thesurface layer 108. The partial removing of thepolysilicon layer 535 may include CMP and/or an etch process selective to polysilicon, and separates partially formed triplewidth field plates 540, each having abottom portion 541, amiddle portion 542 and atop portion 543, respectively corresponding to thebottom portion 105 b 1, themiddle portion 105 b 2 and thetop portion 105 b 3. Processing of the trenchgate MOSFET cells 105 may continue as illustrated byFIG. 3F , et seq. Themethod 500 may be adapted to provide more than three widths of the partially formedfield plates 540, e.g. by using more than two etch process steps to remove portions of thephotoresist 505. - The addition of the wider
top portion 105 b 3 is an innovative solution to the undercut issue described previously. Unlike the double-width field plate of some baseline devices, thetop portion 105 b 3 has no significant effect on the electrical operation of transistors employing this feature. Whereas the double-width field plate is typically used to make more uniform the electrical fields in the drift region of thesurface layer 108, this advantage is not generally applicable at the top of thefield plate 105 b, where the electric field is substantially reduced relative to the bottom of thefield plate 105 b. While providing little to no electrical benefit, the widertop portion 105 b 3 provides significant processing benefit by reducing the area available for a wet etch, e.g. an HF etch, to attack thedielectric liner 105 c 3 while removing thedielectric liner 105 c from the trench sidewalls in preparation to form a clean gate dielectric layer above thefield plate 105 b. Moreover, while a thinner dielectric liner dielectric might otherwise result in reduced voltage capacity of the transistor, the described implementations include the realization that such a thinner dielectric liner adjacent thegate 105 a can be used to increase the process margin of the transistor while not sacrificing voltage range due to the reduced electric field near thebody region 102. Absent this realization, there is no motivation to add the widertop portion 105 b 3 to the double-width field plate. - Disclosed aspects are further illustrated by the following specific Examples, which should not be construed as limiting the scope or content of this Disclosure in any way.
- Probe yield based on the parameter Igss (the gate to source leakage measured at 12 V) of a disclosed trench gate n-channel MOSFET device having a triple width field plate compared to Igss probe yield data of a trench gate n-channel MOSFET device having a double width field plate demonstrated a probe yield about four times higher for the triple width field plate MOSFET device as compared to the double width field plate MOSFET device.
- Disclosed aspects can be used to form trench gate MOSFET devices comprising a semiconductor die that may be integrated into a variety of assembly flows to form a variety of different devices and related products. The semiconductor die may include various elements therein and/or layers thereon, including barrier layers, dielectric layers, device structures, active elements and passive elements including source regions, drain regions, bit lines, bases, emitters, collectors, conductive lines, conductive vias, etc. Moreover, the semiconductor die can be formed from a variety of processes including bipolar, Insulated Gate Bipolar Transistor (IGBT), CMOS, BiCMOS and MEMS.
- Those skilled in the art to which this Disclosure relates will appreciate that many other aspects are possible within the scope of the claimed invention, and further additions, deletions, substitutions and modifications may be made to the described aspects without departing from the scope of this Disclosure.
Claims (20)
1. A method of fabricating a transistor, comprising:
forming a plurality of trenches in a semiconductor layer over a semiconductor substrate, the plurality of trenches including a first trench and a second trench;
forming a gate dielectric layer on first and second sidewalls of the trench, and a gate electrode between the first and second sidewalls;
forming a dielectric liner on the first and second sidewalls, the dielectric liner having a first portion at a bottom of the trench with a first thickness, a second portion between the first portion and the gate dielectric layer with a second thickness less than the first thickness, and a third portion between the second portion and the gate dielectric layer with a third thickness less than the second thickness;
forming a conductive field plate in the trench, the field plate having a bottom portion with a first width, a middle portion between the bottom portion and the gate electrode with a second width greater than the first width, and a top portion between the middle portion and the gate electrode with a third width greater than the second width.
2. The method of claim 1 , wherein the forming the field plate includes:
forming a dielectric layer on the first and second sidewalls;
filling the trench with an initial filler material comprising polysilicon between the first and second sidewalls;
etching back the initial filler material thereby forming a first remaining polysilicon portion within the trench;
thinning the dielectric layer above the first remaining polysilicon portion;
filling the trench with a second filler material comprising polysilicon;
etching back the second filler material thereby forming a second remaining polysilicon portion within the trench;
thinning the dielectric layer above the second remaining portion; and
filling the trench with a third filler material comprising polysilicon.
3. The method of claim 1 , wherein the forming the field plate includes:
forming a dielectric layer on the first and second sidewalls;
filling the trench with a sacrificial layer between the first and second sidewalls;
etching back the sacrificial layer thereby exposing a first portion of the dielectric layer;
thinning the first portion of the dielectric layer;
etching back of the sacrificial layer thereby exposing a second portion of the dielectric layer; and
thinning the first and second portions of the dielectric layer.
4. The method of claim 1 , wherein the gate dielectric layer has a thickness in a range from 100 Å to 10,000 Å.
5. The method of claim 1 , wherein forming the gate electrode includes forming a recess in the gate electrode.
6. The method of claim 1 , wherein the semiconductor substrate is n-type doped.
7. The method of claim 1 , further comprising forming a body region between the first and second trenches and a first doped region within the body region, the first doped region providing a source of a trench gate MOSFET and the semiconductor substrate providing a drain of the trench gate MOSFET.
8. The method of claim 7 , further comprising depositing a pre-metal dielectric (PMD) layer over the first and second trenches and forming contacts through the PMD layer, including a first contact to the body region and a second contact to the gate electrode, wherein forming the first contact further comprises etching through the first doped region to reach the body region.
9. The method of claim 1 , wherein the plurality of trenches are features of a discrete MOSFET device.
10. The method of claim 1 , wherein the plurality of trenches are features of a MOSFET device in an integrated circuit.
11. A trench gate metal oxide semiconductor (MOSFET) device, comprising:
a substrate having a semiconductor surface layer doped a first conductivity type;
at least one trench gate MOSFET cell in or over the semiconductor surface layer, including:
a body region in the semiconductor surface layer doped a second conductivity type;
a source region on top of the body region doped the first conductivity type;
a trench extending down from a top side of the semiconductor surface layer, the trench abutting the body region and being lined with a dielectric material;
a field plate comprising polysilicon in the trench; and
a gate electrode over the field plate,
wherein the field plate has a bottom portion with a first width, a middle portion having a second width between the bottom portion and the gate electrode, and a top portion having a third width between the middle portion and the gate electrode, the second width greater than the first width and the third width greater than the second width.
12. The trench gate MOSFET device of claim 11 , wherein the trench gate MOSFET device is a discrete device.
13. The trench gate MOSFET device of claim 11 , wherein the trench gate MOSFET device is connected within an integrated circuit.
14. The trench gate MOSFET device of claim 11 , further comprising a gate dielectric layer between the gate electrode and a trench sidewall, the gate dielectric layer having a thickness in a range from 100 Å to 10,000 Å.
15. The trench gate MOSFET device of claim 11 , wherein the gate electrode includes a recess.
16. The trench gate MOSFET device of claim 11 , wherein the first conductivity type is n-type.
17. The trench gate MOSFET device of claim 11 , wherein the at least one trench gate MOSFET cell is one of a plurality of trench gate MOSFET cells and the gate electrode is one of a corresponding plurality of gate electrodes, and the source region is one of a corresponding plurality of source regions each located between an adjacent pair of field plates, the plurality of source regions providing a combined source region for the plurality of trench gate MOSFET cells and the substrate providing a drain for the plurality of trench gate MOSFET cells.
18. The trench gate MOSFET device of claim 17 , further comprising a pre-metal dielectric (PMD) layer over the plurality of trench gate MOSFET cells and contacts through the PMD layer, a first subset of the contacts reaching the body regions under the combined source region, and a second subset reaching the gate electrodes, wherein each of the first subset of contacts electrically connects to a corresponding one of the source regions and a corresponding one of the body regions.
19. The trench gate MOSFET device of claim 11 , wherein the field plate comprises doped polysilicon.
20. The trench gate MOSFET device of claim 11 , where the field plate comprises undoped polysilicon.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111091799.6 | 2021-09-17 | ||
CN202111091799.6A CN115832019A (en) | 2021-09-17 | 2021-09-17 | Field plate arrangement for trench gate field effect transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
US20230087151A1 true US20230087151A1 (en) | 2023-03-23 |
Family
ID=85515655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/502,692 Pending US20230087151A1 (en) | 2021-09-17 | 2021-10-15 | Field plate arrangement for trench gate fet |
Country Status (2)
Country | Link |
---|---|
US (1) | US20230087151A1 (en) |
CN (1) | CN115832019A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220052194A1 (en) * | 2020-08-13 | 2022-02-17 | Stmicroelectronics Pte Ltd | Split-gate trench power mosfet with self-aligned poly-to-poly isolation |
CN117410173A (en) * | 2023-12-15 | 2024-01-16 | 中晶新源(上海)半导体有限公司 | Manufacturing method of trench semiconductor device with stepped dielectric layer |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080258208A1 (en) * | 2007-04-19 | 2008-10-23 | Infineon Technologies Austria Ag | Semiconductor component including compensation zones and discharge structures for the compensation zones |
US20140030868A1 (en) * | 2012-07-25 | 2014-01-30 | Power Integrations, Inc. | Deposit/etch for tapered oxide |
US20160093719A1 (en) * | 2014-09-30 | 2016-03-31 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing same |
US20200212219A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Vertical trench gate mosfet with integrated schottky diode |
US20200243656A1 (en) * | 2019-01-30 | 2020-07-30 | Siliconix Incorporated | Split gate semiconductor with non-uniform trench oxide |
US20210119030A1 (en) * | 2019-10-18 | 2021-04-22 | Nami MOS CO., LTD. | Shielded gate trench mosfet integrated with super barrier rectifier |
US20210126124A1 (en) * | 2019-10-29 | 2021-04-29 | Nami MOS CO., LTD. | Termination of multiple stepped oxide shielded gate trench mosfet |
US20230010328A1 (en) * | 2021-07-06 | 2023-01-12 | Nami MOS CO., LTD. | Shielded gate trench mosfet with multiple stepped epitaxial structures |
-
2021
- 2021-09-17 CN CN202111091799.6A patent/CN115832019A/en active Pending
- 2021-10-15 US US17/502,692 patent/US20230087151A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080258208A1 (en) * | 2007-04-19 | 2008-10-23 | Infineon Technologies Austria Ag | Semiconductor component including compensation zones and discharge structures for the compensation zones |
US20140030868A1 (en) * | 2012-07-25 | 2014-01-30 | Power Integrations, Inc. | Deposit/etch for tapered oxide |
US20160093719A1 (en) * | 2014-09-30 | 2016-03-31 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing same |
US20200212219A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Vertical trench gate mosfet with integrated schottky diode |
US20200243656A1 (en) * | 2019-01-30 | 2020-07-30 | Siliconix Incorporated | Split gate semiconductor with non-uniform trench oxide |
US20210119030A1 (en) * | 2019-10-18 | 2021-04-22 | Nami MOS CO., LTD. | Shielded gate trench mosfet integrated with super barrier rectifier |
US20210126124A1 (en) * | 2019-10-29 | 2021-04-29 | Nami MOS CO., LTD. | Termination of multiple stepped oxide shielded gate trench mosfet |
US20230010328A1 (en) * | 2021-07-06 | 2023-01-12 | Nami MOS CO., LTD. | Shielded gate trench mosfet with multiple stepped epitaxial structures |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220052194A1 (en) * | 2020-08-13 | 2022-02-17 | Stmicroelectronics Pte Ltd | Split-gate trench power mosfet with self-aligned poly-to-poly isolation |
US11848378B2 (en) * | 2020-08-13 | 2023-12-19 | Stmicroelectronics Pte Ltd | Split-gate trench power MOSFET with self-aligned poly-to-poly isolation |
CN117410173A (en) * | 2023-12-15 | 2024-01-16 | 中晶新源(上海)半导体有限公司 | Manufacturing method of trench semiconductor device with stepped dielectric layer |
Also Published As
Publication number | Publication date |
---|---|
CN115832019A (en) | 2023-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20190305099A1 (en) | Semiconductor device | |
US9159807B2 (en) | Semiconductor device and manufacturing method thereof | |
US8227832B2 (en) | SiGe heterojunction bipolar transistor multi-finger structure | |
US10777661B2 (en) | Method of manufacturing shielded gate trench MOSFET devices | |
US10636883B2 (en) | Semiconductor device including a gate trench and a source trench | |
CN113519054B (en) | Method of manufacturing a shielded gate trench MOSFET device | |
US7061060B2 (en) | Offset-gate-type semiconductor device | |
US20230087151A1 (en) | Field plate arrangement for trench gate fet | |
TW201707134A (en) | Semiconductor device and manufacturing method of the same | |
CN111771286A (en) | Semiconductor device having polysilicon field plate for power MOSFET | |
US8071445B2 (en) | Method for manufacturing semiconductor device, and semiconductor device | |
US20100197089A1 (en) | Methods of fabricating semiconductor devices with metal-semiconductor compound source/drain contact regions | |
US11056587B2 (en) | Semiconductor device and method for fabricating the same | |
KR20190056341A (en) | Dual gate dielectric transistor | |
US11349010B2 (en) | Schottky barrier diode with reduced leakage current and method of forming the same | |
US10916470B2 (en) | Modified dielectric fill between the contacts of field-effect transistors | |
US20230178625A1 (en) | Semiconductor device | |
US11563089B2 (en) | Method for manufacturing a semiconductor device | |
KR102324168B1 (en) | Semiconductor device and fabricating method of the same | |
TWI823639B (en) | Semiconductor device and methods for forming the same | |
US20240047574A1 (en) | High voltage semiconductor devices and methods of manufacturing thereof | |
US20230087690A1 (en) | Semiconductor structures with power rail disposed under active gate | |
US11967626B2 (en) | Field effect transistors with gate fins and method of making the same | |
US20240030314A1 (en) | Semiconductor device and method of manufacturing the same | |
US20220393018A1 (en) | Semiconductor devices and methods of manufacturing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |